Optoelectronic device

Abstract

The utility model provides an optoelectronic device. The optoelectronic device comprises a photonic integrated chip; and the optical component is arranged on the photonic integrated chip and is provided with an opening, and the optical component penetrates through the opening and is used for guiding an optical signal emitted by the photonic integrated chip. Therefore, the optical component is arranged on the photonic integrated chip, the adhesive for fixing the photonic integrated chip is prevented from influencing the accurate position of the optical component, and the stability of the optical component is ensured; meanwhile, the opening is formed, so that the light reflection and transmission effects are guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a photoelectric device. Background Art

[0002] Optical radar, also known as LiDAR (Light Detection And Ranging), measures the distance and other related parameters of the target object by emitting a beam of light, usually in the form of a pulsed laser. At present, the market is committed to the development of various types of LiDAR sensors, especially the design of solid-state frequency modulation modules from the perspective of silicon photonics and photonic crystal technology. Compared with traditional LiDAR systems, miniaturized, integrated and modular LiDAR chips are expected to achieve significant optimization in size, weight and power consumption. In addition, the application of silicon photonics technology can also help reduce manufacturing costs, thereby promoting the large-scale production and application of LiDAR.

[0003] However, there are still deficiencies in the assembly method of the optical reflective component and the optical module (including photonic integrated chip and electronic integrated chip) in the small LiDAR chip. The traditional assembly method requires that the optical module and the optical reflective component be independently installed on the substrate. In this process, it is necessary to first use an adhesive such as epoxy resin to fix the optical module to the substrate, and then fix the optical reflective component. However, the adhesive may penetrate, diffuse, etc. during use, which will interfere with the precise position of the optical reflective component, thereby affecting its stability, and ultimately having a significant impact on the reflection and transmission of light.

[0004] like Figure 1 As shown, Figure 1 It is a schematic diagram of the structure of the optoelectronic device in the prior art. Figure 1 The optoelectronic device shown comprises:

[0005] Electronic integrated chip 01;

[0006] Photonic integrated chip 02, the electronic integrated chip 01 is arranged above the photonic integrated chip 02;

[0007] Substrate 03 , the photon integrated chip 02 is fixed on the substrate 03 by epoxy resin glue 05 , and the optical component 04 is fixed on the substrate 03 and is located next to the photon integrated chip 02 .

[0008] During the manufacturing process, the photon integrated chip 02 is first fixed on the substrate 03 with epoxy resin glue 05. In this case, the epoxy resin glue 05 may penetrate, diffuse, etc. Then, when the optical component 04 is further fixed, some epoxy resin glue 05 will remain on the substrate 03, which will interfere with the precise position of the optical component 04, thereby affecting its stability and ultimately having a significant impact on the reflection and transmission of light. Utility Model Content

[0009] The present application provides a photovoltaic device.

[0010] In a first aspect, the present application provides an optoelectronic device, comprising:

[0011] Photonic integrated chips;

[0012] An optical component is disposed on the photonic integrated chip and is provided with an opening. The optical component passes through the opening to guide the optical signal emitted by the photonic integrated chip.

[0013] As a possible implementation manner, the optical component is provided with a reflective component, and the reflective component is used to guide the optical signal emitted by the photonic integrated chip.

[0014] As a possible implementation manner, the optical component includes an optical element, and the optical element is disposed at the opening to guide the optical signal.

[0015] As a possible implementation manner, the optical element includes an optical lens.

[0016] As a possible implementation, the optical lenses are arranged in an array.

[0017] As a possible implementation manner, the reflective component includes an opposing surface opposite to the photonic integrated chip.

[0018] As a possible implementation manner, a reflective film is disposed on the opposite surface.

[0019] As a possible implementation manner, the photonic integrated chip is provided with a groove.

[0020] As a possible implementation manner, the photonic integrated chip includes an optical waveguide.

[0021] As a possible implementation manner, one end of the optical waveguide is exposed from the groove.

[0022] As a possible implementation manner, in a cross section, one end of the optical waveguide is exposed from the groove and exceeds the photonic integrated chip.

[0023] As a possible implementation manner, the optical component is disposed in the groove.

[0024] As a possible implementation manner, the optical component is disposed on the photonic integrated chip by using optical glue.

[0025] As a possible implementation, the optical signal passes through the optical glue.

[0026] As a possible implementation manner, the optoelectronic device further includes:

[0027] An electronic integrated chip, wherein the electronic integrated chip is arranged on the photon integrated chip.

[0028] As a possible implementation manner, the optoelectronic device further includes:

[0029] A substrate, on which the photonic integrated chip is arranged.

[0030] As a possible implementation manner, the optical component is a sphere.

[0031] As a possible implementation manner, a reflective portion is provided on the spherical surface of the spherical optical component.

[0032] As a possible implementation manner, the longitudinal cross-section of the optical component is L-shaped.

[0033] As a possible implementation manner, an embedded metal film is provided in the optical component.

[0034] As a possible implementation manner, the projection of the optical glue in the horizontal direction exceeds the projection of the photonic integrated chip in the horizontal direction.

[0035] In order to ensure the stability of the optical reflection component, the present application proposes an optoelectronic device, including a photon integrated chip; an optical component, the optical component is arranged on the photon integrated chip and is provided with an opening, and the optical component is used to guide the light signal emitted by the photon integrated chip to pass through the opening. In this way, the optical component is arranged on the photon integrated chip to avoid the adhesive for fixing the photon integrated chip affecting the position of the optical component, thereby ensuring the stability of the optical component; at the same time, the opening is provided to ensure the reflection and transmission effect of light. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0037] Figure 1 It is a schematic diagram of the structure of a photoelectric device in the prior art;

[0038] Figure 2 is a front view and a partially enlarged view of an optoelectronic device 100 according to an embodiment of the utility model;

[0039] Figure 3 is a top view of an optoelectronic device 100 according to an embodiment of the present utility model;

[0040] Figure 4 is a front view of an optoelectronic device 200 according to an embodiment of the utility model;

[0041] Figure 5 is a front view of an optoelectronic device 300 according to an embodiment of the present utility model;

[0042] Figure 6 is a front view of an optoelectronic device 400 according to an embodiment of the present utility model;

[0043] Figure 7 is a front view of an optoelectronic device 500 according to an embodiment of the present utility model;

[0044] Figure 8 is a top view of an optoelectronic device 600 according to an embodiment of the present utility model;

[0045] Fig. 9 1 is a schematic diagram of the structure of an optoelectronic device 100 at various manufacturing stages according to an embodiment of the present invention.

[0046] Description of reference numerals / symbols:

[0047] 01-electronic integrated chip; 02-photon integrated chip; 03-substrate; 04-optical component; 05-epoxy resin glue; 101-photon integrated chip; 1011-groove; 1012-optical waveguide; 102-optical component; 1021-reflection component; 10211-first plane; 10212-second plane; 10213-third plane; 1022-opening; 1023-optical element; 1024-embedded metal film; 103-optical glue; 104-electronic integrated chip; 105-substrate; 1051-adhesive; 106-optical signal. DETAILED DESCRIPTION

[0048] The specific implementation methods of the present application are described below in conjunction with the accompanying drawings and embodiments. Through the contents recorded in this specification, those skilled in the art can easily understand the technical problems solved by the present application and the technical effects produced. It is understood that the specific embodiments described herein are only used to explain the relevant inventions, rather than to limit the inventions. In addition, for ease of description, only the parts related to the relevant inventions are shown in the accompanying drawings.

[0049] It should be readily understood that the meanings of “on,” “over,” and “over” in this application should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also means “on something” including the presence of intermediate components or layers therebetween.

[0050] Additionally, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or component to another element or component illustrated in the drawings. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

[0051] The term "layer" as used herein refers to a material portion including an area with a certain thickness. The layer can extend over the entire lower or upper structure, or can have a degree less than the range of the lower or upper structure. In addition, the layer can be a region of a homogeneous or inhomogeneous continuous structure, and its thickness is less than the thickness of the continuous structure. For example, the layer can be located between the top surface and the bottom surface of the continuous structure or between any pair of horizontal planes therebetween. The layer can extend horizontally, vertically and / or along a tapered surface. A substrate can be a layer, one or more layers can be included therein, and / or one or more layers can be provided thereon, above and / or below. A layer can include multiple layers. For example, a semiconductor layer can include one or more doped or undoped semiconductor layers, and can have the same or different materials.

[0052] The term "substrate" as used herein refers to a material on which subsequent material layers are added. The substrate itself may be patterned. The material added on top of the substrate may be patterned or may remain unpatterned. In addition, the substrate may include a variety of semiconductor materials, such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate may be made of a non-conductive material, such as glass, plastic, or a sapphire chip, etc. Further alternatively, the substrate may have a semiconductor device or circuit formed therein.

[0053] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of the specification are only used to match the contents recorded in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of the present application, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed in the present application. At the same time, the terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of narration, and are not used to limit the scope of the implementation of the present application. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present application without substantially changing the technical content.

[0054] It should also be noted that the longitudinal cross-section corresponding to the embodiment of the present application may be a cross-section corresponding to the front view direction, the transverse cross-section may be a cross-section corresponding to the right view direction, and the horizontal cross-section may be a cross-section corresponding to the top view direction.

[0055] In addition, the embodiments and features in the embodiments of the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0056] Combination Figure 2 , Figure 3 As shown, Figure 2 is a front view and a partially enlarged schematic diagram of an optoelectronic device 100 according to an embodiment of the present utility model, Figure 3 1 is a top view of an optoelectronic device 100 according to an embodiment of the present invention. The optoelectronic device 100 mainly includes:

[0057] The photonic integrated chip 101 and the optical component 102 , wherein the optical component 102 is disposed on the photonic integrated chip 101 and is provided with an opening 1022 , and its function is to guide the optical signal 106 emitted by the photonic integrated chip 101 to pass through the opening 1022 .

[0058] In this way, the optical component 102 is arranged on the photonic integrated chip 101 to avoid the adhesive for bonding the photonic integrated chip 101 affecting the position of the optical component 102 when it is arranged on the substrate 105, thereby ensuring the stability of the optical component 102; at the same time, the opening 1022 is set to ensure the reflection and transmission effect of light.

[0059] As a possible implementation, the optical component 102 may be provided with a reflective component 1021, the main function of which is to guide the optical signal 106 emitted by the photonic integrated chip 101. Preferably, the reflective component 1021 may be a separate multi-layer plane, see Figure 2The reflective component 1021 may include an opposite surface opposite to the photonic integrated chip 101. To enhance the reflection effect, a reflective film may be provided on the opposite surface.

[0060] In addition, the optical component 102 may further include an optical element 1023 disposed at the opening 1022 , which is also used to guide the optical signal 106 . As an example, the optical element 1023 may be an optical lens.

[0061] Meanwhile, the photon integrated chip 101 may be provided with a groove 1011 and an optical waveguide 1012. One end of the optical waveguide 1012 (eg Figure 2 The left end of the optical waveguide 1012 is exposed outside the groove 1011, that is, in the cross section (cross section) projected in the horizontal direction, one end of the optical waveguide 1012 is exposed in the groove 1011 and exceeds the photon integrated chip 101. Since the optical component 102 needs to be fixed on the photon integrated chip 101 by the optical glue 103, Figure 2 In the embodiment, the portion of the optical waveguide 1012 exposed in the groove 1011 is covered by the optical glue 103. In this case, the optical signal 106 can be transmitted through the optical glue 103, and the horizontal projection of the optical glue 103 should exceed one side of the photonic integrated chip 101 to ensure the complete transmission of the optical signal 106. Preferably, in order to delay the divergence of the optical signal 106, the refractive index of the optical glue 103 can be set to 1.4±0.2.

[0062] In addition, the optoelectronic device 100 may further include an electronic integrated chip 104, which is disposed on the photonic integrated chip 101 to achieve coordinated processing of the optoelectronic signal 106. The substrate 105 serves as a supporting structure, and the photonic integrated chip 101 may be disposed thereon.

[0063] As a possible implementation, see further Figure 4 , Figure 4 2 is a front view of an optoelectronic device 200 according to an embodiment of the present invention. The optoelectronic device 200 is similar to the optoelectronic device 100, except that:

[0064] ① The reflective component 1021 in the optoelectronic device 100 is a separate multi-layer plane, see Figure 2 The first plane 10211 and the second plane 10212 in the optoelectronic device 200 have only one plane, see Figure 4 The third plane 10213 in.

[0065] ② One end of the optical component 102 in the optoelectronic device 100 is exposed from the photonic integrated chip 101; while the lower end of the optical component 102 of the optoelectronic device 200 is embedded in the photonic integrated chip 101. In the cross section, the bottom surface of the optical component 102 is lower than the top surface of the photonic integrated chip 101, and part of the side wall of the optical component 102 is also lower than the top surface of the photonic integrated chip 101.

[0066] As a possible implementation, see further Figure 5 , Figure 5 2 is a front view of an optoelectronic device 300 according to an embodiment of the present invention. The optoelectronic device 300 is similar to the optoelectronic device 200, except that:

[0067] The lower end of the optical component 102 of the optoelectronic device 200 is completely embedded in the photonic integrated chip 101; while in the optoelectronic device 300, only a portion of the lower end of the optical component 102 is embedded in the photonic integrated chip 101, and the other portion is exposed from the photonic integrated chip 101, that is, in the cross section, the side wall of the optical component 102 will exceed the side wall of the chip 101, that is, one end of the optical component 102 will be exposed from the photonic integrated chip 101.

[0068] As a possible implementation, see further Figure 6 , Figure 6 1 is a front view of an optoelectronic device 400 according to an embodiment of the present invention. The optoelectronic device 400 is similar to the optoelectronic device 200, except that:

[0069] The cross section (longitudinal section) of the optical component 102 of the optoelectronic device 200 is triangular, while the cross section (longitudinal section) of the optical component 102 of the optoelectronic device 400 is circular. It should be noted that the arc surface of the optoelectronic device 400 may be provided with a reflective portion to enhance the reflection effect of the optical signal.

[0070] As a possible implementation, see further Figure 7 , Figure 7 1 is a front view of an optoelectronic device 500 according to an embodiment of the present invention. The optoelectronic device 500 is similar to the optoelectronic device 300, except that:

[0071] The cross section (longitudinal section) of the optical component 102 of the optoelectronic device 300 is triangular; while the cross section (longitudinal section) of the optical component 102 of the optoelectronic device 500 is L-shaped, and the optical adhesive 103 is completely wrapped by the optical component 102 and the electronic integrated chip 101 .

[0072] It should be noted that an internally embedded metal film may be provided inside the optical component 102 of the optoelectronic device 500 to optimize the reflection and transmission performance of the optical signal.

[0073] As a possible implementation, see further Figure 8 , Figure 8 1 is a top view of an optoelectronic device 600 according to an embodiment of the present invention. The optoelectronic device 600 is similar to the optoelectronic device 100, except that:

[0074] The optoelectronic device 100 does not have a plurality of optical lenses arranged in an array; in order to optimize the guiding effect of the optical signal 106 and converge the divergent optical signal 106 , the optoelectronic device 600 has a plurality of optical lenses arranged in an array.

[0075] In summary, the optoelectronic device proposed in the present application uses optical components of different shapes and different arrangements to achieve efficient guidance and transmission of optical signals.

[0076] Refer to the following Fig. 9 The following are the steps for manufacturing a thin circuit structure 100 according to an embodiment of the present invention:

[0077] Step 1: See Fig. 9 In step (a), an electronic integrated chip 104 is disposed above the photonic integrated chip 101;

[0078] Step 2: See Fig. 9 In step (b), the photonic integrated chip 101 and the electronic integrated chip 104 are disposed on the substrate 105 by using an adhesive 1051;

[0079] Step 3: See Fig. 9 In step (c), optical glue 103 is applied to the edge (eg, the upper left edge) of the photonic integrated chip 101;

[0080] Step 4: See Fig. 9 In step (d), the optical component 102 is disposed on the edge of the photonic integrated chip 101 where the optical glue 103 is applied.

[0081] As used herein, the terms "substantially," "substantial," "approximately," and "about" are used to indicate and explain minor variations. For example, when used in conjunction with a numerical value, the above terms may refer to a variation range of less than or equal to ±10% of the corresponding numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. As another example, the thickness of a film or layer is "substantially uniform" and may refer to a standard deviation of less than or equal to ±10% of the average thickness of the film or layer, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term "substantially coplanar" may refer to two surfaces that are within 50 μm along the same plane, such as within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm along the same plane. Two components may be considered to be "substantially aligned" if, for example, the two components overlap or overlap within 200 μm, 150 μm, 100 μm, 50 μm, 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm. Two surfaces or components may be considered to be "substantially perpendicular" if the angle between the two surfaces or components is, for example, 90°±10°, such as ±5°, ±4°, ±3°, ±2°, ±1°, ±0.5°, ±0.1°, or ±0.05°. When used in conjunction with an event or situation, the terms "substantially", "substantial", "approximately", and "about" may refer to situations where the event or situation occurs exactly as well as situations where the event or situation occurs very approximately.

Claims

1. A photoelectric device, characterized in that: include: Photonic integrated chips; An optical component is disposed on the photonic integrated chip and is provided with an opening. The optical component passes through the opening to guide the optical signal emitted by the photonic integrated chip.

2. The device according to claim 1, characterized in that The optical component is provided with a reflective component, and the reflective component is used to guide the optical signal emitted by the photonic integrated chip.

3. The device according to claim 1, characterized in that The optical component includes an optical element, which is disposed at the opening and is used to guide the optical signal.

4. The device according to claim 3, characterized in that The optical element includes optical lenses, and the optical lenses are arranged in an array.

5. The device according to claim 1, characterized in that The photon integrated chip is provided with a groove.

6. The device according to claim 5, characterized in that The photonic integrated chip includes an optical waveguide.

7. The device according to claim 6, characterized in that One end of the optical waveguide is exposed in the groove.

8. The device according to claim 6, characterized in that In the cross section, one end of the optical waveguide is exposed from the groove and exceeds the photonic integrated chip.

9. The device according to claim 5, characterized in that The optical component is arranged in the groove.

10. The device according to claim 1, characterized in that The optical component is arranged on the photon integrated chip by using optical glue, and the projection of the optical glue in the horizontal direction exceeds the projection of the photon integrated chip in the horizontal direction.

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