Crystal bar processing device integrating orienting, rounding and positioning edge processing

Abstract

The utility model discloses a crystal bar machining device integrating orienting, rounding and positioning edge machining, and belongs to the technical field of crystal bar machining. The machining device comprises a base used for containing a crystal bar, and the base can drive the crystal bar to rotate and adjust the inclination angle of the crystal bar in the horizontal direction; the XRD orientation mechanism comprises an X-ray emitting unit, an X-ray receiving unit and a signal intensity monitoring unit; the laser emitting part is arranged above the base; and the displacement driving mechanism is used for driving the crystal bar and the laser emitting part to move relatively and parallelly. According to the machining device, accurate orientation of the crystal bar can be achieved through the base and the XRD orientation mechanism, integrated machining of rolling and edge positioning is achieved through the laser emitting part, production efficiency and machining accuracy are improved at the same time, material loss and production cost are reduced, and quality stability of mass production of the crystal bar is improved.

Description

Technical Field

[0001] The present application relates to a crystal rod processing device integrating orientation, rounding and positioning edge processing, belonging to the technical field of crystal rod processing. Background Art

[0002] Silicon carbide is a semiconductor material with excellent performance, which is widely used in the field of high-power, high-frequency and high-temperature electronic devices. With the development of silicon carbide technology, its application in power electronics, optoelectronic devices and high-temperature devices has been continuously expanded, and higher requirements have been put forward for the quality and processing technology of silicon carbide crystal rod materials. However, the current silicon carbide crystal rod processing method has many shortcomings, which restricts the improvement of its production efficiency and product quality.

[0003] The existing silicon carbide ingot processing method mainly relies on mechanical grinding technology, and the specific steps include rough rolling, orientation, flat grinding, fine rolling, positioning edge processing, etc. Each of these steps requires precise operation and repeated adjustments, especially in the orientation and rolling stages, which often need to be repeated many times due to the need for high-precision orientation. This cumbersome processing process leads to a long overall processing time, which seriously affects production efficiency.

[0004] During the mechanical grinding process, mechanical stress is inevitably introduced due to the "hard-on-hard" grinding method, which not only easily damages the internal structure of the silicon carbide crystal rod, but also may cause defects such as cracks and edge collapse. These defects significantly reduce the yield rate of the silicon carbide crystal rod, and thus affect the performance and stability of its subsequent applications. In addition, a large amount of silicon carbide debris is generated during the mechanical grinding process, which not only increases material loss and production costs, but also has a negative impact on the environment. Utility Model Content

[0005] In order to solve the above problems, the present application proposes a crystal rod processing device that integrates orientation, rounding and positioning edge processing. The processing device can realize precise orientation of the crystal rod through a base and an XRD orientation mechanism, and realizes integrated processing of rounding and positioning edges through a laser emitting part, thereby improving production efficiency and processing accuracy while reducing material loss and production costs, and improving the quality stability of mass-produced crystal rods.

[0006] The present application provides a crystal rod processing device integrating orientation, rounding and positioning edge processing, characterized in that it includes:

[0007] A base, the base is used to place the crystal rod, and the base can drive the crystal rod to rotate and adjust the inclination angle of the crystal rod in the horizontal direction;

[0008] An XRD orientation mechanism includes an X-ray emitting unit, an X-ray receiving unit and a signal intensity monitoring unit;

[0009] A laser emitting unit, wherein the laser emitting unit is arranged above the base;

[0010] The displacement driving mechanism is used to drive the crystal rod and the laser emitting part to move relative and parallel.

[0011] Optionally, the base includes a first inclined portion, a second inclined portion, a rotation drive mechanism and a carrier which are connected in sequence from bottom to top;

[0012] The carrier is used to place the crystal rod, the rotation drive mechanism is used to drive the crystal rod to rotate, the first tilting portion is used to adjust the tilt angle of the crystal rod in the horizontal X-axis direction, and the second tilting portion is used to adjust the tilt angle of the crystal rod in the horizontal Y-axis direction.

[0013] Optionally, the first inclined portion includes a first base plate, two first side plates and a first driving shaft, the two first side plates are relatively arranged on the first side edge and the third side edge of the first base plate, the first side plate is provided with a first mounting hole, the first driving shaft is installed in the first mounting holes of the two first side plates, and the first driving shaft is connected to the second inclined portion.

[0014] Optionally, the second inclined portion includes a second base plate, two second side plates and a second drive shaft, the two second side plates are relatively arranged on the second side edge and the fourth side edge of the second base plate, the second side plate is provided with a second mounting hole, the second drive shaft is installed in the second mounting holes of the two second side plates, and the second drive shaft is connected to the rotation drive mechanism.

[0015] Optionally, the first mounting hole is arranged on a vertical center line of the first side plate, and the second mounting hole is arranged on a vertical center line of the second side plate.

[0016] Optionally, the dot of the first mounting hole coincides with an intersection of a vertical center line and a horizontal center line of the first side plate.

[0017] Optionally, the width of the second bottom plate in the Y-axis direction is (0.9-0.95) times the distance between the two first side plates.

[0018] Optionally, the displacement driving mechanism is connected to the base, and the displacement driving mechanism drives the crystal rod to move relatively parallel to the laser emitting part.

[0019] Optionally, the displacement drive mechanism includes an X-axis translation drive mechanism and a Y-axis translation drive mechanism, the X-axis translation drive mechanism drives the crystal rod to translate in the X-axis direction, and the Y-axis drive mechanism drives the crystal rod to translate in the Y-axis direction.

[0020] Optionally, the X-axis translation drive mechanism is disposed below the Y-axis translation drive mechanism, and the Y-axis translation drive mechanism is connected to the bottom surface of the base.

[0021] Optionally, the X-axis translation drive mechanism includes an X-axis translation plate and an X-axis translation member, the X-axis translation member is connected to the Y-axis translation drive mechanism, the X-axis translation plate is provided with an X-axis translation portion, and the X-axis translation member can move along the X-axis translation portion.

[0022] Optionally, the Y-axis translation drive mechanism includes a Y-axis translation plate and a Y-axis translation member, the Y-axis translation member is connected to the base, the Y-axis translation plate is provided with a Y-axis translation portion, and the Y-axis translation member can move along the Y-axis translation portion.

[0023] Optionally, the laser emitting unit is a micro-jet water-guided laser emitting unit.

[0024] The beneficial effects of this application include but are not limited to:

[0025] 1. The crystal rod processing device of the present application integrates orientation, rounding and positioning edge processing, realizes the orientation of the crystal rod through the cooperation of the base and the XRD orientation mechanism, and then drives the base and the laser emitting part to cooperate through the displacement drive mechanism to realize the rounding and positioning edge processing of the crystal rod, which can significantly improve the processing efficiency of the crystal rod and reduce the processing cost.

[0026] 2. The crystal rod processing device of the present application integrates orientation, rounding and positioning edge processing, avoids material waste and introduction of new defects into the crystal rod, and can detect the accuracy of orientation in real time during the processing process, thereby ensuring smooth processing of rounding and positioning edges.

[0027] 3. The crystal rod processing device of the present application, which integrates orientation, rounding and positioning edge processing, can realize the integrated processing of orientation, rounding and positioning edge of the crystal rod, avoid the deviation of the crystal rod during the processing, and improve the processing efficiency, processing accuracy and cutting surface quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0029] Figure 1 It is a three-dimensional schematic diagram of a crystal rod processing device integrating orientation, rounding and positioning edge processing involved in an embodiment of the present application;

[0030] Figure 2 A top view of a crystal rod processing device that integrates orientation, rounding, and positioning edge processing according to an embodiment of the present application;

[0031] Figure 3 It is a first side view of a crystal rod processing device integrating orientation, rounding and positioning edge processing according to an embodiment of the present application;

[0032] Figure 4 A second side view of a crystal rod processing device integrating orientation, rounding, and positioning edge processing according to an embodiment of the present application;

[0033] List of parts and reference numerals:

[0034] 11. Carrier; 12. Rotary drive mechanism; 131. Second bottom plate; 132. Second side plate; 133. Second mounting hole; 134. Second drive shaft; 141. First bottom plate; 142. First side plate; 143. First mounting hole; 144. First drive shaft; 21. X-ray emitting unit; 22. X-ray receiving unit; 30. Laser emitting unit; 41. X-axis translation plate; 42. X-axis translation unit; 43. Y-axis translation plate; 44. Y-axis translation unit; 50. Crystal rod. DETAILED DESCRIPTION

[0035] In order to more clearly illustrate the overall concept of the present application, a detailed description is given below in an illustrative manner in conjunction with the accompanying drawings.

[0036] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0037] In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present application is not limited to the specific embodiments disclosed below.

[0038] In addition, in the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0040] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0041] In the present application, unless otherwise clearly specified and limited, a first feature "above" or "below" a second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in an appropriate manner in any one or more embodiments or examples.

[0042] refer to Figure 1-4 The embodiment of the present application discloses a crystal rod 50 processing device integrating orientation, rounding, and positioning edge processing, including a base, an XRD orientation mechanism, a laser emitting unit 30, and a displacement driving mechanism. The base is used to place the crystal rod 50, and the base can drive the crystal rod 50 to rotate and adjust the inclination angle of the crystal rod 50 in the horizontal direction; the XRD orientation mechanism includes an X-ray emitting unit 21, an X-ray receiving unit 22, and a signal strength monitoring unit; the laser emitting unit 30 is arranged above the base; the displacement driving mechanism is used to drive the crystal rod 50 and the laser emitting unit 30 to move relative and parallel.

[0043] The method of using the device is as follows: placing the crystal rod 50 to be processed on the base, orienting the crystal rod 50 by rotating the base and tilting it in the horizontal direction in cooperation with the XRD orientation mechanism, and then driving the base and / or the laser emitting unit 30 to move by the displacement drive mechanism to achieve the relative horizontal movement of the crystal rod 50 and the laser emitting unit 30 to achieve the rounding and positioning edge processing of the crystal rod 50 by the laser. In the process of orientation, rounding and positioning edge processing, firstly, it can avoid material waste and the introduction of new defects into the crystal rod 50, and avoid damage to the internal structure of the crystal rod 50; secondly, it can avoid the deviation of the crystal rod 50 during the processing, and improve the processing efficiency, processing accuracy and cutting surface quality; thirdly, it can detect the accuracy of orientation in real time during the processing, so as to ensure the smooth processing of rounding and positioning edge.

[0044] Specifically, the operation and connection of the X-ray emitting unit 21, the X-ray receiving unit 22 and the signal strength monitoring unit (not shown in the figure) in the XRD orientation mechanism can be implemented by the existing methods in the prior art, as long as the X-ray emission and X-ray reception can be realized, and the corresponding test values ​​can be fed back to assist the orientation. In addition, the XRD emitting unit and the X-ray receiving unit 22 are fixed by a fixing mechanism (not shown in the figure).

[0045] Specifically, the displacement drive mechanism is used to drive the relative parallel movement of the crystal rod 50 and the laser emitting unit 30. The path of the relative parallel movement is the cutting processing path for the rounding and positioning edge of the crystal rod 50. Technical personnel in this field can set the corresponding displacement drive as needed. For example, the displacement drive mechanism can be connected only to the base. The laser emitting unit 30 remains stationary during the processing. The displacement drive mechanism drives the base to move in the horizontal direction relative to the laser emitting unit 30. For example, the displacement drive mechanism can also be connected only to the laser emitting unit 30. The base remains stationary during the processing, and the laser emitting unit 30 is driven by the displacement drive mechanism to move in the horizontal direction relative to the base. For example, displacement drive mechanisms can also be provided on both the base and the laser emitting unit 30. The relative horizontal movement of the two is achieved by driving the two displacement drive mechanisms, thereby realizing the laser cutting processing of the crystal rod 50.

[0046] Specifically, the laser emitting unit 30 is used to emit laser to perform rounding and cutting processing on the positioning edge of the crystal rod 50 . The laser can be a common laser or a micro-jet water-guided laser, as long as it can achieve precise processing of the rounding and positioning edge of the crystal rod 50 .

[0047] As a preferred embodiment, the laser emitting unit 30 is a micro-jet water-guided laser emitting unit. The use of micro-jet water-guided laser can further improve the processing efficiency of rounding and positioning edges, and improve the surface quality after processing.

[0048] Specifically, during the orientation process, the base and the XRD orientation mechanism can tilt and rotate the crystal rod 50 according to the required orientation angle, so as to achieve accurate orientation of the crystal rod 50. For example, when the crystal rod 50 is a silicon carbide crystal rod, the XRD orientation mechanism and the base can be used to orient the (11-28) crystal plane of the silicon carbide crystal rod. The specific method is as follows:

[0049] S1: First adjust the X-ray incident angle θ1 and the exit angle θ2 to 9°±0.1° and 96°±0.1° respectively;

[0050] S2: The silicon carbide crystal rod is then rotated about the vertical center line, and the XRD orientation mechanism performs a φ scan on the silicon carbide crystal rod until it rotates to the position where the diffraction intensity is the maximum and stops;

[0051] S3: Then adjust the inclination angle of the silicon carbide crystal rod in the horizontal direction and perform χ scanning until it rotates to the position of the maximum diffraction intensity. Finally, continue to rotate the silicon carbide crystal rod around the horizontal center line and adjust the χ value according to the required crystal rod deflection angle.

[0052] In step S2, the rotation of the silicon carbide crystal rod about the vertical center line is achieved by rotating the base, and in step S3, the adjustment of the inclination angle of the silicon carbide crystal rod in the horizontal direction is achieved by rotating the base about the horizontal center line. Therefore, the specific structure of the base needs to be able to drive the crystal to rotate and tilt in the horizontal direction.

[0053] As an embodiment, the base includes a first inclined portion, a second inclined portion, a rotation drive mechanism 12 and a carrier 11 which are connected in sequence from bottom to top; the carrier 11 is used to place the crystal rod 50, the rotation drive mechanism 12 is used to drive the crystal rod 50 to rotate, the first inclined portion is used to adjust the inclination angle of the crystal rod 50 in the horizontal X-axis direction, and the second inclined portion is used to adjust the inclination angle of the crystal rod 50 in the horizontal Y-axis direction.

[0054] Under this setting, the silicon carbide crystal rod is driven to rotate about the vertical center line by the rotary drive mechanism 12, and the silicon carbide crystal rod is tilted in the horizontal direction by the cooperation of the first inclined portion and the second inclined portion. The mutual cooperation of the above components can improve the flexibility of the base, and is convenient for the operator to quickly adjust the rotation angle and tilt angle as required.

[0055] Specifically, the crystal rod 50 is placed on the carrier 11 and can be fixed on the carrier 11. The crystal rod 50 can be fixed on the carrier 11 by vacuum adsorption, or a fixing groove can be opened on the carrier 11. As long as the crystal rod 50 can be fixed on the carrier 11, it can be avoided that the crystal rod 50 is offset when it is rotated and tilted horizontally.

[0056] Specifically, the rotation drive mechanism 12 can be a rotating column that drives the carrier 11 to rotate, or the rotation drive mechanism 12 can be set as an electromagnetic drive plate, and a material that matches the electromagnetic drive plate is set at the bottom or inside of the carrier 11. The rotation of the carrier 11 is achieved by electromagnetic drive, thereby achieving the rotation of the crystal rod 50.

[0057] As an alternative embodiment, the base can also include a plurality of telescopic support columns, a rotating drive mechanism 12 and a carrier 11 from bottom to top, the carrier 11 is used to place the crystal rod 50, the rotating drive mechanism 12 is used to drive the crystal rod 50 to rotate, and the plurality of telescopic support columns are evenly distributed along the circumference of the rotating drive mechanism 12.

[0058] Under this setting, by adjusting the different telescopic distances of several telescopic support columns, the rotation drive mechanism 12 and the carrier 11 can be driven to tilt, thereby adjusting the tilt angle of the crystal rod 50, and it can also be coordinated with the XRD orientation mechanism to achieve precise orientation.

[0059] As an embodiment, the first inclined portion includes a first bottom plate 141, two first side plates 142 and a first drive shaft 144. The two first side plates 142 are relatively arranged at the first side and the third side of the first bottom plate 141. The first side plate 142 is provided with a first mounting hole 143. The first drive shaft 144 is installed in the first mounting hole 143 of the two first side plates 142. The first drive shaft 144 is connected to the second inclined portion. The second inclined portion includes a second bottom plate 131, two second side plates 132 and a second drive shaft 134. The two second side plates 132 are relatively arranged at the second side and the fourth side of the second bottom plate 131. The second side plate 132 is provided with a second mounting hole 133. The second drive shaft 134 is installed in the second mounting hole 133 of the two second side plates 132. The second drive shaft 134 is connected to the rotation drive mechanism 12.

[0060] In this setting, the first bottom plate 141 and the first side plate 142 provide support for the first drive shaft 144, the second inclined portion, the rotation drive mechanism 12 and the carrier 11. The rotation of the first drive shaft 144 can drive the second bottom plate 131 to tilt, thereby adjusting the tilt angle of the crystal rod 50 in the horizontal X-axis direction; the second bottom plate 131 and the second side plate 132 provide support for the second drive shaft 134, the rotation drive mechanism 12 and the carrier 11. The rotation of the second drive shaft 134 drives the rotation drive mechanism 12 to tilt, thereby adjusting the tilt angle of the crystal rod 50 in the horizontal Y-axis direction. The above setting realizes the setting of the tilt angle of the crystal rod 50 in the X-axis direction and the Y-axis direction respectively through the rotation of the first drive shaft 144 and the second drive shaft 134, and the specific rotation angles of the first drive shaft 144 and the second drive shaft 134 can be selected according to the orientation requirements.

[0061] Specifically, the first rotating axis drives the second bottom plate 131 to tilt, and the second bottom plate 131 can be set between the two first side plates 142. In this case, the first mounting hole 143 is set on other areas of the first side plate 142 except the top surface; the second bottom plate 131 can also be set above the two first side plates 142. In this case, the first mounting hole 143 can be set on the top surface of the first side plate 142.

[0062] As a preferred embodiment, the first mounting hole 143 is arranged on the vertical center line of the first side plate 142, and the second mounting hole 133 is arranged on the vertical center line of the second side plate 132. Since the positions of the rotation drive mechanism 12 and the carrier 11 remain unchanged, the positions of the first mounting hole 143 and the second mounting hole 133 determine the installation positions of the first drive shaft 144 and the second drive shaft 134. Under this setting, the first drive shaft 144 and the second drive shaft 134 can be installed at the center position, avoiding the rotation drive mechanism 12 and the carrier 11 from being offset during the rotation process, so that the crystal rod 50 slips during orientation and processing, thereby improving the safety of the device.

[0063] As an embodiment, the dot of the first mounting hole 143 coincides with the intersection of the vertical center line and the horizontal center line of the first side plate 142. This arrangement, on the basis of preventing the crystal rod 50 from slipping during orientation and processing, can also further improve the stability of the crystal rod 50 during the process of adjusting the inclination angle in the horizontal X-axis direction, so as to facilitate the rapid completion of orientation. In addition, under this arrangement, the second side plate 132 is arranged between the two first side plates 142, which can increase the matching stability of the first inclined portion and the second inclined portion.

[0064] As a preferred embodiment, the width of the second bottom plate 131 in the Y-axis direction is (0.9-0.95) times the distance between the two first side plates 142. Since the second bottom plate 131 is arranged between the two first side plates 142, the width of the second bottom plate 131 in the Y-axis direction is the width of the second bottom plate 131 between the two side plates. Under this arrangement, the contact distance between the second bottom plate 131 and the first driving shaft 144 can be increased, thereby improving the stability of the device.

[0065] As a preferred embodiment, the first side plate 142 and the second side plate 132 are both semicircular. This arrangement can increase the visibility of the device without affecting the operating stability of the device, making it easier for staff to perform inspection and maintenance.

[0066] As an embodiment, the displacement drive mechanism is connected to the base, and the displacement drive mechanism drives the crystal rod 50 to move relatively parallel to the laser emitting unit 30. In this setting, the laser emitting unit 30 is fixed by a fixing mechanism (not shown in the figure), and the base is moved by the displacement drive mechanism, thereby completing the movement of the crystal rod 50 along the cutting path.

[0067] As an implementation manner, the displacement drive mechanism includes an X-axis translation drive mechanism and a Y-axis translation drive mechanism. The X-axis translation drive mechanism drives the crystal rod 50 to translate in the X-axis direction, and the Y-axis drive mechanism drives the crystal rod 50 to translate in the Y-axis direction.

[0068] The displacement distances of the base in the X-axis direction and the Y-axis direction are respectively adjusted by the X-axis translation mechanism and the Y-axis translation mechanism to realize the movement of the crystal rod 50 along the cutting path. Those skilled in the art can understand that after determining the cutting path for rounding and positioning edge processing of the crystal rod 50, the movement distance of the crystal rod 50 in the X-axis direction and the Y-axis direction at a certain position is determined by the cutting path, and is realized by the X-axis translation drive mechanism and the Y-axis translation drive mechanism. The X-axis translation drive mechanism and the Y-axis translation drive mechanism are realized in various ways and can be adjusted according to actual needs.

[0069] As an implementation manner, the X-axis translation drive mechanism is disposed below the Y-axis translation drive mechanism, and the Y-axis translation drive mechanism is connected to the bottom surface of the base.

[0070] As an embodiment, the X-axis translation drive mechanism includes an X-axis translation plate 41 and an X-axis translation member, the X-axis translation member is connected to the Y-axis translation drive mechanism, the X-axis translation plate 41 is provided with an X-axis translation portion 42, and the X-axis translation member can move along the X-axis translation portion 42, the Y-axis translation drive mechanism includes a Y-axis translation plate 43 and a Y-axis translation member, the Y-axis translation member is connected to the base, the Y-axis translation plate 43 is provided with a Y-axis translation portion 44, and the Y-axis translation member can move along the Y-axis translation portion 44.

[0071] This setting is a way to realize the movement distance of the crystal rod 50 in the X-axis direction and the Y-axis direction by using the X-axis translation drive mechanism and the Y-axis translation drive mechanism. The crystal rod 50 is driven to move in the X-axis direction by moving the X-axis translation member along the X-axis translation portion 42, and the crystal rod 50 is driven to move in the opposite direction of the Y-axis by moving the Y-axis translation member along the Y-axis translation portion 44.

[0072] Specifically, the X-axis translation part 42 and the Y-axis translation part 44 may be guide rails, and the X-axis translation member and the Y-axis translation member may be sliders, and the X-axis translation member moves along the X-axis translation part 42 and the Y-axis translation member moves along the Y-axis translation part 44 by moving the sliders along the guide rails.

[0073] Specifically, the X-axis translation part 42 and the Y-axis translation part 44 can be racks, and the X-axis translation member and the Y-axis translation member can be gears. The gears and the racks are meshed, and the X-axis translation member moves along the X-axis translation part 42 and the Y-axis translation member moves along the Y-axis translation part 44 by rotating the gears and moving along the racks.

[0074] As a preferred embodiment, there are at least two X-axis translation parts 42 and Y-axis translation parts 44, each X-axis translation part 42 is matched with at least two X-axis translation parts, and each Y-axis translation part 44 is matched with at least two Y-axis translation parts. It is also provided to improve the operation stability and reliability of the X-axis translation drive mechanism and the Y-axis translation drive mechanism.

[0075] The driving mode of the components in the above device can be electric drive, hydraulic drive or other driving modes, as long as the components can be driven separately without affecting the functions of other components, for example, the first rotating shaft, the second rotating shaft and the rotation drive mechanism 12 are driven by electric drive to adjust and rotate the inclination angle of the crystal rod 50 in the horizontal direction. The driving mode of the above components does not constitute a limitation to the present application, as long as the functions of the above components can be realized, and those skilled in the art can select a suitable mode according to actual needs.

[0076] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0077] The above is only an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A crystal rod processing device integrating orientation, rounding and positioning edge processing, characterized in that: include: A base, the base is used to place the crystal rod, and the base can drive the crystal rod to rotate and adjust the inclination angle of the crystal rod in the horizontal direction; An XRD orientation mechanism includes an X-ray emitting unit, an X-ray receiving unit and a signal intensity monitoring unit; A laser emitting unit, wherein the laser emitting unit is arranged above the base; The displacement driving mechanism is used to drive the crystal rod and the laser emitting part to move relative and parallel.

2. The crystal rod processing device integrating orientation, rounding and positioning edge processing according to claim 1 is characterized in that: The base includes a first inclined portion, a second inclined portion, a rotation drive mechanism and a carrier which are connected in sequence from bottom to top; The carrier is used to place the crystal rod, the rotation drive mechanism is used to drive the crystal rod to rotate, the first tilting portion is used to adjust the tilt angle of the crystal rod in the horizontal X-axis direction, and the second tilting portion is used to adjust the tilt angle of the crystal rod in the horizontal Y-axis direction.

3. The crystal rod processing device integrating orientation, rounding and positioning edge processing as one of claim 2, characterized in that: The first inclined portion includes a first base plate, two first side plates and a first driving shaft. The two first side plates are relatively arranged on the first side edge and the third side edge of the first base plate. The first side plate is provided with a first mounting hole. The first driving shaft is installed in the first mounting holes of the two first side plates. The first driving shaft is connected to the second inclined portion.

4. The crystal rod processing device integrating orientation, rounding and positioning edge processing as one of claim 3, characterized in that: The second inclined portion includes a second base plate, two second side plates and a second drive shaft. The two second side plates are relatively arranged on the second side edge and the fourth side edge of the second base plate. The second side plate is provided with a second mounting hole. The second drive shaft is installed in the second mounting holes of the two second side plates. The second drive shaft is connected to the rotation drive mechanism.

5. The crystal rod processing device integrating orientation, rounding and positioning edge processing as claimed in claim 4, characterized in that: The first mounting hole is arranged on the vertical center line of the first side plate, and the second mounting hole is arranged on the vertical center line of the second side plate.

6. The crystal rod processing device integrating orientation, rounding and positioning edge processing as one of claim 5, characterized in that: The round point of the first mounting hole coincides with the intersection of the vertical center line and the horizontal center line of the first side plate.

7. The crystal rod processing device integrating orientation, rounding and positioning edge processing according to any one of claims 1 to 6, characterized in that: The displacement driving mechanism is connected to the base, and the displacement driving mechanism drives the crystal rod to move relatively parallel to the laser emitting part.

8. The crystal rod processing device integrating orientation, rounding and positioning edge processing as claimed in claim 7, characterized in that: The displacement drive mechanism includes an X-axis translation drive mechanism and a Y-axis translation drive mechanism. The X-axis translation drive mechanism drives the crystal rod to translate in the X-axis direction, and the Y-axis translation drive mechanism drives the crystal rod to translate in the Y-axis direction.

9. The crystal rod processing device integrating orientation, rounding and positioning edge processing as one of claim 8, characterized in that: The X-axis translation driving mechanism is arranged below the Y-axis translation driving mechanism, and the Y-axis translation driving mechanism is connected to the bottom surface of the base.

10. The crystal rod processing device integrating orientation, rounding and positioning edge processing according to any one of claims 1 to 6, characterized in that: The laser emitting part is a micro-jet water-guided laser emitting part.

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