Device for detecting edges and chamfers of silicon wafers

Abstract

The utility model relates to a silicon wafer edge and chamfer detection device, which comprises a conveyor belt and two oppositely arranged support plates, the conveyor belt conveys silicon wafers from upstream, the conveyor belt is positioned between the two support plates, a strip-shaped light source and a reflecting mechanism are arranged between the two support plates, chamfer light source assemblies are arranged on the two support plates, and the chamfer light source assemblies are arranged on the two support plates. A top plate is fixedly connected between the top ends of the two supporting plates, a detection camera is installed at the top of the top plate, a gap aligned with the detection camera is formed in the top of the top plate, and the strip-shaped light source is used for illuminating the front edge and the rear edge of the silicon wafer; the chamfering light source assembly is used for illuminating the chamfer of the silicon wafer; the reflection mechanism is used for collecting the light after the front edge and the rear edge of the silicon wafer are illuminated by the detection camera through primary reflection and collecting the light after the chamfer of the silicon wafer is illuminated by the detection camera through primary reflection; according to the utility model, the imaging projection of the silicon wafer only needs to be reflected once, the internal complexity of equipment is reduced, and the maintenance is simple.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer detection, in particular to a device for detecting edges and chamfers of silicon wafers. Background Art

[0002] As an important raw material for solar cells, silicon wafers are widely used in the production of solar cells, circuit boards and other products. In the production process of silicon wafers, it is necessary to detect whether there are defects on the edges of silicon wafers to ensure the quality of solar cells, circuit boards and other products made from silicon wafers. However, when existing detection equipment detects the edges of silicon wafers, it usually uses a light source to illuminate the edges of the silicon wafers, and then the image projection of the edges can be captured by the detection camera after multiple reflections, which increases the complexity of the equipment and makes maintenance difficult. Utility Model Content

[0003] The purpose of the utility model is to design a device for detecting edges and chamfers of silicon wafers, so as to solve the problems mentioned in the background technology.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] A device for detecting edges and chamfers of silicon wafers, comprising a conveyor belt and two support plates arranged opposite to each other, wherein the conveyor belt transmits silicon wafers flowing from upstream, the conveyor belt is located between the two support plates, a strip light source and a reflection mechanism are installed between the two support plates, a chamfer light source assembly is installed on both support plates, a top plate is fixedly connected between the top ends of the two support plates, a detection camera is installed on the top of the top plate, and a gap is provided on the top of the top plate to align with the detection camera, wherein:

[0006] The strip light source is used to illuminate the front edge and the rear edge of the silicon wafer;

[0007] The chamfer light source assembly is used to illuminate the chamfer of the silicon wafer;

[0008] The reflection mechanism is used to collect the light after illuminating the front edge and the back edge of the silicon wafer through one reflection by the detection camera, and to collect the light after illuminating the chamfer of the silicon wafer through one reflection by the detection camera.

[0009] Furthermore, there are two strip-shaped light sources and they are arranged in sequence along the conveying direction of the silicon wafer. The first strip-shaped light source along the conveying direction of the silicon wafer is used to illuminate the rear edge of the silicon wafer, and the second strip-shaped light source along the conveying direction of the silicon wafer is used to illuminate the front edge of the silicon wafer. There are two reflecting mechanisms and they correspond one-to-one to the two strip-shaped light sources respectively. The chamfered light source assembly includes two point light sources, and the two point light sources correspond one-to-one to the two reflecting mechanisms respectively.

[0010] Furthermore, the chamfered light source assembly also includes a vertical rod, and the support plate is provided with a plurality of screw holes arranged in sequence along the height direction. The vertical rod is connected to the screw holes through a first screw, and a first adjustment plate is fixedly connected to the top of the vertical rod, a first screw rod is rotatably connected to the first adjustment plate, a first slider is slidably connected to the first adjustment plate, a first screw hole is provided on the first slider and is threadedly connected to the first screw rod, a first knob is provided at one end of the first screw, and the point light source is mounted on the first slider.

[0011] Furthermore, a connecting rod is provided on the top of the first slider, a first long groove is provided on the connecting rod, the first long groove is fixed to the slider by a second screw, an angle rod is provided at one end of the connecting rod, a second long groove is provided on the angle rod, the second long groove is fixed to the connecting rod by a third screw, and the point light source is fixedly connected to one end of the angle rod.

[0012] Furthermore, the reflection mechanism includes a reflector, a first inlay axis and a second inlay axis, the reflector is fixed between the first inlay axis and the second inlay axis, one of the support plates is provided with an inlay groove on its inner wall for engaging with the first inlay axis, and the other support plate is provided with an inlay hole for engaging with the second inlay axis.

[0013] Furthermore, a limiting plate is provided at one end of the second inlay axis away from the first inlay axis, a limiting groove is provided on the limiting plate, a sliding groove docking with the limiting groove is provided on the supporting plate provided with the inlay hole, and a limiting block is slidably connected in the sliding groove.

[0014] Furthermore, the detection cameras are provided with two and correspond one to one with the two reflection mechanisms respectively, the top of the top plate is fixedly connected with a second adjustment plate corresponding one to one with the two detection cameras, the second adjustment plate is rotatably connected with a second screw rod, the second adjustment plate is slidably connected with a second slider, the second slider is provided with a second screw hole threadedly connected with the second screw rod, a second knob is provided at one end of the second screw rod, and the detection camera is fixed on the second slider.

[0015] Furthermore, two groups of pulley assemblies are provided between the two support plates, and the two groups of pulley assemblies correspond one-to-one to the two reflection mechanisms respectively. The pulley assemblies include four pulleys arranged in pairs up and down, the conveyor belt is connected to the four pulleys by winding and transmission, and the reflection mechanism is located between the four pulleys.

[0016] Furthermore, the distance between the top two of the pulleys is less than half the length of the silicon wafer.

[0017] Furthermore, the front edge of the silicon wafer is illuminated earlier than the rear edge of the silicon wafer.

[0018] The beneficial effects of the utility model are:

[0019] The silicon wafer is moved in the conveying direction by the conveyor belt, so that the strip light source can illuminate the front and back edges of the silicon wafer, and the chamfer light source assembly can illuminate the chamfer of the silicon wafer. Then the reflection mechanism will reflect the light from the front and back edges of the silicon wafer once and be collected by the inspection camera, and the light from the chamfer of the silicon wafer once and be collected by the inspection camera, thereby realizing defect detection of the front, back and chamfer of the silicon wafer, and the imaging projection only needs one reflection, which reduces the complexity inside the equipment and simplifies maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a schematic diagram of the structure of the utility model;

[0022] Figure 2 This is a schematic diagram of the structure of the utility model after one of the support plates is hidden;

[0023] Figure 3 It is a structural schematic diagram of the reflection mechanism in the utility model;

[0024] Figure 4 This is a schematic diagram of the structure of the limit groove and the slide groove docking in the utility model;

[0025] Figure 5 This is a schematic diagram of the light path of the front edge of the silicon wafer being illuminated in the utility model;

[0026] Figure 6 This is a schematic diagram of the light path of the rear edge of the silicon wafer being illuminated in the utility model;

[0027] Figure 7 It is a schematic diagram of the light path of the silicon wafer chamfer being illuminated in the utility model.

[0028] The names of the components marked in the figure are as follows:

[0029] 1. Conveyor belt; 2. Support plate; 3. Silicon wafer; 4. Strip light source; 5. Top plate; 6. Detection camera; 7. Point light source; 8. Vertical rod; 9. Screw hole; 10. First adjustment plate; 11. First screw rod; 12. First slider; 13. First knob; 14. Connecting rod; 15. First long groove; 16. Angle rod; 17. Second long groove; 18. Reflector; 19. First inlay axis; 20. Second inlay axis; 21. Inlay hole; 22. Limit plate; 23. Limit groove; 24. Slide groove; 25. Limit block; 26. Second adjustment plate; 27. Second screw rod; 28. Second slider; 29. ​​Second knob; 30. Pulley. DETAILED DESCRIPTION

[0030] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined purpose of the utility model, the specific implementation method, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0031] like Figure 1-7 As shown, a device for detecting edges and chamfers of silicon wafers comprises a conveyor belt 1 and two support plates 2 arranged opposite to each other. The conveyor belt 1 transmits silicon wafers 3 flowing from upstream. The conveyor belt 1 is located between the two support plates 2. A strip light source 4 and a reflection mechanism are installed between the two support plates 2. A chamfer light source assembly is installed on both support plates 2. A top plate 5 is fixedly connected between the top ends of the two support plates 2. A detection camera 6 is installed on the top of the top plate 5. The detection camera 6 adopts an 8K line scan camera. A gap is provided on the top of the top plate 5 for aligning with the detection camera 6, wherein:

[0032] The strip light source 4 is used to illuminate the front edge and the rear edge of the silicon wafer 3;

[0033] The chamfer light source assembly is used to illuminate the chamfer of the silicon wafer 3;

[0034] The reflection mechanism is used to collect the light after illuminating the front edge and the back edge of the silicon wafer 3 through one reflection by the detection camera 6, and collect the light after illuminating the chamfer of the silicon wafer 3 through one reflection by the detection camera 6, thereby realizing defect detection of the front edge, the back edge and the chamfer of the silicon wafer 3, and improving the detection efficiency;

[0035] There are two strip light sources 4 and they are arranged in sequence along the conveying direction of the silicon wafer 3. The first strip light source 4 along the conveying direction of the silicon wafer 3 is used to illuminate the rear edge of the silicon wafer 3, and the second strip light source 4 along the conveying direction of the silicon wafer 3 is used to illuminate the front edge of the silicon wafer 3. The front edge of the silicon wafer 3 is illuminated earlier than the rear edge of the silicon wafer 3. This can effectively reduce the distance between the two strip light sources 4, thereby reducing the size of the device; there are two reflecting mechanisms and they correspond to the two strip light sources 4 one by one, respectively. The chamfered light source assembly includes a vertical rod 8 and two point light sources 7, that is, a total of four point light sources 7 are arranged on the two support plates 2, corresponding to the four chamfers of the silicon wafer 3 respectively; the two point light sources 7 correspond to the two reflecting mechanisms one by one, respectively, and a plurality of screw holes 9 are arranged in sequence along the height direction on the support plate 2. The vertical rod 8 is connected to the screw hole 9 by a first screw, and the height of the vertical rod 8 can be adjusted by adjusting the connection between the first screw and the screw hole 9; the top of the vertical rod 8 is fixedly connected with a first adjustment plate 1 0, a first screw rod 11 is rotatably connected to the first adjustment plate 10, a first slider 12 is slidably connected to the first adjustment plate 10, a first screw hole threadedly connected to the first screw rod 11 is provided on the first slider 12, a first knob 13 is provided at one end of the first screw rod 11, the first screw rod 11 is driven to rotate by the first knob 13, and the first slider 12 is driven to slide on the first adjustment plate 10; a connecting rod 14 is provided on the top of the first slider 12, a first long groove 15 is provided on the connecting rod 14, the first long groove 15 is fixed to the slider 12 by a second screw, an angle rod 16 is provided at one end of the connecting rod 14, a second long groove 17 is provided on the angle rod 16, and the second long groove 17 is fixed to the connecting rod 14 by a third screw, when the third screw is loosened, the angle between the angle rod 16 and the connecting rod 14 can be adjusted; the point light source 7 is fixedly connected to one end of the angle rod 16, according to the above structure, the height and angle of the point light source and the distance between it and the silicon wafer 3 can be adjusted, thereby increasing practicality.

[0036] The reflecting mechanism comprises a reflecting mirror 18, a first inlay axis 19 and a second inlay axis 20, wherein the reflecting mirror 18 is fixed between the first inlay axis 19 and the second inlay axis 20, wherein an inlay groove which is engaged with the first inlay axis 19 is provided on the inner wall of one supporting plate 2, and an inlay hole 21 which is engaged with the second inlay axis 20 is provided on the other supporting plate 2, so that the reflecting mechanism can be detachably installed between the two supporting plates 2, which is convenient for maintaining or cleaning the reflecting mirror 18; a limiting plate 22 is provided at one end of the second inlay axis 20 away from the first inlay axis 19, and a limiting groove 23 is provided on the limiting plate 22, and a sliding groove 24 which is docked with the limiting groove 23 is provided on the supporting plate 2 provided with the inlay hole 21, and a limiting block 25 is slidably connected in the sliding groove 24, and a part of the limiting block 25 slides into the limiting groove 23, so as to limit the limiting plate 22, and then limit the angle of the reflecting mirror 18, so as to avoid an unsatisfactory reflection angle of the reflecting mirror 18.

[0037] Two detection cameras 6 are provided and correspond to the two reflection mechanisms one by one. The top of the top plate 5 is fixedly connected with a second adjustment plate 26 corresponding to the two detection cameras 6 one by one. The second adjustment plate 26 is rotatably connected with a second screw rod 27. The second adjustment plate 26 is slidably connected with a second slider 28. The second slider 28 is provided with a second screw hole threadedly connected to the second screw rod 27. A second knob 29 is provided at one end of the second screw 27. The detection camera 6 is fixed on the second slider 28. The second screw rod 27 is driven to rotate by the second knob 29, and the second slider 28 is driven to slide on the second adjustment plate 26, so as to adjust the distance between the detection camera 6 and the reflector 18, so that the image collected by the detection camera 6 is cleaner.

[0038] Two groups of pulley assemblies are arranged between the two support plates 2, and the two groups of pulley assemblies correspond to the two reflecting mechanisms one by one. The pulley assembly includes four pulleys 30 arranged in pairs up and down. The conveyor belt 1 is wound and connected with the four pulleys 30. The reflecting mechanism is located between the four pulleys 30, so that the light path projected to the reflecting mechanism after the silicon wafer 3 is illuminated and the light path after the reflection by the reflecting mechanism are both propagated in the space structure surrounded by the four pulleys 30, so as to avoid the interference of the conveyor belt 1 on the propagation of the light path; the distance between the top ends of the two uppermost pulleys 30 is less than half the length of the silicon wafer 3, so as to avoid the silicon wafer 3 from losing weight and falling.

[0039] Working principle:

[0040] like Figure 1-7 As shown, when the detection device is in use, the silicon wafer 3 to be detected is placed on the conveyor belt 1, and the conveyor belt 1 drives the silicon wafer 3 to move between the two support plates 2. Since the front edge of the silicon wafer 3 is illuminated earlier than the rear edge of the silicon wafer 3, the front edge of the silicon wafer 3 will be illuminated by the second strip light source 4 along the conveying direction of the silicon wafer 3 first, and the light path after the front edge of the silicon wafer 3 is illuminated will be projected to the corresponding reflector 18, and the reflector 18 will then reflect the light path to be collected by the corresponding detection camera 6 to complete the detection; similarly, the rear edge of the silicon wafer 3 will be illuminated by the first strip light source 4 along the conveying direction of the silicon wafer 3, and the light path after the rear edge of the silicon wafer 3 is illuminated will be projected to the corresponding reflector 18, and the reflector 18 will then reflect the light path to be collected by the corresponding detection camera 6 to complete the detection;

[0041] The moment when the chamfers at both ends of the front edge of the silicon wafer 3 are illuminated is also earlier than the moment when the chamfers at both ends of the rear edge of the silicon wafer 3 are illuminated. Therefore, the second point light source 7 along the conveying direction of the silicon wafer 3 on the two support plates 3 will first illuminate the chamfers at both ends of the front edge of the silicon wafer 3, and the light path after the chamfers at both ends of the front edge of the silicon wafer 3 are illuminated will be projected to the corresponding reflector 18, and the reflector 18 will then reflect the changed light path to be collected by the corresponding detection camera 6 to complete the detection; similarly, the first point light source 7 along the conveying direction of the silicon wafer 3 on the two support plates 3 will illuminate the chamfers at both ends of the rear edge of the silicon wafer 3, and the light path after the chamfers at both ends of the rear edge of the silicon wafer 3 are illuminated will be projected to the corresponding reflector 18, and the reflector 18 will then reflect the changed light path to be collected by the corresponding detection camera 6 to complete the detection.

[0042] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A device for detecting edges and chamfers of silicon wafers, characterized in that: The invention comprises a conveyor belt (1) and two support plates (2) arranged opposite to each other, the conveyor belt (1) transmits silicon wafers (3) flowing from upstream, the conveyor belt (1) is located between the two support plates (2), a strip light source (4) and a reflection mechanism are installed between the two support plates (2), a chamfered light source assembly is installed on each of the two support plates (2), a top plate (5) is fixedly connected between the top ends of the two support plates (2), a detection camera (6) is installed on the top of the top plate (5), and a gap is provided on the top of the top plate (5) for aligning with the detection camera (6), wherein: The strip light source (4) is used to illuminate the front edge and the rear edge of the silicon wafer (3); The chamfer light source assembly is used to illuminate the chamfer of the silicon wafer (3); The reflection mechanism is used to collect the light after illuminating the front edge and the rear edge of the silicon wafer (3) through one reflection by the detection camera (6), and to collect the light after illuminating the chamfer of the silicon wafer (3) through one reflection by the detection camera (6).

2. The device for detecting silicon wafer edges and chamfers according to claim 1, characterized in that: Two strip-shaped light sources (4) are provided and are arranged in sequence along the conveying direction of the silicon wafer (3); the first strip-shaped light source (4) along the conveying direction of the silicon wafer (3) is used to illuminate the rear edge of the silicon wafer (3); the second strip-shaped light source (4) along the conveying direction of the silicon wafer (3) is used to illuminate the front edge of the silicon wafer (3); two reflection mechanisms are provided and correspond one-to-one to the two strip-shaped light sources (4); the chamfering light source assembly includes two point light sources (7); the two point light sources (7) correspond one-to-one to the two reflection mechanisms.

3. The device for detecting silicon wafer edges and chamfers according to claim 2, characterized in that: The chamfered light source assembly also includes a vertical rod (8), a plurality of screw holes (9) are arranged in sequence along the height direction on the support plate (2), the vertical rod (8) is connected to the screw hole (9) by a first screw, a first adjustment plate (10) is fixedly connected to the top of the vertical rod (8), a first screw rod (11) is rotatably connected to the first adjustment plate (10), a first slider (12) is slidably connected to the first adjustment plate (10), a first screw hole is provided on the first slider (12) and is threadedly connected to the first screw rod (11), a first knob (13) is provided at one end of the first screw rod (11), and the point light source (7) is mounted on the first slider (12).

4. The device for detecting silicon wafer edges and chamfers according to claim 3, characterized in that: A connecting rod (14) is provided at the top of the first sliding block (12), a first long groove (15) is provided on the connecting rod (14), the first long groove (15) is fixed to the sliding block (12) by a second screw, an angle rod (16) is provided at one end of the connecting rod (14), a second long groove (17) is provided on the angle rod (16), the second long groove (17) is fixed to the connecting rod (14) by a third screw, and the point light source (7) is fixedly connected to one end of the angle rod (16).

5. The device for detecting silicon wafer edges and chamfers according to claim 2, characterized in that: The reflection mechanism comprises a reflection mirror (18), a first embedding shaft (19) and a second embedding shaft (20); the reflection mirror (18) is fixed between the first embedding shaft (19) and the second embedding shaft (20); an embedding groove for clamping with the first embedding shaft (19) is provided on the inner wall of one support plate (2); and an embedding hole (21) for clamping with the second embedding shaft (20) is provided on the other support plate (2).

6. The device for detecting silicon wafer edges and chamfers according to claim 5, characterized in that: A limiting plate (22) is provided at one end of the second embedding shaft (20) away from the first embedding shaft (19), a limiting groove (23) is provided on the limiting plate (22), a sliding groove (24) docking with the limiting groove (23) is provided on the supporting plate (2) provided with the embedding hole (21), and a limiting block (25) is slidably connected in the sliding groove (24).

7. The device for detecting silicon wafer edges and chamfers according to claim 2, characterized in that: Two detection cameras (6) are provided and correspond to the two reflection mechanisms respectively. The top of the top plate (5) is fixedly connected with a second adjustment plate (26) corresponding to the two detection cameras (6) one by one. The second adjustment plate (26) is rotatably connected with a second screw rod (27). The second adjustment plate (26) is slidably connected with a second slider (28). The second slider (28) is provided with a second screw hole threadedly connected to the second screw rod (27). One end of the second screw rod (27) is provided with a second knob (29). The detection camera (6) is fixed on the second slider (28).

8. The device for detecting silicon wafer edges and chamfers according to claim 2, characterized in that: Two groups of pulley assemblies are arranged between the two support plates (2), and the two groups of pulley assemblies correspond to the two reflection mechanisms one by one. The pulley assemblies include four pulleys (30) arranged in pairs up and down, the conveyor belt (1) is connected to the four pulleys (30) by winding transmission, and the reflection mechanism is located between the four pulleys (30).

9. The device for detecting silicon wafer edges and chamfers according to claim 8, characterized in that: The distance between the top ends of the two uppermost pulleys (30) is less than half the length of the silicon wafer (3).

10. The device for detecting silicon wafer edges and chamfers according to claim 2, characterized in that: The time when the front edge of the silicon wafer (3) is illuminated is earlier than the time when the rear edge of the silicon wafer (3) is illuminated.

Images