Silicon carbide sheet processing and transporting device

Abstract

The utility model discloses a silicon carbide sheet processing and transporting device, which relates to the technical field of silicon carbide sheet transporting equipment and comprises a transporting bin, and a buffer sleeve is mounted on the inner wall of the transporting bin. The buffering sleeve and the clamping block are arranged, the buffering sleeve is connected with the transportation bin in an inserted mode through the clamping block, the buffering sleeve is prevented from being abraded after being used for a long time, and therefore the buffering sleeve is convenient to replace, the buffering sleeve is made of soft rubber materials and has certain elasticity, and when silicon carbide pieces are inserted into the buffering sleeve, the silicon carbide pieces can be buffered and protected, and the service life of the silicon carbide pieces is prolonged. The transportation safety of the silicon carbide sheets is improved; through the arranged rebounding mechanism, by pressing an ejector rod, the ejector rod pushes a limiting rod to move inwards, so that the locking state of the limiting rod and the bottom of the transportation bin is released, at the moment, an ejector plate pushes upwards through the elastic force of a positioning spring, silicon carbide pieces are automatically ejected out, taking is convenient, and the situation that the silicon carbide pieces are damaged when being located in a buffering sleeve is avoided. And the silicon carbide sheet is bent and fractured due to strong extraction of workers.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon carbide slice transportation equipment, in particular to a silicon carbide slice processing and transportation device. Background Art

[0002] Silicon carbide wafers are a type of semiconductor device, and their main application areas include LED solid-state lighting and high-frequency devices. This material has excellent properties such as bandgap, drift velocity, breakdown voltage, thermal conductivity, and high temperature resistance that are several times higher than traditional silicon. It has irreplaceable advantages in electronic applications such as high temperature, high pressure, high frequency, high power, optoelectronics, radiation resistance, microwave resistance, and applications in extreme environments such as aerospace, military industry, and nuclear energy. Silicon carbide wafers need to be transported in a centralized manner during the production and processing process to avoid damage to the silicon carbide wafers during transportation and to ensure their safe removal. Therefore, a silicon carbide wafer processing and transportation device is needed.

[0003] The existing silicon carbide wafer processing and transportation device has the problem of being unable to provide buffer protection and being inconvenient to take when in operation, and therefore a silicon carbide wafer processing and transportation device is urgently needed. Utility Model Content

[0004] Based on this, the purpose of the utility model is to provide a silicon carbide wafer processing and transportation device to solve the problem that the existing silicon carbide wafer processing and transportation device cannot provide buffer protection and is inconvenient to take when in use.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a silicon carbide wafer processing and transportation device, comprising a transportation bin, a buffer sleeve is installed on the inner wall of the transportation bin, and a clamping block is installed on the outer wall of the buffer sleeve.

[0006] A silicon carbide sheet is installed on the inner wall of the buffer sleeve.

[0007] A rebound mechanism is installed at the bottom of the transport bin.

[0008] Preferably, the buffer sleeves are arranged at equal intervals with the central axis of the transport bin as the center, and the buffer sleeves are engaged with the transport bin via a clamping block.

[0009] Preferably, the silicon carbide sheet is plugged into a buffer sleeve, and the inner wall of the buffer sleeve is provided with an arc-shaped groove.

[0010] Preferably, the rebound mechanism includes a top plate, a limit spring, a limit rod, a push rod, a return spring, a positioning block and a positioning spring. The bottom of the silicon carbide sheet is installed with a top plate, the inner wall of the top plate is installed with a limit spring, the outer wall of the limit spring is installed with a limit rod, the outer wall of the limit rod is installed with a push rod, the outer wall of the push rod is installed with a return spring, the bottom of the top plate is installed with a positioning block, and the outer wall of the positioning block is installed with a positioning spring.

[0011] Preferably, the top plate is tightly fitted to the silicon carbide sheet, and the limiting rod forms a telescopic structure with the top plate via a limiting spring.

[0012] Preferably, the limiting rod is tightly fitted with the top rod, and the positioning springs are distributed at equal intervals with the central axis of the top plate as the center.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The utility model provides a buffer sleeve and a clamping block, and the buffer sleeve is plugged into the transport bin through the clamping block, so as to avoid the buffer sleeve from being worn out due to long-term use, thereby facilitating the replacement of the buffer sleeve. The buffer sleeve is made of a soft rubber material and has a certain elasticity. When the silicon carbide wafer is inserted into the buffer sleeve, it can provide buffer protection for the silicon carbide wafer, thereby improving the safety of transportation of the silicon carbide wafer.

[0015] 2. The utility model sets a rebound mechanism, and by pressing the push rod, the push rod pushes the limit rod to move inward, so that the limit rod and the bottom of the transport bin are unlocked. At this time, the top plate is pushed upward by the elastic force of the positioning spring, and the silicon carbide sheet is automatically pushed out, which is convenient for taking and avoids the silicon carbide sheet being bent and broken when the staff forcefully extracts it inside the buffer sleeve. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the structure of the utility model from the front;

[0017] Figure 2 It is a schematic structural diagram of a cross-section of the rebound mechanism of the utility model;

[0018] Figure 3 It is a structural schematic diagram showing some parts of the utility model;

[0019] Figure 4 For this utility model Figure 2 Schematic diagram of the enlarged structure of part A.

[0020] In the figure: 1. transport bin; 2. buffer sleeve; 3. clamping block; 4. silicon carbide sheet; 5. rebound mechanism; 501. top plate; 502. limit spring; 503. limit rod; 504. top rod; 505. return spring; 506. positioning block; 507. positioning spring. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. The embodiments described below with reference to the drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model.

[0022] The following describes an embodiment of the utility model based on its overall structure.

[0023] See also Figure 1-4 A silicon carbide wafer processing and transportation device comprises a transportation bin 1, a buffer sleeve 2 is installed on the inner wall of the transportation bin 1, a clamping block 3 is installed on the outer wall of the buffer sleeve 2, the buffer sleeve 2 is arranged at equal intervals with the central axis of the transportation bin 1 as the center, the buffer sleeve 2 is engaged with the transportation bin 1 through the clamping block 3, and the buffer sleeve 2 is plugged into the transportation bin 1 through the clamping block 3 through the provided buffer sleeve 2 and the clamping block 3, so as to avoid the wear of the buffer sleeve 2 due to long-term use, thereby facilitating the replacement of the buffer sleeve 2, and the buffer sleeve 2 is made of soft rubber material and has a certain elasticity. When the silicon carbide wafer 4 is inserted into the buffer sleeve 2, it can play a buffering and protective role on the silicon carbide wafer 4, thereby improving the safety of the transportation of the silicon carbide wafer 4.

[0024] See also Figure 1-4 A silicon carbide sheet processing and transportation device, a silicon carbide sheet 4 is installed on the inner wall of the buffer sleeve 2, the silicon carbide sheet 4 is plugged into the buffer sleeve 2, and the inner wall of the buffer sleeve 2 is provided with an arc groove.

[0025] See also Figure 1-4 A silicon carbide sheet processing and transportation device, a rebound mechanism 5 is installed at the bottom of the transportation bin 1, and the rebound mechanism 5 includes a top plate 501, a limit spring 502, a limit rod 503, a push rod 504, a return spring 505, a positioning block 506 and a positioning spring 507. The silicon carbide sheet 4 is installed with a top plate 501 at the bottom, the limit spring 502 is installed on the inner wall of the top plate 501, the limit rod 503 is installed on the outer wall of the limit spring 502, the push rod 504 is installed on the outer wall of the limit rod 503, the return spring 505 is installed on the outer wall of the push rod 504, the bottom of the top plate 501 is installed with a positioning block 506, the outer wall of the positioning block 506 is installed with a positioning spring 507, the top plate 50 1 fits tightly with the silicon carbide sheet 4, the limiting rod 503 forms a telescopic structure with the top plate 501 through the limiting spring 502, the limiting rod 503 fits tightly with the top rod 504, the positioning spring 507 is evenly spaced and arranged with the central axis of the top plate 501 as the center, and the rebound mechanism 5 is set, by pressing the top rod 504, the top rod 504 pushes the limiting rod 503 to move inward, so that the limiting rod 503 and the bottom of the transport bin 1 are unlocked, and the top plate 501 is pushed upward by the elastic force of the positioning spring 507, and the silicon carbide sheet 4 is automatically ejected, which is convenient for taking, and avoiding the silicon carbide sheet 4 from bending and breaking when the staff extracts it forcefully inside the buffer sleeve 2.

[0026] Working principle: When in use, first move the device to the desired position, then plug the buffer sleeve 2 into the transport bin 1 through the clamp block 3, and then insert the silicon carbide sheet 4 into the arc groove set inside the buffer sleeve 2 for clamping and fixing. At this time, the bottom of the silicon carbide sheet 4 will press the top plate 501 down to the specified position, and the limit rod 503 will be pushed out by the elastic force of the limit spring 502 and clamped and fixed with the bottom of the transport bin 1. When the silicon carbide sheet 4 is transported to the specified location and needs to be taken out, it can be taken out by pressing the push rod 504. The push rod 504 pushes the limit rod 503 to move inward, so that the limit rod 503 and the bottom of the transport bin 1 are unlocked. At this time, the top plate 501 is pushed upward by the elastic force of the positioning spring 507, and the silicon carbide sheet 4 is automatically pushed out, which is convenient for taking out and avoids the silicon carbide sheet 4 being bent and broken when the silicon carbide sheet 4 is inside the buffer sleeve 2 due to forceful extraction by the staff. In this way, the use process of the device is completed. The content not described in detail in this manual belongs to the existing technology known to professional and technical personnel in this field.

[0027] The directions or positional relationships indicated by terms such as "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the directions or positional relationships shown in the accompanying drawings. They are merely simplified descriptions for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the protection content of the present invention.

[0028] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A silicon carbide wafer processing and transportation device, comprising a transportation bin (1), characterized in that: The inner wall of the transport bin (1) is installed with a buffer sleeve (2), and the outer wall of the buffer sleeve (2) is installed with a clamping block (3); A silicon carbide sheet (4) is installed on the inner wall of the buffer sleeve (2); A rebound mechanism (5) is installed at the bottom of the transport bin (1).

2. The silicon carbide wafer processing and transportation device according to claim 1, characterized in that: The buffer sleeves (2) are arranged at equal intervals with the central axis of the transport bin (1) as the center, and the buffer sleeves (2) are connected to the transport bin (1) by means of a clamping block (3).

3. The silicon carbide wafer processing and transportation device according to claim 1, characterized in that: The silicon carbide sheet (4) is plugged into the buffer sleeve (2), and the inner wall of the buffer sleeve (2) is provided with an arc-shaped groove.

4. The silicon carbide sheet processing and transportation device according to claim 1, characterized in that: The rebound mechanism (5) comprises a top plate (501), a limit spring (502), a limit rod (503), a push rod (504), a return spring (505), a positioning block (506) and a positioning spring (507); the top plate (501) is installed at the bottom of the silicon carbide sheet (4); the limit spring (502) is installed on the inner wall of the top plate (501); the limit rod (503) is installed on the outer wall of the limit spring (502); the push rod (504) is installed on the outer wall of the limit rod (503); the return spring (505) is installed on the outer wall of the push rod (504); the bottom of the top plate (501) is installed with a positioning block (506); and the outer wall of the positioning block (506) is installed with a positioning spring (507).

5. The silicon carbide wafer processing and transportation device according to claim 4, characterized in that: The top plate (501) is tightly fitted to the silicon carbide sheet (4), and the limiting rod (503) forms a telescopic structure with the top plate (501) via a limiting spring (502).

6. The silicon carbide wafer processing and transportation device according to claim 4, characterized in that: The limiting rod (503) is tightly fitted with the top rod (504), and the positioning springs (507) are arranged at equal intervals with the central axis of the top plate (501) as the center.

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