Electronic component and patch magnetic element

Abstract

The utility model relates to the technical field of electronic components, and discloses an electronic component and a patch magnetic element, and the electronic component comprises a base material and an electrode configured on the base material; the electrode comprises a first metal layer, a second metal layer and a third metal layer which are sequentially connected in a stacked mode, and the first metal layer is connected to the base material; the third metal layer comprises a first welding part and a first tin climbing part which are integrally connected, the first welding part is located on the end face of the base material, and the first tin climbing part is connected to the side face of the base material; the first tin climbing part faces the base material and is designed to be of an arch structure, and the thickness of the first tin climbing part is gradually reduced from the center of the first tin climbing part to the two ends of the first tin climbing part. The reliability of the electronic component is improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic components, and particularly relates to an electronic component and a surface-mounted magnetic component. Background Art

[0002] In a surface-mounted magnetic component, electrodes are usually directly made on a substrate material for electrically connecting the head / tail of a wire coil and the pads on a PCB board. In the related art, the thickness of the electrode metal layer is uniform and the structure is simple, which is not conducive to improving the bonding force between the metal layer and the substrate and between metal layers. Moreover, after electrode welding, the contact area between the side metal layer and the solder climbing is small, which is not conducive to improving the bonding force between the electrode and the PCB pad. In the harsh vehicle-mounted application environment with long-term frequent vibration, temperature and humidity shock, and high reliability requirements, as well as in the aerospace application environment with severe high and low temperature shock and strong electromagnetic radiation, there is a risk of separation between metal layers, and there is a risk of solder joint cracking or even component dropping. Summary of the Utility Model

[0003] In view of this, the present application provides an electronic component and a surface-mounted magnetic component to solve the above technical problems.

[0004] To achieve the above object, according to the first aspect, the technical solution adopted is:

[0005] An electronic component, comprising:

[0006] A substrate and an electrode disposed on the substrate;

[0007] The electrode includes a first metal layer, a second metal layer, and a third metal layer that are sequentially laminated and connected, and the first metal layer is connected to the substrate;

[0008] The third metal layer includes a first welding portion and a first solder climbing portion that are integrally connected. The first welding portion is located at the end face of the substrate, and the first solder climbing portion is connected to the side face of the substrate;

[0009] The first solder climbing portion is designed in an arched structure facing the substrate, and the thickness of the first solder climbing portion gradually decreases from its center to both ends.

[0010] The present application is further configured such that: the third metal layer further includes a first connecting portion, the first connecting portion connects the first welding portion and the first solder climbing portion respectively, and the first connecting portion is located at the connection between the end face and the side face of the substrate; the first connecting portion has a smooth arc surface or curved surface, and the thickness of the first connecting portion is less than the thickness of the first welding portion and the first solder climbing portion.

[0011] The present application is further configured such that: the first metal layer includes a second soldering portion and a second solder climbing portion, the second soldering portion is connected to an end face of the substrate, the second solder climbing portion is attached to a side face of the substrate, and the second solder climbing portion tapers in thickness from its center to both ends thereof to construct an arcuate cross-sectional profile of the second solder climbing portion.

[0012] The present application is further configured such that: the first metal layer further includes a second connecting portion, the second connecting portion connects the second soldering portion and the second solder climbing portion respectively, and the second connecting portion is connected to a connection portion between the end face and the side face of the substrate, the second connecting portion has a smooth arc surface or curved surface, and the thickness of the second connecting portion is less than the thicknesses of the second soldering portion and the second solder climbing portion.

[0013] The present application is further configured such that: the interior of the first metal layer is a porous structure, the porosity range of the material of the first metal layer includes 20% - 85%, and the forming material of the first metal layer includes any one of silver, silver alloy, copper, copper alloy, molybdenum alloy, iron, or chromium.

[0014] The present application is further configured such that: the forming material of the third metal layer includes any one of tin, silver, or gold; the thickness range of the first soldering portion includes 5um - 30um, the thickness range of the first solder climbing portion includes 25um - 45um, and the thickness range of the first connecting portion includes 0.05um - 10um.

[0015] The present application is further configured such that: there is at least one layer of the second metal layer, and the forming material of at least one layer of the second metal layer includes any one of nickel, nickel alloy, copper, copper alloy, iron, or iron alloy; the thickness range of the second metal layer includes 1um - 10um.

[0016] The present application is further configured such that: there is a set distance between an end of the first solder climbing portion away from the first soldering portion and an end of the second metal layer, and the set distance includes 5um - 70um.

[0017] The present application is further configured such that: the thickness range of the second soldering portion includes 6um - 20um, the thickness range of the second solder climbing portion includes 4.5um - 15um, and the thickness range of the second connecting portion includes 0.2um - 3.5um.

[0018] According to the second aspect, the technical solution adopted is:

[0019] A surface-mounted magnetic component includes the electronic component described in any of the foregoing embodiments.

[0020] In summary, compared with the prior art, the present application discloses an electronic component and a surface-mounted magnetic component. The electronic component includes a substrate and an electrode. The electrode has a first metal layer, a second metal layer, and a third metal layer that are sequentially stacked and connected. The first metal layer is connected to the substrate. Among them, the third metal layer includes a first welding portion located at the end face of the substrate and a first solder climbing portion connected to the side face of the substrate. The first solder climbing portion is designed in an arched structure facing the substrate, and the thickness of the first solder climbing portion gradually decreases from its center to its two ends. That is, through the above settings, the solder climbing area of the electrode metal layer is increased, ensuring its stable connection with the external environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0022] Figure 1 is a schematic structural diagram of the electronic component in this embodiment;

[0023] Figure 2 is a schematic diagram of the welding process of the electronic component in this embodiment. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] Here, the exemplary embodiments will be described in detail, and the examples are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0025] It should be noted that in this article, the term "including", "comprising", or any other variant thereof is intended to cover non-exclusively, so that a process, method, article, or device including a series of elements not only includes those elements but also includes other elements not explicitly listed, or further includes elements inherent to such a process, method, article, or device. Without further limitations, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article, or device including that element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined based on their explanations in the specific embodiments or further in combination with the context of the specific embodiments.

[0026] It should be understood that the specific embodiments described herein are merely for explaining the present application and are not intended to limit the present application.

[0027] In the following description, suffixes such as "module", "component", or "unit" used to represent elements are only for the convenience of explaining the present application, and they have no specific meaning in themselves. Therefore, "module", "component", or "unit" can be used interchangeably.

[0028] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0029] The technical solution shown in the present application will be described in detail below through specific embodiments. It should be noted that the description order of the following embodiments does not limit the priority order of the embodiments.

[0030] Reference Figure 1 , the electronic component of this embodiment includes a base material 100 and an electrode 200. The electrode 200 can be stably disposed on the base material 100, thereby realizing the dual functions of electrical connection and mechanical support.

[0031] The electrode 200 includes a first metal layer 1, a second metal layer 2, and a third metal layer 3 that are sequentially stacked and connected. Among them, the first metal layer 1 is connected to the base material 100, that is, the electronic component is sequentially connected in the order of the base material 100, the first metal layer 1, the second metal layer 2, and the third metal layer 3. This stacked structure can provide better mechanical strength and electrical performance, and through the design optimization of different metal layers, the bonding force between the electrode 200 and the base material 100 is enhanced, and the overall reliability of the electronic component is improved.

[0032] The third metal layer 3 of this embodiment includes a first welding portion 31 and a first solder climbing portion 32 that are integrally connected. The first welding portion 31 is located at the end face A of the base material 100, and the first solder climbing portion 32 is connected to the side face B of the base material 100.

[0033] It should be noted that the end face A is the surface for welding and connecting the electronic component to an external component or a PCB pad, and the side face B is used for the solder paste to adhere during this welding process, so as to ensure the effective connection between the electronic component and the outside.

[0034] Among them, the first solder climbing part 32 is designed in an arched structure facing the base material 100, and the thickness of the first solder climbing part 32 gradually decreases from its center to both ends. That is, for the arched first solder climbing part 32, its structural thickness gradually decreases from the direction away from the base material 100 towards the direction close to the base material 100. Thereby, the first solder climbing part 32 has a larger surface area, that is, the solder climbing area during the welding of the electrode 200 to the outside is increased, thereby improving the bonding force between the electrode 200 and the outside and ensuring the stable connection between the electronic component and the external environment.

[0035] On the other hand, the first solder climbing part 32 is designed in an arched structure facing the base material 100, and the thickness of the first solder climbing part 32 gradually decreases from its center to both ends, which can also effectively reduce the stress concentration of the metal layer, help to evenly distribute the mechanical stress, avoid stress concentration at a specific point, and thus reduce the risk of cracks or separation between metal layers in the electrode 200.

[0036] In one embodiment, for the first solder climbing part 32 designed in an arched structure and with its thickness gradually decreasing from its center to both ends, which has a crescent cross-sectional profile, the mechanical properties of the first solder climbing part 32 can be optimized based on this crescent profile, while ensuring a large surface area of the first solder climbing part 3.

[0037] In the specific implementation process, the third metal layer 3 further includes a first connecting part 33. The first connecting part 33 connects the first welding part 31 and the first solder climbing part 32 respectively. Specifically, the first connecting part 33 is located at the connection of the end face A and the side face B of the base material 100, and the first connecting part 33 has a smooth arc surface or curved surface.

[0038] The first connecting part 33 of this embodiment serves as a connection transition between the first welding part 31 and the first solder climbing part 32, and is configured at the connection of the end face A and the side face B of the base material 100. With its smooth arc surface or curved surface, it fits the profile of the base material 100, thereby ensuring the integral connection of the first welding part 31 and the first solder climbing part 32. Among them, the thickness of the first connecting part 33 is less than the thicknesses of the first welding part 31 and the first solder climbing part 32 to ensure the regular shape of the metal layer of the electrode 200, and when the electronic component is welded to an external component or a PCB pad, the third metal layer 3 can accommodate more solder.

[0039] It should be noted that the base material 100 can be made of various materials, including but not limited to soft magnetic materials and ceramic materials, to meet different application requirements. For example, soft magnetic materials are used to improve magnetic properties and reduce energy loss, while ceramic materials provide excellent high-temperature resistance and insulation properties.

[0040] In one embodiment, the thickness range of the first welding part 31 includes 5um - 30um to ensure the sufficient thickness of the first welding part 31 for the effective welding of the electrode 200 to the outside.

[0041] In one embodiment, the thickness range of the first solder climbing portion 32 includes 25um - 45um, and this thickness range ensures the solder climbing area of the electrode 200 during the soldering process.

[0042] In one embodiment, the thickness range of the first connecting portion 33 includes 0.05um - 10um, so as to achieve a more delicate structural transition, reduce stress concentration, and improve the reliability of the overall structure of the electrode 200.

[0043] In the specific implementation process, the first metal layer 1 includes a second soldering portion 11 and a second solder climbing portion 12. The second soldering portion 11 is connected to the end face A of the substrate 100, and the second solder climbing portion 12 is attached to the side face B of the substrate 100. Moreover, the thickness of the second solder climbing portion 12 gradually decreases from its center to both ends, that is, the second solder climbing portion 12 matches the first solder climbing portion 32 through this structural design, and also makes the second solder climbing portion 12 have a larger surface area, improving the bonding force between the first metal layer 1 and the substrate 100, and ensuring the stable connection between the metal layers of the electrode 200.

[0044] In one embodiment, the thickness of the second solder climbing portion 12 gradually decreases from its center to both ends, that is, the structural thickness of the second solder climbing portion 12 gradually decreases from the direction away from the substrate 100 to the direction close to the substrate 100, so as to construct the arcuate cross-sectional profile of the second solder climbing portion 12.

[0045] The first metal layer 1 further includes a second connecting portion 13. The second connecting portion 13 is respectively connected to the second soldering portion 11 and the second solder climbing portion 12, and the second connecting portion 13 is connected to the connection part of the end face and the side face of the substrate 100. The second connecting portion 13 has a smooth arc surface or curved surface, and the thickness of the second connecting portion 13 is less than the thicknesses of the second soldering portion 11 and the second solder climbing portion 12.

[0046] The second connecting portion 13 of this embodiment serves as the connection transition between the second soldering portion 11 and the second solder climbing portion 12, and is configured at the connection part of the end face A and the side face B of the substrate 100. Its smooth arc surface or curved surface cooperates with the contour of the substrate 100, thereby ensuring the integral connection of the second soldering portion 11 and the second solder climbing portion 12, and improving the bonding force between the first metal layer 1 and the substrate 100. Among them, the thickness of the second connecting portion 13 is less than the thicknesses of the second soldering portion 11 and the second solder climbing portion 12, so as to ensure the regular shape of the metal layer of the electrode 200, and when the electronic component is soldered to an external component or a PCB pad, the electrode 200 can accommodate more solder.

[0047] It should be noted that the inside of the first metal layer 1 is a porous structure, and the range of the material porosity of the first metal layer 1 includes 20% - 85%, which can improve the adhesion of the first metal layer 1 to the substrate 100.

[0048] In a specific implementation process, the forming material of the first metal layer 1 includes any one of silver, silver alloy, copper, copper alloy, molybdenum alloy, iron or chromium, and the forming material of the third metal layer 3 includes any one of tin, silver or gold to meet different conductivity and strength requirements of the electrode 200.

[0049] In one embodiment, the thickness range of the second welding part 11 includes 6um - 20um, the thickness range of the second solder climbing part 12 includes 4.5um - 15um, and the thickness range of the second connecting part 13 includes 0.2um - 3.5um, thereby ensuring the welding thickness of the electrode 200, ensuring the solder climbing area of the electrode 200 during the welding process, and improving the reliability of the overall structure of the electrode 200.

[0050] It should be noted that the second metal layer 2 has at least one layer, and the forming material of the at least one layer of the second metal layer 2 includes any one of nickel, nickel alloy, copper, copper alloy, iron, and iron alloy, thereby ensuring the stable connection of the second metal layer 2 with the first metal layer 1 and the third metal layer 3 respectively, improving the overall connection strength of the electrode 200, and avoiding the separation between metal layers.

[0051] In one embodiment, there are two or three layers of the second metal layer 2 between the first metal layer 1 and the third metal layer 3.

[0052] In one embodiment, the thickness range of the second metal layer 2 includes 1um - 10um.

[0053] In one embodiment, one end of the first solder climbing part 32 far from the first welding part 31 has a set distance H from the end of the second metal layer 2. The set distance H includes 5um - 70um. Thus, the size of the thickness of the first solder climbing part 32 of the arched structure design that tapers from its center to its two ends is limited, avoiding the end of the first solder climbing part 32 being too narrow to make insufficient contact with the base material 100 or having unstable connection.

[0054] In one embodiment, the electrode 200 of this embodiment has a first metal layer 1, two layers of the second metal layer 2, and a third metal layer 3. Specifically, the forming material of the first metal layer 1 is silver, the forming material of one layer of the second metal layer 2 is copper, the forming material of the other second metal layer 2 is nickel, and the forming material of the third metal layer 3 is tin.

[0055] Reference Figure 1 and Figure 2, during the assembly process of the electronic component of this embodiment with the PCB board 300, first, a solder paste layer 400 can be brushed on the installation position of the PCB board 300, and then the electronic component including the substrate 100 and the electrode 200 is connected to the solder paste layer 400. Then, the solder paste of the solder paste layer 400 is forced to overflow and creep along the side of the electrode 200, especially the first solder creep part 32 of the third metal layer 3. Based on the structural design of the first metal layer 1, the second metal layer 2, and the third metal layer 3 of the electrode 200 in the foregoing embodiment, the electronic component has a larger solder creep area, that is, the solder paste contacts more with the metal layers of the electrode 200. After reflow soldering, a stable and firm solder joint 500 is formed between the electrode 200 of the electronic component and the PCB board 300. Therefore, in the harsh vehicle-mounted application environment with long-term frequent vibrations, temperature and humidity shocks, and high reliability requirements, as well as in the aerospace application environment with severe high and low temperature shocks and strong electromagnetic radiation, the electronic component of this embodiment can be safely and stably connected to the outside world, avoiding the risk of separation between metal layers and the risk of solder joint cracking or even component dropping.

[0056] This embodiment also discloses a surface-mounted magnetic component. The surface-mounted magnetic component includes the electronic component of any of the above embodiments. Compared with the existing surface-mounted magnetic components, the surface-mounted magnetic component of this embodiment has a more excellent electrode structure design, ensuring the solder creep area of the electrode metal layer and the stable connection between metal layers. Therefore, in the harsh vehicle-mounted application environment with long-term frequent vibrations, temperature and humidity shocks, and high reliability requirements, as well as in the aerospace application environment with severe high and low temperature shocks and strong electromagnetic radiation, the surface-mounted magnetic component of this embodiment can be safely and stably connected to the outside world.

[0057] For other working principles and processes of the surface-mounted magnetic component of this embodiment, refer to the description of the electronic component in the foregoing embodiment, which will not be elaborated here.

[0058] The above has introduced in detail an electronic component and a surface-mounted magnetic component provided by this application. Specific examples are used in this article to elaborate on the principle and implementation manner of this application. It should be noted that in this application, the descriptions of each embodiment have their own emphases. For parts not detailed or recorded in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0059] The above is only the preferred embodiment of this application, and it does not limit the patent scope of this application. The technical features of the technical solutions of this application can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above embodiments are described. Any equivalent structural or equivalent process transformation made by using the content of the specification and drawings of this application, or directly or indirectly applied in other related technical fields, as long as the combination of these technical features does not conflict, is equally included in the patent protection scope of this application.

Claims

1. An electronic component, characterized in that: include: A substrate and an electrode disposed on the substrate; The electrode comprises a first metal layer, a second metal layer and a third metal layer which are stacked and connected in sequence, wherein the first metal layer is connected to the substrate; The third metal layer includes a first welding portion and a first creeping tin portion which are integrally connected, the first welding portion is located at the end surface of the substrate, and the first creeping tin portion is connected to the side surface of the substrate; The first tin-climbing portion is designed to be an arched structure facing the substrate, and the thickness of the first tin-climbing portion gradually decreases from the center to both ends thereof.

2. The electronic component according to claim 1, wherein: The third metal layer also includes a first connecting portion, which connects the first welding portion and the first tin-climbing portion respectively, and is located at the connection between the end face and the side face of the substrate; the first connecting portion has a smooth arc surface or a curved surface, and the thickness of the first connecting portion is less than the thickness of the first welding portion and the first tin-climbing portion.

3. The electronic component according to claim 1, wherein: The first metal layer includes a second welding portion and a second creeping tin portion, the second welding portion is connected to the end surface of the substrate, the second creeping tin portion is attached to the side surface of the substrate, and the thickness of the second creeping tin portion gradually decreases from the center to both ends to construct an arched cross-sectional profile of the second creeping tin portion.

4. The electronic component according to claim 3, wherein: The first metal layer also includes a second connecting portion, which is respectively connected to the second welding portion and the second creeping tin portion, and is connected to the connection between the end face and the side face of the substrate, the second connecting portion has a smooth arc surface or curved surface, and the thickness of the second connecting portion is less than the thickness of the second welding portion and the second creeping tin portion.

5. The electronic component according to claim 1, wherein: The interior of the first metal layer is a loose porous structure, the material porosity of the first metal layer ranges from 20% to 85%, and the forming material of the first metal layer includes any one of silver, silver alloy, copper, copper alloy, molybdenum alloy, iron or chromium.

6. The electronic component according to claim 2, wherein: The forming material of the third metal layer includes any one of tin, silver or gold; the thickness range of the first welding part includes 5um-30um, the thickness range of the first creeping tin part includes 25um-45um, and the thickness range of the first connecting part includes 0.05um-10um.

7. The electronic component according to claim 1, wherein: The second metal layer is at least one layer, and the forming material of the at least one layer of the second metal layer includes any one of nickel, nickel alloy, copper, copper alloy, iron, and iron alloy; the thickness range of the second metal layer includes 1um-10um.

8. The electronic component according to claim 1, wherein: An end of the first tin-climbing portion away from the first welding portion has a set distance from an end of the second metal layer, and the set distance includes 5um-70um.

9. The electronic component according to claim 4, wherein: The thickness range of the second welding portion includes 6um-20um, the thickness range of the second tin-climbing portion includes 4.5um-15um, and the thickness range of the second connecting portion includes 0.2um-3.5um.

10. A patch magnetic component, characterized in that: The electronic component comprises the electronic component according to any one of claims 1 to 9.

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