Probe testing system

Abstract

The utility model provides a probe testing system, which mainly comprises a carrying layer, a probe testing layer and a probe testing layer, the pressure sensing system is detachably arranged below the object carrying layer, the pressure sensing system comprises at least one pressure sensor array, and the pressure sensor array is used for obtaining position information of a test probe currently acting on the chip to be tested, and detecting the chip to be tested based on the position information and a test point of the chip to be tested. And determining the moving direction and the moving distance of the test probe. According to the invention, the position information of the test probe currently acting on the chip to be tested can be obtained through the pressure sensing system, and the efficiency and success rate of obtaining the EFA result are improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a probe testing system. Background Art

[0002] Fault analysis equipment is mainly used in the semiconductor industry, optoelectronics industry, integrated circuit and packaging testing processes. It can be used in the research and development of precision electrical measurements of complex and high-speed devices to ensure quality and reliability, and reduce research and development time and device manufacturing process costs. Fault analysis equipment is used to check the fault conditions of semiconductor devices under actual working conditions, verify the reliability of semiconductor devices, and restore failure scenarios, so as to determine the defect location and cause of the semiconductor device, and improve the design and manufacturing process of semiconductor devices based on the EFA (Electrical Failure Analysis) results to improve the reliability of semiconductor devices.

[0003] With the development of process nodes, line widths are getting narrower and narrower. During the failure analysis process, if the probe station in the fault analysis equipment can accurately locate the test points in the semiconductor device, the efficiency and success rate of obtaining EFA results can be improved.

[0004] In the related art, the semiconductor device is first fixed on a glass slide by hot melt adhesive, and then the glass slide is fixed on a stage by tape, and then the probe is moved to the test point of the semiconductor device to start the test.

[0005] However, when the operator controls the probe to move horizontally, due to the narrow detection space, the semiconductor device may have spherical bumps or half pads, resulting in the probe being located at a different point from the test point after movement, which in turn reduces the efficiency and success rate of obtaining EFA results. In addition, the semiconductor device may be scratched or even damaged during the movement, which also reduces the efficiency and success rate of obtaining EFA results. Utility Model Content

[0006] The technical problem to be solved by the present application is that the efficiency and success rate of obtaining EFA results are low.

[0007] To solve the above technical problems, the present application provides a probe testing system, comprising: a carrier layer, which is used to carry a chip to be tested; a pressure sensing system, which is detachably arranged under the carrier layer, and the pressure sensing system includes at least one pressure sensor array, and the pressure sensor array is used to obtain the position information of the test probe currently acting on the chip to be tested, and determine the moving direction and moving distance of the test probe based on the position information and the test point of the chip to be tested.

[0008] In some embodiments of the present application, the carrier layer includes at least one detection card slot, the detection card slot is used to accommodate a glass slide, the size of the detection card slot is adapted to the size of the glass slide, and the glass slide is used to carry the chip to be tested.

[0009] In some embodiments of the present application, the detection card slot includes: a card slot base, the card slot base is a hollow structure, and a slide groove is arranged on the inner side of the hollow structure; a card slot carrier, the card slot carrier is detachably connected to the card slot base through the slide groove, and the card slot carrier is used to accommodate the glass slide.

[0010] In some embodiments of the present application, the carrier layer includes at least one locking device, and the at least one locking device is arranged on the carrier layer. One locking device corresponds to one detection slot, and the locking device is used to fix the slot carrier.

[0011] In some embodiments of the present application, the locking device includes at least two locking components, and the locking components include a steering screw and a locking pressure plate. The steering screw is sleeved with the locking pressure plate and fixed on the carrier layer.

[0012] In some embodiments of the present application, the pressure sensor array corresponds to the detection card slots one by one.

[0013] In some embodiments of the present application, the pressure sensor array is disposed directly below the detection card slot.

[0014] In some embodiments of the present application, the pressure sensor array is a flexible thin film pressure sensor array.

[0015] In some embodiments of the present application, the probe testing system further includes: a supporting layer, which is detachably disposed below the pressure sensing system, the supporting layer being used to support the chip to be tested, the carrier layer and the pressure sensing system, and the supporting layer being used to support the detection pressure generated by the probe in detecting the chip to be tested.

[0016] In some embodiments of the present application, the pressure sensing system includes a packaging layer, the packaging layer is disposed on the pressure sensor array, and the material of the packaging layer is a deformation memory material.

[0017] Compared with the prior art, the technical solution of the present application sets a pressure-sensing system under the carrier layer, wherein the pressure-sensing system includes at least one pressure sensor array, and the pressure sensor array is used to obtain the position information of the test probe currently acting on the chip to be tested, and the pressure-sensing system determines the moving direction and moving distance of the test probe based on the position information and the test point of the chip to be tested. Therefore, when the operator controls the horizontal movement of the probe, the position information of the test probe currently acting on the chip to be tested can be obtained through the pressure-sensing system, and the moving direction and moving distance of the test probe can be determined based on the pressure-sensing system. Moving the test probe can improve the accuracy of the detected test points, and can also reduce the possibility of scratching or even damaging the semiconductor device during the movement process, thereby improving the efficiency and success rate of obtaining EFA results. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The following figures describe in detail the exemplary embodiments disclosed in this application. The same reference numerals represent similar structures in several views of the drawings. Those skilled in the art will understand that these embodiments are non-limiting, exemplary embodiments, and the drawings are only for the purpose of illustration and description, and are not intended to limit the scope of this application. Other embodiments may also accomplish the inventive intent in this application. It should be understood that the drawings are not drawn to scale.

[0019] Figure 1 is a schematic diagram of the structure of a probe testing system according to some embodiments of the present application;

[0020] Figure 2 is a schematic diagram of a carrier layer according to some embodiments of the present application;

[0021] Figure 3 is a schematic diagram of the structure of a locking device according to some embodiments of the present application;

[0022] Description of the accompanying drawings: 11-carrying layer, 12-pressure sensing system, 13-supporting layer, 121-pressure sensor array, 111-detection card slot, 21-card slot base, 22-card slot carrier, 112-locking device, 31-locking assembly, 311-steering screw and 312-locking pressure plate. DETAILED DESCRIPTION

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some examples or embodiments of the present application. For ordinary technicians in this field, the present application can also be applied to other similar scenarios based on these drawings without creative work. Unless it is obvious from the language environment or otherwise explained, the same reference numerals in the figures represent the same structure or operation. It should be clearly understood that the drawings are only for the purpose of illustration and description and are not intended to limit the scope of disclosure of this specification.

[0024] It should be understood that the "module" and "circuit" used herein are a method for distinguishing different components, elements, parts, portions or assemblies at different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.

[0025] The terms used in this application are only used for the purpose of describing specific example embodiments and are not restrictive. When used in this specification, the terms "include", "comprise" and / or "contain" mean the existence of the associated integers, steps, operations, elements and / or components, but do not exclude the existence of one or more other features, integers, steps, operations, elements, components and / or groups or the addition of other features, integers, steps, operations, elements, components and / or groups in the probe test system system. When describing the association of different components in this specification, it can be a direct relationship or an indirect relationship. For example, "A and B are connected" can mean that A and B are directly connected, or A and B are indirectly connected through other components.

[0026] In the related art, the semiconductor device is first fixed on a glass slide by hot melt adhesive, and then the glass slide is fixed on a stage by tape, and then the probe is moved to the test point of the semiconductor device to start the test. However, during the process of the operator controlling the horizontal movement of the probe, due to the narrow detection space, the semiconductor device may have spherical protrusions or half pads, resulting in the position of the probe after movement is not the test point, which in turn reduces the efficiency and success rate of obtaining EFA results. In addition, the semiconductor device may be scratched or even damaged during the movement, which also reduces the efficiency and success rate of obtaining EFA results. Moreover, in the process of fixing the glass slide, glue marks may be left on the stage, affecting the surface flatness of the stage. At the same time, if the tape is not fixed correctly, the glass slide will not be able to remain level, affecting the observation effect of the semiconductor device under the lens, and also reducing the success rate of obtaining EFA results.

[0027] Based on the above analysis, if Figure 1 As shown, the probe testing system provided in the embodiment of the present application may include:

[0028] A carrier layer 11, wherein the carrier layer 11 is used to carry the chip to be tested;

[0029] The pressure sensing system 12 is detachably arranged below the carrier layer 11, and the pressure sensing system 12 includes at least one pressure sensor array 121. The pressure sensor array 121 is used to obtain the position information of the test probe currently acting on the chip to be tested. The pressure sensing system 12 is used to determine the moving direction and moving distance of the test probe based on the position information and the test point of the chip to be tested.

[0030] In the embodiment of the present application, the chip to be tested can be first fixed on the glass slide, and then the glass slide is fixed on the carrier layer 11. From top to bottom, the chip to be tested, the glass slide, the carrier layer 11 and the pressure sensing system 12 are arranged in sequence.

[0031] In the embodiment of the present application, when the test probe is used for front testing, the test probe is pressed downward on the chip to be tested, and the generated probe pressure is transmitted to the pressure sensor array 121 in the pressure sensing system 12 through the carrier layer 11. Then, the pressure sensor array 121 is used to obtain the position information of the test probe currently acting on the chip to be tested. Finally, the pressure sensing system 12 determines the moving direction and moving distance of the test probe based on the position information and the test point of the chip to be tested.

[0032] It can be understood that when the test probe is used to perform a front test, the test probe and the observation device for obtaining the EFA result are located on the same side of the chip to be tested.

[0033] In the embodiment of the present application, the pressure sensing system 12 further includes a power supply device and a controller, wherein the power supply device is used to supply power to at least one of the pressure sensor arrays 121 and the controller. The controller is used to obtain the test point and the position information of the chip to be tested, and the controller is also used to determine the test position of the test point of the chip to be tested on the pressure sensor array 121 according to the relative position relationship between the chip to be tested and the pressure sensor array 121. Thereafter, the controller is also used to determine the moving direction and moving distance of the test probe with the position information as the starting point and the test position as the end point.

[0034] It is understandable that the chip to be tested may have one or more test points. In the case of multiple test points, each test position may be determined as an end point in sequence.

[0035] It should be noted that the controller is also used to determine that the test probe can test the test point of the chip to be tested when the test position and the position information are the same.

[0036] In some embodiments of the present application, the pressure sensor array 121 is a flexible thin film pressure sensor array.

[0037] In this way, when the test probe is used for detection, it is not necessary to determine whether the detection is successful by horizontally moving the probe, which can avoid scratching or even damaging the chip to be tested, thereby avoiding affecting the current-voltage IV curve and capturing hot spots in EFA. In addition, for the chip to be tested with spherical bumps or half pads, the digital signal (position information) obtained by the pressure sensor array 121 directly determines the moving direction and moving distance, which can increase the speed of placing the test probe at the test point, thereby improving the efficiency of obtaining EFA results.

[0038] Since the test probe needs to apply a certain amount of pressure to the chip to be tested, the relative position of the chip to be tested and the carrier layer 11 may change, which in turn may cause the relative position relationship between the chip to be tested and the pressure sensor array 121 to change, resulting in inaccurate movement direction and movement distance of the test probe, ultimately leading to low efficiency and success rate in obtaining EFA results.

[0039] To solve the above problems, in some embodiments of the present application, Figure 2 As shown, the carrier layer 11 includes at least one detection card slot 111, and the detection card slot 111 is used to accommodate a glass slide. The size of the detection card slot 111 is adapted to the size of the glass slide, and the glass slide is used to carry the chip to be tested.

[0040] In the embodiment of the present application, the pressure sensor array 121 can be arranged directly below the detection card slot 111, so as to reduce the number of the pressure sensor arrays 121, reduce the failure rate, and reduce the cost of the probe test system.

[0041] In some embodiments of the present application, the area of ​​the detection slot 111 is adapted to the area of ​​the pressure sensor array 121 .

[0042] In some embodiments of the present application, the pressure sensor array 121 corresponds to the detection slot 111 one by one, that is, one pressure sensor array 121 is correspondingly arranged for one detection slot 111 .

[0043] When the test probe is used for a front test, the test probe is pressed downward on the chip to be tested, and the generated probe pressure is transmitted to the pressure sensor array 121 in the pressure sensing system 12 through the chip to be tested, the glass slide, and the carrier layer 11. In order to increase the sensitivity of testing the probe pressure, in some embodiments of the present application, the pressure sensor array is arranged directly below the detection card slot 111.

[0044] In this way, the position of the glass slide can be fixed through the detection card slot 111, and then the position of the chip to be tested can be fixed, so that when the test probe applies a certain pressure to the chip to be tested, the relative position of the chip to be tested and the carrier layer 11 is prevented from changing, and the relative position relationship between the chip to be tested and the pressure sensor array 121 is prevented from changing, thereby avoiding inaccurate movement direction and movement distance of the test probe, and ultimately improving the efficiency and success rate of obtaining EFA results.

[0045] In some embodiments of the present application, Figure 2 As shown, the detection card slot 111 includes: a card slot base 21, the card slot base 21 is a hollow structure, and a slide groove is arranged on the inner side of the hollow structure; a card slot carrier 22, the card slot carrier 22 is slidably connected to the card slot base 21 through the slide groove, and the card slot carrier 22 is used to accommodate the slide.

[0046] In the embodiment of the present application, the card slot carrier 22 can be first moved to a larger operating platform, and then the glass slide carrying the chip to be tested can be installed on the larger operating platform. Finally, the card slot base 21 is connected to the card slot carrier 22 through the slide slot.

[0047] In the embodiment of the present application, the slot base 21 surrounds the hollow structure and is provided with the slide groove on the inner side in the same sliding direction as the slot carrier 22. After the slot carrier 22 and the slot base 21 are slidably connected via the slide groove, the bottom and top of the slot carrier 22 and the slot base 21 are at the same horizontal position.

[0048] In the embodiment of the present application, the card slot carrier 22 is a hollow sheet structure, and a accommodating table is arranged on the inner side of the card slot carrier 22 surrounding the hollow sheet structure. The accommodating table is used to carry the glass slide so that the horizontal relative position of the glass slide and the card slot carrier 22 remains unchanged.

[0049] In the embodiment of the present application, the thickness of the accommodating platform is selected under the following conditions: less than the maximum deformation degree of the glass slide, and able to bear the pressure applied by the test probe to the chip to be tested.

[0050] In this way, by reducing the thickness of the accommodating platform, that is, reducing the distance between the glass slide and the pressure sensor array 121 , the accuracy of placing the test probes of the pressure sensor array 121 at the test points is improved.

[0051] In this way, the relative position of the card slot base 21 disposed in the carrier layer 11 and the card slot carrier 22 for accommodating the glass slide can be prevented from changing. In short, the relative position of the carrier layer 11 and the glass slide can be prevented from changing. In this way, the speed at which the test probe moves to the test point can be increased, thereby improving the efficiency and success rate of obtaining EFA results.

[0052] In some embodiments of the present application, if the direction in which the test probe applies pressure to the chip to be tested is the same as the direction in which the card slot carrier 22 slides out of the card slot base 21 through the slide slot, then the card slot carrier 22 may slide out of the card slot base 21. Therefore, the carrier layer 11 includes at least one locking device 112, and the at least one locking device 112 is arranged on the carrier layer 11, one locking device 112 corresponds to one detection card slot 111, and the locking device 112 is used to fix the card slot carrier 22.

[0053] Exemplarily, the carrier layer 11 includes four locking devices 112 , and the four locking devices 112 are all located on one side of the carrier layer 11 , and the four locking devices 112 are evenly distributed around the card slot base 21 .

[0054] Exemplarily, the carrier layer 11 includes 6 locking devices 112, wherein 4 locking devices 112 are located on one side of the carrier layer 11, and the 4 locking devices 112 are evenly distributed around the slot base 21; another 2 locking devices 112 are located on the other side of the carrier layer 11, and another 2 locking devices 112 are evenly distributed around the slot base 21.

[0055] In this way, the locking device 112 can reduce the risk that the card slot carrier 22 may slip out of the card slot base 21, thereby avoiding adjusting the direction of applied pressure when using the test probe for detection, thereby increasing the probe test speed and thereby improving the efficiency and success rate of obtaining EFA results.

[0056] In some embodiments of the present application, in order to better observe the test status of the chip to be tested, the test probe can be used to perform back-side testing. It is understandable that when the test probe is used to perform back-side testing, the test probe and the observation device for obtaining the EFA result are located on both sides of the chip to be tested. At this time, it is necessary to remove the obstructions on both sides of the chip to be tested, that is, remove the pressure sensing system 12.

[0057] Specifically, the chip to be tested may be first fixed on the glass slide, and then the glass slide is fixed on the carrier layer 11. From top to bottom, the glass slide, the chip to be tested and the carrier layer 11 are arranged in sequence.

[0058] In this way, the locking device 112 can reduce the risk that the slot carrier 22 may slip out of the slot base 21, and can also prevent the slot carrier 22 from slipping out of the slot base 21 or even from the carrier layer due to the upward pressure applied during the detection process, thereby avoiding adjusting the direction of applied pressure when using the test probe for detection, thereby increasing the probe testing speed and thereby improving the efficiency and success rate of obtaining EFA results.

[0059] In some embodiments of the present application, Figure 3 As shown, the locking device 112 includes at least two locking components 31 . The locking components 31 include a turning screw 311 and a locking pressing plate 312 . The turning screw 311 is sleeved with the locking pressing plate 312 and fixed on the carrier layer 11 .

[0060] In the embodiment of the present application, the steering screw 311 can be fixed on the carrier layer 11 by threaded connection.

[0061] In the embodiment of the present application, the locking pressure plate 312 can rotate along the steering screw 311. When the locking pressure plate 312 is rotated onto the glass slide, the glass slide can be locked; when the locking pressure plate 312 is rotated outside the glass slide, the card slot carrier 22 can be slid out of the card slot base 21 together with the glass slide.

[0062] In the embodiment of the present application, when the locking pressure plate 312 rotates outside the glass slide, the steering screw 311 also rotates with the locking pressure plate 312, so as to reduce the degree of pressure of the locking pressure plate 312 on the glass slide, and avoid scratching the glass slide when the locking pressure plate 312 rotates outside the glass slide.

[0063] In some embodiments of the present application, Figure 1 As shown, the probe testing system also includes: a support layer 13, which is detachably arranged below the pressure sensing system 12, and is used to support the chip to be tested, the carrier layer 11 and the pressure sensing system 12, and the support layer 13 is also used to support the detection pressure generated by the probe to detect the chip to be tested.

[0064] In this way, the support layer 13 can prevent the pressure sensing system 12 from deforming due to uneven force, thereby avoiding inaccurate detected position information, thereby improving the accuracy of the detected position information and the success rate of obtaining EFA results.

[0065] In some embodiments of the present application, Figure 1As shown, the pressure sensing system includes a packaging layer 122 , and the packaging layer 122 is disposed on the pressure sensor array 121 . The material of the packaging layer 122 is a deformation memory material.

[0066] In the embodiment of the present application, the encapsulation layer 122 is arranged on the pressure sensor array 121. On the one hand, it can prevent dust, humid environment or other foreign matter from covering and affecting the detection accuracy of the pressure sensor array 121. On the other hand, it can prevent the test probe from directly acting on the pressure sensor array 121, thereby reducing the pressure of the pressure sensor array 121 and improving the service life of the pressure sensor array 121.

[0067] The probe test system provided in the embodiment of the present application is provided with a pressure sensing system 12 below the carrier layer 11, wherein the pressure sensing system 12 includes at least one pressure sensor array 121, and the pressure sensor array 121 is used to obtain the position information of the test probe currently acting on the chip to be tested, and the pressure sensing system 12 determines the moving direction and moving distance of the test probe based on the position information and the test point of the chip to be tested. Thus, when the operator controls the horizontal movement of the probe, the position information of the test probe currently acting on the chip to be tested can be obtained through the pressure sensing system 12, and the moving direction and moving distance of the test probe can be determined based on the pressure sensing system 12. Moving the test probe can improve the accuracy of the detected test point, and can also reduce the possibility of scratching or even damaging the semiconductor device during the movement process, thereby improving the efficiency and success rate of obtaining EFA results.

[0068] It should be noted that different embodiments may produce different beneficial effects. In different embodiments, the beneficial effects that may be produced may be any one or a combination of the above, or any other possible beneficial effects.

[0069] In summary, after reading the contents of this application, those skilled in the art will appreciate that the aforementioned application contents may be presented only in an exemplary manner and may not be restrictive. Although not explicitly stated herein, those skilled in the art will appreciate that this application is intended to encompass various reasonable changes, improvements and modifications to the embodiments. These changes, improvements and modifications are within the spirit and scope of the exemplary embodiments of this application.

[0070] It should also be understood that although the terms first, second, third, etc. can be used to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. Therefore, without departing from the teachings of the present application, the first element in some embodiments can be referred to as the second element in other embodiments. The same reference numerals or the same reference signs represent the same elements throughout the specification.

Claims

1. A probe testing system, characterized in that: include: A carrier layer, the carrier layer is used to carry the chip to be tested; A pressure sensing system, wherein the pressure sensing system is detachably arranged below the carrier layer, and the pressure sensing system includes at least one pressure sensor array, wherein the pressure sensor array is used to obtain position information of a test probe currently acting on the chip to be tested, and the pressure sensing system is used to determine a moving direction and a moving distance of the test probe based on the position information and the test point of the chip to be tested.

2. The probe testing system according to claim 1, characterized in that: The carrier layer includes at least one detection card slot, the detection card slot is used to accommodate a glass slide, the size of the detection card slot is adapted to the size of the glass slide, and the glass slide is used to carry the chip to be tested.

3. The probe testing system according to claim 2, characterized in that: The detection card slot comprises: A card slot base, wherein the card slot base is a hollow structure, and a slide slot is arranged inside the hollow structure; A card slot carrier, wherein the card slot carrier is detachably connected to the card slot base via the slide slot, and the card slot carrier is used to accommodate the glass slide.

4. The probe testing system according to claim 3, characterized in that: The carrier layer includes at least one locking device, which is arranged on the carrier layer. One locking device corresponds to one detection card slot, and the locking device is used to fix the card slot carrier.

5. The probe testing system according to claim 4, characterized in that: The locking device comprises at least two locking components, wherein the locking components comprise a steering screw and a locking pressing plate, and the steering screw is sleeved with the locking pressing plate and fixed on the load-bearing layer.

6. The probe testing system according to claim 2, characterized in that: The pressure sensor array corresponds to the detection card slots one by one.

7. The probe testing system according to claim 6, characterized in that: The pressure sensor array is arranged directly below the detection card slot.

8. The probe testing system according to claim 6, characterized in that: The pressure sensor array is a flexible thin film pressure sensor array.

9. The probe testing system according to claim 1, wherein: Also includes: The support layer is detachably disposed below the pressure sensing system, and is used to support the chip to be tested, the carrier layer and the pressure sensing system, and is also used to support the detection pressure generated by the probe when detecting the chip to be tested.

10. The probe testing system according to any one of claims 1 to 9, characterized in that: The pressure sensing system comprises a packaging layer, the packaging layer is arranged on the pressure sensor array, and the material of the packaging layer is a deformation memory material.

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