Electromagnetic heat dissipation structure of vehicle-mounted equipment

Abstract

The utility model provides a vehicle-mounted equipment electromagnetic heat dissipation structure, the vehicle-mounted equipment electromagnetic heat dissipation structure comprises a circuit board assembly, a heat dissipation shell and an inductance magnet, and the circuit board assembly comprises a main board component and an auxiliary board component; the heat dissipation shell and the mainboard component are arranged in a stacked mode. The heat dissipation shell is used for containing a flowable liquid metal working medium, and the liquid metal working medium is used for dissipating heat of the mainboard component; the inductance magnet and the heat dissipation shell are oppositely and fixedly arranged; the inductance magnet and the auxiliary plate component are oppositely arranged in the stacking direction of the heat dissipation shell and the main plate component, and the inductance magnet is used for being electrically connected with the auxiliary plate component so as to drive the liquid metal working medium to flow. According to the vehicle-mounted equipment electromagnetic heat dissipation structure provided by the invention, heat dissipation is performed on the circuit board assembly through the flowing liquid metal working medium to prevent the mainboard component from being overheated, so that the probability of damage of components on the mainboard component is reduced, and the stability of the mainboard component in the working process is improved.

Description

Technical Field

[0001] This application belongs to the technical field of heat dissipation for vehicle-mounted devices, and particularly relates to an electromagnetic heat dissipation structure for vehicle-mounted devices. Background Art

[0002] With the improvement of consumer demands and the continuous development and optimization of agricultural machinery equipment, agricultural vehicle-mounted products have emerged. However, in the agricultural vehicle-mounted products provided by the prior art, due to the relatively high performance of the agricultural vehicle-mounted products used in agricultural machinery equipment, the overall power consumption of agricultural machinery equipment is relatively large. As the CPU module and 5G module in agricultural vehicle-mounted products, their heat generation is also relatively large. At the same time, agricultural machinery equipment needs to operate in an outdoor high-temperature environment, which easily causes the circuit board of the agricultural vehicle-mounted product to overheat. When the overheating is severe, it will cause damage to the electronic components on the circuit board of the agricultural vehicle-mounted product, and thus easily affect the normal use of the agricultural vehicle-mounted product. Summary of the Utility Model

[0003] In view of the deficiencies of the prior art, this application provides an electromagnetic heat dissipation structure for vehicle-mounted devices, which can dissipate heat from the main board component of the circuit board assembly through a flowing liquid metal working medium to prevent the main board component from overheating, thereby reducing the probability of damage to the components on the main board component due to heat generation during the working process, and improving the stability of the main board component during the working process.

[0004] On the one hand, this application provides an electromagnetic heat dissipation structure for vehicle-mounted devices, including:

[0005] A circuit board assembly, including a main board component and a secondary board component;

[0006] A heat dissipation housing, which is stacked with the main board component; the heat dissipation housing is used to accommodate a flowable liquid metal working medium, and the liquid metal working medium is used to dissipate heat from the main board component; and

[0007] An inductor magnet, which is relatively fixedly arranged with the heat dissipation housing; the inductor magnet and the secondary board component are oppositely arranged along the direction in which the heat dissipation housing and the main board component are stacked, and the inductor magnet is used to be electrically connected to the secondary board component to drive the liquid metal working medium to flow.

[0008] In a possible implementation, the main board member includes a circuit board, a first heating element, and a second heating element. The auxiliary board member, the first heating element, and the second heating element are all disposed on the circuit board. The heat dissipation housing includes a first heat dissipation cavity, a second heat dissipation cavity, and a communication cavity. The communication cavity communicates the first heat dissipation cavity with the second heat dissipation cavity. The first heat dissipation cavity and the first heating element are disposed opposite to each other along the stacking direction of the heat dissipation housing and the main board member. The second heat dissipation cavity and the second heating element are disposed opposite to each other along the stacking direction of the heat dissipation housing and the main board member. The communication cavity is disposed opposite to the auxiliary board member.

[0009] In a possible implementation, the first heating element is spaced apart from the surface of the heat dissipation housing corresponding to the first heat dissipation cavity, and a first heat conducting member is disposed between the first heating element and the heat dissipation housing. The second heating element is spaced apart from the surface of the heat dissipation housing corresponding to the second heat dissipation cavity, and a second heat conducting member is disposed between the second heating element and the heat dissipation housing.

[0010] In a possible implementation, the number of inductance magnets is multiple, and the multiple inductance magnets are annularly disposed on the heat dissipation housing, and any two adjacent inductance magnets are spaced apart.

[0011] In a possible implementation, the electromagnetic heat dissipation structure of the vehicle-mounted device further includes a heat dissipation plate, and the thermal conductivity of the heat dissipation plate is greater than or equal to 210 W / (M*K). The heat dissipation plate is disposed on a side of the heat dissipation housing facing away from the circuit board assembly.

[0012] In a possible implementation, the heat dissipation housing has a mounting hole, and the mounting hole penetrates along the stacking direction of the heat dissipation housing and the main board member, and the mounting hole is not communicated with the heat dissipation cavity. The inductance magnet is received in the mounting hole and fixed to a side of the heat dissipation plate facing the heat dissipation housing.

[0013] In a possible implementation, the electromagnetic heat dissipation structure of the vehicle-mounted device further includes a housing structure and a display screen. The housing structure has a receiving cavity, and the display screen is disposed outside the receiving cavity and electrically connected to the circuit board assembly. The circuit board assembly is received in the receiving cavity, a part of the heat dissipation housing is disposed outside the receiving cavity, and another part of the heat dissipation housing extends into the receiving cavity.

[0014] In a possible implementation, a heat dissipation step is provided on the heat dissipation housing, and the heat dissipation step protrudes toward the circuit board assembly. An avoidance hole communicating with the receiving cavity is provided on the housing structure, and the heat dissipation step passes through the avoidance hole and contacts the main board member of the circuit board assembly.

[0015] In a possible implementation manner, the housing structure includes a first housing, a second housing, and a sealing ring. The first housing and the second housing are covered to form the accommodation cavity, and the sealing ring is disposed between the first housing and the second housing to seal the accommodation cavity.

[0016] In a possible implementation manner, the electromagnetic heat dissipation structure of the vehicle-mounted device includes an electrical connector, and the electrical connector is connected between the auxiliary board member and the inductive magnet; the electrical connector can extend or contract along the stacking direction of the circuit board assembly and the heat dissipation housing.

[0017] The electromagnetic heat dissipation structure of the vehicle-mounted device provided by this application is electrically connected to the auxiliary board member through the inductive magnet. After the inductive magnet is energized, a magnetic field is formed to enable the liquid metal working medium disposed in the heat dissipation housing to flow. Moreover, the heat dissipation housing and the main board member are oppositely arranged, so that the liquid metal working medium in the heat dissipation housing can dissipate heat from the main board member of the circuit board assembly. Thus, the electromagnetic heat dissipation structure of the vehicle-mounted device provided by this application can prevent the main board member from overheating, and further reduce the probability of damage to the components on the main board member due to heat generation during the working process, and improve the stability of the main board member during the working process. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions of the embodiments of this application, the drawings required to be used in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some implementation manners provided by the embodiments of this application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 is an assembly structure diagram of an electromagnetic heat dissipation structure of a vehicle-mounted device provided by an embodiment of this application;

[0020] Figure 2 is an exploded structure diagram of an electromagnetic heat dissipation structure of a vehicle-mounted device provided by an embodiment of this application;

[0021] Figure 3 is a cross-sectional view of an electromagnetic heat dissipation structure of a vehicle-mounted device provided by an embodiment of this application;

[0022] Figure 4 is a structure diagram of a circuit board assembly provided by an embodiment of this application;

[0023] Figure 5 is an exploded structure diagram of a heat dissipation component provided by an embodiment of this application;

[0024] Figure 6It is an exploded view structure diagram of a heat dissipation housing provided by an embodiment of the present application;

[0025] Figure 7 It is a structure diagram of a second housing provided by an embodiment of the present application. Detailed implementation manners

[0026] Next, the technical solutions of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described implementation manners are only a part of the implementation manners of the present application, rather than all of the implementation manners. Based on the implementation manners in the present application, all other implementation manners obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0027] The descriptions of the following embodiments are with reference to the attached drawings, which are used to illustrate specific embodiments in which the present application can be implemented. The directional terms mentioned in the description of the present application, for example, "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "top surface", "side surface", "bottom surface", "top wall", "side wall", "bottom wall", "inner side wall", "peripheral side wall", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer description and understanding of the present application, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present application. In the description of the present application, the "connection" and "coupling" involved, unless otherwise specified, both include direct connection (coupling) and indirect connection (coupling).

[0028] With the improvement of consumer demands and the continuous development and optimization of agricultural machinery equipment, agricultural machinery vehicle-mounted products have emerged as the times require. However, in the agricultural machinery vehicle-mounted products provided by the prior art, due to the relatively high performance of the agricultural machinery vehicle-mounted products used in agricultural machinery equipment, the overall power consumption of the agricultural machinery equipment is relatively large. As the CPU module and 5G module in the agricultural machinery vehicle-mounted products, their heat generation is also relatively large. At the same time, agricultural machinery equipment needs to operate in an outdoor high-temperature environment, which is likely to cause the circuit board of the agricultural machinery vehicle-mounted products to overheat. When the overheating is severe, it will cause damage to the electronic components on the circuit board of the agricultural machinery vehicle-mounted products, and thus easily affect the normal use of the agricultural machinery vehicle-mounted products.

[0029] To solve the technical problems generated by the above-mentioned prior art:

[0030] The present application provides an electromagnetic heat dissipation structure for vehicle-mounted equipment. The electromagnetic heat dissipation structure for vehicle-mounted equipment provided by the present application includes but is not limited to being applied to agricultural machinery equipment, engineering machinery equipment, transportation equipment, mining equipment, industrial control equipment, medical equipment, etc. The present application does not make any restrictions on this.

[0031] Please refer to Figures 1 to 3, Figure 1 is an assembly structure diagram of an electromagnetic heat dissipation structure of a vehicle-mounted device provided by an embodiment of the present application, Figure 2 is an exploded structure diagram of an electromagnetic heat dissipation structure of a vehicle-mounted device provided by an embodiment of the present application, Figure 3 is a cross-sectional view of an electromagnetic heat dissipation structure of a vehicle-mounted device provided by an embodiment of the present application.

[0032] In one embodiment, taking the electromagnetic heat dissipation structure 1000 of the vehicle-mounted device as a display device as an example, the electromagnetic heat dissipation structure 1000 of the vehicle-mounted device includes a heat dissipation member 100, a housing structure 200, and a display screen 300. The housing structure 200 has a receiving cavity 201. Part of the heat dissipation member 100 is received in the receiving cavity 201, and another part of the heat dissipation member 100 is disposed outside the receiving cavity 201. The display screen 300 is disposed outside the receiving cavity 201.

[0033] The heat dissipation member 100 of the electromagnetic heat dissipation structure 1000 of the vehicle-mounted device includes a circuit board assembly 10 and a heat dissipation assembly 20. The circuit board assembly 10 is used for electrically connecting with the display screen 300. The heat dissipation assembly 20 is stacked with the circuit board assembly 10. The heat dissipation assembly 20 is used for dissipating heat from the circuit board assembly 10 to reduce damage to the electronic components on the circuit board assembly 10 due to overheating, thereby ensuring that the circuit board assembly 10 can operate normally.

[0034] The housing structure 200 includes a first housing 202, a second housing 203, and a seal 204. The first housing 202 and the second housing 203 are covered and combined to form a receiving cavity 201. The seal 204 is clamped between the peripheral edge of the side of the first housing 202 facing the second housing 203 and the peripheral edge of the side of the second housing 203 facing the first housing 202, so that the receiving cavity 201 formed after the first housing 202 and the second housing 203 are covered has better sealing performance, and thus the waterproof performance of the display screen 300 is better.

[0035] The circuit board assembly 10 is disposed in the receiving cavity 201 formed by the first housing 202 and the second housing 203. Part of the heat dissipation assembly 20 is disposed on the side of the second housing 203 facing away from the first housing 202, and another part of the heat dissipation assembly 20 penetrates through the second housing 203 and extends into the receiving cavity 201 formed by the first housing 202 and the second housing 203. The display screen 300 is disposed on the side of the first housing 202 facing away from the second housing 203. The display screen 300 is bonded and fixed to the first housing 202 by a foam adhesive.

[0036] It should be understood that the assembly process of the electromagnetic heat dissipation structure 1000 of the vehicle-mounted device is as follows:

[0037] First, install the display screen 300 on the side of the first housing 202 facing away from the second housing 203, and apply pressure for 15 seconds through a pressure maintaining fixture.

[0038] Then, the heat dissipation component 20 is installed on one side of the second housing 203 facing away from the first housing 202, and the heat dissipation component 20 is locked to the heat dissipation component 20 screw position by screws.

[0039] Then, the seal 204 is disposed on one side of the second housing 203 facing the first housing 202.

[0040] Then, the circuit board assembly 10 is installed on one side of the second housing 203 facing the first housing 202, and the circuit board assembly 10 is locked to the circuit board screw position by screws.

[0041] Finally, the first housing 202 installed with the display screen 300 is mounted on the second housing 203 installed with the heat dissipation component 20, the seal 204 and the circuit board assembly 10, and the first housing 202 and the second housing 203 are fixed by a screw locking process.

[0042] Please refer to Figures 2 to 5 , Figure 4 which is a structural diagram of a circuit board assembly provided by an embodiment of the present application, Figure 5 and which is an exploded structural diagram of a heat dissipation component provided by an embodiment of the present application.

[0043] In one embodiment, the heat dissipation member 100 of the in-vehicle device electromagnetic heat dissipation structure 1000 includes a circuit board assembly 10 and a heat dissipation component 20. The circuit board assembly 10 includes a main board member 11 and a sub-board member 12. The heat dissipation component 20 includes a heat dissipation housing 21 and an inductive magnet 22. The heat dissipation housing 21 is stacked with the main board member 11. The heat dissipation housing 21 is used to accommodate a flowable liquid metal working medium, and the liquid metal working medium is used to dissipate heat from the main board member 11 during the flowing process. The inductive magnet 22 is fixedly arranged opposite to the heat dissipation housing 21, and the inductive magnet 22 and the sub-board member 12 are arranged opposite to each other along the stacking direction of the heat dissipation housing 21 and the main board member 11. The inductive magnet 22 is electrically connected to the sub-board member 12 to drive the liquid metal working medium to flow in the heat dissipation housing 21.

[0044] The electromagnetic heat dissipation structure 1000 of the vehicle-mounted device provided by the present application is electrically connected to the auxiliary board member 12 through the inductive magnet 22. After the inductive magnet 22 is energized, a magnetic field is formed to enable the liquid metal working medium arranged in the heat dissipation housing 21 to flow. Moreover, the heat dissipation housing 21 is arranged opposite to the main board member 11, so that the liquid metal working medium in the heat dissipation housing 21 can dissipate heat from the main board member 11 of the circuit board assembly 10. Thus, in the electromagnetic heat dissipation structure 1000 of the vehicle-mounted device provided by the present application, the electromagnetic force of the inductive magnet 22 is used to drive the liquid metal working medium in the heat dissipation housing 21 to flow so as to dissipate heat from the main board member 11, which can prevent the main board member 11 from overheating, and further reduce the probability that the components on the main board member 11 are damaged due to heat generation during the working process of the main board member 11, and improve the stability of the electromagnetic heat dissipation structure 1000 of the vehicle-mounted device during the working process.

[0045] It should be understood that the heat dissipation principle of the heat dissipation member 100 of the electromagnetic heat dissipation structure 1000 of the vehicle-mounted device: by controlling the magnetic field of the inductive magnet 22 through a changing current, the liquid metal working medium is subjected to the thrust of the changing magnetic field, so that the liquid metal working medium flows in the heat dissipation housing 21, and further realizes the flowing heat dissipation of the pressing table metal working medium to the main board member 11 of the circuit board assembly 10.

[0046] Please refer to Figures 2 to 6 , Figure 6 which is an exploded view of a heat dissipation housing provided by an embodiment of the present application.

[0047] In one embodiment, the main board member 11 includes a circuit board 111, a first heat generating component 112 and a second heat generating component 113. The auxiliary board member 12, the first heat generating component 112 and the second heat generating component 113 are all arranged on the circuit board 111. Taking the application of the electromagnetic heat dissipation structure 1000 of the vehicle-mounted device to the display device as an example, the first heat generating component 112 of the main board member 11 is a CPU module, and the second heat generating component 113 of the main board member 11 is a 5G module. It should be understood that the first heat generating component 112 and the second heat generating component 113 can be other electronic components or electronic modules, and the present application does not limit this.

[0048] In a specific embodiment, the secondary board member 12 is provided with secondary board screw positions, and the secondary board member 12 is fixed to the circuit board 111 of the main board member 11 by screwing the screws at the secondary board screw positions. On the side of the secondary board member 12 facing away from the circuit board 111, there is also an electrical conduction position, which is used for electrically connecting with the inductor magnet 22, so that after the inductor magnet 22 is energized, an electromagnetic field is formed, thereby driving the liquid metal working medium to flow in the heat dissipation housing 21. The heat dissipation assembly 20 of the heat dissipation member 100 further includes an electrical connection member 23, which is arranged in the second housing 203 through a riveting process, and the electrical connection member 23 exposes opposite sides of the second housing 203. The electrical connection member 23 is electrically connected between the electrical conduction position of the secondary board member 12 and the inductor magnet 22, that is, one end of the electrical connection member 23 is electrically connected to the inductor magnet 22, and the other end of the electrical connection member 23 is in electrical contact with the electrical conduction position of the secondary board member 12.

[0049] It should be understood that in the vehicle-mounted device electromagnetic heat dissipation structure 1000 provided by the present application, the electrical connection member 23 is an elastic telescopic needle. Through the setting of the elastic telescopic needle, the electrical connection stability between the inductor magnet and the electrical conduction position of the secondary board member 12 is better, and thus the stability of driving the liquid metal working medium to flow after the inductor magnet 22 is energized can be improved.

[0050] In one embodiment, the heat dissipation housing 21 of the heat dissipation member 100 includes a first cover plate 211 and a second cover plate 212. The second cover plate 212 and the first cover plate 211 are covered and combined to form a first heat dissipation cavity 213, a second heat dissipation cavity 214 and a communication cavity 215. The communication cavity 215 communicates the first heat dissipation cavity 213 with the second heat dissipation cavity 214. The liquid metal working medium is arranged in the first heat dissipation cavity 213, the second heat dissipation cavity 214 and the communication cavity 215, and the liquid metal working medium can flow in the first heat dissipation cavity 213, the second heat dissipation cavity 214 and the communication cavity 215 under the action of the electromagnetic force of the inductor magnet 22. The first heat dissipation cavity 213 and the first heat generating member 112 are oppositely arranged along the stacking direction of the heat dissipation housing 21 and the main board member 11, the second heat dissipation cavity 214 and the second heat generating member 113 are oppositely arranged along the stacking direction of the heat dissipation housing 21 and the main board member 11, and the communication cavity 215 is oppositely arranged with the secondary board member 12.

[0051] It should be understood that the process of pouring the liquid metal working medium into the heat dissipation housing 21 is as follows:

[0052] First, pour the liquid metal working medium into the first cover plate 211 of the heat dissipation housing 21.

[0053] Then, assemble the second cover plate 212 of the heat dissipation housing 21, and make the second cover plate 212 and the second cover plate 212 cover and combine through a laser welding process, leaving a sealing hole 210.

[0054] Then, perform a vacuum pumping process on the covered heat dissipation housing 21 through the sealing hole 210.

[0055] Finally, weld and seal the sealing hole 210 to prevent the liquid metal working medium from flowing out of the heat dissipation housing 21.

[0056] Please refer to Figures 2 to 6 , in one embodiment, the first heating element 112 is spaced from the surface of the heat dissipation housing 21 corresponding to the first heat dissipation cavity 213, and a first heat conducting member 24 is disposed between the first heating element 112 and the heat dissipation housing 21. The second heating element 113 is spaced from the surface of the heat dissipation housing 21 corresponding to the second heat dissipation cavity 214, and a second heat conducting member 25 is disposed between the second heating element 113 and the heat dissipation housing 21. Thus, the heat generated by the first heating element 112 flows to the position of the heat dissipation housing 21 corresponding to the first heat dissipation cavity 213 through the first heat conducting member 24, and then is dissipated by the liquid metal working medium flowing in the first heat dissipation cavity 213. Among them, by providing the first heat conducting member 24, the speed at which the heat generated by the first heating element 112 is transmitted to the surface of the heat dissipation housing 21 corresponding to the first heat dissipation cavity 213 can be increased, so that the first heating element 112 can dissipate heat in time. The heat generated by the second heating element 113 flows to the position of the heat dissipation housing 21 corresponding to the second heat dissipation cavity 214 through the second heat conducting member 25, and then is dissipated by the liquid metal working medium flowing in the second heat dissipation cavity 214. Among them, by providing the second heat conducting member 25, the speed at which the heat generated by the second heating element 113 is transmitted to the surface of the heat dissipation housing 21 corresponding to the second heat dissipation cavity 214 can be increased, so that the second heating element 113 can dissipate heat in time.

[0057] In a specific embodiment, both the first heat conducting member 24 and the second heat conducting member 25 are thermal conductive gels. By discharging the air between the first heating element 112 and the surface of the heat dissipation housing 21 corresponding to the first heat dissipation cavity 213 through the thermal conductive gel, and discharging the air between the second heating element 113 and the surface of the heat dissipation housing 21 corresponding to the second heat dissipation cavity 214 through the thermal conductive gel, the barrier of air to the heat conduction of the first heating element 112 and the second heating element 113 can be reduced, which is beneficial to improving the heat dissipation efficiency and heat dissipation speed of the first heating element 112 and the second heating element 113, and further improving the heat dissipation efficiency of the electromagnetic heat dissipation structure 1000 of the vehicle-mounted device.

[0058] It can be understood that in some other embodiments, the first heat conducting member 24 and the second heat conducting member 25 can be thermal conductive silica gel, thermal conductive silicone grease, copper, etc., and the present application does not limit this.

[0059] It can be understood that in some other embodiments, the first heat conducting member 24 and the second heat conducting member 25 can be omitted, the first heat dissipation member is in close contact with the surface of the heat dissipation housing 21 corresponding to the first heat dissipation cavity 213, and the second heat dissipation member is in close contact with the surface of the heat dissipation housing 21 corresponding to the second heat dissipation cavity 214, and the present application does not limit this.

[0060] Please refer to Figures 3 to 6 In one embodiment, the number of inductive magnets 22 is multiple, and the multiple inductive magnets 22 are arranged in a ring shape, and any two adjacent inductive magnets 22 are spaced apart. In the on-vehicle device electromagnetic heat dissipation structure 1000 provided in this embodiment, the number of inductive magnets 22 is six, and the six inductive magnets 22 are evenly distributed on the circumference of the same circle. Through the arrangement of the six inductive magnets, a reflux effect is generated in the liquid metal working medium in the heat dissipation housing 21, so as to increase the driving force of the inductive magnets on the liquid metal working medium, and further increase the flow velocity of the liquid metal working medium in the heat dissipation housing 21, which can make the heat dissipation efficiency of the on-vehicle device electromagnetic heat dissipation structure 1000 higher and the heat dissipation more uniform.

[0061] It should be understood that in some other embodiments, the number of inductive magnets 22 can be three, four, five, etc., and the present application does not limit this.

[0062] Please refer to Figures 3 to 6 In one embodiment, the heat dissipation component 20 of the heat dissipation member 100 further includes a heat dissipation plate 26, and the thermal conductivity of the heat dissipation plate 26 is greater than or equal to 210 W / (M*K). The heat dissipation plate 26 is disposed on the side of the heat dissipation housing 21 facing away from the circuit board assembly 10, and the heat dissipation plate 26 is fixed to the heat dissipation housing 21 by soldering with solder paste and is in close contact with the heat dissipation housing 21. The heat dissipation plate 26 is used to dissipate heat from the liquid metal working medium. By defining that the thermal conductivity of the heat dissipation plate 26 is greater than or equal to 210 W / (M*K), the heat dissipation effect of the liquid metal working medium on the main board member 11 of the circuit board assembly 10 is improved. In this embodiment, the heat dissipation plate 26 is a heat dissipation aluminum plate. By connecting the heat dissipation plate 26 and the heat dissipation housing 21 to form an integral structure, while improving the heat dissipation performance of the on-vehicle device electromagnetic heat dissipation structure 1000, it can also improve the impact stress of the on-vehicle device electromagnetic heat dissipation structure 1000 externally, reduce the risk of damage and leakage of the heat dissipation housing 21 due to external forces, and further protect the sealing performance of the heat dissipation housing 21.

[0063] It can be understood that in some other embodiments, the material of the heat dissipation plate 26 can also be a material with a relatively high thermal conductivity such as copper, and the present application does not limit this.

[0064] Please refer to Figures 3 to 6 In a specific embodiment, the heat dissipation housing 21 has a mounting hole 216, and the mounting hole 216 is penetrated along the direction in which the heat dissipation housing 21 and the main board member 11 are stacked, and the mounting hole 216 is not communicated with the heat dissipation cavity. The inductive magnet 22 is received in the mounting hole 216 and fixed to the side of the heat dissipation plate 26 facing the heat dissipation housing 21. Among them, the inductive magnet 22 and the heat dissipation plate 26 are fixedly connected by riveting and pressing.

[0065] It can be understood that in some other embodiments, the mounting hole 216 may not penetrate through the heat dissipation housing 21, the inductance magnet 22 is spaced apart from the heat dissipation plate 26, and the inductance magnet 22 is only received and fixed in the mounting hole 216. The present application does not limit this.

[0066] Please refer to Figures 3 to 7 , Figure 7 which is a structural diagram of a second housing provided by an embodiment of the present application.

[0067] In a specific embodiment, a heat dissipation step 217 is provided on the heat dissipation housing 21, and the heat dissipation step 217 protrudes toward the circuit board assembly 10. An avoidance hole 2031 communicating with the accommodation cavity 201 is provided on the second housing 203, and the heat dissipation step 217 passes through the avoidance hole 2031 and contacts the main board member 11 of the circuit board assembly 10. Moreover, the inner side wall of the avoidance hole 2031 and the inner side wall of the heat dissipation step 217 are sealed by dispensing glue to prevent water or impurities from entering the accommodation cavity 201 through the avoidance hole 2031 and affecting the electronic components on the circuit board assembly 10, which is beneficial to improving the sealing and waterproof effect of the accommodation cavity 201, and further improving the working stability of the circuit board assembly 10.

[0068] The above are some implementation manners of the present application. It should be noted that for those of ordinary skill in the art in the technical field, without departing from the principle of the present application, several improvements and refinements can be made, and these improvements and refinements are also regarded as the protection scope of the present application.

Claims

1. An electromagnetic heat dissipation structure for vehicle-mounted equipment, characterized in that: include: A circuit board assembly, including a main board component and a sub-board component; A heat dissipation shell is stacked with the mainboard component; the heat dissipation shell is used to contain a flowable liquid metal working medium, and the liquid metal working medium is used to dissipate heat from the mainboard component; as well as The inductor magnet is fixedly arranged relative to the heat dissipation shell; the inductor magnet and the sub-plate component are arranged relative to each other along the stacking direction of the heat dissipation shell and the main plate component, and the inductor magnet is used to be electrically connected to the sub-plate component to drive the liquid metal working medium to flow.

2. The electromagnetic heat dissipation structure of the vehicle-mounted equipment according to claim 1, characterized in that: The main board component includes a circuit board, a first heat generating element and a second heat generating element, and the auxiliary board component, the first heat generating element and the second heat generating element are all arranged on the circuit board; The heat dissipation shell includes a first heat dissipation cavity, a second heat dissipation cavity and a connecting cavity, the connecting cavity connects the first heat dissipation cavity and the second heat dissipation cavity, the first heat dissipation cavity and the first heat generating element are arranged opposite to each other along the direction in which the heat dissipation shell and the main board component are stacked, the second heat dissipation cavity and the second heat generating element are arranged opposite to each other along the direction in which the heat dissipation shell and the main board component are stacked, and the connecting cavity is arranged opposite to the sub-board component.

3. The electromagnetic heat dissipation structure of the vehicle-mounted equipment according to claim 2, characterized in that: The first heat-generating element and the heat-dissipating shell are spaced apart from each other on the surface corresponding to the first heat-dissipating cavity, and a first heat-conducting element is disposed between the first heat-generating element and the heat-dissipating shell; the second heat-generating element and the heat-dissipating shell are spaced apart from each other on the surface corresponding to the second heat-dissipating cavity, and a second heat-conducting element is disposed between the second heat-generating element and the heat-dissipating shell.

4. The electromagnetic heat dissipation structure of vehicle-mounted equipment according to claim 2, characterized in that: There are a plurality of the inductor magnets, which are arranged in a ring shape on the heat dissipation housing, and any two adjacent inductor magnets are arranged at intervals.

5. The electromagnetic heat dissipation structure of vehicle-mounted equipment according to claim 1, characterized in that: The electromagnetic heat dissipation structure of the vehicle-mounted equipment also includes a heat dissipation plate, the thermal conductivity of the heat dissipation plate is greater than or equal to 210W / (M*K); the heat dissipation plate is arranged on a side of the heat dissipation housing facing away from the circuit board assembly.

6. The electromagnetic heat dissipation structure of vehicle-mounted equipment according to claim 1, characterized in that: The electromagnetic heat dissipation structure of the vehicle-mounted equipment also includes a shell structure and a display screen. The shell structure has a accommodating cavity. The display screen is arranged outside the accommodating cavity and is electrically connected to the circuit board assembly; the circuit board assembly is accommodated in the accommodating cavity, part of the heat dissipation shell is arranged outside the accommodating cavity, and another part of the heat dissipation shell extends into the accommodating cavity.

7. The electromagnetic heat dissipation structure of vehicle-mounted equipment according to claim 6, characterized in that: The heat dissipation housing is provided with a heat dissipation step, and the heat dissipation step is protruded toward the circuit board assembly; The housing structure is provided with an avoidance hole communicating with the accommodating cavity, and the heat dissipation step passes through the avoidance hole and contacts with the mainboard component of the circuit board assembly.

8. The electromagnetic heat dissipation structure of vehicle-mounted equipment according to claim 6, characterized in that: The shell structure includes a first shell, a second shell and a sealing ring. The first shell and the second shell cover and combine to form the accommodating cavity. The sealing ring is arranged between the first shell and the second shell to seal the accommodating cavity.

9. The electromagnetic heat dissipation structure of vehicle-mounted equipment according to claim 1, characterized in that: The electromagnetic heat dissipation structure of the vehicle-mounted equipment includes an electrical connector, which is connected between the auxiliary board component and the inductor magnet; the electrical connector can extend or shrink along the stacking direction of the circuit board assembly and the heat dissipation housing.

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