Circuit board capable of increasing current

Abstract

The circuit board comprises a conductive layer, an insulating layer, a through hole, a blind hole, a conductive plating layer, a first conductive block and a second conductive block, the conductive layer comprises a power supply layer and a signal layer, the power supply layer is used for supplying power to the whole circuit board, the power supply layer is provided with a power supply circuit, the signal layer is provided with a signal circuit, and the first conductive block and the second conductive block are electrically connected. An insulating layer is arranged between any two adjacent conducting layers; the through hole penetrates through the whole circuit board; the circuit board is provided with the blind hole, one end of the blind hole is communicated with one surface layer of the circuit board, the other end of the blind hole is communicated with the signal circuit and extends to the power circuit, and the hole wall of the blind hole is provided with the conductive coating, so that the power layer is communicated with the signal layer; the first conductive blocks are embedded in the blind holes, and the second conductive blocks connected with the first conductive blocks are arranged on the outer side of the top conductive layer or the bottom conductive layer, so that the conduction current between the power circuit and the signal circuit is further increased, the conditions of unstable load, non-uniform power distribution and the like are avoided, and the stability and the performance of the circuit of the circuit board are improved.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, and more specifically, to a circuit board with increased current. Background Art

[0002] In a multi-layer circuit board, the circuit board includes a plurality of conductive layers and a plurality of insulating layers. The conductive layers include a plurality of signal layers, a plurality of power layers, and a plurality of ground layers. The signal layers are provided with signal lines, the power layers are provided with power lines, and the ground layers are provided with ground lines; an insulating layer is provided between any two conductive layers, and the lines in each conductive layer can only be conducted between single-layer conductive layers;

[0003] Currently, due to the limitations of the board frame size and wiring, the current of the power lines in the inner layer of the circuit board is insufficient, resulting in unstable loads and uneven power distribution during the use of the circuit board, affecting the stability and performance of the circuit. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is to provide a circuit board with increased current for the problem of insufficient and unstable conduction current between the power lines and signal lines in the circuit board.

[0005] The technical solution of the utility model to solve the above technical problem is a circuit board with increased current, which is characterized by including:

[0006] A plurality of conductive layers, the conductive layers include at least one signal layer, at least one power layer, and at least one ground layer, the signal layer is provided with signal lines, the power layer is provided with power lines, and the ground layer is provided with ground lines;

[0007] A plurality of insulating layers, the insulating layers and the conductive layers are laminated in sequence, and the top layer and the bottom layer are conductive layers;

[0008] Through holes, the through holes vertically penetrate the entire circuit board;

[0009] Blind holes, one end of the blind holes penetrates the top layer or the bottom layer of the conductive layer, and the other end extends to any one of the power layers in the inner layer;

[0010] Conductive coatings, the conductive coatings are uniformly distributed on the inner walls of the through holes and the blind holes;

[0011] First conductive blocks, the first conductive blocks are arranged corresponding to the blind holes, and the first conductive blocks are embedded in the blind holes.

[0012] As a further improvement of the utility model, it further includes an ink layer, and the ink layer is provided on the upper surface of the top conductive layer and the lower surface of the bottom conductive layer.

[0013] As a further improvement of the present utility model, the ink layer is fixedly connected to the conductive layers of the top layer and the bottom layer respectively.

[0014] As a further improvement of the present utility model, it further includes a second conductive block, the second conductive block is disposed on the surface of the ink layer, and the second conductive block is fixedly connected to the first conductive block.

[0015] As a further improvement of the present utility model, it further includes an insulating sleeve, the insulating sleeve wraps the outside of the second conductive block, and the insulating sleeve is fixedly connected to the ink layer.

[0016] As a further improvement of the present utility model, it further includes a plurality of first pads, the plurality of first pads are respectively disposed on the surface of the ink layer and are connected to the conductive plating layer.

[0017] As a further improvement of the present utility model, the first pad is in a circular ring shape, and the inner diameter of the first pad corresponds to the diameters of the blind hole and the through hole.

[0018] As a further improvement of the present utility model, it further includes a plurality of second pads, the plurality of second pads are respectively located at the conductive layers where the blind hole and the through hole penetrate the inner layer.

[0019] As a further improvement of the present utility model, the second pad is in a circular ring shape, and the inner diameter of the second pad corresponds to the diameters of the blind hole and the through hole.

[0020] As a further improvement of the present utility model, the insulating layer is fixedly connected to the conductive layer.

[0021] The present utility model has the following beneficial effects: By providing blind holes in the circuit board, one end of the blind hole penetrates the upper surface or the lower surface of the circuit board, the other end conducts the signal line and extends to the power line on the power layer, and the inner wall of the blind hole is provided with a conductive plating layer to realize the conduction between the power layer and the signal layer; A conductive block is embedded in the blind hole to further increase the conduction current between the power line and the signal line in the circuit board, avoid situations such as unstable load and uneven power distribution, and effectively improve the stability and performance of the circuit board circuit. Description of the Drawings

[0022] Figure 1 is a three-dimensional view of the existing circuit board;

[0023] Figure 2 is a three-dimensional schematic diagram of a circuit board with increased current provided by an embodiment of the present utility model;

[0024] Figure 3 is a top view schematic diagram of a circuit board with increased current provided by an embodiment of the present utility model;

[0025] Figure 4 Yes Figure 3 It is a schematic cross-sectional view at A-A in the middle.

[0026] Label description: 1. Power supply layer; 2. Signal layer; 3. Ground layer; 4. Insulation layer; 5. Ink layer; 6. Conductive plating layer; 7. Through hole; 81. First pad; 82. Second pad; 83. Reserved area; 9. Blind hole; 101. First conductive block; 102. Second conductive block; 11. Insulating sleeve. Specific implementation manner

[0027] In order to make the purpose, technical solution and advantages of the present utility model more clear and understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0028] As Figure 1 shown, the multi-layer circuit board includes multiple conductive layers, multiple insulation layers 4, conductive plating layers 6 and at least one through hole 7. Among them, the conductive layers include at least one signal layer 2 and at least one power supply layer 1. The power supply layer 1 is arranged on the inner layer of the circuit board and is used to supply power to the entire circuit board. The signal layer 2 is provided with signal lines, and the power supply layer 1 is arranged on the power supply lines; an insulation layer 4 is arranged between any two conductive layers, and the lines in each conductive layer can only be conducted between single-layer conductive layers; currently, due to the limitations of the board frame size and wiring of the circuit board, the conduction current of the power supply line and the signal line is likely to be insufficient, resulting in situations such as unstable load and uneven power distribution during the use of the circuit board, greatly reducing the stability and overall performance of the circuit board.

[0029] As Figures 2 to 4 shown, it is a schematic diagram of a circuit board with increased current according to an embodiment of the present utility model. This circuit board can increase the current of the power supply line in the circuit board and improve the stability and overall performance of the circuit board; a circuit board with increased current according to an embodiment of the present utility model includes multiple conductive layers, multiple insulation layers 4, through holes 7, blind holes 9, conductive plating layers 6 and first conductive blocks 101.

[0030] The above-mentioned multiple conductive layers include at least one signal layer 2, at least one power supply layer 1 and at least one ground layer 3; the signal layer 2 is provided with signal lines, the power supply layer 1 is provided with power supply lines, and the ground layer 3 is provided with ground lines; among them, the signal layer 2 adopts a positive film design. The positive film does not have copper, and copper is only plated at the positions where wiring is required to form signal lines; the power supply layer 1 and the ground layer 3 adopt a negative film design. The negative film has copper, and the copper in the parts that do not need to be conducted is removed, and the remaining copper-plated areas form power supply lines and ground lines.

[0031] A plurality of insulating layers 4, the insulating layers 4 and the conductive layers are stacked in sequence, and the top layer and the bottom layer are conductive layers. In a specific embodiment, the top conductive layer and the bottom conductive layer are mostly signal layers 2, which is beneficial for component soldering.

[0032] Through holes 7, the through holes 7 are used to conduct signal lines, power lines and ground lines and penetrate the entire circuit board. On the one hand, it is beneficial to realize the electrical connection between components and the circuit board. On the other hand, it is beneficial to realize the conduction of different conductive layers; the number of through holes 7 is not fixed, and the diameter of the through holes 7 and the distance between the through holes 7 need to meet the process requirements. The diameter of the through holes 7 is greater than or equal to 0.2 mm, and the hole pitch between the through holes 7 is greater than or equal to 0.4 mm; the shape of the through holes 7 includes cylindrical, and the hole walls of the through holes 7 are provided with conductive coatings 6.

[0033] Blind holes 9, one end of the blind holes 9 is provided on the upper surface layer or the lower surface layer of the circuit board, and the other end conducts the signal line and extends to any power line to realize the conduction of the signal line and the power line; the shape of the blind holes 9 is not fixed, and the shape of the blind holes 9 includes cylindrical; the size of the blind holes 9 is not fixed.

[0034] Since the aperture of the through holes 7 is generally small, and the distance between the through holes 7 needs to meet the process requirements, if the distance between the through holes 7 is too close, it will cause damage to the circuit board near the through holes 7. Therefore, while using multiple through holes 7 to conduct different conductive layer lines and ensuring the distance between the through holes 7, a large amount of circuit board space will be wasted, resulting in an oversized circuit board.

[0035] Compared with the through holes 7, the blind holes 9 do not penetrate the entire circuit board, causing less damage to the circuit board; secondly, the hole pitch between the blind holes 9 is not restricted, which will not cause waste of the circuit board and is beneficial to reducing the volume of the circuit board; finally, the blind holes 9 directly conduct the power line and other lines that need to be powered, realizing power supply to the circuit board by the power line, effectively increasing the conduction current between the power line and the signal line in the circuit board.

[0036] Conductive coatings 6, the conductive coatings 6 are evenly distributed on the hole walls of the through holes 7 and the blind holes 9. In a specific embodiment, the conductive coatings 6 mostly adopt the electroless copper plating process to deposit and thicken copper on the surface of the hole walls of the through holes 7 and the blind holes 9 to form the conductive coatings 6. The through holes 7 conduct different conductive layer lines, and the blind holes 9 conduct the inner power layer 1. The conductive coatings 6 are evenly distributed on the hole walls of the through holes 7 and the blind holes 9, effectively realizing the conduction of the lines in each conductive layer. The provision of the conductive coatings 6 on the blind holes 9 can increase the conduction of the current between the power line and the signal line.

[0037] The first conductive block 101 is arranged corresponding to the blind hole 9, and the first conductive block 101 is embedded in the blind hole 9; the first conductive block 101 is cylindrical, the diameter of the first conductive block 101 is less than or equal to the diameter of the blind hole 9, the height of the first conductive block 101 corresponds to the height of the blind hole 9, and the first conductive block 101 is embedded in the blind hole 9 to realize the conduction between the power supply layer 1 and other conductive layers, effectively increasing the conduction current between the power supply layer 1 and other conductive layers; the connection manner between the first conductive block 101 and the blind hole 9 includes detachable connection or fixed connection, and the first conductive block 101 can further increase the conduction of the current in the power supply line and the signal line.

[0038] In an embodiment, the circuit board is further provided with an ink layer 5, and the ink layer 5 is arranged on the upper surface of the top conductive layer and the lower surface of the bottom conductive layer. The conductive layer and the insulating layer 4 are respectively arranged between the ink layers 5. The ink layer 5 is fixedly connected to the top and bottom conductive layers respectively, and the insulating layer 4 is fixedly connected to the conductive layer.

[0039] Specifically, the ink layer 5 is arranged on the upper surface of the top conductive layer and the lower surface of the bottom conductive layer. The conductive layer and the insulating layer 4 are respectively arranged between the ink layers 5. The ink layer 5 covers the conductive layer and the insulating layer 4 to prevent the circuits in the conductive layer from being exposed to the outside and causing short circuits; prevent the circuits in the conductive layer from being damaged by the harsh external environment; the conductive layer, the insulating layer 4 and the ink layer 5 are arranged in parallel. The ink layer 5 is fixedly connected to the top conductive layer and the bottom conductive layer. The fixed connection manner includes spraying the ink on the surfaces of the top and bottom conductive layers; the conductive layer is fixedly connected to the insulating layer 4. The conductive layer is formed by laying copper on both sides of the insulating layer 4 to realize the fixed connection between the conductive layer and the insulating layer 4.

[0040] In an embodiment, the circuit board further includes a second conductive block 102, and the second conductive block 102 is arranged on the surface of the ink layer 5 and is fixedly connected to the first conductive block 101.

[0041] Specifically, the second conductive block 102 is fixedly connected to the first conductive block 101, and the second conductive block 102 is closely attached to the surface of the ink layer 5. The shape of the second conductive block 102 is not fixed and includes a cylindrical shape; the second conductive block 102 is beneficial to installation and disassembly; further increases the conduction current between the power supply line of the power supply layer 1 and other lines, greatly improving the stability and overall performance of the circuit board.

[0042] In an embodiment, the circuit board further includes an insulating sleeve 11, and the insulating sleeve 11 is arranged outside the second conductive block 102 and wraps the second conductive block 102. The insulating sleeve 11 is fixedly connected to the ink layer 5;

[0043] Specifically, since the second conductive block 102 is disposed on the surface layer of the circuit board adjacent to the outside, an insulating sleeve 11 is provided outside the second conductive block 102. The insulating sleeve 11 wraps the second conductive block 102, and the insulating sleeve 11 is fixedly connected to the ink layer 5, so that the first conductive block 101 and the second conductive block 102 are isolated from the outside, which can effectively prevent the first conductive block 101 and the second conductive block 102 from contacting the outside, and avoid the reaction between the outside air and the first conductive block 101 and the second conductive block 102, thus preventing the circuit board from short - circuiting or having unstable current. In a specific embodiment, the insulating sleeve 11 is made of insulating materials, including polymer materials, such as plastics and rubbers. The fixed connection method between the insulating sleeve 11 and the ink layer 5 includes adhesive fixation. In one embodiment, it further includes a plurality of first pads 81. The plurality of first pads 81 are respectively disposed on the surface of the ink layer 5. The first pads 81 are circular - ring - shaped. The inner diameter of the first pads 81 corresponds to the diameters of the blind holes 9 and the through - holes 7. The inner circle of the first pads 81 is connected to the conductive coating 6.

[0044] Specifically, since the top - layer and bottom - layer conductive layers are mostly signal layers 2, the signal lines are relatively thin and components need to be soldered. To make the soldering of components and lines more stable, first pads 81 are provided at the locations where the top - layer and bottom - layer signal lines need to be conducted. The first pads 81 are in contact with the surface of the ink layer 5. The shape of the first pads 81 is circular - ring - shaped. The first pads 81 are formed by copper plating. The inner diameter of the first pads 81 corresponds to the diameters of the blind holes 9 and the through - holes 7. The outer circle of the first pads 81 is connected and conducted with the signal lines, and the inner circle of the first pads 81 is connected and conducted with the conductive coating 6. Components are soldered inside the first pads 81 to achieve precise soldering of components and realize the electrical connection between the components and the circuit board, making the electrical connection more stable. The ink layer 5 is provided with a reserved area 83. In a specific embodiment, the first pads 81 are disposed within the reserved area 83, and the blind holes 9 are disposed on the first pads 81. In another specific embodiment, the blind holes 9 are disposed within the reserved area 83.

[0045] In one embodiment, it further includes a plurality of second pads 82. The plurality of second pads 82 are respectively located at the positions where the blind holes 9 and the through - holes 7 penetrate the inner - layer conductive layer. The second pads 82 are circular - ring - shaped. The inner diameter of the second pads 82 corresponds to the diameters of the blind holes 9 and the through - holes 7.

[0046] Specifically, since the inner - layer conductive layer includes a power layer 1, and the power layer 1 is provided with power lines which need to supply power to other lines, second pads 82 are provided at the positions where conduction is required in the inner - layer conductive layer. The second pads 82 are circular - ring - shaped. The second pads 82 are formed by copper plating. The blind holes 9 and the through - holes 7 penetrate the second pads 82. The inner diameter of the second pads 82 corresponds to the diameters of the blind holes 9 and the through - holes 7. The outer circle of the second pads 82 is connected to the inner - layer conductive - layer lines, and the outer circle of the second pads 82 is connected to the conductive coating 6, which is conducive to the power lines supplying power to other circuits and conducive to the conduction between the inner - layer lines and the outer - layer lines.

[0047] The number of layers of the circuit board is the number of conductive layers, that is, the number of layers of the circuit board is the sum of the signal layer 2, the power layer 1, and the ground layer 3; the multi-layer circuit board can achieve high-density integration of circuits and fast transmission of signals; the number of layers of the circuit board and the arrangement of the conductive layers can be adjusted according to electrical performance, mechanical performance, and manufacturing cost; in a specific embodiment, the layers of the four-layer circuit board can be, in sequence, the ink layer 5, the signal layer 2, the insulating layer 4, the ground layer 3, the insulating layer 4, the power layer 1, the insulating layer 4, the signal layer 2, and the ink layer 5; the power layer 1 is adjacent to the ground layer 3 and is relatively close, which is beneficial to realizing the coupling between the power supply and the ground and is beneficial to reducing impedance; the ground layer 3 is adjacent to the signal layer 2 with the densest signal lines, forming a smaller loop area, which is beneficial to absorbing and suppressing electromagnetic radiation.

[0048] In the present utility model, while retaining the through holes 7 on the circuit board, blind holes 9 are additionally provided. One end of the blind hole 9 penetrates the upper surface layer or the lower surface layer of the circuit board, and the other end extends to the power line. A conductive coating 6 is provided on the hole wall of the blind hole 9 to increase the current conduction between the power line and the signal line. A first conductive block 101 is embedded in the blind hole 9 to achieve an increase in the conduction current between the power line and the signal line. A second conductive block 102 connected to the first conductive block 101 is provided outside the signal layers 2 on the top layer and the bottom layer, further increasing the conduction current between the power line and the signal line in the circuit board, avoiding situations such as unstable load and uneven power distribution, and effectively improving the stability and performance of the circuit board circuit.

[0049] The above is only the preferred specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any change or replacement that can be easily thought of by those skilled in the art within the technical scope disclosed by the present utility model should be covered within the protection scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the protection scope of the claims.

Claims

1. A circuit board with increased current, characterized in that: include: A plurality of conductive layers, wherein the conductive layers include at least one signal layer, at least one power layer and at least one ground layer, the signal layer is provided with a signal line, the power layer is provided with a power line, and the ground layer is provided with a ground line; A plurality of insulating layers, wherein the insulating layers and the conductive layers are stacked in sequence, and the top layer and the bottom layer are conductive layers; A through hole, wherein the through hole vertically passes through the entire circuit board; A blind hole, one end of which passes through the top or bottom conductive layer, and the other end of which extends to any power supply layer of the inner layer; A conductive coating, wherein the conductive coating is evenly distributed on the hole walls of the through hole and the blind hole; A first conductive block is disposed corresponding to the blind hole and embedded in the blind hole.

2. A circuit board with increased current according to claim 1, characterized in that: It also includes an ink layer, which is arranged on the upper surface of the top conductive layer and the lower surface of the bottom conductive layer.

3. A circuit board with increased current according to claim 2, characterized in that: The ink layer is fixedly connected to the conductive layers of the top layer and the bottom layer respectively.

4. A circuit board with increased current according to claim 3, characterized in that: It also includes a second conductive block, which is arranged on the surface of the ink layer and is fixedly connected to the first conductive block.

5. A circuit board with increased current according to claim 4, characterized in that: It also includes an insulating sleeve, which wraps the outer side of the second conductive block and is fixedly connected to the ink layer.

6. A circuit board with increased current according to claim 3, characterized in that: It also includes a plurality of first pads, which are respectively arranged on the surface of the ink layer and connected to the conductive plating layer.

7. A circuit board with increased current according to claim 6, characterized in that: The first pad is in a circular ring shape, and an inner diameter of the first pad corresponds to the diameters of the blind hole and the through hole.

8. A circuit board with increased current according to claim 1 or 6, characterized in that: It also includes a plurality of second pads, which are respectively located at the blind holes and the conductive layer where the through holes penetrate the inner layer.

9. A circuit board with increased current according to claim 8, characterized in that: The second pad is in a circular ring shape, and the inner diameter of the second pad corresponds to the diameters of the blind hole and the through hole.

10. The circuit board with increased current according to claim 1, characterized in that: The insulating layer is fixedly connected to the conductive layer.

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