Electronic component
By embedding magnetic structures in the transformer and designing a non-orthogonal coil placement method, the problems of low conversion efficiency and electromagnetic interference in space reduction are solved, and high-efficiency energy conversion and improved space utilization are achieved.
Patent Information
- Application Number
- CN202421380809.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-17
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-06-17
AI Technical Summary
While the space of the existing transformers is reduced, it is difficult to improve conversion efficiency and easily generate electromagnetic interference to affect surrounding components.
An electronic component is designed to close the magnetic flux by embedding the magnetic structure in the center of the coil, and the placement of two sets of coils is designed in a non-orthogonal way to increase the mutual inductance and achieve a high coupling effect.
The energy conversion efficiency of the transformer is improved, electromagnetic interference is reduced, and these effects can be achieved under the condition of space reduction, thereby improving space utilization.
Smart Images
Figure CN222952905U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor packaging technology, and in particular to an electronic component. Background Art
[0002] Coils can be used in the design of inductors or transformers. In inductor applications, generally, two coils are placed in an orthogonal manner to minimize the mutual inductance between the two coils, thereby avoiding mutual influence on the inductance. In transformer applications, most of the transformer coils currently do not contain magnetic components and are designed using a plane. This type of planar transformer is prone to electromagnetic interference problems due to the inability to close the magnetic flux path, which affects other surrounding components and thus affects the conversion efficiency of the transformer. Today, power conversion designs are increasingly sensitive to space. While reducing the design space, the energy conversion efficiency must be improved. Therefore, how to achieve structural optimization of the transformer is an inevitable issue. Utility Model Content
[0003] The present application provides an electronic component.
[0004] In a first aspect, the present application provides an electronic component, comprising: a magnetic conductive structure having a first part and a second part symmetrically arranged; a first conductive element extending from the first part of the magnetic conductive structure to the second part and arranged around it; a second conductive element extending from the first part of the magnetic conductive structure to the second part and arranged around it, wherein the first conductive element is wound around the outside of the second conductive element.
[0005] In some optional embodiments, the first portion of the magnetic conductive structure and the second portion of the magnetic conductive structure form a closed loop.
[0006] In some optional embodiments, the closed loop presents a symmetrical square structure.
[0007] In some optional embodiments, the first conductive element and the second conductive element are arranged around the same central axis.
[0008] In some optional embodiments, the first conductive element has a first part and a second part, the second conductive element has a first part and a second part, the first part of the first conductive element and the first part of the second conductive element are arranged around the same central axis, and the second part of the first conductive element and the second part of the second conductive element are arranged around the same central axis.
[0009] In some optional embodiments, the angle between the first conductive element and the second conductive element is non-orthogonal.
[0010] In some optional embodiments, an included angle between the first conductive element and the second conductive element on the upper surface of the magnetic conductive structure is different from an included angle between the first conductive element and the second conductive element on the lower surface of the magnetic conductive structure.
[0011] In some optional embodiments, the angle between the first conductive element and the second conductive element ranges from 0 to 15 degrees.
[0012] In some optional embodiments, the electronic components are embedded in the substrate.
[0013] In some optional embodiments, the first conductive element includes a first circuit, a second circuit, a first conductive via and a second conductive via, and the first conductive element is formed by connecting the first circuit and the second circuit via the first conductive via and the second conductive via.
[0014] In order to solve the problem of how to improve the conversion efficiency of the transformer while reducing the space, the present application proposes an electronic component, which increases the mutual inductance by designing the placement of two sets of coils in a non-orthogonal manner, and embeds a magnetic conductive structure in the center of the coil to close the magnetic flux, thereby achieving a high coupling effect between the two coils, thereby improving the energy conversion efficiency of the transformer, and will not cause electromagnetic interference problems to affect other components. In addition, this transformer structure can be embedded in a chip or substrate package, which can improve space utilization and meet the needs of miniaturization. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:
[0016] Figure 1 It is based on an existing schematic diagram of an inductor structure;
[0017] Figure 2 It is a structural schematic diagram based on an existing transformer;
[0018] Figure 3 is a schematic structural diagram of an embodiment 3a of an electronic component according to the present application;
[0019] Figure 4 yes Figure 3 A schematic diagram of a top view structure;
[0020] Figure 5 yes Figure 4 A partial enlarged view of
[0021] Figure 6 yes Figure 3 A side view structural schematic diagram of;
[0022] Figure 7is a schematic diagram of a structure in which the via holes of the first conductive element and the second conductive element are asymmetrically arranged;
[0023] Figure 8 is a schematic structural diagram of symmetrical arrangement of the through holes of the first conductive element and the second conductive element;
[0024] Fig. 9 is a schematic diagram of magnetic flux direction of an embodiment 3a of an electronic component according to the present application;
[0025] Fig.10 It is a schematic diagram of magnetic flux when the conductive element is designed on one side;
[0026] Fig.11 yes Fig.10 Schematic diagram of magnetic flux change;
[0027] Fig.12 It is a magnetic flux diagram when the conductive element is designed on both sides according to an embodiment 3a of the electronic element of the present application;
[0028] Fig.13 yes Fig.12 Schematic diagram of magnetic flux change;
[0029] Fig.14 is a schematic diagram of a magnetic flux path when a conductive element is designed on both sides according to an embodiment 3a of an electronic element of the present application;
[0030] Fig.15 is based on Figure 4 The schematic diagram of the product structure is shown;
[0031] Table 1 shows the thickness of each layer of an exemplary product structure.
[0032] Description of reference numerals / symbols:
[0033] 101-first coil; 102-second coil; 103-third coil; 201-magnetic conductive structure; 202-first conductive element; 203-second conductive element; 2011-first part of the magnetic conductive structure; 2012-second part of the magnetic conductive structure; 2021-first circuit; 2022-second circuit; 2023 first conductive hole; 2024 second conductive hole; 2031-third circuit; 2032-fourth circuit; 2033-third conductive hole; 2034-fourth conductive hole. DETAILED DESCRIPTION
[0034] The specific implementation methods of the present application are described below in conjunction with the accompanying drawings and embodiments. Through the contents recorded in this specification, those skilled in the art can easily understand the technical problems solved by the present application and the technical effects produced. It is understood that the specific embodiments described herein are only used to explain the relevant inventions, rather than to limit the inventions. In addition, for ease of description, only the parts related to the relevant inventions are shown in the accompanying drawings.
[0035] It should be readily understood that the meanings of “on,” “over,” and “over” in this application should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also means “on something” including the presence of intermediate components or layers therebetween.
[0036] Additionally, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or component to another element or component illustrated in the drawings. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.
[0037] The term "layer" as used herein refers to a material portion including an area with a certain thickness. The layer can extend over the entire lower or upper structure, or can have a degree less than the range of the lower or upper structure. In addition, the layer can be a region of a homogeneous or inhomogeneous continuous structure, and its thickness is less than the thickness of the continuous structure. For example, the layer can be located between the top surface and the bottom surface of the continuous structure or between any pair of horizontal planes therebetween. The layer can extend horizontally, vertically and / or along a tapered surface. A substrate can be a layer, one or more layers can be included therein, and / or one or more layers can be present thereon, above and / or below. A layer can include multiple layers. For example, a semiconductor layer can include one or more doped or undoped semiconductor layers, and can have the same or different materials.
[0038] The term "substrate" as used herein refers to a material on which subsequent material layers are added. The substrate itself may be patterned. The material added on top of the substrate may be patterned or may remain unpatterned. In addition, the substrate may include a variety of semiconductor materials, such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate may be made of a non-conductive material, such as glass, plastic, or sapphire wafer, etc. Further alternatively, the substrate may have a semiconductor device or circuit formed therein.
[0039] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of the specification are only used to match the contents recorded in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of the present application, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed in the present application. At the same time, the terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of narration, and are not used to limit the scope of the implementation of the present application. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present application without substantially changing the technical content.
[0040] It should also be noted that the longitudinal section corresponding to the embodiment of the present application may be a section corresponding to the front view direction, the transverse section may be a section corresponding to the right view direction, and the horizontal section may be a section corresponding to the top view direction.
[0041] In addition, the embodiments and features in the embodiments of the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.
[0042] refer to Figure 1 , Figure 1 It is based on an existing schematic diagram of an inductor structure.
[0043] like Figure 1 The inductor structure shown includes a first coil 101 , a second coil 102 and a third coil 103 .
[0044] In this structure, the first coil 101, the second coil 102 and the third coil 103 are placed in an orthogonal manner, so that the mutual inductance between the coils can be minimized, thereby avoiding mutual influence on the inductance.
[0045] refer to Figure 2 , Figure 2 It is a structural schematic diagram based on an existing transformer.
[0046] In this structure, no magnetic element is arranged in the middle of the coil, and the magnetic flux path cannot be closed, which easily causes electromagnetic interference problems and affects other surrounding components, thus affecting the energy conversion efficiency of the transformer.
[0047] refer to Figure 3 and Figure 4 , Figure 3 is a schematic structural diagram of an embodiment 3a of an electronic component according to the present application, Figure 4 yes Figure 3 Schematic diagram of the top view structure.
[0048] like Figure 3 and Figure 4 As shown, the electronic component 3a of the present application includes a magnetic conductive structure 201, having a first part and a second part symmetrically arranged; a first conductive element 202, extending from the first part of the magnetic conductive structure 201 to the second part and arranged around it; a second conductive element 203, extending from the first part of the magnetic conductive structure to the second part and arranged around it, wherein the first conductive element 202 is wound around the outside of the second conductive element 203.
[0049] In some optional implementations, the magnetic conductive structure 201 is magnetic, and the material of the magnetic conductive structure may be iron, or the magnetic conductive structure 201 may also be a magnetic material such as cobalt, nickel, and alloys thereof.
[0050] Here, the magnetic conductive structure 201 has a first part and a second part that are symmetrically arranged, wherein the first part may be the first part 2011 of the magnetic conductive structure, and the second part may be the second part 2012 of the magnetic conductive structure 201 .
[0051] Here, the first conductive element 202 and the second conductive element 203 both extend from the first portion 2011 of the magnetic conductive structure to the second portion 2012 of the magnetic conductive structure 201 , and are disposed around the first portion 2011 of the magnetic conductive structure and the second portion 2012 of the magnetic conductive structure 201 .
[0052] In some optional implementations, the angle between the first conductive element 202 and the second conductive element 203 is non-orthogonal.
[0053] Here, the angle between the first conductive element 202 and the second conductive element 203 may refer to the angle between the first conductive element 202 located on the upper surface of the magnetic structure 201 and the second conductive element 203 located on the upper surface of the magnetic structure 201, or may refer to the angle between the first conductive element 202 located on the lower surface of the magnetic structure 201 and the second conductive element 203 located on the lower surface of the magnetic structure 201.
[0054] The non-orthogonal angle between the first conductive element 202 and the second conductive element 203 may mean that the angle between the first conductive element 202 located on the upper surface of the magnetic structure 201 and the second conductive element 203 located on the upper surface of the magnetic structure 201 is not 90 degrees, or may mean that the angle between the first conductive element 202 located on the lower surface of the magnetic structure 201 and the second conductive element 203 located on the lower surface of the magnetic structure 201 is not 90 degrees.
[0055] Here, the magnetic conductive structure 201 is located at the center, the second conductive element 203 is wound around the outside of the magnetic conductive structure 201, and the first conductive element 202 is wound around the outside of the second conductive element 203. Since the first conductive element 202 and the second conductive element 203 are both arranged around the magnetic conductive structure 201, and the first conductive element 202 and the second conductive element 203 are arranged in a non-orthogonal manner, the mutual inductance between the two can be increased, and a high coupling effect between the first conductive element 202 and the second conductive element 203 can be achieved. In addition, since the magnetic conductive structure 201 is embedded between the first conductive element 202 and the second conductive element 203, the magnetic flux path can be closed, the electromagnetic interference problem can be reduced, and the influence on other surrounding components can be avoided, thereby improving the energy conversion efficiency of the electronic components. In addition, the first conductive element 202 is wound around the outside of the second conductive element 203, which can also reduce the space of the electronic components and improve the space utilization.
[0056] In addition, the electronic component of the present application, when the parameters of the magnetic conductive structure are fixed, after testing at different frequencies, the first conductive element 202 and the second conductive element 203 have a higher self-inductance value, a lower magnetic resistance, a higher quality value, and a high coupling efficiency.
[0057] In some optional implementations, the electronic components are embedded in the substrate. Thus, embedding the electronic components in the substrate can further improve space utilization and meet the needs of miniaturized space.
[0058] In some optional implementations, the first portion 2011 of the magnetic conductive structure 201 and the second portion 2012 of the magnetic conductive structure form a closed loop.
[0059] Here, the magnetic conductive structure 201 is a closed loop. Setting the magnetic conductive structure as a closed loop can effectively concentrate and guide the magnetic field, concentrate the magnetic flux inside the magnetic conductive structure 201 instead of spreading it to the surrounding space, reduce the leakage of the magnetic field, thereby improving the magnetic field strength and efficiency, and avoiding affecting other surrounding components.
[0060] In some optional embodiments, the closed loop presents a symmetrical square structure.
[0061] Here, the first part 2011 of the magnetic conductive structure 201 may refer to half of the magnetic conductive structure 201 separated along the center position of the two sides of the square structure that are not wrapped around the first conductive element 202 and the second conductive element 203, and the second part 2012 of the magnetic conductive structure 201 may refer to the other half of the magnetic conductive structure 201 separated along the center position of the two sides of the square structure that are not wrapped around the first conductive element 202 and the second conductive element 203.
[0062] In some optional implementations, the first conductive element 202 and the second conductive element 203 are arranged around the same central axis.
[0063] Here, the magnetic conductive structure 201 may be a square structure, and the central axis of the magnetic conductive structure 201 may refer to a straight line connecting the center positions of two sides of the square structure that are not wound around the first conductive element 202 and the second conductive element 203 .
[0064] The first conductive element 202 and the second conductive element 203 are disposed around the same central axis, which may mean that the first conductive element 202 and the second conductive element 203 are disposed around the central axis of the magnetic conductive structure 201 .
[0065] In some optional embodiments, the first conductive element 202 has a first part and a second part, the second conductive element 203 has a first part and a second part, the first part of the first conductive element 202 and the first part of the second conductive element 203 are arranged around the same central axis, and the second part of the first conductive element 202 and the second part of the second conductive element 203 are arranged around the same central axis.
[0066] Here, the first conductive element 202 has a first part and a second part, wherein the first part of the first conductive element 202 may refer to a part of the first conductive element 202 arranged around the first part 2011 of the magnetic conductive structure 201, and the second part of the first conductive element 202 may refer to a part of the first conductive element 202 arranged around the second part 2012 of the magnetic conductive structure.
[0067] The second conductive element 203 has a first part and a second part, wherein the first part of the second conductive element 203 may refer to a part of the second conductive element 203 arranged around the first part 2011 of the magnetic conductive structure, and the second part of the second conductive element 203 may refer to a part of the second conductive element 203 arranged around the second part 2012 of the magnetic conductive structure.
[0068] Here, the first part of the first conductive element 202 and the first part of the second conductive element 203 can both be arranged around the central axis of the first part 2011 of the magnetic conductive structure, and the second part of the first conductive element 202 and the second part of the second conductive element 203 can both be arranged around the central axis of the second part 2012 of the magnetic conductive structure. In this way, the first part of the first conductive element 202 and the first part of the second conductive element 203 and the second part of the first conductive element 202 and the second part of the second conductive element 203 each share the same central axis, so that the magnetic fields generated by the first conductive element 202 and the second conductive element 203 can be superimposed on each other inside the magnetic conductive structure 201 to generate a stronger magnetic field, thereby enhancing the magnetic coupling effect between the first conductive element 202 and the second conductive element 203. In addition, by arranging in this way, a closed magnetic flux path can be formed, magnetic flux leakage can be reduced, and the energy conversion efficiency of electronic components can be improved.
[0069] In some optional implementations, the included angle between the first conductive element 202 and the second conductive element 203 on the upper surface of the magnetic conductive structure 201 is different from the included angle between the first conductive element 202 and the second conductive element 203 on the lower surface of the magnetic conductive structure.
[0070] Here, the angle between the first conductive element 202 and the second conductive element 203 may refer to the angle between the first conductive element 202 located on the upper surface of the magnetic structure 201 and the second conductive element 203 located on the upper surface of the magnetic structure 201, or may refer to the angle between the first conductive element 202 located on the lower surface of the magnetic structure 201 and the second conductive element 203 located on the lower surface of the magnetic structure 201.
[0071] Since the first conductive element 202 and the second conductive element are respectively arranged around the first part 2011 and the second part 2012 of the magnetic conductive structure, the angle between the first conductive element 202 and the second conductive element 203 on the upper surface of the magnetic conductive structure 201 and the angle on the lower surface of the magnetic conductive structure can be different.
[0072] In some optional implementations, the angle between the first conductive element 202 and the second conductive element 203 is in the range of 0 to 15 degrees.
[0073] refer to Figure 5 , Figure 5 for Figure 4 A partial enlarged view of .
[0074] Here, by setting the angle between the first conductive element 202 and the second conductive element 203 to a range of 0 to 15 degrees, it can refer to setting the angle between the first line 2021 of the first conductive element and the third line 2031 of the second conductive element to 0 to 15 degrees, that is, setting the two in a non-orthogonal manner, which can increase the mutual inductance between the two and reduce electromagnetic interference to other components. At the same time, the transformer coil designed relatively flat can also reduce the design space.
[0075] refer to Figure 3 and Figure 6 , Figure 6 yes Figure 3 Schematic diagram of the side structure.
[0076] In some optional embodiments, the first conductive element 202 includes a first line 2021 , a second line 2022 , a first via 2023 and a second via 2024 . The first conductive element 202 can be formed by connecting the first line 2021 and the second line 2022 via the first via 2023 and the second via 2024 .
[0077] Here, the first circuit 2021 of the first conductive element 202 can be set on the upper surface of the magnetic structure 201, and connected to the first conductive hole 2023 via the upper surface of the magnetic structure 201. The second circuit 2022 of the first conductive element 202 can be set on the lower surface of the magnetic structure 201, and the first conductive hole 2023 can be connected to the second circuit 2022 of the first conductive element 202. Then, the second circuit 2022 of the first conductive element 202 can be connected to the second conductive hole 2024 via the lower surface of the magnetic structure, and the second conductive hole 2024 can be connected to the next first circuit 2021 of the first conductive element 202. This cycle is repeated to achieve the first conductive element 202 being set around the magnetic structure 201.
[0078] In some optional embodiments, the second conductive element 203 includes a third line 2031 , a fourth line 2032 , a third via 2033 and a fourth via 2034 , and the second conductive element 203 can be formed by connecting the third line 2031 and the fourth line 2032 via the third via 2033 and the fourth via 2034 .
[0079] Here, the third circuit 2031 of the second conductive element 203 can be arranged on the upper surface of the magnetic structure 201, and connected to the third conductive hole 2033 via the upper surface of the magnetic structure 201. The fourth circuit 2032 of the second conductive element 203 can be arranged on the lower surface of the magnetic structure 201, and the third conductive hole 2033 can be connected to the fourth circuit 2032 of the second conductive element 203. Then, the fourth circuit 2032 of the second conductive element 203 can be connected to the fourth conductive hole 2034 via the lower surface of the magnetic structure 201, and the fourth conductive hole 2034 can be connected to the next third circuit 2031 of the second conductive element 203. This cycle is repeated to achieve the second conductive element 203 being arranged around the magnetic structure 201.
[0080] In some optional embodiments, the first conductive via 2023 and the second conductive via 2024 of the first conductive element 202 and the third conductive via 2033 and the fourth conductive via 2034 of the second conductive element 203 may be arranged asymmetrically.
[0081] refer to Figure 7 , Figure 7 It is a schematic diagram of a structure in which the conducting holes of the first conducting element 202 and the second conducting element 203 are asymmetrically arranged.
[0082] like Figure 7As shown, each first conductive hole 2023 of the first conductive element 202 and each third conductive hole 2033 of the second conductive element 203 are arranged on different horizontal lines, and each second conductive hole 2024 of the first conductive element 202 and each fourth conductive hole 2034 of the second conductive element 203 are arranged on different horizontal lines.
[0083] In some optional embodiments, the first conductive via and the second conductive via of the first conductive element are symmetrically arranged with the third conductive via and the fourth conductive via of the second conductive element.
[0084] refer to Figure 8 , Figure 8 It is a schematic diagram of a structure in which the conducting holes of the first conducting element 202 and the second conducting element 203 are symmetrically arranged.
[0085] like Figure 8 As shown, each first conductive via 2023 of the first conductive element 202 and each third conductive via 2033 of the second conductive element 203 are disposed on the same horizontal line, and each second conductive via 2024 of the first conductive element 202 and each fourth conductive via 2034 of the second conductive element 203 are disposed on the same horizontal line.
[0086] In some optional implementations, the intervals between two adjacent first conductive vias 2023 , second conductive vias 2024 , third conductive vias 2033 , or fourth conductive vias 2034 are equal.
[0087] Here, the first conductive element 202 is wound through the first conductive hole 2023 and the second conductive hole 2024, and the second conductive element 203 is wound through the third conductive hole 2033 and the fourth conductive hole 2034. Compared with directly winding the coil, the angle and gap between each first line 2021 and each second line 2022 of the first conductive element 202, the angle and gap between each third line 2031 and each fourth line 2032 of the second conductive element 203, the angle and gap between each first line 2021 of the first conductive element 202 and each third line 2031 of the second conductive element 203, and the angle and gap between each second line 2022 of the first conductive element 202 and each fourth line 2032 of the second conductive element 203 can be more accurately controlled.
[0088] In some optional implementations, in a side view, the first conductive via 2023 , the second conductive via 2024 , the third conductive via 2033 , or the fourth conductive via 2034 is vertically disposed.
[0089] In some optional implementations, the number of the first conductive vias 2023 and the number of the third conductive vias 2033 are not equal.
[0090] In some optional implementations, the number of the second conductive vias 2024 and the number of the fourth conductive vias 2034 are not equal.
[0091] Here, the number of the first conductive holes 2023 and the number of the third conductive holes 2033 are not equal, and the number of the second conductive holes 2024 and the number of the fourth conductive holes 2034 are not equal. Correspondingly, the number of the first circuit 2021 and the second circuit 2022 of the first conductive element 202 is different from the number of the third circuit 2031 and the fourth circuit 2032 of the second conductive element 203, that is, the number of coil turns set in the first conductive element 202 and the second conductive element 203 is different. In this way, the voltage transformation of the electronic component can be achieved, so that the voltage of the electronic component is increased or decreased.
[0092] refer to Fig. 9 , Fig. 9 It is a schematic diagram of the magnetic flux direction of an embodiment 3a of the electronic component according to the present application.
[0093] like Fig. 9 As shown, the magnetic conductive structure 201 has a first part and a second part which are symmetrically arranged. Meanwhile, the first conductive element 202 and the second conductive element 203 extend from the first part of the magnetic conductive structure 201 to the second part and are arranged around it. In this way, the magnetic flux direction is mirrored left and right, which can prevent the magnetic flux from escaping to the coil on the other side. By embedding the magnetic conductive structure 201, the magnetic flux path can be closed, and electromagnetic interference problems will not be generated to affect other components.
[0094] refer to Fig.10 and Fig.11 , Fig.10 This is a schematic diagram of magnetic flux when the conductive element is designed on one side. Fig.11 10 is a schematic diagram of the magnetic flux change.
[0095] like Fig.10 and Fig.11 As shown, when only one side of the magnetic conductive structure 201, the conductive element 202 and the conductive element 203 are designed, the magnetic flux will dissipate from around the coil and the magnetic flux path cannot be closed, which will affect other surrounding components and also lead to low energy conversion efficiency of the electronic components.
[0096] refer to Fig.12 , Fig.13 and Fig.14 , Fig.12 is a schematic diagram of magnetic flux when a conductive element is designed on both sides according to an embodiment 3a of the electronic element of the present application, Fig.13 yes Fig.12 Schematic diagram of magnetic flux change, Fig.14 It is a schematic diagram of the magnetic flux path when the conductive element is designed on both sides according to an embodiment 3a of the electronic element of the present application.
[0097] like Fig.12 and Fig.13 As shown, when the magnetic conductive structure 201, the conductive element 202 and the conductive element 203 are designed with bilateral symmetry, the directions of the magnetic flux on the left and right sides are also symmetrical, and the magnetic flux can flow from the conductive element 202 and the conductive element 203 on one side to the conductive element 202 and the conductive element 203 on the other side, forming a closed magnetic flux path, reducing magnetic flux dissipation, reducing the impact on other surrounding components, and at the same time, improving the energy conversion efficiency of the electronic components.
[0098] The electronic components in this application can be applied to products with high spatial sensitivity, are not limited to wafers or substrates, and can also be packaged as separate physical transformers, using external pin terminals to make the application more flexible.
[0099] refer to Fig.15 and Table 1, Fig.15 is based on Figure 4 A schematic diagram of the product structure is shown, and Table 1 is the thickness of each layer of an exemplary product structure.
[0100] Table 1
[0101]
[0102] Combination Fig.15 As shown in Table 1, the electronic component of the present application includes a total of six circuit layers from L1 to L6, and dielectric layers between each circuit layer. Among them, the L1 circuit layer can be the first circuit 2021, the L2 circuit layer can be the third circuit 2031, the L5 circuit layer can be the fourth circuit 2032, and the L6 circuit layer can be the second circuit 2022. Among them, the dielectric layer between the L3 circuit layer and the L4 circuit layer can be a core layer (core). The difference between PP (PrePreg, prepreg material or semi-cured resin, semi-cured sheet) and the core layer (core) is generally that in addition to resin, the core also contains glass fiber to improve structural strength and load-bearing capacity, while PP does not contain glass fiber.
[0103] Although the present application has been described and illustrated with reference to the specific embodiments of the present application, these descriptions and illustrations do not limit the present application. It is clearly understood by those skilled in the art that various changes can be made, and equivalent elements can be substituted in the embodiments without departing from the true spirit and scope of the present application as defined by the appended claims. The illustrations may not necessarily be drawn to scale. Due to variables in the manufacturing process, etc., there may be differences between the technical reproduction in the present application and the actual implementation. There may be other embodiments of the present application that are not specifically described. The description and illustrations should be regarded as illustrative, not restrictive. Modifications may be made to adapt specific circumstances, materials, material compositions, methods or processes to the goals, spirits and scopes of the present application. All such modifications fall within the scope of the appended claims. Although the methods disclosed herein have been described with reference to specific operations performed in a specific order, it should be understood that these operations can be combined, subdivided or reordered to form equivalent methods without departing from the teachings of the present application. Therefore, unless specifically indicated herein, the order and grouping of operations do not limit the present application.
Claims
1. An electronic component, characterized in that: include: The magnetic conductive structure comprises a first part and a second part which are symmetrically arranged; A first conductive element extends from the first portion of the magnetic conductive structure to the second portion and is disposed around the second portion; The second conductive element extends from the first portion of the magnetic conductive structure to the second portion and is disposed around the first portion, wherein the first conductive element is wound around the outside of the second conductive element.
2. The electronic component according to claim 1, characterized in that The first part of the magnetic conductive structure and the second part of the magnetic conductive structure form a closed loop.
3. The electronic component according to claim 2, characterized in that: The closed loop presents a symmetrical square structure.
4. The electronic component according to claim 1, characterized in that The first conductive element and the second conductive element are arranged around the same central axis.
5. The electronic component according to claim 1, characterized in that The first conductive element has a first part and a second part, the second conductive element has a first part and a second part, the first part of the first conductive element and the first part of the second conductive element are arranged around the same central axis, and the second part of the first conductive element and the second part of the second conductive element are arranged around the same central axis.
6. The electronic component according to claim 5, characterized in that The angle between the first conductive element and the second conductive element is non-orthogonal.
7. The electronic component according to claim 6, characterized in that: An included angle between the first conductive element and the second conductive element on the upper surface of the magnetic conductive structure is different from an included angle between the first conductive element and the second conductive element on the lower surface of the magnetic conductive structure.
8. The electronic component according to claim 6, characterized in that The included angle between the first conductive element and the second conductive element is in the range of 0 to 15 degrees.
9. The electronic component according to claim 1, characterized in that: The electronic components are embedded in the substrate.
10. The electronic component according to claim 1, characterized in that The first conductive element includes a first line, a second line, a first conductive via, and a second conductive via, and the first conductive element is formed by connecting the first line and the second line via the first conductive via and the second conductive via.