Supporting film for OLED module

Abstract

The utility model provides a supporting film for an OLED module, and relates to the technical field of electronic products. The supporting film for the OLED module comprises a protective film layer, a body use layer and a release film layer which are stacked in sequence, wherein the protective film layer comprises a first base material layer and a first pressure-sensitive adhesive layer; the body use layer comprises a second base material layer and a second pressure-sensitive adhesive layer; the release film layer comprises a release layer and a third base material layer; wherein the release layer comprises an anti-fingerprint coating and a hardened layer. The supporting film solves the technical problems that due to the fact that modulus and stiffness are poor, concave-convex is prone to being generated on the appearance, and concave-convex points can be newly added due to workshop cleanliness, interlayer foreign matter, incoming material defects and the like.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic products, in particular to a supporting film for an OLED module. Background Art

[0002] OLED (Organic Light-Emitting Diode) is the third generation display technology after CRT and LCD technology. In recent years, due to its many advantages such as low power consumption, fast response speed, and high resolution, OLED has been extended to the fields of electronic products, commerce, transportation, industrial control, and medicine. With the widespread application of OLED, the demand for OLED support film (which plays a supporting and protective role) is also increasing.

[0003] At present, the structure of OLED support film is: upper protective layer + main body use layer + release film. After laser cutting, the release film needs to be torn off. In order to make it easy to tear off after laser cutting, the release film needs to be thinned, for example, the thickness is reduced to less than 30μm. However, the thinned release film has poor modulus and stiffness, and the surface is prone to unevenness. Workshop cleanliness, interlayer foreign matter, incoming material defects, etc. will be lifted up due to the poor stiffness of the release film, thereby deforming the adhesive surface and generating new uneven points.

[0004] CN214099647U discloses an OLED support film, including a transparent PET film substrate made of polyethylene terephthalate film antistatic material, a PU protective film layer is provided on the lower end surface of the transparent PET film substrate, a safe connection and fastening adhesive layer is provided on the upper end of the transparent PET film substrate, the safe connection and fastening adhesive layer is an acid-free antistatic protective layer, and a light release film is provided on the upper end of the safe connection and fastening adhesive layer. The thickness of the light release film is 50 μm, and due to the poor modulus and stiffness, the surface is prone to unevenness. In addition, it plays an anti-electric effect by using the acid-free antistatic protective layer as a connection and fastening adhesive layer, and the adhesive layer has a greater impact on the viscosity over time, which may cause insufficient bonding between the support film and the flexible substrate, reducing product stability.

[0005] CN212833580U discloses an OLED process protective tape, which is used to be applied to the surface of an OLED display panel. The protective tape includes an antistatic PET film layer, a PE film layer located on the upper surface and the lower surface of the antistatic PET film layer, and a polyurethane adhesive layer. An antistatic release film is located on the surface opposite to the polyurethane adhesive layer and the antistatic PET film layer, and the thickness of the antistatic PET film layer is greater than the thickness of the PE film layer. The antistatic release film is a PET film, PE film or OPP film coated with a release agent layer. That is, the thickness of the antistatic release film is as high as 60 to 90 μm, that is, the problem of the release film being easily pulled and deformed is avoided by increasing the thickness, but if the thickness is too high, it will not be easy to tear off after laser cutting.

[0006] In view of this, the present utility model is proposed. Utility Model Content

[0007] The purpose of the utility model is to provide a support film for an OLED module, which solves the technical problem that the surface is prone to unevenness due to poor modulus and stiffness, and avoids the addition of uneven points due to workshop cleanliness, interlayer foreign matter, and incoming material defects.

[0008] The utility model provides a support film for an OLED module, wherein the support film for the OLED module comprises: a protective film layer, a main body use layer and a release film layer stacked in sequence;

[0009] Among them, the protective film layer includes a first substrate layer and a first pressure-sensitive adhesive layer; the main body layer includes a second substrate layer and a second pressure-sensitive adhesive layer; the release film layer includes a release layer and a third substrate layer; wherein the release layer includes an anti-fingerprint coating and a hardening layer.

[0010] Furthermore, the first substrate layer is located at a side away from the main body layer, and the first pressure-sensitive adhesive layer is located at a side close to the main body layer;

[0011] The second substrate layer is located on a side close to the protective film layer, and the second pressure-sensitive adhesive layer is located on a side close to the release film layer;

[0012] The release layer is located on a side close to the main body layer, and the third substrate layer is located on a side away from the main body layer;

[0013] Wherein, the anti-fingerprint coating is located on a side close to the main body use layer, and the hardening layer is located on a side close to the third substrate layer.

[0014] Furthermore, the protective film layer also includes a first antistatic coating.

[0015] Furthermore, the first antistatic coating is located on one side of the first substrate layer and away from the side of the main body use layer.

[0016] Furthermore, the main body layer also includes a second antistatic coating.

[0017] Furthermore, the second antistatic coating is located between the first pressure-sensitive adhesive layer and the second substrate layer.

[0018] Furthermore, the anti-fingerprint coating also includes an antistatic agent to form an anti-fingerprint antistatic coating.

[0019] Furthermore, the release film layer further includes a third antistatic coating and / or a fourth antistatic coating.

[0020] Furthermore, the third antistatic coating is located between the anti-fingerprint coating and the hardening layer.

[0021] Furthermore, the fourth antistatic coating is located on the surface of the third substrate layer and away from the side of the hardening layer.

[0022] Compared with the prior art, the utility model has the following beneficial effects:

[0023] (1) The surface flatness and roughness of the release film layer used in the support film for the OLED module described in the present invention are better than those of the release film in the prior art. There are fewer bumps and punctures on the surface, and after bonding, there will be no bumps and punctures similar to those on the release film. After bonding, the degree of bumps and punctures will deepen during aging, and the adhesive surface will be lifted up and new defects will be generated.

[0024] (2) The surface stiffness of the release film layer used in the support film for the OLED module described in the present invention will also be increased, and the stiffness requirement of the original thick release film can be met. During the manufacturing process (passing through the guide roller and the composite roller), the impact of foreign matter on the roller will be less, and the new point defects after bonding will also be greatly reduced.

[0025] (3) The performance of the release film layer used in the support film for the OLED module described in the present invention meets all the requirements for release film lamination, and the number of defects after aging and standing is consistent with the number of defects after being removed from the machine, and the problem of exponential increase in defects after the release film is lamination, aging, and placement will not occur. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 This is a basic structural diagram of the support membrane provided by the utility model.

[0028] Figure 2 This is a structural diagram of a support film of a release film layer having an anti-fingerprint coating and a hardening layer provided by the utility model.

[0029] Figure 3 A structural diagram of a support film having a protective film layer with an antistatic coating provided by the utility model.

[0030] Figure 4 This is a structural diagram of the support film of the main body using layer with antistatic coating provided by the utility model.

[0031] Figure 5 This is a structural diagram of a release film layer with an anti-fingerprint and anti-static coating provided by the utility model.

[0032] Figure 6 This is a structural diagram of a third antistatic coating provided by the utility model located between the anti-fingerprint coating and the hardening layer.

[0033] Figure 7 This is a structural diagram of the fourth antistatic coating 315 provided by the present invention being located on the surface of the third substrate layer.

[0034] Figure 8 This is a structural diagram of a support film for an OLED module provided in Example 1 of the utility model.

[0035] Fig. 9 This is a structural diagram of a support film for an OLED module provided in Example 2 of the present utility model.

[0036] Fig.10 This is a structural diagram of a support film for an OLED module provided in Example 3 of the present utility model.

[0037] Fig.11 This is a structural diagram of a support film for an OLED module provided in Example 4 of the utility model.

[0038] Among them, 10 is a protective film layer, 20 is a main body layer, 30 is a release film layer; 11 is a first substrate layer, 12 is a first pressure-sensitive adhesive layer, 13 is a first antistatic coating; 21 is a second substrate layer, 22 is a second pressure-sensitive adhesive layer, 23 is a second antistatic coating; 31 is a release layer, 32 is a third substrate layer; 311 is an anti-fingerprint coating, 312 is a hardening layer, 313 is an anti-fingerprint antistatic coating, 314 is a third antistatic coating, and 315 is a fourth antistatic coating. DETAILED DESCRIPTION

[0039] The technical solution of the utility model will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0040] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. In contrast, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0041] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0042] In addition, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", "third", and "fourth" may explicitly or implicitly include one or more of the feature. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of the template are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0044] like Figure 1 As shown, the utility model provides a support film for an OLED module, wherein the support film for the OLED module comprises: a protective film layer 10, a main body use layer 20 and a release film layer 30 which are stacked in sequence.

[0045] The protective film layer 10 includes a first substrate layer 11 and a first pressure-sensitive adhesive layer 12 .

[0046] The main body layer 20 includes a second substrate layer 21 and a second pressure-sensitive adhesive layer 22 .

[0047] The release film layer 30 includes a release layer 31 and a third substrate layer 32 .

[0048] like Figure 2 As shown, the release layer 31 includes an anti-fingerprint coating 311 and a hardening layer 312 .

[0049] In the utility model, a hardening layer 312 and an anti-fingerprint coating 311 are sequentially arranged above the third substrate layer 32 to replace the existing release film for lamination; wherein, the hardening layer 312 can enhance the stiffness of the film, while the anti-fingerprint coating 311 has little difference in water contact, dyne, and release force with the release film surface, and its effect is consistent with that of the release film, and can be used as the release surface of the release film.

[0050] Among them, the hardening layer can be referred to as the HC layer; the anti-fingerprint coating can be referred to as the AF layer.

[0051] As a preferred embodiment of the present invention, the surface water contact angle of the anti-fingerprint coating is greater than 110°, for example, it can be 110°, 112°, 114°, 116°, 118°, 120°, etc.

[0052] As a preferred embodiment of the present invention, the dyne of the anti-fingerprint coating meets the requirements of a 44# dyne pen or above, for example, a 44# dyne pen, a 46# dyne pen, a 48# dyne pen, a 50# dyne pen or a 60# dyne pen.

[0053] like Figure 1 As shown, the first substrate layer 11 is located at a side away from the main body layer 20 , and the first pressure-sensitive adhesive layer 12 is located at a side close to the main body layer 20 .

[0054] like Figure 1 As shown, the second substrate layer 21 is located on a side close to the protective film layer 10 , and the second pressure-sensitive adhesive layer 22 is located on a side close to the release film layer 30 .

[0055] like Figure 1 As shown, the release layer 31 is located on a side close to the main body layer 20 , and the third substrate layer 32 is located on a side away from the main body layer 20 .

[0056] like Figure 2 As shown, the anti-fingerprint coating 311 is located on a side close to the main body layer 20 , and the hardening layer 312 is located on a side close to the third substrate layer 32 .

[0057] As a preferred embodiment of the present invention, Figure 3 As shown, the protective film layer 10 further includes a first antistatic coating 13 .

[0058] As a preferred embodiment of the present invention, Figure 3 As shown, the first antistatic coating 13 is located on one side of the first substrate layer 11 and away from the side of the main body layer 20 .

[0059] As a preferred embodiment of the present invention, Figure 4 As shown, the main body layer 20 further includes a second antistatic coating 23 .

[0060] As a preferred embodiment of the present invention, Figure 4 As shown, the second antistatic coating 23 is located between the first pressure-sensitive adhesive layer 12 and the second substrate layer 21 .

[0061] As a preferred embodiment of the present invention, Figure 5 As shown, the anti-fingerprint coating also includes an antistatic agent to form an anti-fingerprint antistatic coating 313 .

[0062] It should be noted that the anti-fingerprint antistatic coating 313 of the present invention is formed by mixing an anti-fingerprint agent and an antistatic agent and coating the mixture on the surface of the hardening layer 312 .

[0063] As a preferred embodiment of the present invention, the release film layer further includes a third antistatic coating and / or a fourth antistatic coating.

[0064] As a preferred embodiment of the present invention, Figure 6 As shown, the third antistatic coating 314 is located between the anti-fingerprint coating 311 and the hardening layer 312 .

[0065] As a preferred embodiment of the present invention, Figure 7 As shown, the fourth antistatic coating 315 is located on the surface of the third substrate layer 32 and away from the side of the hardening layer 312 .

[0066] As an optional embodiment of the present invention, the thickness of the first substrate layer 11 is 38 to 75 μm, for example, it can be 38 μm, 40 μm, 42 μm, 45 μm, 48 μm, 50 μm, 52 μm, 55 μm, 58 μm, 60 μm, 62 μm, 65 μm, 68 μm, 70 μm, 72 μm, 75 μm, etc.

[0067] As an optional embodiment of the present invention, the thickness of the first pressure-sensitive adhesive layer 12 is 10-25 μm, for example, it can be 10 μm, 12 μm, 14 μm, 16 μm, 18 μm, 20 μm, 22 μm, 24 μm, 25 μm, etc.

[0068] As an optional embodiment of the present invention, the thickness of the second substrate layer 21 is 50-100 μm, for example, it can be 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 90 μm, 95 μm, 100 μm, etc.

[0069] As an optional embodiment of the present invention, the thickness of the second pressure-sensitive adhesive layer 22 is 10-25 μm, for example, it can be 10 μm, 12 μm, 14 μm, 16 μm, 18 μm, 20 μm, 22 μm, 24 μm, 25 μm, etc.

[0070] As an optional embodiment of the present invention, the thickness of the third substrate layer 32 is 20-30 μm, for example, it can be 20 μm, 21 μm, 22 μm, 23 μm, 24 μm, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, etc.

[0071] As an optional embodiment of the present invention, the thickness of the hardened layer 312 is 2 to 5 μm, for example, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 5 μm, etc.

[0072] As an optional implementation of the present invention, the thickness of the anti-fingerprint coating 311 is 50-80 nm, for example, 50 nm, 55 nm, 60 nm, 65 nm, 70 nm, 75 nm, 80 nm, etc.

[0073] As an optional embodiment of the present invention, the thickness of the antistatic coating (the first antistatic coating 13, the second antistatic coating 23, the third antistatic coating 314, and the fourth antistatic coating 315) is independently 30 to 50 nm, for example, 30 nm, 35 nm, 40 nm, 45 nm, 50 nm, etc.

[0074] As an optional implementation of the present invention, the thickness of the anti-fingerprint antistatic coating 313 is 50-80 nm, for example, it can be 50 nm, 55 nm, 60 nm, 65 nm, 70 nm, 75 nm, 80 nm, etc.

[0075] As an optional embodiment of the present invention, the first substrate layer, the second substrate layer and the third substrate layer are each independently selected from any one of a polyethylene terephthalate layer (PET layer), a cellulose acetate layer (TAC layer), and a polymethyl methacrylate layer (PMMA layer) or a combination of at least two thereof.

[0076] As a preferred embodiment of the present invention, the first substrate layer, the second substrate layer and the third substrate layer are selected from polyethylene terephthalate layers.

[0077] As an optional embodiment of the present invention, the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer are each independently selected from any one of an acrylic adhesive layer, a silicone layer or a PU adhesive layer, or a combination of at least two thereof.

[0078] As a preferred embodiment of the present invention, the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer are selected from acrylic adhesive layers.

[0079] The present invention is further described below by way of examples. Unless otherwise specified, the materials in the examples are prepared according to existing methods or purchased directly from the market.

[0080] Example 1

[0081] This embodiment provides a support film for an OLED module, such as Figure 8 As shown, the support film for the OLED module includes: a protective film layer 10, a main body layer 20 and a release film layer 30 stacked in sequence.

[0082] The protective film layer 10 includes: a first substrate layer 11 and a first pressure-sensitive adhesive layer 12 stacked in sequence; the first substrate layer 11 is a PET layer with a thickness of 38 μm, and the first pressure-sensitive adhesive layer 12 is an acrylic adhesive layer with a thickness of 13 μm.

[0083] The main body layer 20 includes: a second substrate layer 21 and a second pressure-sensitive adhesive layer 22 stacked in sequence; the second substrate layer 21 is a PET layer with a thickness of 75 μm, and the second pressure-sensitive adhesive layer 22 is an acrylic adhesive layer with a thickness of 13 μm.

[0084] Among them, the release film layer 30 includes: a release layer 31 and a third substrate layer 32 stacked in sequence; the release layer 31 includes an anti-fingerprint antistatic coating 313 and a hardening layer 312; the third substrate layer 32 is a PET layer with a thickness of 25μm, the thickness of the hardening layer 312 is 3.5μm, and the thickness of the anti-fingerprint antistatic coating 313 is 55nm; the surface water contact angle of the anti-fingerprint antistatic coating 313 is 110°; the dyne of the anti-fingerprint antistatic coating 313 meets the 44# dyne pen.

[0085] Example 2

[0086] This embodiment provides a support film for an OLED module, such as Fig. 9 As shown, the support film for the OLED module includes: a protective film layer 10, a main body layer 20 and a release film layer 30 stacked in sequence.

[0087] Among them, the protective film layer 10 includes: a first antistatic coating 13, a first substrate layer 11 and a first pressure-sensitive adhesive layer 12 stacked in sequence; the first antistatic coating 13 has a thickness of 30nm, the first substrate layer 11 is a PET layer with a thickness of 38μm; the first pressure-sensitive adhesive layer 12 is an acrylic adhesive layer with a thickness of 13μm.

[0088] Among them, the main body layer 20 includes: a second antistatic coating 23, a second substrate layer 21 and a second pressure-sensitive adhesive layer 22 stacked in sequence; the thickness of the second antistatic coating 23 is 30nm, the second substrate layer 21 is a PET layer with a thickness of 75μm; the second pressure-sensitive adhesive layer 22 is an acrylic adhesive layer with a thickness of 13μm.

[0089] Among them, the release film layer 30 includes: a release layer 31 and a third substrate layer 32 stacked in sequence; the release layer 31 includes: an anti-fingerprint coating 311, a third antistatic coating 314 and a hardening layer 312 stacked in sequence; the third substrate layer 32 is a PET layer with a thickness of 30μm, the thickness of the hardening layer 312 is 4μm, the thickness of the third antistatic coating 314 is 40nm, and the thickness of the anti-fingerprint coating 311 is 55nm; the surface water contact angle of the anti-fingerprint coating 311 is 110°; the dyne of the anti-fingerprint coating 311 meets the 44# dyne pen.

[0090] Example 3

[0091] This embodiment provides a support film for an OLED module, such as Fig.10 As shown, the support film for the OLED module includes: a protective film layer 10, a main body layer 20 and a release film layer 30 stacked in sequence.

[0092] Among them, the protective film layer 10 includes: a first antistatic coating 13, a first substrate layer 11 and a first pressure-sensitive adhesive layer 12 stacked in sequence; the first antistatic coating 13 has a thickness of 30nm, the first substrate layer 11 is a PET layer with a thickness of 38μm; the first pressure-sensitive adhesive layer 12 is an acrylic adhesive layer with a thickness of 13μm.

[0093] Among them, the main body layer 20 includes: a second antistatic coating 23, a second substrate layer 21 and a second pressure-sensitive adhesive layer 22 stacked in sequence; the thickness of the second antistatic coating 23 is 30nm, the second substrate layer 21 is a PET layer with a thickness of 75μm; the second pressure-sensitive adhesive layer 22 is an acrylic adhesive layer with a thickness of 13μm.

[0094] Among them, the release film layer 30 includes: an anti-fingerprint coating 311, a third antistatic coating 314, a hardening layer 312, a third substrate layer 32 and a fourth antistatic coating 315 stacked in sequence; the third substrate layer 32 is a PET layer with a thickness of 20μm, the thickness of the hardening layer 312 is 3μm, the thickness of the third antistatic coating 314 is 30nm, and the thickness of the fourth antistatic coating 315 is 30nm; the thickness of the anti-fingerprint coating 311 is 80nm; the surface water contact angle of the anti-fingerprint coating 311 is 120°; the dyne of the anti-fingerprint coating 311 meets the 48# dyne pen.

[0095] Example 4

[0096] This embodiment provides a support film for an OLED module, such as Fig.11 As shown, the support film for the OLED module includes: a protective film layer 10, a main body layer 20 and a release film layer 30 stacked in sequence.

[0097] The protective film layer 10 includes: a first substrate layer 11 and a first pressure-sensitive adhesive layer 12 stacked in sequence; the first substrate layer 11 is a PET layer with a thickness of 38 μm, and the first pressure-sensitive adhesive layer 12 is an acrylic adhesive layer with a thickness of 13 μm.

[0098] The main body layer 20 includes: a second substrate layer 21 and a second pressure-sensitive adhesive layer 22 stacked in sequence; the second substrate layer 21 is a PET layer with a thickness of 75 μm, and the second pressure-sensitive adhesive layer 22 is an acrylic adhesive layer with a thickness of 13 μm.

[0099] Among them, the release film layer 30 includes: an anti-fingerprint antistatic coating 313, a hardening layer 312, a third substrate layer 32 and a fourth antistatic coating 315 stacked in sequence; the third substrate layer 32 is a polymethyl methacrylate layer with a thickness of 25μm, the thickness of the hardening layer 312 is 3μm, the thickness of the anti-fingerprint antistatic coating 313 is 55nm, and the thickness of the fourth antistatic coating 315 is 30nm; the surface water contact angle of the anti-fingerprint antistatic coating 313 is 110°; the dyne of the anti-fingerprint antistatic coating 313 meets the 44# dyne pen.

[0100] Example 5

[0101] This embodiment provides a support film for an OLED module, such as Fig.11 As shown, the support film for the OLED module includes: a protective film layer 10, a main body layer 20 and a release film layer 30 stacked in sequence.

[0102] The protective film layer 10 includes: a first substrate layer 11 and a first pressure-sensitive adhesive layer 12 stacked in sequence; the first substrate layer 11 is a PET layer with a thickness of 38 μm, and the first pressure-sensitive adhesive layer 12 is an acrylic adhesive layer with a thickness of 13 μm.

[0103] The main body layer 20 includes: a second substrate layer 21 and a second pressure-sensitive adhesive layer 22 stacked in sequence; the second substrate layer 21 is a PET layer with a thickness of 75 μm, and the second pressure-sensitive adhesive layer 22 is an acrylic adhesive layer with a thickness of 13 μm.

[0104] Among them, the release film layer 30 includes: an anti-fingerprint antistatic coating 313, a hardening layer 312, a third substrate layer 32 and a fourth antistatic coating 315 stacked in sequence; the third substrate layer 32 is a cellulose acetate layer with a thickness of 25μm, the thickness of the hardening layer 312 is 3μm, the thickness of the anti-fingerprint antistatic coating 313 is 55nm, and the thickness of the fourth antistatic coating 315 is 30nm; the surface water contact angle of the anti-fingerprint antistatic coating 313 is 110°; the dyne of the anti-fingerprint antistatic coating 313 meets the 44# dyne pen.

[0105] Comparative Example 1

[0106] This comparative example provides a support film for an OLED module, which is different from Example 1 only in that the release film layer is no longer provided with an anti-fingerprint antistatic coating 313, and other configurations are completely consistent with Example 1. The surface water contact angle of the hardening layer 312 is 80°.

[0107] Comparative Example 2

[0108] This comparative example provides a support film for an OLED module, which is different from Example 1 only in that the release film layer is no longer provided with a hardening layer 312, and other configurations are completely consistent with Example 1. The surface water contact angle of the anti-fingerprint antistatic coating 313 is 110°.

[0109] Comparative Example 3

[0110] This comparative example provides a support film for an OLED module, which is different from Example 1 only in that the release film layer is a common 25 μm release film layer, and other settings are completely consistent with Example 1.

[0111] Comparative Example 4

[0112] This comparative example provides a support film for an OLED module, which is different from Example 1 only in that the release film layer is a common 50 μm release film layer, and other settings are completely consistent with Example 1.

[0113] Test Case

[0114] Test samples: support films for OLED modules provided in Examples 1 to 5, and support films provided in Comparative Examples 1 to 4;

[0115] Test method:

[0116] (1) Tear force: Use a tensile testing machine and 7475 tape to test the 90° tear force. Test three times. If the tear force is between 25-35 gf for all three tests, it is considered OK.

[0117] (2) Dot defect: visual inspection, size comparison with the dot and line gauge film ruler comparison card; if the diameter of the concave and convex dots is ≤0.4mm and the number is ≤5 / ㎡, it is judged as qualified; otherwise, it is judged as unqualified.

[0118] The specific test results are shown in Table 1 below:

[0119] Table 1

[0120]

[0121]

[0122] As shown in Table 1, the tearing force of the support film for OLED modules provided by the utility model is 25-35gf, and the point defect performance is qualified. This shows that the surface flatness and roughness of the release film layer used in the support film for OLED modules described in the utility model are better than the release film of the prior art, and there are fewer bumps and punctures on its surface. After bonding, no bumps and punctures similar to those on the release film will be produced. After bonding, the degree of deepening during aging will lift the adhesive surface and add new point defects; and the surface stiffness will also increase, which can meet the stiffness requirements of the original thick release film. In the process (passing through the guide roller and the composite roller), it is less affected by foreign matter on the roller, and the new point defects after bonding will also be greatly reduced.

[0123] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A support film for an OLED module, characterized in that: The support film for the OLED module includes: a protective film layer, a main body use layer and a release film layer stacked in sequence; Among them, the protective film layer includes a first substrate layer and a first pressure-sensitive adhesive layer; the main body layer includes a second substrate layer and a second pressure-sensitive adhesive layer; the release film layer includes a release layer and a third substrate layer; wherein the release layer includes an anti-fingerprint coating and a hardening layer.

2. The support film for an OLED module according to claim 1, characterized in that: The first substrate layer is located at a side away from the main body layer, and the first pressure-sensitive adhesive layer is located at a side close to the main body layer; The second substrate layer is located on a side close to the protective film layer, and the second pressure-sensitive adhesive layer is located on a side close to the release film layer; The release layer is located on a side close to the main body layer, and the third substrate layer is located on a side away from the main body layer; Wherein, the anti-fingerprint coating is located on a side close to the main body use layer, and the hardening layer is located on a side close to the third substrate layer.

3. The support film for an OLED module according to claim 1 or 2, characterized in that: The protective film layer also includes a first antistatic coating.

4. The support film for an OLED module according to claim 3, characterized in that: The first antistatic coating is located on one side of the first substrate layer and away from the side of the main body use layer.

5. The support film for an OLED module according to claim 1 or 2, characterized in that: The main body utilization layer also includes a second antistatic coating.

6. The support film for an OLED module according to claim 5, characterized in that: The second antistatic coating is located between the first pressure-sensitive adhesive layer and the second substrate layer.

7. The support film for an OLED module according to claim 1, characterized in that: The anti-fingerprint coating also includes an antistatic agent to form an anti-fingerprint antistatic coating.

8. The support film for an OLED module according to claim 1 or 2, characterized in that: The release film layer further includes a third antistatic coating and / or a fourth antistatic coating.

9. The support film for an OLED module according to claim 8, characterized in that: The third antistatic coating is located between the anti-fingerprint coating and the hardening layer.

10. The support film for an OLED module according to claim 9, characterized in that: The fourth antistatic coating is located on the surface of the third substrate layer and away from the side of the hardening layer.

Images