Surface-mounted ceramic capacitor

Abstract

The utility model belongs to the technical field of ceramic capacitors, and particularly relates to a surface-mounted ceramic capacitor, which comprises a ceramic capacitor dielectric sheet, a first conducting layer and a second conducting layer are respectively arranged on the upper side and the lower side of the ceramic capacitor dielectric sheet, and a first metal end cap and a second metal end cap are respectively welded at one end of the first conducting layer and one end of the second conducting layer. The first metal end cap and the second metal end cap respectively wrap the two ends of the ceramic capacitor dielectric sheet, the outer side of the ceramic capacitor dielectric sheet, the outer side of the first conductive layer and the outer side of the second conductive layer are packaged with an insulation packaging body, a plurality of heat pipes are further installed in the insulation packaging body, and clamping pieces are installed on the outer sides of the heat pipes in a clamped mode. When the capacitor works, the evaporation section, the heat insulation section and the surroundings conduct heat transfer, after the evaporation section absorbs heat, an internal medium is vaporized, moves into the condensation section through capillary action, releases heat and then flows back to the evaporation section, and therefore according to different installation environments, the local heat deposition phenomenon caused by different heat dissipation efficiencies of the front face and the back face of the capacitor is solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of ceramic capacitors, and in particular relates to a mounted ceramic capacitor. Background Art

[0002] Chip capacitors, also known as SMD capacitors (Surface Mount Device Capacitors), are miniaturized, high-performance, low-cost, and highly reliable capacitor components that are widely used in various electronic products. The working principle of chip capacitors is the same as that of conventional capacitors, that is, based on the basic function of capacitors, an electric field is formed between two conductive plates to store charge. When a chip capacitor is connected to a circuit, it forms an electric field between the two electrodes to store charge. When the voltage in the circuit changes, the capacitor absorbs or releases charge to maintain the stability of the circuit.

[0003] As a type of chip capacitor, SMD ceramic capacitors have no positive and negative poles and can be installed in any direction, so there is no need to distinguish between the front and back sides. Existing SMD solid-state capacitors are mostly used to operate in high-temperature environments. Long-term high-temperature use can easily lead to damage to the capacitors and shorten their service life. Utility Model Content

[0004] In view of the above problems, the purpose of the utility model is to provide a mounted ceramic capacitor to solve the problem that the existing chip-type solid-state capacitors are mostly used to operate in high-temperature environments. During long-term high-temperature use, the capacitors are easily damaged and have a short service life.

[0005] To achieve the above purpose, the technical solution adopted by the utility model is: a mounted ceramic capacitor, including a ceramic capacitor dielectric sheet, a first conductive layer and a second conductive layer are respectively arranged on the upper and lower sides of the ceramic capacitor dielectric sheet, a metal end cap 1 and a metal end cap 2 are respectively welded to one end of the first conductive layer and the second conductive layer, the metal end cap 1 and the metal end cap 2 are respectively coated on the two ends of the ceramic capacitor dielectric sheet, the ceramic capacitor dielectric sheet, the first conductive layer and the second conductive layer between the metal end cap 1 and the metal end cap 2 are encapsulated with an insulating encapsulation body on the outer side, a plurality of heat pipes are also installed inside the insulating encapsulation bodies on the upper and lower sides of the first conductive layer and the second conductive layer, and the outer sides of the plurality of heat pipes are clamped with clamping parts.

[0006] The beneficial effects of the utility model are as follows: when the capacitor is working, the evaporation section, the insulation section and the surroundings transfer heat. After the evaporation section absorbs heat, the internal medium vaporizes and moves to the condensation section through capillary action to release heat and then flows back to the evaporation section. In this way, according to different installation environments, the local heat accumulation phenomenon caused by different heat dissipation efficiencies on the front and back sides of the capacitor can be solved.

[0007] In order to evenly and effectively absorb and transfer the heat generated by the capacitor when it is working;

[0008] As a further improvement of the above technical solution: the plurality of heat pipes are arranged at equal intervals.

[0009] The beneficial effect of this improvement is that a plurality of heat pipes arranged at equal intervals can uniformly absorb the heat of capacitors at different positions.

[0010] In order to evenly and effectively absorb and transfer the heat generated by the capacitor when it is working;

[0011] As a further improvement of the above technical solution: the heat pipe is a U-shaped structure formed by bending an evaporation section, an insulation section, and a condensation section in sequence, and the evaporation section and the condensation section are arranged parallel to the upper and lower end surfaces of the ceramic capacitor dielectric sheet.

[0012] The beneficial effect of this improvement is that the evaporation section and the condensation section arranged parallel to the upper and lower end surfaces of the ceramic capacitor dielectric sheet can evenly and effectively absorb and transfer the heat generated when the capacitor is working.

[0013] In order to effectively reduce the thickness of the heat pipe;

[0014] As a further improvement of the above technical solution: the cross-section of the tube shell of the heat pipe in the radial direction is elliptical.

[0015] The beneficial effect of this improvement is that the heat pipe with an elliptical cross-section effectively reduces its own thickness while also having good support properties, and can provide certain support for the capacitor body when the capacitor is under pressure.

[0016] In order to effectively control the spacing between multiple heat pipes before packaging;

[0017] As a further improvement of the above technical solution: the clamping piece is formed by bending to form a plurality of arc-shaped groove structures adapted to be clamped on the outer side of the heat pipe.

[0018] The beneficial effect of this improvement is that the clamping piece can be clamped on the heat pipe to stably connect multiple heat pipes and effectively control the distance between the multiple heat pipes before packaging.

[0019] In order to connect multiple heat pipes stably and effectively through the use of a clamp;

[0020] As a further improvement of the above technical solution: there are multiple clamping parts, and they are installed on the outside of the evaporation section and the condensation section at equal intervals along the axial direction of the evaporation section and the condensation section.

[0021] The beneficial effect of this improvement is that a plurality of clamping parts can stably connect a plurality of heat pipes.

[0022] In order to quickly determine the direction of the evaporation section and the condensation section during the welding process of this capacitor;

[0023] As a further improvement of the above technical solution: an indicator arrow is provided on the side of the insulating enclosure, and the indicator arrow points to the evaporation section.

[0024] The beneficial effect of this improvement is that when welding the capacitor, the operator can quickly determine the direction of the evaporation section and the condensation section by the direction of the arrow of the indicator arrow.

[0025] The parts not involved in the device are the same as those in the prior art or can be implemented by using the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a front sectional view of the utility model;

[0027] Figure 2 It is a side sectional view of the utility model;

[0028] Figure 3 It is a schematic diagram of the structure of the utility model;

[0029] Figure 4 This is a schematic diagram of the structure of the ultra-thin heat pipe and the clamping member in the utility model;

[0030] In the figure: 1. Ceramic capacitor dielectric sheet; 2. First conductive layer; 3. Second conductive layer; 4. Metal end cap 1; 5. Insulating enclosure; 6. Heat pipe; 61. Evaporation section; 62. Insulation section; 63. Condensation section; 7. Connector; 8. Indicator arrow; 9. Metal end cap 2. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings. The description in this part is only exemplary and explanatory and should not have any limiting effect on the protection scope of the present invention.

[0032] Embodiment 1:

[0033] like Figure 1—4 shows: a mounted ceramic capacitor, comprising a ceramic capacitor dielectric sheet 1, wherein the upper and lower sides of the ceramic capacitor dielectric sheet 1 are respectively provided with a first conductive layer 2 and a second conductive layer 3, wherein one end of the first conductive layer 2 and the second conductive layer 3 are respectively welded with a metal end cap 1 4 and a metal end cap 2 9, wherein the metal end cap 1 4 and the metal end cap 2 9 are respectively coated on the two ends of the ceramic capacitor dielectric sheet 1, and an insulating encapsulation body 5 is encapsulated on the outer sides of the ceramic capacitor dielectric sheet 1, the first conductive layer 2 and the second conductive layer 3 between the metal end cap 1 4 and the metal end cap 2 9, and the insulating encapsulation body 5 is encapsulated on the upper and lower sides of the first conductive layer 2 and the second conductive layer 3. A plurality of heat pipes 6 are also installed inside the encapsulation body 5, and a clamping piece 7 is installed on the outer side of the plurality of heat pipes 6. When the capacitor is working, the evaporation section 61 and the insulation section 62 transfer heat with the surrounding. After the evaporation section 61 absorbs heat, the internal medium vaporizes and moves to the condensation section 63 through capillary action to release heat and then flows back to the evaporation section 61. In this way, according to different installation environments, the local heat accumulation phenomenon caused by different heat dissipation efficiencies on the front and back sides of the capacitor is solved. The plurality of heat pipes 6 are arranged at equal distances, and the plurality of heat pipes 6 arranged at equal distances can evenly absorb the heat of the capacitors at different positions. The heat pipe 6 is composed of the evaporation section 61, the insulation section 62, and the heat pipe 6. The heat pipe 6 has a U-shaped structure formed by bending the evaporation section 61 and the condensation section 63 in sequence. The evaporation section 61 and the condensation section 63 are arranged parallel to the upper and lower end surfaces of the ceramic capacitor dielectric sheet 1. The evaporation section 61 and the condensation section 63 arranged parallel to the upper and lower end surfaces of the ceramic capacitor dielectric sheet 1 can evenly and effectively absorb and transfer the heat generated when the capacitor is working. The cross-section of the tube shell of the heat pipe 6 in the radial direction is elliptical. The heat pipe 6 with an elliptical cross-section effectively reduces its own thickness and has good support. When the capacitor is under pressure, it can provide certain support for the capacitor body. The clamping piece 7 is pressed and bent to form a plurality of adapters mounted on the heat pipe 6. The arc-shaped groove structure on the outside, the clamping piece 7 can be clamped on the heat pipe 6 to stably connect the multiple heat pipes 6, and effectively control the spacing between the multiple heat pipes 6 before packaging. The number of the clamping pieces 7 is multiple, and they are installed on the outside of the evaporation section 61 and the condensation section 63 at equal intervals along the axial direction of the evaporation section 61 and the condensation section 63. The multiple clamping pieces 7 can stably connect the multiple heat pipes 6. The side of the insulating enclosure 5 is provided with an indicator arrow 8, and the indicator arrow 8 points to the evaporation section 61. When welding the capacitor, the operator can quickly determine the direction of the evaporation section 61 and the condensation section 63 by the direction of the indicator arrow 8.

[0034] The working principle of the present technical solution is as follows: the installation direction of the front and back sides of the capacitor is determined according to the installation environment: when there is air convection generated by a cooling fan in the installation environment, the condensation section 63 is set to face away from the circuit board, so that the heat transferred by the condensation section 63 is effectively taken away by the flowing air; when there is no heat dissipation mechanism in the installation environment and the capacitor is only cooled by the heat conduction of the circuit board, the condensation section 63 is set toward the circuit board, so that the heat of the condensation section 63 is transferred through the circuit board; when the capacitor is working, the evaporation section 61 and the insulation section 62 transfer heat with the surroundings, and after the evaporation section 61 absorbs heat, the internal medium vaporizes and moves to the condensation section 63 through capillary action to release heat and then flows back to the evaporation section 61. In this way, according to different installation environments, the local heat accumulation phenomenon caused by different heat dissipation efficiencies on the front and back sides of the capacitor is solved.

[0035] It should be noted that, in this article, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0036] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. The above is only a preferred implementation of the present invention. It should be pointed out that due to the limitations of textual expression, there are objectively infinite specific structures. For ordinary technicians in this technical field, without departing from the principles of the present invention, they can make several improvements, modifications or changes, and can also combine the above technical features in an appropriate manner; these improvements, modifications, changes or combinations, or the direct application of the inventive concept and technical solution to other occasions without improvement, should be regarded as the protection scope of the present invention.

Claims

1. A surface mounted ceramic capacitor, characterized in that: The invention comprises a ceramic capacitor dielectric sheet (1), wherein a first conductive layer (2) and a second conductive layer (3) are respectively arranged on the upper and lower sides of the ceramic capacitor dielectric sheet (1), a metal end cap (4) and a metal end cap (9) are respectively welded to one end of the first conductive layer (2) and the second conductive layer (3), the metal end cap (4) and the metal end cap (9) are respectively coated on the two ends of the ceramic capacitor dielectric sheet (1), an insulating encapsulation body (5) is encapsulated on the outer side of the ceramic capacitor dielectric sheet (1), the first conductive layer (2) and the second conductive layer (3) between the metal end cap (4) and the metal end cap (9), and a plurality of heat pipes (6) are also installed inside the insulating encapsulation bodies (5) on the upper and lower sides of the first conductive layer (2) and the second conductive layer (3), and a clamping piece (7) is clamped on the outer side of the plurality of heat pipes (6).

2. The surface mount ceramic capacitor according to claim 1, characterized in that: The plurality of heat pipes (6) are arranged at equal intervals.

3. The surface mount ceramic capacitor according to claim 1, characterized in that: The heat pipe (6) is a U-shaped structure formed by bending an evaporation section (61), an insulation section (62), and a condensation section (63) in sequence, and the evaporation section (61) and the condensation section (63) are arranged parallel to the upper and lower end surfaces of the ceramic capacitor dielectric sheet (1).

4. The surface mount ceramic capacitor according to claim 1, characterized in that: The cross section of the tube shell of the heat pipe (6) in the radial direction is elliptical.

5. The surface mount ceramic capacitor according to claim 1, characterized in that: The clamping piece (7) is formed by bending to form a plurality of arc-shaped groove structures adapted to be clamped on the outside of the heat pipe (6).

6. The surface mount ceramic capacitor according to claim 1, characterized in that: The number of the clamping parts (7) is plural, and they are installed at equal intervals on the outside of the evaporation section (61) and the condensation section (63) along the axial direction of the evaporation section (61) and the condensation section (63).

7. The surface mount ceramic capacitor according to claim 1, characterized in that: An indicating arrow (8) is provided on the side of the insulating enclosure (5), and the indicating arrow (8) points to the evaporation section (61).

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