Heat dissipation device based on solid-state microwave source
By introducing semiconductor refrigeration sheets into the heat dissipation system of the solid-state microwave source, heat is transferred from the solid-state source to the heat sink, and combined with the fan to accelerate heat dissipation, the problem of low heat dissipation efficiency of solid-state microwave sources in the prior art is solved, achieving more efficient heat dissipation effects and longer equipment service life.
Patent Information
- Application Number
- CN202421609240.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-09
- Publication Date
- 2025-06-03
- Estimated Expiration
- 2034-07-09
AI Technical Summary
The existing thermal dissipation systems of solid-state microwave sources are inefficient in chassis with good sealing, resulting in increased temperatures, which may cause problems such as overheating, burning and power reduction of control boards.
Using a semiconductor refrigeration sheet combined with aluminum alloy heat sink and fan, heat is transferred from a solid source to the heat sink through the thermoelectric effect of the semiconductor refrigeration sheet, improving heat dissipation efficiency, and accelerating heat dissipation through the fan.
It improves heat dissipation efficiency, reduces the working temperature of the solid-state source, extends the service life of the equipment, and improves the stability and reliability of the device, avoiding the decrease in heat dissipation effect caused by fan failure or air duct blockage.
Smart Images
Figure CN222941102U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of solid-state microwave sources, in particular to a heat dissipation device based on a solid-state microwave source. Background Technique
[0002] A solid-state microwave source is a device that uses solid-state active devices to generate microwave signals. It can be divided into a transferred electron oscillator, an avalanche diode oscillator, and a microwave transistor oscillator according to the solid-state devices used. The solid-state microwave source generates heat during use.
[0003] Currently, in the domestic and foreign solid-state microwave source heat dissipation systems, a combination of heat sinks and fans is usually used to discharge the heat generated by the solid-state source. The heat sink is usually made of aluminum alloy and has a large surface area to enhance the heat dissipation effect, while the fan accelerates the transfer and dissipation of heat by circulating air.
[0004] However, when dissipating heat through an aluminum alloy heat sink plus a fan, the heat dissipation effect is greatly related to the sealing performance of the chassis itself. For a chassis with good sealing performance, the efficiency of using this heat dissipation system is low, the temperature is likely to rise, which may cause problems such as overheating and burning of the control board, and a decrease in overheating power. Content of the Utility Model
[0005] Aiming at the deficiencies of the existing technology, the purpose of the utility model is to provide a heat dissipation device based on a solid-state microwave source.
[0006] In order to achieve the above purpose, the technical solution of the utility model is as follows:
[0007] A heat dissipation device based on a solid-state microwave source includes a solid-state source and a heat sink. The solid-state source is fixedly installed on the heat sink. A refrigeration sheet is arranged between the solid-state source and the heat sink. A fan is installed around the heat sink. The refrigeration sheet is embedded in the heat sink. The cold end of the refrigeration sheet is installed at the heat generation end of the solid-state source, and the heat sink is installed at the hot end of the refrigeration sheet.
[0008] Preferably, the cross-sectional shapes of the solid-state source, the refrigeration sheet, and the heat sink are the same and set in equal proportion.
[0009] Preferably, the cross-sectional area of the refrigeration sheet is not less than one-sixth of the cross-sectional area of the solid-state source.
[0010] Preferably, a copper block is padded between the refrigeration sheet and the solid-state source, and the copper block is embedded in the refrigeration sheet.
[0011] Preferably, the volume of the copper block is not less than two-thirds of the volume of the refrigeration sheet.
[0012] Preferably, the solid state source includes a cover plate, a surrounding frame, and a control board. The control board is connected to a heat sink and a thermoelectric cooler. The surrounding frame is mounted on the heat sink, covers the control board, and the cover plate is fixed to the surrounding frame.
[0013] Preferably, the control board is detachably mounted on the heat sink and is completely attached to the heat sink.
[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0015] 1. By utilizing the thermoelectric effect of the thermoelectric cooler, the present utility model effectively transfers heat from the solid state source to the heat sink, thereby improving the heat dissipation efficiency. Compared with the solution that only relies on traditional heat sinks and fans, the introduction of the thermoelectric cooler can dissipate heat more quickly and effectively, thus reducing the operating temperature of the solid state source and extending the service life of the device.
[0016] 2. Since the thermoelectric cooler of the present utility model has the advantages of no mechanical moving parts, small volume, fast response, etc., it can improve the stability and reliability of the device. Compared with the traditional fan heat dissipation solution, the thermoelectric cooler is not easily affected by the external environment and will not cause a decline in heat dissipation effect due to problems such as fan failure or air duct blockage, thus ensuring the long-term stable operation of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The disclosure of the present utility model will be described with reference to the accompanying drawings. It should be understood that the drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present utility model. In the drawings, the same reference numerals are used to refer to the same components.
[0018] Wherein:
[0019] Figure 1 is a schematic diagram of the overall structure of the present utility model;
[0020] Figure 2 is a schematic diagram of the structure of the solid state source of the present utility model.
[0021] Reference numerals in the figures: 1, solid state source; 11, cover plate; 12, surrounding frame; 13, control board;
[0022] 2, copper block; 3, thermoelectric cooler; 4, heat sink. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0023] It is easy to understand that according to the technical solution of the present utility model, without changing the essential spirit of the present utility model, those of ordinary skill in the art can propose various structural forms and implementation manners that can be mutually replaced. Therefore, the following specific embodiments and the accompanying drawings are only exemplary descriptions of the technical solution of the present utility model, and should not be regarded as all of the present utility model or as a limitation or restriction on the technical solution of the present utility model.
[0024] As Figure 1 shown, as the heat dissipation device based on a solid-state microwave source of the present utility model, it includes a solid-state source 1. As Figure 2 shown, the solid-state source 1 includes a cover plate 11, a surrounding frame 12, and a control board 13. The control board 13 is fixedly installed on the top of the aluminum alloy heat sink 4 by bolts, and the control board 13 is completely attached to the heat sink 4. By being completely attached, the contact area between the control board 13 and the heat sink 4 is increased, thereby enhancing the heat dissipation effect. Fixing by bolts facilitates loading and unloading. The surrounding frame 12 is installed on the heat sink 4 to cover the control board 13, and the cover plate 11 is fixed on the surrounding frame 12. The control board 13 is protected by the cover plate 11 and the surrounding frame 12 to prevent the control board 13 from being bumped, thereby increasing the service life of the control board 13. The heat dissipation of the control board 13 is carried out through the heat sink 4 to prevent the control board 13 from being burned due to excessive temperature.
[0025] As Figure 1 shown, a semiconductor refrigeration sheet 3 is provided between the control board 13 and the heat sink 4. The cold end of the refrigeration sheet 3 is installed at the heat-generating end of the control board 13, and the heat sink 4 is installed at the hot end of the refrigeration sheet 3. Heat is transferred from the control board 13 to the aluminum alloy heat sink 4 through the thermoelectric effect, thereby improving the heat dissipation efficiency. By introducing the semiconductor refrigeration sheet 3, heat can be dissipated more quickly and effectively, thereby reducing the operating temperature of the solid-state source 1 and extending the service life of the device. A fan is installed around the heat sink 4 to increase air circulation and accelerate heat dissipation. At the same time, since the semiconductor refrigeration sheet 3 has the advantages of no mechanical moving parts, small volume, fast response, etc., the stability and reliability of the device can be improved. Compared with the traditional fan heat dissipation scheme, the semiconductor refrigeration sheet 3 is not easily affected by the external environment and will not cause a decrease in the heat dissipation effect due to problems such as fan failure or air duct blockage, thereby ensuring the long-term stable operation of the device.
[0026] As Figure 2As shown in the figure, a first groove is formed at the top of the heat sink 4, and the refrigeration chip 3 is embedded in the first groove. A second groove is formed at the top of the refrigeration chip 3, and a copper block 2 located between the refrigeration chip 3 and the control board 13 is embedded in the second groove. Heat conduction is carried out through the copper block 2, so that heat can be transferred faster, thereby improving the heat dissipation effect. The volume of the copper block 2 is not less than two-thirds of the volume of the refrigeration chip 3. The efficient heat transfer is ensured by sufficient volume. The cross-sectional shapes of the solid state source 1, the refrigeration chip 3, and the heat sink 4 are the same and are set in equal proportion. The stable heat dissipation of the refrigeration chip 3 and the heat sink 4 to the solid state source 1 is ensured by the same shape in equal proportion. The cross-sectional area of the refrigeration chip 3 is not less than one-sixth of the cross-sectional area of the solid state source 1. The efficient completion of the heat dissipation work is ensured by sufficient contact area.
[0027] The technical scope of the present utility model is not limited to the content described in the above description. Those skilled in the art can make various deformations and modifications to the above embodiments without departing from the technical idea of the present utility model, and these deformations and modifications should all fall within the protection scope of the present utility model.
Claims
1. A heat dissipation device based on a solid-state microwave source, characterized in that: The invention comprises a solid state source (1) and a heat sink (4), wherein the solid state source (1) is fixedly mounted on the heat sink (4), a cooling fin (3) is arranged between the solid state source (1) and the heat sink (4), and a fan is installed around the heat sink (4), the cooling fin (3) is embedded in the heat sink (4), the cold end of the cooling fin (3) is mounted on the heat end of the solid state source (1), and the heat sink (4) is mounted on the hot end of the cooling fin (3).
2. The heat dissipation device based on a solid-state microwave source according to claim 1, characterized in that: The cross-sections of the solid source (1), the cooling fins (3) and the heat sink (4) are of the same shape and are arranged in equal proportions.
3. The heat dissipation device based on a solid-state microwave source according to claim 2, characterized in that: The cross-sectional area of the cooling plate (3) is not less than one sixth of the cross-sectional area of the solid source (1).
4. The heat dissipation device based on a solid-state microwave source according to claim 1, characterized in that: A copper block (2) is placed between the cooling plate (3) and the solid source (1), and the copper block (2) is embedded in the cooling plate (3).
5. The heat dissipation device based on a solid-state microwave source according to claim 4, characterized in that: The volume of the copper block (2) is not less than two thirds of the volume of the refrigeration plate (3).
6. The heat dissipation device based on a solid-state microwave source according to claim 1, characterized in that: The solid-state source (1) comprises a cover plate (11), a surrounding frame (12) and a control board (13); the control board (13) is connected to a heat sink (4) and a cooling fin (3); the surrounding frame (12) is mounted on the heat sink (4); the surrounding frame (12) covers the control board (13); and the cover plate (11) is fixed on the surrounding frame (12).
7. The heat dissipation device based on a solid-state microwave source according to claim 6, characterized in that: The control board (13) is detachably mounted on the heat sink (4), and the control board (13) is completely attached to the heat sink (4).