Camera module and electronic equipment

Abstract

The utility model provides a camera module and electronic equipment, which can improve the stability of a module structure while improving the heat dissipation performance, so as to solve the problem of influence of environmental factors such as high and low temperatures or vibration on the product performance. The camera module comprises a mounting bracket; the photosensitive chip is mounted on the mounting bracket; the lens base assembly is fixedly arranged on the mounting bracket, so that a photosensitive space for accommodating the photosensitive chip is formed between the lens base assembly and the mounting bracket, and the lens base assembly is provided with a lateral opening communicated with the photosensitive space; the adapter plate is fixedly arranged on the mounting bracket and is positioned outside the photosensitive space; and the flexible substrate is provided with a hollow end which is positioned around the photosensitive chip and is electrically connected with the photosensitive chip, and a connecting end which extends out from the lateral opening and is electrically connected with the adapter plate.

Description

Technical Field

[0001] The utility model relates to the field of camera technology, in particular to a camera module and an electronic device. Background Art

[0002] With the rapid development of computer vision and deep learning technologies, binocular camera systems have been widely used in fields such as three-dimensional vision reconstruction and target tracking. However, the traditional binocular camera structure is prone to be affected by vibration and deformation in complex environments such as movement, unstable environments, or large climate changes, thus affecting the imaging quality and the acquisition of depth information.

[0003] For example, in existing binocular cameras, through holes are usually opened in an aluminum alloy bracket, the camera module is passed through the through holes, and glue is applied and fixed on the front or back of the module. However, this structure has the following defects: the thermal expansion coefficient of aluminum alloy is relatively high, and its stability is poor in occasions where the ambient temperature changes greatly; the fitting gap between the through hole and the module is relatively large, which means that all six degrees of freedom rely on glue fixation, and it is greatly affected by the dispensing process and the performance of the glue; the dispensing position is difficult to control the dispensing uniformity due to the influence of the assembly gap, and the environmental reliability of the glue is worse than that of metal, ultimately affecting the product stability; the lens mount of the module is usually a plastic part with low heat conduction efficiency, and the photosensitive chip is connected to the aluminum alloy bracket through the lens mount by glue. The heat generated by the photosensitive chip cannot be preferentially conducted to the bracket. Even if a copper foil is pasted on the back of the module, it cannot dissipate heat efficiently due to the too long conduction distance between the photosensitive chip and the bracket.

[0004] In order to improve the stability and heat dissipation performance of the binocular camera structure, some binocular camera manufacturers will first hollow out the rigid PCB board, then directly attach the photosensitive chip to the stainless steel bracket through the hollow hole, and then connect the photosensitive chip and the rigid PCB board with gold wires. Finally, the lens mount is fixed on the rigid PCB board to improve the stability of the relative position of the two photosensitive chips and the heat conduction performance. However, this technical solution will result in an unstable structure added between the lens and the photosensitive chip, that is, there are differences in the thermal expansion coefficients of the rigid PCB board and the stainless steel board, which will bring new deviations; at the same time, the relative positions of the stainless steel bracket, the photosensitive chip, and the rigid PCB board are fixed, and the reusability is poor, which does not meet the requirements of flexible design. Summary of the Utility Model

[0005] An advantage of the utility model is to provide a camera module and an electronic device, which can improve the stability of the module structure while improving the heat dissipation performance, so as to solve the problem of the influence of environmental factors such as high and low temperatures or vibrations on the product performance.

[0006] Another advantage of the present utility model is to provide a camera module and an electronic device. In one embodiment of the present utility model, the camera module can reduce the degree of freedom of the photosensitive chip, lower the assembly precision and improve the stability.

[0007] Another advantage of the present utility model is to provide a camera module and an electronic device. In one embodiment of the present utility model, the camera module can improve the heat dissipation performance of the photosensitive chip while reducing the influence of the printed circuit board.

[0008] Another advantage of the present utility model is to provide a camera module and an electronic device. In one embodiment of the present utility model, the camera module can improve the product reusability to meet different customer requirements.

[0009] Another advantage of the present utility model is to provide a camera module and an electronic device. In one embodiment of the present utility model, the electronic device can reduce stress transmission and improve the stability of the overall structure.

[0010] Another advantage of the present utility model is to provide a camera module and an electronic device. In one embodiment of the present utility model, the electronic device can reduce the requirements for the front shell, improve the assembly efficiency and further reduce the cost.

[0011] Another advantage of the present utility model is to provide a camera module and an electronic device. In one embodiment of the present utility model, the electronic device adopts a structure with a flexible exterior and a rigid interior, which is convenient for reducing the calibration and assembly requirements and improving the applicability of the product.

[0012] Another advantage of the present utility model is to provide a camera module and an electronic device. In one embodiment of the present utility model, the electronic device can reduce the assembly difficulty of the product and improve the mass production stability.

[0013] Another advantage of the present utility model is to provide a camera module and an electronic device. To achieve the above purposes, a complex structure and design are not required in the present utility model. Therefore, the present utility model successfully and effectively provides a solution, not only providing a simple camera module and an electronic device, but also increasing the practicability and reliability of the camera module and the electronic device.

[0014] To achieve at least one of the above advantages or other advantages and purposes of the present utility model, the present utility model provides a camera module, including:

[0015] A mounting bracket;

[0016] A photosensitive chip, which is mounted on the mounting bracket;

[0017] A lens holder assembly, wherein the lens holder assembly is fixedly provided on the mounting bracket to form a photosensitive space for accommodating the photosensitive chip between the lens holder assembly and the mounting bracket, and the lens holder assembly has a lateral opening communicating with the photosensitive space;

[0018] An adapter board, which is fixedly provided on the mounting bracket and located outside the photosensitive space; and

[0019] A flexible substrate, having a hollowed end located around the photosensitive chip and electrically connected to the photosensitive chip, and a connection end extending out from the lateral opening and electrically connected to the adapter board.

[0020] According to an embodiment of the present application, the elastic modulus of the mounting bracket is greater than 200 GPa, and the thermal expansion coefficient of the mounting bracket is less than 17 ppm.

[0021] According to an embodiment of the present application, the adapter board is provided with a connector, and the connection end of the flexible substrate is detachably inserted into the connector; the hollowed end of the flexible substrate is wire-bonded to the photosensitive chip.

[0022] According to an embodiment of the present application, the hollowed end of the flexible substrate is provided with a hollowed hole matching the photosensitive chip, and the photosensitive chip extends into the hollowed hole from the mounting bracket so that the hollowed end surrounds the photosensitive chip.

[0023] According to an embodiment of the present application, the photosensitive chip is adhered to the mounting bracket; the lens holder assembly includes a lens holder adhered to the mounting bracket and a lens assembled on the lens holder to be located on the photosensitive path of the photosensitive chip; the lateral opening is located at a position on the lens holder adjacent to the mounting bracket.

[0024] According to an embodiment of the present application, two photosensitive chips are spacedly arranged on the mounting bracket; two lens holder assemblies are respectively and correspondingly spacedly arranged on the mounting bracket and located on opposite sides of the adapter board; two flexible substrates respectively electrically connect the two photosensitive chips to the adapter board.

[0025] According to an embodiment of the present application, the imaging module further includes a light-emitting component fixedly installed on the mounting bracket; the light-emitting component is located between the two lens holder assemblies and electrically connected to the adapter board.

[0026] According to an embodiment of the present application, the adapter board has an avoidance hole matching the light-emitting component, and the light-emitting component extends out of the avoidance hole from the mounting bracket.

[0027] According to another aspect of the present application, the present application further provides an electronic device, including:

[0028] a housing having a light-transmitting window; and

[0029] any one of the above-mentioned camera modules, assembled in the housing and corresponding to the light-transmitting window.

[0030] According to an embodiment of the present application, the housing includes a front housing adhesively fixed to the mounting bracket and a buckle fixedly connected to the front housing and clamping the mounting bracket; the front housing is adhesively bonded to the mounting bracket through a double-sided foam tape; the front housing is a plastic housing. Description of the Drawings

[0031] Figure 1 is a three-dimensional schematic diagram of an electronic device according to an embodiment of the present application;

[0032] Figure 2 shows a schematic diagram of the state of the electronic device according to the above embodiment of the present application from another perspective;

[0033] Figure 3 shows a cross-sectional schematic diagram of the electronic device according to the above embodiment of the present application;

[0034] Figure 4 shows a partial schematic diagram of the camera module in the electronic device according to the above embodiment of the present application;

[0035] Figure 5 shows a schematic diagram of the structure of the camera module omitting the lens holder assembly according to the above embodiment of the present application;

[0036] Figure 6 shows Figure 5 a partial top view schematic diagram of the shown camera module.

[0037] Main element symbol description: 1, electronic device; 10, camera module; 100, photosensitive space; 11, mounting bracket; 12, photosensitive chip; 13, lens holder assembly; 130, lateral opening; 131, lens holder; 132, lens; 14, adapter board; 141, connector; 142, avoidance hole; 15, flexible substrate; 151, hollow end; 152, connection end; 153, hollow hole; 16, light-emitting component; 20, housing; 200, light-transmitting window; 201, light receiving hole; 202, light emitting hole; 21, front housing; 22, buckle.

[0038] The above main element symbol description further describes the present invention in detail in conjunction with the drawings and specific embodiments. Detailed Embodiments

[0039] The following description is used to disclose the present utility model so that those skilled in the art can implement the present utility model. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles defined in the following description of the present utility model can be applied to other implementation schemes, variant schemes, improvement schemes, equivalent schemes, and other technical schemes that do not depart from the spirit and scope of the present utility model.

[0040] In the present utility model, the term "a" in the claims and the specification should be understood as "one or more". That is, in one embodiment, the number of an element can be one, while in other embodiments, the number of the element can be multiple. Unless it is clearly indicated in the disclosure of the present utility model that the number of the element is only one, the term "a" cannot be understood as being unique or single, and the term "a" cannot be understood as a limitation on the number.

[0041] In the description of the present utility model, it should be understood that terms such as "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection; it can be a direct connection, or an indirect connection through a medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0042] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0043] Considering that the existing binocular cameras will increase an unstable structure between the lens and the photosensitive chip, that is, the difference in the coefficient of thermal expansion between the PCB hard board and the stainless steel board will bring new deviations; at the same time, the relative positions among the stainless steel bracket, the photosensitive chip and the PCB hard board are fixed, and the reusability is poor, which does not meet the requirements of flexible design. In view of this, the present application creatively proposes an imaging module and an electronic device, which can improve the stability of the module structure while improving the heat dissipation performance, so as to solve the problem of the influence of environmental factors such as high and low temperatures or vibrations on the product performance.

[0044] Specifically, referring to the accompanying drawings of the specification of the present application Figures 1 to 3 , according to an embodiment of the present application, an electronic device 1 is provided, which may include an imaging module 10 and a housing 20 having a light-transmitting window 200. The imaging module 10 is assembled in the housing 20 and corresponds to the light-transmitting window 200 to receive light through the light-transmitting window 200 for imaging.

[0045] More specifically, as Figure 3 and Figure 4 shown, the imaging module 10 may include a mounting bracket 11, a photosensitive chip 12, a lens seat assembly 13, an adapter board 14, and a flexible substrate 15; the photosensitive chip 12 is mounted on the mounting bracket 11; the lens seat assembly 13 is fixed to the mounting bracket 11 to form a photosensitive space 100 for accommodating the photosensitive chip 12 between the lens seat assembly 13 and the mounting bracket 11, and the lens seat assembly 13 has a lateral opening 130 communicating with the photosensitive space 100; the adapter board 14 is fixed to the mounting bracket 11 and is located outside the photosensitive space 100; the flexible substrate 15 has a hollow end 151 located around the photosensitive chip 12 and electrically connected to the photosensitive chip 12, and a connection end 152 extending out from the lateral opening 130 and electrically connected to the adapter board 14.

[0046] It should be noted that since both the photosensitive chip 12 and the lens seat assembly 13 are directly fixed on the mounting bracket 11, compared with the solution of fixing the lens seat on the PCB hard board, the imaging module 10 of the present application will not be affected by the PCB hard board under environments such as high and low temperatures or vibrations, improving the stability of the module structure, and can also improve the heat dissipation performance of the photosensitive chip 12 by means of the mounting bracket 11 with a larger heat dissipation area. At the same time, since the photosensitive chip 12 and the adapter board 14 are conducted through the flexible substrate 15 instead of being directly connected, the imaging module 10 of the present application realizes flexible connection through the flexible substrate 15, completely avoiding the influence of the PCB hard board.

[0047] Optionally, the elastic modulus of the mounting bracket 11 is greater than 200 GPa, and the thermal expansion coefficient of the mounting bracket 11 is less than 17 ppm, so as to improve the stability of the module structure by taking advantage of the high rigidity and low thermal expansion coefficient of the mounting bracket 11. For example, the mounting bracket 11 can be, but is not limited to, implemented as a ceramic plate or a carbon fiber plate. In addition, the photosensitive chip 12 is thermally conductively mounted on the mounting bracket 11; for example, the photosensitive chip 12 can be, but is not limited to, adhesively fixed to the mounting bracket 11 through thermal conductive glue, so as to further improve the heat dissipation performance of the camera module 10.

[0048] Exemplarily, as Figures 3 to 6 shown, the number of the mounting bracket 11 and the adapter board 14 in each camera module 10 is one, and the number of the photosensitive chip 12, the lens holder assembly 13, and the flexible substrate 15 is two. The two photosensitive chips 12 are spaced apart and arranged on the same mounting bracket 11, the two lens holder assemblies 13 are respectively and correspondingly spaced apart and arranged on the mounting bracket 11 and on opposite sides of the adapter board 14, and the two flexible substrates 15 respectively electrically connect the two photosensitive chips 12 to the same adapter board 14, so that the camera module 10 is implemented as a binocular camera to obtain more stable imaging and more accurate depth information, and further adapt to the application requirements in various complex environments. It can be understood that the adapter board 14 mentioned in the present application can be, but is not limited to, implemented as a printed circuit board fixed to the mounting bracket 11 with double-sided tape. In addition, in other examples of the present application, the number of the photosensitive chip 12, the lens holder assembly 13, and the flexible substrate 15 in each camera module 10 can also be implemented as one to be implemented as a monocular camera.

[0049] Optionally, as Figure 4 shown, the adapter board 14 is provided with a connector 141, and the connection end 152 of the flexible substrate 15 is detachably inserted into the connector 141 to achieve electrical connection through the connector 141, ensuring that the flexible substrate 15 and the adapter board 14 are separable, which helps to improve the reusability of the product. That is to say, in order to meet the different customer needs, the length of the mounting bracket 11 can be adjusted or replaced, but the flexible substrate 15 and the adapter board 14 can both be reused. It can be understood that the flexible substrate 15 mentioned in the present application can be, but is not limited to, implemented as a flexible printed circuit (abbreviated as FPC in English).

[0050] Optionally, as Figure 5 and Figure 6 shown, the gold wire of the hollow end 151 of the flexible substrate 15 is connected to the photosensitive chip 12, so as to flexibly conduct the photosensitive chip 12 and the adapter board 14 through the flexible substrate 15.

[0051] Optionally, asFigure 4 and Figure 6 As shown in Figure 6 , a hollowed end 151 of the flexible substrate 15 is provided with a hollowed hole 153 matching the photosensitive chip 12. The photosensitive chip 12 extends into the hollowed hole 153 from the mounting bracket 11, such that the hollowed end 151 of the flexible substrate 15 surrounds the photosensitive chip 12, so as to electrically connect the flexible substrate 15 and the photosensitive chip 12 by means of wire bonding through a COB (Chips on Board) process. It can be understood that the height of the photosensitive chip 12 can be greater than the thickness of the flexible substrate 15 to protrude from the hollowed hole 153; of course, the height of the photosensitive chip 12 can also be less than or equal to the thickness of the flexible substrate 15, which will not be elaborated in this application.

[0052] Optionally, the photosensitive chip 12 is adhered to the mounting bracket 11, such that the bottom of the photosensitive chip 12 is in close contact with the mounting bracket 11, ensuring that the glue located between the photosensitive chip 12 and the mounting bracket 11 is uniformly extruded under force, while reducing the degree of freedom of the photosensitive chip 12, facilitating the reduction of assembly accuracy and the improvement of structural stability. It can be understood that the photosensitive chip 12 of this application can be, but is not limited to, mounted to the mounting bracket 11 through a tooling or HA (automatic packaging) process.

[0053] Optionally, as Figure 4 shown, the lens holder assembly 13 includes a lens holder 131 adhered to the mounting bracket 11 and a lens 132 assembled to the lens holder 131 to be located in the light sensing path of the photosensitive chip 12; the side opening 130 is located at a position on the lens holder 131 adjacent to the mounting bracket 11, so that the connecting end 152 of the flexible substrate 15 extends out of the side opening 130 against the mounting bracket 11. It can be understood that the opening orientation of the side opening 130 mentioned in this application on the lens holder 131 can be designed as required. For example, the side opening 130 can be located on any side wall of the lens holder 131, which will not be elaborated in this application.

[0054] According to the above examples of this application, as Figure 1 、 Figure 3 and Figure 5 shown, each camera module 10 can further include a light emitting component 16 fixedly installed on the mounting bracket 11 to emit light required by the camera module 10. For example, the light emitting component 16 can be implemented as a fill light or a projector.

[0055] Optionally, the light emitting component 16 is located between two lens holder assemblies 13 and electrically connected to the adapter board 14, so as to transmit control signals and / or supply electrical energy to the light emitting component 16 through the adapter board 14.

[0056] Optionally, as Figure 3and Figure 5 As shown in Figure 5 , the adapter board 14 has an avoidance hole 142 that matches the light-emitting component 16. The light-emitting component 16 extends out of the avoidance hole 142 from the mounting bracket 11, so as to project light outward for supplementary lighting while dissipating heat directly through the mounting bracket 11.

[0057] According to the above embodiments of the present application, as Figures 1 to 3 shown, the housing 20 includes a front housing 21 adhesively fixed to the mounting bracket 11. The light-transmitting window 200 includes a light-receiving hole 201 formed in the front housing 21 and corresponding to the lens holder assembly 13, so as to protect the lens holder assembly 13 through the front housing 21 while ensuring that external light can pass through the front housing 21 via the light-receiving hole 201 and be received and imaged by the photosensitive chip 12 after being modulated by the lens holder assembly 13.

[0058] Optionally, as Figure 1 and Figure 3 shown, the light-transmitting window 200 further includes a light-emitting hole 202 formed in the front housing 21 and corresponding to the light-emitting component 16, so as to protect the light-emitting component 16 through the front housing 21 while ensuring that the light emitted by the light-emitting component 16 can pass through the front housing 21 via the light-emitting hole 202 for supplementary lighting.

[0059] Optionally, the front housing 21 is adhesively bonded to the mounting bracket 11 by a double-sided foam tape (not shown in the figure), so as to reduce stress transmission by using the high elasticity of the foam material and improve the stability of the overall structure. It can be understood that the double-sided foam tape mentioned in the present application can also be replaced by other double-sided tapes with high elasticity, and the present application will not elaborate on this.

[0060] Optionally, as Figure 2 and Figure 3 shown, the housing 20 further includes a buckle 22 fixedly connected to the front housing 21 and clamping the mounting bracket 11, so as to use the buckle method for limiting, improve the assembly efficiency, reduce the product assembly difficulty, and improve the mass production stability. It can be understood that a bayonet matching the buckle 22 can also be provided on the back of the mounting bracket 11 to prevent the mounting bracket 11 from falling off the housing 20.

[0061] It should be noted that since the photosensitive chip 12, the lens mount assembly 13, the adapter board 14, and the light-emitting assembly 16 are all directly fixed to the mounting bracket 11 to form a semi-finished product with a stable structure, and the front housing 21 is bonded to the mounting bracket 11 through a highly elastic double-sided adhesive, the electronic device of the present application can reduce the requirements for the front housing 21, enabling the front housing 21 to be implemented as a plastic shell to form a structure with a flexible exterior and a rigid interior. This not only reduces the calibration and assembly requirements and improves the product applicability, but also further reduces the device cost.

[0062] In addition, the device body of the present application can be, but is not limited to, implemented as devices such as monocular cameras, binocular cameras, sweeping robots, monitoring devices, AR / VR, service robots, and personal verification devices, as long as they are configured with the imaging module 10. The present application will not elaborate on this. In addition, the housing 20 can also be provided with mounting holes for assembling other components, which will not be elaborated in the present application.

[0063] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0064] The above embodiments only represent several implementation manners of the present application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application.

Claims

1. A camera module, characterized in that: include: Mounting bracket; The photosensitive chip is mounted on the mounting bracket; A lens mount assembly, wherein the lens mount assembly is fixedly mounted on the mounting bracket to form a photosensitive space for accommodating the photosensitive chip between the lens mount assembly and the mounting bracket, and the lens mount assembly has a lateral opening communicating with the photosensitive space; An adapter plate is fixed to the mounting bracket and is located outside the photosensitive space; as well as The flexible substrate has a hollow end located around the photosensitive chip and electrically connected to the photosensitive chip, and a connecting end extending from the lateral opening and electrically connected to the adapter plate.

2. The camera module according to claim 1, characterized in that: The elastic modulus of the mounting bracket is greater than 200 GPa, and the thermal expansion coefficient of the mounting bracket is less than 17 ppm.

3. The camera module according to claim 1, characterized in that: The adapter board is provided with a connector, and the connecting end of the flexible substrate is detachably plugged into the connector; the hollow end gold wire of the flexible substrate is connected to the photosensitive chip.

4. The camera module according to claim 1, characterized in that: The hollow end of the flexible substrate is provided with a hollow hole matching the photosensitive chip, and the photosensitive chip extends from the mounting bracket into the hollow hole so that the hollow end surrounds the photosensitive chip.

5. The camera module according to claim 1, characterized in that: The photosensitive chip is glued to the mounting bracket; the lens mount assembly includes a lens mount glued to the mounting bracket and a lens assembled to the lens mount to be located in the photosensitive path of the photosensitive chip; the lateral opening is located on the lens mount at a position adjacent to the mounting bracket.

6. The camera module according to any one of claims 1 to 5, characterized in that: The two photosensitive chips are arranged at intervals on the mounting bracket; the two lens mount assemblies are correspondingly arranged at intervals on the mounting bracket and are located on opposite sides of the adapter plate; the two flexible substrates electrically connect the two photosensitive chips to the adapter plate respectively.

7. The camera module according to claim 6, characterized in that: It also includes a light-emitting component fixed to the mounting bracket; the light-emitting component is located between the two lens seat components and is electrically connected to the adapter plate.

8. The camera module according to claim 7, characterized in that: The adapter plate has an avoidance hole matching the light emitting component, and the light emitting component extends from the mounting bracket to the avoidance hole.

9. An electronic device, characterized in that include: A housing having a light-transmitting window; and The camera module as described in any one of claims 1 to 8 is assembled in the housing and corresponds to the light-transmitting window.

10. The electronic device according to claim 9, characterized in that: The shell comprises a front shell body bonded and fixed to the mounting bracket and a buckle fixedly connected to the front shell body and clamped to the mounting bracket; the front shell body is bonded to the mounting bracket by a foam double-sided adhesive; the front shell body is a plastic shell.

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