Industrial all-in-one machine
By designing the closed accommodating space and heat dissipation space separated by the partition wall in the industrial integrated machine, and combining the design of the thermal conduction block and the cooling fan, the existing industrial integrated machine has solved the problems of poor dust protection and poor heat dissipation, achieving higher dust protection and more effective heat dissipation.
Patent Information
- Application Number
- CN202422025965.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-20
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-08-20
AI Technical Summary
In harsh industrial environments, existing industrial integrated machines have problems such as poor dust protection effect, easy damage to the cooling fan, difficult to replace and high power consumption, resulting in frequent failures and short component life.
An industrial integrated machine is designed, and its shell is divided into an enclosed storage space and a heat dissipation space through a partition wall. The processor module is placed in the enclosed storage space. Combined with a heat conducting block and a heat dissipation fan, it uses the heat dissipation holes and air outlets on the cover plate to form a directional airflow to improve the heat dissipation effect.
Effectively isolate external dust and extend the working life of the equipment; improve the heat dissipation effect and reduce the probability of failure by optimizing the heat dissipation design.
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Figure CN222952647U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of industrial all-in-one machines, and in particular to an industrial all-in-one machine. Background Art
[0002] Among the related technologies, industrial all-in-one computers are widely used in many industrial fields such as manufacturing, automated production lines, logistics warehousing, and intelligent transportation, providing an efficient and reliable computing and control platform for industrial production and management. At the same time, industrial all-in-one computers use a sturdy shell material that can withstand harsh industrial environments such as high temperature, high humidity, dust, and vibration.
[0003] With the upgrading of industrial industries, it is often necessary to process large amounts of data, complex calculations and high-precision control tasks. For example, in an automated production line, it is necessary to monitor and analyze the operating status of many devices in real time. High-performance industrial all-in-one machines can quickly process these massive amounts of data to ensure the efficiency and stability of the production process.
[0004] The current industrial integrated machines have the disadvantages of messy internal wiring, poor dustproof, poor high temperature resistance, and frequent vibration. At the same time, the cooling fan is set inside the industrial integrated machine, and the industrial environment is dusty, so the cooling fan is easily damaged. Moreover, since the cooling fan is set inside the industrial integrated machine, it is not easy to replace.
[0005] In addition, current industrial computers do not have high power consumption and dust prevention treatments, allowing some dust to enter the computer, which in turn leads to many industrial computer failures, blue screens, and short component lifespans. Utility Model Content
[0006] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes an industrial all-in-one machine that can improve the dustproof effect.
[0007] The industrial all-in-one machine of the embodiment of the present application includes:
[0008] A shell, comprising a hollow shell body and a partition wall, wherein the partition wall separates the shell into a first chamber and a second chamber;
[0009] A screen assembly is mounted on the housing body, and the screen assembly and the first chamber enclose a closed accommodation space;
[0010] A processor module is disposed in the accommodation space; and
[0011] A cover plate is installed on a side of the shell body away from the screen assembly, and the cover plate and the second chamber enclose a heat dissipation space, wherein the cover plate is provided with heat dissipation holes.
[0012] Furthermore, the processor module includes a CPU, and the CPU is disposed in the accommodation space, and the CPU abuts against the partition wall.
[0013] Furthermore, the processor module further includes a heat-conducting block, which is mounted on the partition wall and abuts against the CPU.
[0014] Furthermore, it also includes a heat dissipation component, which includes a heat dissipation plate, which is installed in the heat dissipation space, and the partition wall is provided with an avoidance channel, and the heat conductive block is at least partially penetrated through the avoidance channel and abuts against the heat dissipation plate.
[0015] Furthermore, the heat dissipation assembly also includes a heat dissipation fan, and the heat dissipation fan is installed in the heat dissipation space.
[0016] Furthermore, the heat dissipation plate is provided with heat dissipation grooves.
[0017] Furthermore, the cover plate is formed with a first air outlet and a second air outlet, wherein the first air outlet is located at one end of the cover plate, the second air outlet is located at the other end of the cover plate, and the heat dissipation groove extends in a direction from the first air outlet to the second air outlet.
[0018] Further, thermal conductive silicone grease is provided between the thermal conductive block and the CPU; and / or thermal conductive silicone grease is provided between the thermal conductive block and the heat sink.
[0019] Furthermore, the partition wall is provided with a first mounting hole, a male plug is provided in the first chamber, a power cord of the cooling fan is connected with a female plug, and the male plug is passed through the first mounting hole and electrically connected to the female plug.
[0020] Furthermore, the industrial all-in-one machine also includes a frame and a lock screen bracket, the lock screen bracket is connected to the shell body, the frame is arranged on the lock screen bracket, the frame has an installation groove, the screen assembly includes a touch screen and an LCD screen arranged in sequence, the touch screen is arranged in the installation groove, the LCD screen is located in the accommodating space, and the side of the LCD screen is abutted against the lock screen bracket.
[0021] The industrial all-in-one machine of the embodiment of the present application has at least the following beneficial effects: the screen assembly is connected to the shell and encloses a closed accommodation space with the first chamber, and the accommodation space is used to install the processor module, so that the processor module can be placed in a closed space, thereby effectively isolating the processor module from external dust; the processor module is placed in a closed accommodation space, which helps the processor module to maintain normal operation in a high humidity or dusty environment, and is conducive to extending the working life of the industrial all-in-one machine. Among them, the partition wall divides the hollow shell into the first chamber and the second chamber, and the second chamber and the cover plate cooperate to enclose a heat dissipation space, and the heat dissipation space is separated from the accommodation space, so that dust can be prevented from adhering to the processor module and its surroundings, which is conducive to ensuring the heat dissipation effect of the processor module.
[0022] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The present application is further described below with reference to the accompanying drawings and embodiments, wherein:
[0024] Figure 1 This is a schematic diagram of the overall structure of an industrial all-in-one machine according to an embodiment of the present application;
[0025] Figure 2 This is a schematic diagram of the cross-section structure of an industrial all-in-one machine according to an embodiment of the present application;
[0026] Figure 3 This is a schematic diagram of the back structure of an industrial all-in-one machine according to an embodiment of the present application;
[0027] Figure 4 This is a partial structural schematic diagram of an industrial all-in-one machine according to an embodiment of the present application, wherein the cover plate is not shown in the figure;
[0028] Figure 5 The figure is a schematic diagram of the flow of external heat dissipation airflow in an industrial all-in-one machine according to an embodiment of the present application.
[0029] Reference numerals:
[0030] 100, housing; 110, partition wall; 120, first chamber; 130, second chamber;
[0031] 200, screen assembly; 210, touch screen; 220, liquid crystal screen; 230, double-sided foam tape;
[0032] 310, CPU; 320, motherboard; 330, heat conduction block;
[0033] 400, cover plate; 410, first air outlet; 420, second air outlet;
[0034] 510, frame; 520, lock screen bracket;
[0035] 610, heat sink; 611, heat sink; 620, cooling fan; 621, female connector. DETAILED DESCRIPTION
[0036] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.
[0037] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0038] In the description of this application, "several" means more than one, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0039] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.
[0040] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0041] See also Figures 1 to 4 In one aspect, an embodiment of the present application discloses an industrial all-in-one machine, which includes a housing 100 , a screen assembly 200 , a processor module and a cover plate 400 .
[0042] Specifically, the shell 100 includes a shell body and a partition wall 110, the shell body is a hollow structure, and the partition wall 110 separates the hollow shell 100 into a first chamber 120 and a second chamber 130; the screen assembly 200 is installed on the shell body, and the screen assembly 200 and the first chamber 120 enclose a closed accommodating space; the processor module is arranged in the accommodating space; and the cover plate 400 is installed on the side of the shell body away from the screen assembly 200, and the cover plate 400 and the second chamber 130 enclose a heat dissipation space, wherein the cover plate 400 is provided with heat dissipation holes.
[0043] In the above embodiment, the screen assembly 200 is electrically connected to the processor module.
[0044] In the embodiment of the present application, the screen assembly 200 is connected to the housing 100, and encloses a closed accommodation space with the first chamber 120. The accommodation space is used to install the processor module. In this way, the processor module can be placed in a closed space, which can effectively isolate the processor module from external dust. The processor module is placed in a closed accommodation space, which helps the processor module to maintain normal operation in a high humidity or dusty environment, and is conducive to extending the working life of the industrial all-in-one machine. Among them, the partition wall 110 divides the hollow housing 100 into the first chamber 120 and the second chamber 130. The second chamber 130 and the cover plate 400 cooperate to enclose a heat dissipation space, and the heat dissipation space is separated from the accommodation space. In this way, dust can be prevented from adhering to the processor module and its surroundings, which is conducive to ensuring the heat dissipation effect of the processor module, thereby ensuring its normal operation and reducing the probability of failure.
[0045] In some embodiments of the present application, the processor module includes a CPU 310 (i.e., a processor), which is disposed in the accommodation space and abuts against the partition wall 110. In this way, the heat generated by the CPU 310 when working can be conducted to the heat dissipation space through the partition wall 110. The cover plate 400 at the heat dissipation space is provided with heat dissipation holes, which can allow the airflow outside the device to enter the heat dissipation space through the heat dissipation holes and discharge the heat in the heat dissipation space to the outside of the heat dissipation space in a timely manner. In this way, the heat dissipation effect can be improved.
[0046] It is worth to understand that the number and location of the heat dissipation holes on the cover plate 400 can be set accordingly according to the heat dissipation requirements and the direction of airflow.
[0047] In a possible implementation manner, along a direction perpendicular to the screen, the projection of the CPU 310 is located between two ends of the cover plate 400 , and heat dissipation holes are disposed at both ends of the cover plate 400 .
[0048] In one embodiment of the present application, the processor module includes a mainboard 320, which is disposed in the accommodation space, so that dust from the external environment can be prevented from adhering to the mainboard 320, which helps to ensure the normal operation of the mainboard 320. The mainboard 320 is electrically connected to the CPU 310.
[0049] In some embodiments of the present application, see Figures 1 to 4 The processor module further includes a heat conducting block 330, which is mounted on the partition wall 110 and abuts against the CPU 310. In this embodiment, the partition wall 110 is provided with an installation channel for the heat conducting block 330 to pass through, and the heat conducting block 330 is at least partially arranged in the installation channel, so that the heat generated by the CPU 310 can be conducted to the heat dissipation space through the heat conducting block 330 to improve the heat dissipation effect.
[0050] It should be noted that the heat-conducting block 330 may also directly abut against the partition wall 110 to achieve heat dissipation by transferring heat to the partition wall 110 and then conducting the heat into the heat dissipation space through the partition wall 110 .
[0051] In a possible implementation, the heat conducting block 330 is in a stepped structure, specifically, the heat conducting block 330 includes a first portion and a second portion, the cross-sectional area of the second portion is smaller than the cross-sectional area of the first portion, the CPU 310 abuts against the second portion, and the first portion cooperates with the mounting channel of the partition wall 110. The cross-sectional area of the first portion is larger than the cross-sectional area of the second portion, so that the area of the heat conducting block 330 located in the heat dissipation space is larger, that is, the heat dissipation area of the heat conducting block 330 can be increased, which helps to improve the heat dissipation effect.
[0052] In this embodiment, the heat conducting block 330 is made of copper. It is worth understanding that the heat conducting block 330 can also be made of other materials with good heat dissipation performance, such as aluminum.
[0053] In some embodiments of the present application, see Figures 1 to 4 The industrial all-in-one machine also includes a heat dissipation component, which includes a heat dissipation plate 610. The heat dissipation plate 610 is installed in the heat dissipation space. The partition wall 110 is provided with an avoidance channel. The heat conductive block 330 is at least partially penetrated through the avoidance channel and abuts against the heat dissipation plate 610.
[0054] In one embodiment of the present application, see Figures 1 to 4 The cover plate 400 is formed with a first air port 410 and a second air port 420, wherein the first air port 410 is located at one end of the cover plate 400, and the second air port 420 is located at the other end of the cover plate 400. In this way, the airflow in the heat dissipation space can form a directional flow, which helps to reduce the generation of turbulence, accelerate the flow of airflow, and help improve the heat dissipation effect.
[0055] In some embodiments of the present application, see Figures 1 to 4 The heat dissipation assembly further includes a heat dissipation fan 620, which is installed in the heat dissipation space. The heat dissipation fan 620 can accelerate the airflow in the heat dissipation space, which helps to improve the heat dissipation effect. Specifically in this embodiment, the heat dissipation fan 620 is specifically a turbo fan, which can drive the airflow to flow along the tangent of the rotation direction of the turbo fan.
[0056] In one possible implementation, please continue to see Figures 1 to 4 The heat dissipation assembly includes a heat dissipation plate 610 and a heat dissipation fan 620 arranged in parallel. The heat dissipation fan 620 is arranged relatively close to the first air outlet 410 relative to the second air outlet 420. The heat dissipation fan 620 is used to push the airflow at the first air outlet 410 to flow to the second air outlet 420. During operation, the external airflow enters the heat dissipation space from the first air outlet 410, and flows through the heat dissipation plate 610 and the second air outlet 420 in sequence under the drive of the heat dissipation fan 620, and then flows out of the heat dissipation space, such as Figure 5 In this process, the heat generated by the CPU 310 can be transferred to the heat sink 610 through the heat conduction block 330, and then flow out of the heat dissipation space along with the airflow passing through the heat sink 610. Since the area of the heat sink 610 is larger than that of the heat conduction block 330 and the CPU 310, the contact between the airflow and the heat sink 610 is increased, which helps to improve the heat dissipation effect.
[0057] In some embodiments of the present application, see Figure 4 The heat sink 610 is provided with a heat sink 611. There are multiple heat sinks 611, and the multiple heat sinks 611 are arranged in parallel and all extend along the flow direction of the airflow in the heat dissipation space. In this way, the contact area between the heat sink 610 and the heat dissipation airflow can be further increased, which helps to improve the heat dissipation effect. At the same time, the heat sink 611 extends along the flow direction of the airflow, which can reduce the generation of turbulence, so that the heat dissipation airflow can be quickly discharged outside the heat dissipation space, so as to further improve the heat dissipation effect.
[0058] In some embodiments of the present application, the heat dissipation slot 611 extends from the first air outlet 410 to the second air outlet 420. The heat dissipation slot 611 extends along the airflow direction, which can reduce the generation of turbulence, so that the heat dissipation airflow can be quickly discharged out of the heat dissipation space, thereby further improving the heat dissipation effect.
[0059] In some embodiments of the present application, thermal grease is provided between the heat conductive block 330 and the CPU 310 to enhance the heat dissipation effect.
[0060] In some embodiments of the present application, thermal grease is disposed between the heat conductive block 330 and the heat dissipation plate 610 to enhance the heat dissipation effect.
[0061] In some embodiments of the present application, see Figure 2 The partition wall 110 is provided with a first mounting hole, a male plug is provided in the first chamber 120, a power cord of the cooling fan 620 is connected with a female plug, the female plug is provided in the cooling space, and the working plug is passed through the first mounting hole and electrically connected to the female plug.
[0062] In one possible implementation, see Figure 2 The power cord of the cooling fan 620 is connected to a female connector 621, which is located in the second chamber 130. A male connector is provided in the first chamber 120 at a position corresponding to the second chamber 130, and the male connector is electrically connected to the female connector 621 through the first mounting hole.
[0063] In some embodiments of the present application, see Figures 1 to 4 The industrial all-in-one machine also includes a frame 510 and a lock screen bracket 520. The lock screen bracket 520 is connected to the shell body. The frame 510 is arranged on the lock screen bracket 520. The frame 510 has a mounting groove. The screen assembly 200 includes a touch screen 210 and a liquid crystal screen 220 arranged in sequence. The touch screen 210 is arranged in the mounting groove. The liquid crystal screen 220 is located in the accommodating space, and the side of the liquid crystal screen 220 is abutted against the lock screen bracket 520.
[0064] In one embodiment of the present application, the screen assembly 200 further includes a foam double-sided adhesive tape 230 , and the foam double-sided adhesive tape 230 is disposed between the touch screen 210 and the liquid crystal screen 220 .
[0065] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present application. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.
Claims
1. An industrial all-in-one machine, characterized in that: include: A shell, comprising a hollow shell body and a partition wall, wherein the partition wall separates the shell into a first chamber and a second chamber; A screen assembly is mounted on the housing body, and the screen assembly and the first chamber enclose a closed accommodation space; A processor module is disposed in the accommodation space; and A cover plate is installed on a side of the shell body away from the screen assembly, and the cover plate and the second chamber enclose a heat dissipation space, wherein the cover plate is provided with heat dissipation holes.
2. The industrial integrated machine according to claim 1, characterized in that: The processor module includes a CPU, and the CPU is disposed in the accommodation space, and the CPU abuts against the partition wall.
3. The industrial integrated machine according to claim 2, characterized in that: The processor module further includes a heat conduction block, which is mounted on the partition wall and abuts against the CPU.
4. The industrial integrated machine according to claim 3, characterized in that: It also includes a heat dissipation component, which includes a heat dissipation plate. The heat dissipation plate is installed in the heat dissipation space. The partition wall is provided with an avoidance channel. The heat conductive block is at least partially passed through the avoidance channel and abuts against the heat dissipation plate.
5. The industrial integrated machine according to claim 4, characterized in that: The heat dissipation assembly also includes a heat dissipation fan, and the heat dissipation fan is installed in the heat dissipation space.
6. The industrial integrated machine according to claim 4 or 5, characterized in that: The heat dissipation plate is provided with heat dissipation grooves.
7. The industrial integrated machine according to claim 6, characterized in that: The cover plate is formed with a first air outlet and a second air outlet, wherein the first air outlet is located at one end of the cover plate, the second air outlet is located at the other end of the cover plate, and the heat dissipation groove extends in a direction from the first air outlet to the second air outlet.
8. The industrial integrated machine according to claim 6, characterized in that: Thermally conductive silicone grease is provided between the thermally conductive block and the CPU; and / or thermally conductive silicone grease is provided between the thermally conductive block and the heat sink.
9. The industrial integrated machine according to claim 5, characterized in that: The partition wall is provided with a first mounting hole, a male plug is provided in the first chamber, a power line of the cooling fan is connected with a female plug, and the male plug is passed through the first mounting hole and electrically connected to the female plug.
10. The industrial integrated machine according to claim 1, characterized in that: The industrial all-in-one machine also includes a frame and a lock screen bracket, the lock screen bracket is connected to the shell body, the frame is arranged on the lock screen bracket, the frame has a mounting groove, the screen assembly includes a touch screen and a liquid crystal screen arranged in sequence, the touch screen is arranged in the mounting groove, the liquid crystal screen is located in the accommodating space, and the side of the liquid crystal screen is abutted against the lock screen bracket.