Mounting structure of power device

Abstract

The utility model belongs to the technical field of power device structures, and particularly relates to a mounting structure of a power device, which is characterized in that a threaded hole is formed in the upper side of a substrate, a through hole is formed in a pressing plate, and a screw is inserted into the through hole of the pressing plate from the upper side and is in threaded fastening with the threaded hole of the substrate; meanwhile, according to the utility model, the power device and the substrate are fixed and conductively connected through the conductive and heat-conducting glue, so that the reliability of the power module is further improved. According to the utility model, the fixation of the power device is realized through the crimping of the pressing plate, the stress matching of the power device and the substrate is better realized, the thermal stress failure caused by a high-temperature welding process is avoided, and the reliability of the connection of the power device and the substrate is effectively improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of power device structures, and in particular relates to a mounting structure of a power device. Background Art

[0002] Power modules are key components in power electronics technology. They integrate one or multiple high-power semiconductor device chips (such as IGBT, MOSFET, etc.) in parallel and are packaged in a modular manner. These modules are designed to handle high voltage and high current to achieve effective conversion and control of electrical energy. They are widely used in motor drives, frequency converters, uninterruptible power supplies (UPS), solar inverters and other fields.

[0003] Under the existing technology, TO263 packaged power chips are generally installed in power modules through the SMT process, which has a great impact on the reliability of TO263 packaged power chips. At the same time, the commonly used IMS and IMB substrates are not suitable for high-temperature welding processes due to their low glass transition temperatures, which further affects the reliability of the prepared power modules. Utility Model Content

[0004] The technical problem to be solved by the utility model is to overcome the defect in the prior art that TO263 packaged power chips are installed using the SMT process, which has a significant impact on the reliability of the power module, thereby providing a mounting structure for a power device.

[0005] A mounting structure for a power device, characterized in that it comprises a power device, a substrate, a pressure plate and a screw; a base plate and pins are fixed on both sides of the power device respectively; the base plate of the power device is fixed and conductively connected to the upper side of the substrate by a conductive and thermally conductive adhesive, and the pins of the power device are welded and fixed to the upper side of the substrate and conductively connected; a through hole is provided on the pressure plate, and a threaded hole is formed on the upper side of the substrate, the screw is inserted into the through hole of the pressure plate from the upper side, and is threadedly fastened with the threaded hole of the substrate to clamp and fix the power device between the pressure plate and the substrate.

[0006] Furthermore, it also includes a pressure buffer layer, which is arranged between the pressure plate and the power device.

[0007] Furthermore, the pins of the power device are fixed to the substrate by ultrasonic welding.

[0008] Furthermore, the pressing plate is rectangular, and the through hole is located at the center of the pressing plate.

[0009] Furthermore, eight power devices are provided and are respectively distributed on the left and right sides of the screw.

[0010] Furthermore, the power device is a TO263 packaged device.

[0011] Furthermore, the pressing plate is a metal pressing plate.

[0012] Furthermore, the substrate is made of one of IMS, IMB, DCB and AMB materials.

[0013] Beneficial effects: The utility model discloses a mounting structure for a power device, in which a threaded hole is formed on the upper side of a substrate and a through hole is opened on a pressure plate, a screw is inserted into the through hole of the pressure plate from the upper side, and a threaded fastening is formed with the threaded hole of the substrate, thereby clamping and fixing the power device between the pressure plate and the substrate, and at the same time, the utility model also fixes and conductively connects the power device to the substrate through conductive and thermally conductive adhesive, further improving the reliability of the power module; the utility model fixes the power device through pressure plate crimping, better achieves stress matching between the power device and the substrate, avoids thermal stress failure caused by high-temperature welding process, and effectively improves the reliability of the connection between the power device and the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 It is a front view structural schematic diagram of the utility model.

[0017] Explanation of the reference numerals: 1. power device; 2. substrate; 3. pressure plate; 4. screw. DETAILED DESCRIPTION

[0018] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0019] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0020] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0021] In this application, when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0022] The present embodiment provides a mounting structure of a power device, characterized in that it includes a power device 1, a substrate 2, a pressing plate 3 and a screw 4; a bottom plate and pins are fixed on both sides of the power device 1 respectively; the bottom plate of the power device 1 is fixed and conductively connected to the upper side of the substrate 2 through a conductive and thermally conductive adhesive, and the pins of the power device 1 are welded and fixed to the upper side of the substrate 2 and conductively connected; a through hole is provided on the pressing plate 3, and a threaded hole is formed on the upper side of the substrate 2, the screw 4 is inserted into the through hole of the pressing plate 3 from the upper side, and is threadedly fastened with the threaded hole of the substrate 2, so that the power device 1 is clamped and fixed between the pressing plate 3 and the substrate 2.

[0023] The present embodiment provides a mounting structure for a power device 1, wherein a threaded hole is formed on the upper side of a substrate 2 and a through hole is opened on a pressure plate 3, a screw 4 is inserted into the through hole of the pressure plate 3 from the upper side, and is threadedly fastened with the threaded hole of the substrate 2, thereby clamping and fixing the power device 1 between the pressure plate 3 and the substrate 2, and at the same time, the utility model also fixes and conductively connects the power device 1 and the substrate 2 through a conductive and thermally conductive adhesive, further improving the reliability of the power module; the utility model fixes the power device through crimping of the pressure plate 3, better achieves stress matching between the power device 1 and the substrate 2, avoids thermal stress failure caused by a high-temperature welding process, and effectively improves the reliability of the connection between the power device 1 and the substrate 2.

[0024] As a further improvement of this embodiment, it also includes a pressure buffer layer, which is arranged between the pressure plate 3 and the power device 1, and can provide pressure buffering to prevent the power device 1 from being damaged by excessive pressure between the pressure plate 3 and the substrate 2, thereby further improving the reliability of the power device 1.

[0025] In some other embodiments of the present invention, the pins of the power device 1 are fixed to the substrate 2 by ultrasonic welding. Ultrasonic welding fixation does not require high temperature welding.

[0026] Specifically, the pressing plate 3 is rectangular, and the through hole is located at the center of the pressing plate 3 .

[0027] In other embodiments of the present invention, the pressing plate 3 is a non-rectangular special-shaped structure, and the through hole is not located at the center of the pressing plate 3, which can meet more diverse power device 1 layout requirements.

[0028] In this embodiment, eight power devices 1 are provided, respectively distributed on the left and right sides of the screw 4. Three groups of power devices 1 are arranged from left to right on the upper side of the substrate 2, and each group is provided with eight power devices 1 and a pressing plate 3.

[0029] In some other embodiments of the present invention, two power devices 1 are provided, which are respectively distributed on the left and right sides of the screw 4 .

[0030] In other embodiments of the present invention, the power devices 1 are provided in plurality and distributed on the lower side of the pressing plate 3. In addition, the power devices 1 are provided in multiple groups and distributed on the upper side of the substrate 2, with each group providing multiple power devices 1 and a pressing plate 3.

[0031] As a preferred embodiment of the present invention, the power device 1 is a TO263 packaged device. The pressing plate 3 is a metal pressing plate 3. The substrate 2 is made of one of IMS, IMB, DCB and AMB materials.

[0032] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0033] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A power device mounting structure, characterized in that: It includes a power device, a substrate, a pressure plate and a screw; a base plate and pins are fixed on both sides of the power device respectively; the base plate of the power device is fixed and conductively connected to the upper side of the substrate by conductive and thermally conductive adhesive, and the pins of the power device are welded and fixed to the upper side of the substrate and conductively connected; the pressure plate is provided with a through hole, and a threaded hole is formed on the upper side of the substrate, the screw is inserted into the through hole of the pressure plate from the upper side, and is threadedly fastened with the threaded hole of the substrate to clamp and fix the power device between the pressure plate and the substrate.

2. A power device mounting structure according to claim 1, characterized in that: It also includes a pressure buffer layer, which is arranged between the pressure plate and the power device.

3. The power device mounting structure according to claim 1, characterized in that: The pins of the power device are fixed to the substrate by ultrasonic welding.

4. The power device mounting structure according to claim 1, characterized in that: The pressing plate is rectangular, and the through hole is located at the center of the pressing plate.

5. The power device mounting structure according to claim 1, characterized in that: There are eight power devices, which are respectively distributed on the left and right sides of the screw.

6. The power device mounting structure according to claim 1, characterized in that: The power device is a TO263 packaged device.

7. The power device mounting structure according to claim 1, characterized in that: The pressing plate is made of metal.

8. The power device mounting structure according to claim 1, characterized in that: The substrate is made of one of IMS, IMB, DCB and AMB materials.

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