High-density SMB packaging frame

Abstract

The utility model relates to the technical field of semiconductor manufacturing, and discloses a high-density SMB packaging frame, which comprises a frame main body, a plurality of chip module units matched with an SMB packaging structure are arranged in the frame main body, and the chip module units are arranged in a matrix in the frame main body. The chip module units at least comprise two columns and multiple rows of reinforcing ribs, the reinforcing ribs are arranged between any two adjacent columns of chip module units and are used for reinforcing the stability of the frame main body, the chip module units are specifically arranged in a column-row matrix mode in the frame main body, jumper wires are welded and fixed on one sides of the chip module units, and the jumper wires are welded and fixed on the other sides of the chip module units. The welding part of the jumper wire adopts a V-shaped design, through unique structural design and layout optimization, the capacity of a module unit is remarkably improved, meanwhile, the stability and reliability of packaging are ensured, the unit cost is reduced, the assembly efficiency is improved, and remarkable practical value and market popularization potential are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a high-density SMB packaging frame. Background Art

[0002] With the increasing popularity and enhanced functions of electronic devices, the integration of electronic components is getting higher and higher, especially in the semiconductor industry, which is developing at a remarkable speed. SMB packaging technology is a technology widely used in the packaging of miniaturized electronic components. It is designed to provide a compact and reliable packaging solution to meet the growing demand for miniaturization. The existing SMB frame design is often limited by the size of assembly welding and plastic sealing equipment, and it is difficult to maximize the number of module units while maintaining structural strength. Therefore, we proposed a high-density SMB packaging frame to solve the above problems. Utility Model Content

[0003] In view of the deficiencies of the prior art, the utility model provides a high-density SMB packaging frame, which solves the problem that the existing SMB frame design is often limited by the size of assembly welding and plastic packaging equipment, making it difficult to maximize the number of module units while maintaining structural strength.

[0004] To achieve the above objectives, the utility model is implemented through the following technical solutions: a high-density SMB packaging frame, including a frame body;

[0005] A plurality of chip module units adapted to the SMB packaging structure are arranged inside the frame body, and the plurality of chip module units are arranged in a matrix in the frame body, and the chip module units include at least two columns and multiple rows;

[0006] The reinforcing ribs are arranged between any two adjacent rows of chip module units to enhance the stability of the frame body.

[0007] Preferably, the chip module units are arranged in a matrix pattern in rows and columns within the frame body.

[0008] Preferably, a jumper is welded and fixed on one side of the chip module unit, the welding part of the jumper is V-shaped, and the negative electrode welding area of ​​the jumper is bent to stabilize the position of the jumper.

[0009] Preferably, a plastic encapsulation material flow channel portion is provided between adjacent chip module units, and the plastic encapsulation material flow channel portion adopts a maximized hollowing design.

[0010] Preferably, a cutting rib is provided on the periphery of the chip module unit.

[0011] Preferably, a hollow rectangular portion is provided between every two groups of the chip module units, and a plurality of groups of the hollow rectangular portions are regularly and equidistantly arranged, and arc chamfers are provided at both hollow ends of the hollow rectangular portions.

[0012] Preferably, a single side of the surface of the frame body is provided with a plurality of groups of equidistantly arranged elliptical holes for anti-reverse installation design.

[0013] Preferably, it also includes a plastic package body, which is fixed to the outside of the chip module unit, and the upper and lower edges of the plastic package body are provided with grooves, and the plastic package body is provided with through holes at the grooves.

[0014] Preferably, a plurality of groups of equidistantly arranged cutouts are provided on both sides of the frame body, and each group of the cutouts is located at the junction of two groups of chip module units for stress release.

[0015] Beneficial Effects

[0016] The utility model provides a high-density SMB packaging frame. Compared with the prior art, it has the following advantages:

[0017] Beneficial effects:

[0018] This high-density SMB packaging frame significantly improves the module unit capacity through unique structural design and layout optimization, while ensuring the stability and reliability of the packaging, reducing unit costs and improving assembly efficiency. It has significant practical value and market promotion potential. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 For this utility model Figure 1 A schematic diagram of the enlarged structure at point A;

[0021] Figure 3 This is a partial diagram of the main structure of the framework of the utility model;

[0022] Figure 4 This is a schematic diagram of the structure of the chip module unit and the connection parts such as jumpers of the utility model;

[0023] Figure 5 It is a schematic diagram of the prior art structure of the frame body of the utility model.

[0024] In the figure: 101, frame body; 102, chip module unit; 103, reinforcing ribs; 104, jumper; 105, plastic encapsulation material flow channel; 106, hollow rectangular part; 107, elliptical hole; 108, cutting rib part; 109, through hole; 110, groove; 111, incision. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] Embodiment 1:

[0027] like Figure 1-5 A high-density SMB packaging frame shown includes a frame body 101;

[0028] A plurality of chip module units 102 adapted to the SMB packaging structure are arranged inside the frame body 101. The plurality of chip module units 102 are arranged in a matrix in the frame body 101. The chip module units 102 include at least two columns and multiple rows.

[0029] The reinforcing ribs 103 are arranged between any two adjacent columns of chip module units 102 to enhance the stability of the frame body 101 . The chip module units 102 are specifically arranged in a matrix of 20 columns and 28 rows in the frame body 101 .

[0030] Preferably, a jumper 104 is welded and fixed on one side of the chip module unit 102, and the welding part of the jumper 104 adopts a V-shaped design. The negative electrode welding area of ​​the jumper 104 is a bent structure, which is used to stabilize the position of the jumper 104. The negative electrode welding area of ​​the jumper 104 has a bent structure, which can prevent displacement during welding. The vertical spatial extension can meet the welding contact area requirements without increasing the plane size of the frame. The V-shaped design of the welding part of the jumper 104 is conducive to reducing the plane size and ensuring the welding area.

[0031] Preferably, a molding compound flow channel portion 105 is provided between adjacent chip module units 102, and the molding compound flow channel portion 105 adopts a maximized hollow design. By carefully designing the molding compound flow channel portion 105, the material flow path is optimized, and the phenomenon of material accumulation on the frame being difficult to remove is reduced, thereby ensuring the uniformity and efficiency of the molding process. Moreover, the maximized hollow design of the molding compound flow channel portion 105 is conducive to removing residual molding compound glue, while ensuring the strength of the frame.

[0032] Preferably, a cutting rib portion 108 is provided on the periphery of the chip module unit 102 for removing the portion of excess frame material on the periphery of the chip module unit 102, thereby significantly improving production efficiency, reducing physical damage to the plastic package of the chip module unit 102 during the cutting process, reducing the risk of damage to the chip module unit 102, and ensuring the quality of the chip module unit 102.

[0033] Preferably, a hollow rectangular portion 106 is provided between every two groups of chip module units 102, which can reduce the structural weight of the frame body 101. Multiple groups of hollow rectangular portions 106 are arranged at regular and equidistant intervals to ensure the uniformity and stability of the structure. Arc chamfers are provided at both ends of the hollow of the hollow rectangular portion 106, which not only reduces the strict requirements on the processing accuracy of the frame body 101 processing plant, but also gives more dimensional margins to the rib cutting process, which can improve the efficiency and quality of the rib cutting process.

[0034] Preferably, a plurality of groups of equidistantly arranged elliptical holes 107 are provided on one side of the surface of the frame body 101 for anti-reverse installation design, thereby ensuring that the packaging module is correctly installed and improving assembly accuracy.

[0035] Preferably, it includes a plastic package body, which is fixed to the outside of the chip module unit 102, and grooves 110 are provided on the upper and lower edges of the plastic package body to effectively block the penetration of external water vapor and protect the internal circuit from moisture. The plastic package body is provided with a through hole 109 at the groove 110 to effectively improve the bonding tightness between the plastic package material and the frame, and enhance the mechanical strength and environmental sealing of the package.

[0036] Preferably, multiple groups of equidistantly arranged cutouts 111 are provided on both sides of the frame body 101, and each group of cutouts 111 is located at the junction of two groups of chip module units 102 for stress release, so as to facilitate accurate cutting of the frame body 101 according to the chip module units 102, simplify the manufacturing process, and improve production efficiency.

[0037] The overall size design of the new frame body 101 is that each piece is 301mm long and 100mm wide, and the frame body 101 accommodates 560 chip module units 102. The overall size design of the prior art is that each piece is 267.6mm long and 93mm wide, accommodating a total of 432 chip module units 102. The average area of ​​each chip module unit 102 of the new frame body 101 is reduced, which means that more chip module units 102 can be accommodated under the same total area, thereby improving the utilization rate of copper materials. In addition, the reinforcement ribs 103 are set to enhance the mechanical stability of the frame without sacrificing the effective packaging area. Through the unique structural design and layout optimization, the module unit capacity is significantly improved, while ensuring the stability and reliability of the packaging, reducing the unit cost and improving the assembly efficiency, which has significant practical value and market promotion potential.

[0038] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.

Claims

1. A high-density SMB packaging frame, characterized in that: It includes a frame body (101); A plurality of chip module units (102) adapted to the SMB packaging structure are arranged inside the frame body (101); the plurality of chip module units (102) are arranged in a matrix in the frame body (101); the chip module units (102) include at least two columns and multiple rows; The reinforcing ribs (103) are arranged between any two adjacent rows of chip module units (102) and are used to strengthen the stability of the frame body (101).

2. A high-density SMB packaging frame according to claim 1, characterized in that: The chip module units (102) are specifically arranged in a matrix of 20 columns and 28 rows within the frame body (101).

3. A high-density SMB packaging frame according to claim 1 or 2, characterized in that: A jumper wire (104) is welded and fixed on one side of the chip module unit (102); the welding portion of the jumper wire (104) is designed in a V-shape; the negative electrode welding area of ​​the jumper wire (104) is in a bent structure, which is used to stabilize the position of the jumper wire (104).

4. The high-density SMB packaging frame according to claim 1, characterized in that: A plastic encapsulation material flow channel portion (105) is provided between adjacent chip module units (102), and the plastic encapsulation material flow channel portion (105) adopts a maximized hollowing design.

5. The high-density SMB packaging frame according to claim 2, characterized in that: A cutting rib portion (108) is provided on the periphery of the chip module unit (102).

6. The high-density SMB packaging frame according to claim 4, characterized in that: A hollow rectangular portion (106) is provided between every two groups of the chip module units (102), and a plurality of groups of the hollow rectangular portions (106) are regularly and equidistantly arranged, and arc-shaped chamfers are provided at both hollow ends of the hollow rectangular portions (106).

7. The high-density SMB packaging frame according to claim 1, characterized in that: A single side of the surface of the frame body (101) is provided with a plurality of groups of equidistantly arranged elliptical holes (107) for anti-reverse installation design.

8. The high-density SMB packaging frame according to claim 1, characterized in that: It also includes a plastic package body, which is fixed to the outside of the chip module unit (102), and the upper and lower edges of the plastic package body are provided with grooves (110), and the plastic package body is provided with through holes (109) located at the grooves (110).

9. The high-density SMB packaging frame according to claim 1, characterized in that: Multiple groups of equidistantly arranged cutouts (111) are provided on both sides of the frame body (101); each group of the cutouts (111) is located at the junction of two groups of chip module units (102) for stress release.

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