Semiconductor packaging clamping assembly

Abstract

The utility model discloses a semiconductor packaging clamping assembly, and belongs to the technical field of semiconductor packaging, the semiconductor packaging clamping assembly comprises a protection box and a concave clamping plate, the right side of the top of the inner cavity of the protection box is fixedly provided with a motor, the output end of the motor is fixedly connected with a first rotating rod, and the bottom of the first rotating rod is fixedly connected with a main gear; the surface of the main gear is engaged with a driven gear; the motor drives the first rotating rod to rotate, the first rotating rod drives the main gear to rotate, the main gear drives the driven gear to rotate, the driven gear drives the second rotating rod to rotate, and the second rotating rod drives the connecting plate to rotate. The connecting plate drives the bearing plate to rotate under the cooperation of the supporting column, the bearing plate drives the processing table to rotate, and the processing table drives the semiconductor to rotate, so that the purpose of adjusting the processing angle of the semiconductor is achieved, and multiple positions of the semiconductor are packaged.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor packaging, and in particular relates to a semiconductor packaging clamping component. Background Art

[0002] Semiconductor packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements. In this process, the top of the semiconductor is usually sealed with a plastic cover, and then processed using various high-end processes to make it into a chip. During the packaging process, the semiconductor is relatively fragile, and the top seal must have a high degree of precision, so the semiconductor wafer needs to be fixed, so a clamping component is needed.

[0003] After searching, the patent number CN219642806U discloses a semiconductor package clamping structure, including a mounting base and a clamping assembly; the clamping assembly is arranged above the mounting base, and a vacuum adsorption assembly for adsorbing the semiconductor is arranged in the center of the mounting base, the semiconductor is positioned by the vacuum adsorption assembly, and the semiconductor is clamped by the clamping assembly; a two-way cylinder is fixed under the mounting base through a fixed seat, and the clamping assembly and the vacuum adsorption assembly are driven by the two-way cylinder, and the clamping device is driven by the two-way cylinder, so that it can clamp semiconductors of different sizes, which is easy to use.

[0004] Although the existing clamping assembly can drive the clamping device through a bidirectional cylinder to clamp semiconductors of different sizes, it does not have the function of rotation. During the packaging process, the semiconductor needs to be packaged from different angles. After the packaging is completed at one position, the limit needs to be released and the position of the workpiece needs to be manually adjusted before processing can continue, which greatly reduces the packaging efficiency and brings great inconvenience to daily use. Utility Model Content

[0005] The purpose of the utility model is to provide a semiconductor package clamping assembly to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor package clamping assembly, comprising a protective box and a concave clamping plate, a motor is fixedly installed on the right side of the top of the inner cavity of the protective box, the output end of the motor is fixedly connected to a first rotating rod, the bottom of the first rotating rod is fixedly connected to a main gear, the surface of the main gear is meshed with a driven gear, the inner cavity of the driven gear is fixedly connected to a second rotating rod, the top of the second rotating rod is welded with a connecting plate, the top of the connecting plate is fixedly connected to a load-bearing plate via support columns on all sides, and the top of the load-bearing plate is fixedly connected to a processing table.

[0007] By adopting the above scheme, the first rotating rod is driven to rotate by the motor, the main gear is driven to rotate by the first rotating rod, the driven gear is driven to rotate by the main gear, the second rotating rod is driven to rotate by the driven gear, the connecting plate is driven to rotate by the second rotating rod, the load-bearing plate is driven to rotate by the connecting plate with the cooperation of the support column, the processing table is driven to rotate by the load-bearing plate, and the semiconductor is driven to rotate by the processing table, so as to achieve the purpose of adjusting the semiconductor processing angle, thereby meeting the packaging of multiple positions of the semiconductor.

[0008] As a preferred embodiment of a semiconductor package clamping assembly, the bottom of the load-bearing plate is fixedly connected to a cylinder, the bottom of the cylinder is fixedly connected to a connecting block, the surface of the connecting block is fixedly connected to a first movable axis on all four sides, a movable rod is hinged on the first movable axis, one end of the movable rod is hinged to a second movable axis, one side of the second movable axis is fixedly connected to a vertical plate, the top of one side of the vertical plate is fixedly connected to a connecting column, one side of the connecting column is fixedly connected to a clamping block, and the concave clamping plate and the clamping block are fixedly connected by installing bolts.

[0009] By adopting the above scheme, the connecting block is driven downward by the cylinder, and the first movable shaft is driven downward by the connecting block. The force generated by the downward movement of the first movable shaft is used to drive the vertical plate to move with the cooperation of the movable rod and the second movable shaft. The vertical plate is used to drive the clamping block and the concave clamping plate to move to one side with the cooperation of the connecting column. The setting of four concave clamping plates can clamp semiconductors of different sizes. At the same time, the concave clamping plates can be quickly disassembled and assembled through the setting of mounting bolts, which is convenient for subsequent replacement and maintenance.

[0010] As a preferred embodiment of a semiconductor package clamping assembly, the bottom of the load-bearing plate is fixedly connected with slideways on all four sides, the slideways are slidably connected with slide rods on the inside, one end of the slide rods is fixedly connected to the surface of the vertical plate, and channels for the vertical plate to operate are opened on all four sides of the top of the load-bearing plate.

[0011] By adopting the above scheme, the slide rail is set to limit the slide bar, assist the vertical board to move, reduce the shaking of the vertical board during operation, and at the same time cooperate with the top channel of the load-bearing plate to further improve the stability of the vertical board during operation.

[0012] As a preferred implementation of a semiconductor package clamping assembly, a bearing is sleeved on the bottom of the second rotating rod, and the bottom of the bearing is fixedly connected to the bottom of the inner cavity of the protection box.

[0013] By adopting the above solution and setting the bearing, the wear of the second rotating rod during operation is reduced, the jamming of the second rotating rod during operation is avoided, and the smoothness of the second rotating rod during operation is greatly improved.

[0014] As a preferred implementation of a semiconductor package clamping assembly, a placement rack is fixedly connected to the front end of the top of the connecting plate.

[0015] By adopting the above scheme, semiconductors to be processed are placed by setting up a placement rack. After the processing of one semiconductor is completed, another semiconductor can be quickly placed on the processing table for further processing, thereby further improving the processing efficiency.

[0016] As a preferred implementation of a semiconductor package clamping assembly, a heat dissipation port is provided on the back of the protective box, and a dustproof net is provided in the inner cavity of the heat dissipation port.

[0017] By adopting the above solution, the heat generated by the motor when it is working can be quickly dissipated through the setting of the heat dissipation port to avoid heat accumulation. At the same time, by setting the dustproof net, the external dust can be prevented from entering the inner cavity of the protective box, causing dust accumulation and causing the device to lag.

[0018] Compared with the prior art, the beneficial effects of the utility model are:

[0019] 1. The utility model drives the first rotating rod to rotate through a motor, drives the main gear to rotate through the first rotating rod, drives the driven gear to rotate through the main gear, drives the second rotating rod to rotate through the driven gear, drives the connecting plate to rotate through the second rotating rod, drives the load-bearing plate to rotate through the connecting plate with the cooperation of the supporting column, drives the processing table to rotate through the load-bearing plate, and drives the semiconductor to rotate through the processing table, so as to achieve the purpose of adjusting the semiconductor processing angle, thereby meeting the packaging of multiple positions of the semiconductor.

[0020] 2. The utility model drives the first movable axis to move downward through the connecting block, and utilizes the force generated by the downward movement of the first movable axis to drive the vertical plate to move with the cooperation of the movable rod and the second movable axis. The vertical plate drives the clamping block and the concave clamping plate to move to one side with the cooperation of the connecting column. The arrangement of four concave clamping plates can clamp semiconductors of different sizes. At the same time, the concave clamping plates can be quickly disassembled and assembled through the arrangement of mounting bolts, which is convenient for subsequent replacement and maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of the utility model;

[0022] Figure 2 This is a schematic diagram of the bottom structure of the load-bearing plate of the utility model;

[0023] Figure 3 It is an enlarged view of point A of the utility model;

[0024] Figure 4It is a cross-sectional view of the protection box of the present utility model.

[0025] In the figure: 1. protective box; 2. motor; 3. first rotating rod; 4. main gear; 5. driven gear; 6. second rotating rod; 7. connecting plate; 8. load-bearing plate; 9. cylinder; 10. connecting block; 11. first movable shaft; 12. movable rod; 13. second movable shaft; 14. vertical plate; 15. connecting column; 16. clamping block; 17. concave clamping plate; 18. processing table; 19. slideway; 20. slide rod. DETAILED DESCRIPTION

[0026] See also Figure 1-4 The utility model provides a semiconductor package clamping assembly, including a protective box 1 and a concave clamping plate 17. A motor 2 is fixedly installed on the right side of the top of the inner cavity of the protective box 1. The output end of the motor 2 is fixedly connected to a first rotating rod 3. The bottom of the first rotating rod 3 is fixedly connected to a main gear 4. The surface of the main gear 4 is meshed with a driven gear 5. The inner cavity of the driven gear 5 is fixedly connected to a second rotating rod 6. A connecting plate 7 is welded on the top of the second rotating rod 6. The top of the connecting plate 7 is fixedly connected to a load-bearing plate 8 on all sides through support columns. Figure 2 As shown, the bottom of the load-bearing plate 8 is fixedly connected with a cylinder 9, the bottom of the cylinder 9 is fixedly connected with a connecting block 10, the surface of the connecting block 10 is fixedly connected with a first movable shaft 11 on all sides, a movable rod 12 is hinged on the first movable shaft 11, one end of the movable rod 12 is hinged with a second movable shaft 13, one side of the second movable shaft 13 is fixedly connected with a vertical plate 14, the top of one side of the vertical plate 14 is fixedly connected with a connecting column 15, one side of the connecting column 15 is fixedly connected with a clamping block 16, the concave clamping plate 17 and the clamping block 16 are fixedly connected by installing bolts, the connecting block 10 is driven to move downward by the cylinder 9, the first movable shaft 11 is driven to move downward by the connecting block 10, the force generated by the downward movement of the first movable shaft 11 is used to drive the vertical plate 14 to move with the cooperation of the movable rod 12 and the second movable shaft 13, and the clamping block is driven by the vertical plate 14 with the cooperation of the connecting column 15 16 and the concave clamping plate 17 move to one side. The arrangement of the four concave clamping plates 17 can clamp semiconductors of different sizes. At the same time, the concave clamping plate 17 can be quickly disassembled and assembled through the arrangement of the mounting bolts, so as to facilitate subsequent replacement and maintenance. A processing table 18 is fixedly connected to the top of the load-bearing plate 8, and the first rotating rod 3 is driven to rotate by the motor 2, the main gear 4 is driven to rotate by the first rotating rod 3, the driven gear 5 is driven to rotate by the main gear 4, the second rotating rod 6 is driven to rotate by the driven gear 5, the connecting plate 7 is driven to rotate by the second rotating rod 6, and the load-bearing plate 8 is driven to rotate by the connecting plate 7 with the cooperation of the support column, the processing table 18 is driven to rotate by the load-bearing plate 8, and the semiconductor is driven to rotate by the processing table 18, so as to achieve the purpose of adjusting the processing angle of the semiconductor, thereby satisfying the packaging of multiple positions of the semiconductor.

[0027] See Figure 3 As shown, the bottom of the load-bearing plate 8 is fixedly connected with a slideway 19 on all sides, and a slide bar 20 is slidably connected inside the slideway 19. One end of the slide bar 20 is fixedly connected to the surface of the vertical plate 14. Channels for the vertical plate 14 to run are opened on all sides of the top of the load-bearing plate 8. Through the setting of the slideway 19, the slide bar 20 is limited to assist the vertical plate 14 to move, reduce the shaking of the vertical plate 14 during operation, and at the same time, it is used in conjunction with the top channel of the load-bearing plate 8 to further improve the stability of the vertical plate 14 during operation. Figure 4 As shown, a bearing is sleeved at the bottom of the second rotating rod 6, and the bottom of the bearing is fixedly connected to the bottom of the inner cavity of the protective box 1. The arrangement of the bearing reduces the wear of the second rotating rod 6 during operation, avoids the jamming of the second rotating rod 6 during operation, and greatly improves the smoothness of the second rotating rod 6 during operation. Figure 1 As shown, the front end of the top of the connecting plate 7 is fixedly connected with a placement rack. The placement rack is used to place the semiconductor to be processed. After one semiconductor is processed, another semiconductor can be quickly placed on the processing table 18 for further processing, which further improves the processing efficiency. Figure 4 As shown, a heat dissipation port is provided on the back of the protective box 1, and a dustproof net is provided in the inner cavity of the heat dissipation port. Through the setting of the heat dissipation port, the heat generated by the motor 2 during operation can be quickly discharged to avoid heat accumulation. At the same time, through the setting of the dustproof net, external dust can be prevented from entering the inner cavity of the protective box 1 to cause dust accumulation, resulting in a jam in the operation of the device.

[0028] When in use, first place the protective box 1 at the specified position, and then fix the protective box 1 with the limit bolts. After the fixing is completed, the semiconductor to be packaged is placed on the top of the processing table 18. After the placement is completed, the first movable shaft 11 is driven to move downward by the connecting block 10, and the force generated by the downward movement of the first movable shaft 11 is used to drive the vertical plate 14 to move with the cooperation of the movable rod 12 and the second movable shaft 13. The vertical plate 14 is used to drive the clamping block 16 and the concave clamping plate 17 to move to one side with the cooperation of the connecting column 15 until one side of the concave clamping plate 17 is tightly fitted with the surface of the semiconductor, and four concave clamps are used to move the first movable shaft 11 downward. The shaped clamping plate 17 is set to clamp and fix the semiconductor. Then, when the semiconductor processing angle needs to be adjusted, the first rotating rod 3 is driven to rotate by the motor 2, the main gear 4 is driven to rotate by the first rotating rod 3, the driven gear 5 is driven to rotate by the main gear 4, the second rotating rod 6 is driven to rotate by the driven gear 5, the connecting plate 7 is driven to rotate by the second rotating rod 6, the load-bearing plate 8 is driven to rotate by the connecting plate 7 with the cooperation of the support column, the processing table 18 is driven to rotate by the load-bearing plate 8, and the semiconductor is driven to rotate by the processing table 18, thereby satisfying the packaging of multiple positions of the semiconductor.

Claims

1. A semiconductor package clamping assembly, characterized in that: The invention comprises a protective box (1) and a concave clamping plate (17), wherein a motor (2) is fixedly installed on the right side of the top of the inner cavity of the protective box (1), the output end of the motor (2) is fixedly connected to a first rotating rod (3), the bottom of the first rotating rod (3) is fixedly connected to a main gear (4), the surface of the main gear (4) is meshed with a driven gear (5), the inner cavity of the driven gear (5) is fixedly connected to a second rotating rod (6), the top of the second rotating rod (6) is welded with a connecting plate (7), the top of the connecting plate (7) is fixedly connected to a load-bearing plate (8) on all four sides via support columns, and the top of the load-bearing plate (8) is fixedly connected to a processing table (18).

2. A semiconductor package clamping assembly according to claim 1, characterized in that: The bottom of the load-bearing plate (8) is fixedly connected to a cylinder (9), the bottom of the cylinder (9) is fixedly connected to a connecting block (10), the surface of the connecting block (10) is fixedly connected to a first movable shaft (11) on all four sides, a movable rod (12) is hinged on the first movable shaft (11), one end of the movable rod (12) is hinged to a second movable shaft (13), one side of the second movable shaft (13) is fixedly connected to a vertical plate (14), the top of one side of the vertical plate (14) is fixedly connected to a connecting column (15), one side of the connecting column (15) is fixedly connected to a clamping block (16), and the concave clamping plate (17) and the clamping block (16) are fixedly connected by mounting bolts.

3. A semiconductor package clamping assembly according to claim 1, characterized in that: The bottom of the load-bearing plate (8) is fixedly connected to a slideway (19) on all sides, the slideway (19) is slidably connected to a slide rod (20), one end of the slide rod (20) is fixedly connected to the surface of the vertical plate (14), and the top of the load-bearing plate (8) is provided with channels for the vertical plate (14) to run on all sides.

4. The semiconductor package clamping assembly according to claim 1, characterized in that: A bearing is sleeved on the bottom of the second rotating rod (6), and the bottom of the bearing is fixedly connected to the bottom of the inner cavity of the protection box (1).

5. The semiconductor package clamping assembly according to claim 1, characterized in that: The front end of the top of the connecting plate (7) is fixedly connected to a placement rack.

6. The semiconductor package clamping assembly according to claim 1, characterized in that: A heat dissipation port is provided on the back of the protection box (1), and a dustproof net is provided in the inner cavity of the heat dissipation port.

Images