Printed circuit board and vehicle-mounted charger

Abstract

The utility model discloses a printed circuit board and a vehicle-mounted charger, and relates to the technical field of PCBs, and the printed circuit board comprises a switch tube welding position which is used for welding any kind of packaged switch tubes of the same kind; the isolation driving chip welding positions are respectively connected with the plurality of driving circuit welding positions and the switch tube welding positions and are used for welding isolation driving chips; the driving circuit welding positions are used for welding driving circuits corresponding to various packaged switch tubes; and the driving circuits welded on the driving circuit welding positions are matched with the switching tubes welded on the switching tube welding positions. The circuit board is provided with the switch tube welding positions which can be used for welding various packaged switch tubes and the drive circuit welding positions which can be used for welding and matching various packaged drive circuits, so that products welded with different packaged switch tubes and corresponding drive circuits can be produced through the same circuit board; for the switch tubes with different packaging requirements, the circuit board does not need to be redesigned or modified, and the cost is saved.

Description

Technical Field

[0001] The present application relates to the field of PCB technology, and in particular to a printed circuit board and a vehicle charger. Background Art

[0002] The switch tube is a key component of the on-board charger of new energy vehicles. It is mainly used to improve the charging efficiency and charging speed of the on-board charger. In addition, some switch tubes are small in size and weight, which can also reduce the overall size and weight of the on-board charger. However, the same type of switch tube may have a variety of different packages. Each package has different requirements for the driving voltage provided by the driving circuit in the product, and the pin distribution shapes of switch tubes with different packages are also different. Therefore, it is usually necessary to design a circuit board specifically for each package of switch tube. This circuit board can only be used in products with corresponding requirements, and can only be produced by welding the corresponding packaged switch tube and the corresponding drive circuit. It has high requirements for the material management of the manufacturer, and when the demand quantity is small, the purchase cost of a single packaged switch tube is high. In addition, if the supply chain of a certain packaged switch tube is interrupted, the circuit board corresponding to this type of packaged switch tube cannot be used and can only be scrapped, which will cause a lot of economic losses. Utility Model Content

[0003] The main purpose of this application is to provide a printed circuit board and a vehicle charger, aiming to solve the technical problem of how to make a circuit board compatible with switch tubes of different packages and corresponding driving circuits.

[0004] To achieve the above object, an embodiment of the present application provides a printed circuit board, the printed circuit board comprising:

[0005] Switch tube welding position, used for welding switch tubes of the same type with any package;

[0006] The isolation driver chip welding position is respectively connected to a plurality of driver circuit welding positions and the switch tube welding position and is used for welding the isolation driver chip;

[0007] Each of the driving circuit welding positions is used to weld the driving circuits corresponding to the switching tubes of various packages;

[0008] Wherein, the driving circuit welded on each of the driving circuit welding positions matches the switching tube welded on the switching tube welding position.

[0009] In one embodiment, each of the driving circuit welding positions includes: a first driving circuit welding position and a second driving circuit welding position, and the printed circuit board further includes: a driving power supply welding position, and the driving power supply welding position is used to weld the driving power supply;

[0010] The driving power supply welding position is respectively connected to the first driving circuit welding position and the second driving circuit welding position, and the first driving circuit welding position and the second driving circuit welding position are also connected to the power input welding point of the isolation driving chip welding position;

[0011] The driving power supply is used to output a first driving voltage;

[0012] The first driving circuit welding position is used to weld the first driving circuit when the first switching tube is welded to the switching tube welding position, and the first driving circuit transmits the first driving voltage to the power input welding point;

[0013] The second driving circuit welding position is used to weld a second driving circuit when a second switching tube is welded to the switching tube welding position, and the second driving circuit converts the first driving voltage into a second driving voltage and transmits the second driving voltage to the power input welding point;

[0014] The first switch tube and the second switch tube have different packages.

[0015] In one embodiment, the first driving circuit welding position is further used for not welding the first driving circuit when the second switching tube is welded to the switching tube welding position;

[0016] The second driving circuit welding position is further used for not welding the second driving circuit when the first switching tube is welded to the switching tube welding position.

[0017] In one embodiment, the printed circuit board further comprises: a voltage clamping circuit soldering position;

[0018] The voltage clamp circuit welding position is respectively connected to the driving output welding point of the isolation driver chip welding position and the gate welding point of the switch tube welding position;

[0019] The voltage clamping circuit welding position is used for welding the voltage clamping circuit;

[0020] The isolation driving chip is further used to transmit the corresponding driving signal to the gate pad through the voltage clamping circuit when receiving the second driving voltage;

[0021] The voltage clamping circuit is used to clamp the high level voltage of the driving signal transmitted to the gate pad at a preset on-voltage, and clamp the low level voltage of the driving signal at a preset off-voltage;

[0022] Wherein, the switch tube is used to enter a fully on state when receiving the preset on voltage, and to enter a fully off state when receiving the preset off voltage.

[0023] In one embodiment, the printed circuit board further comprises: a switch speed regulation circuit welding position;

[0024] The switch speed regulation circuit welding position is respectively connected to the driving output welding point of the isolation drive chip welding position and the gate welding point of the switch tube welding position;

[0025] The switch speed regulating circuit welding position is used for welding the switch speed regulating circuit;

[0026] The switch speed regulating circuit is used to adjust the switching time taken for switching between high level and low level in the drive signal sent by the isolation drive chip to the gate pad according to the impedance inside the switch speed regulating circuit.

[0027] In one embodiment, the printed circuit board further comprises: a filter circuit soldering position;

[0028] The filter circuit welding position is arranged between the switch speed regulation circuit welding position and the gate welding point of the switch tube welding position;

[0029] The filter circuit welding position is used for welding the filter circuit;

[0030] Wherein, the filtering circuit is used to filter the driving signal and transmit the filtered driving signal to the gate pad.

[0031] In one embodiment, the printed circuit board further comprises: a control signal source welding position and a control side power supply welding position;

[0032] The control signal source welding position is connected to the control input welding point of the isolation driver chip welding position, and the control side power supply is connected to the control side power supply welding point of the isolation driver chip welding position;

[0033] The control signal source welding position is used for welding the control signal source;

[0034] The control side power supply welding position is used for welding the control side power supply;

[0035] The control signal source welding position and the control side power supply welding position are arranged on one side of the isolation driver chip welding position, and the driving circuit welding positions and the switch tube welding positions are arranged on the other side of the isolation driver chip welding position.

[0036] In one embodiment, the switch tube welding position includes:

[0037] A plurality of gate soldering points, each of which is interconnected and connected to the isolation driver chip soldering position;

[0038] A plurality of source electrode soldering points, each of the source electrode soldering points being interconnected;

[0039] A plurality of drain electrode soldering points, each of the drain electrode soldering points being interconnected;

[0040] Among them, each of the gate welding points is used to weld the gate of the switching tube of the corresponding package, each of the source welding points is used to weld the source of the switching tube of the corresponding package, and each of the drain welding points is used to weld the drain of the switching tube of the corresponding package.

[0041] In one embodiment, the switch tube includes any one of a first gallium nitride element with integrated driver and a second gallium nitride element without integrated driver.

[0042] In addition, to achieve the above objectives, the present application also provides a vehicle charger, which uses the printed circuit board as described above.

[0043] The embodiment of the present application provides a printed circuit board and a vehicle charger, wherein the printed circuit board includes: a switch tube welding position for welding a switch tube of any package of the same type; an isolation driver chip welding position, respectively connected to a plurality of drive circuit welding positions and the switch tube welding position, for welding an isolation driver chip; each of the drive circuit welding positions is used to weld a drive circuit corresponding to the switch tube of various packages; wherein the drive circuit welded on each of the drive circuit welding positions matches the switch tube welded on the switch tube welding position. By providing switch tube welding positions capable of welding switch tubes of various packages and drive circuit welding positions capable of welding drive circuits matching various packages on the circuit board, products welded with switch tubes of different packages and their corresponding drive circuits can be produced through the same circuit board, and there is no need to redesign or modify the circuit board for switch tubes with different packaging requirements, thereby saving costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0045] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0046] Figure 1 A structural diagram of the first embodiment of the printed circuit board of the present application;

[0047] Figure 2 A structural diagram of the second embodiment of the printed circuit board of this application;

[0048] Figure 3A circuit structure diagram corresponding to the first drive circuit and the second drive circuit;

[0049] Figure 4 A circuit structure diagram corresponding to a voltage clamping circuit;

[0050] Figure 5 This is a structural diagram of the third embodiment of the printed circuit board of this application.

[0051] Figure 6 An overall circuit structure diagram provided for the third embodiment of the printed circuit board of the present application.

[0052] The purpose, features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0053] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of the present application and are not used to limit the present application.

[0054] In order to better understand the technical solution of the present application, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.

[0055] The main solution of the present application is: to design an isolated driver chip soldering position, multiple driver circuit soldering positions and a switch tube soldering position on a printed circuit board, so that the isolated driver chip soldering position is respectively connected to the switch tube soldering position and the multiple driver circuit soldering positions, and each driver circuit soldering position is respectively used to solder a driver circuit required for a packaged switch tube, so that when a switch tube of a corresponding package is soldered on the switch tube soldering position, a corresponding driver circuit can be soldered on a specific driver circuit soldering position, so that products with different switch tube packages and corresponding matching driver circuits can be produced through the same circuit board.

[0056] At present, the switch tube is a key component of the on-board charger of new energy vehicles, mainly used to improve the charging efficiency and charging speed of the on-board charger. In addition, some switch tubes are small in size and weight, which can also reduce the overall size and weight of the on-board charger. However, for the same type of switch tube, there may be a variety of different packages, each package has different requirements for the driving voltage provided by the driving circuit in the product, and the pin distribution shape of the switch tubes of different packages is also different. Therefore, it is usually necessary to design a circuit board specifically for each package of the switch tube. The circuit board can only be applied to the corresponding products, and can only be welded and produced by the corresponding packaged switch tube and the corresponding driving circuit. The material management requirements of the manufacturer are high, and when the demand quantity is small, the purchase cost of a single packaged switch tube is high. In addition, if the supply chain of a certain packaged switch tube is interrupted, the circuit board corresponding to the packaged switch tube cannot be used and can only be scrapped, which will cause a lot of economic losses. Therefore, how to use a circuit board to be compatible with switch tubes of different packages and corresponding driving circuits is a problem that needs to be solved urgently.

[0057] By providing switch tube welding positions on the circuit board that can be used to weld switch tubes of various packages and drive circuit welding positions that can be used to weld drive circuits that match various packages, the present application can produce products with switch tubes of different packages and their corresponding drive circuits welded on the same circuit board. For switch tubes with different packaging requirements, there is no need to redesign or modify the circuit board, thereby saving costs.

[0058] Based on this, the present application proposes a first embodiment of a printed circuit board, please refer to Figure 1 , the printed circuit board comprises:

[0059] The switch tube welding position 10 is used for welding switch tubes of the same type with any package;

[0060] The isolation driver chip welding position 20 is respectively connected to a plurality of drive circuit welding positions 30 and the switch tube welding position 10 and is used for welding the isolation driver chip;

[0061] Each of the driving circuit welding positions 30 is used to weld the driving circuits corresponding to the switch tubes of various packages;

[0062] The driving circuits welded on the driving circuit welding positions 30 match the switching tubes welded on the switching tube welding positions 10 .

[0063] It should be understood that a switch tube refers to an electronic component that can control power output, which can specifically be a gallium nitride power tube. For the same specific type of switch tube, such as a SiC switch tube or a gallium nitride power tube, there may be different packages, and the driving voltage required for the switch tubes of each type of package may be different, so the corresponding driving circuits may also be different. Among them, the driving circuit can be composed of a variety of electronic components such as a switch tube, a capacitor, and a resistor, and is mainly used to provide a driving voltage that can drive the switch tube to work.

[0064] It should be noted that the switch tube welding position 10 refers to the welding position where the user welds the switch tube. The switch tube welding position 10 is provided with welding points for the gate, drain and source of the switch tube, wherein there can be multiple gate welding points, and similarly, there can be multiple drain welding points and source welding points. The welding points corresponding to each electrode in the switch tube welding position 10 can be divided into several groups, and each group of welding points can meet the welding requirements of a corresponding packaged switch tube. Therefore, it can also be considered that the switch tube welding position 10 can be reused for welding switch tubes of multiple packages.

[0065] It is easy to understand that the isolation driver chip welding position 20 can be welded with an isolation driver chip, which is mainly used to achieve electrical isolation between a small current control signal and a large current drive signal, and can divide the circuit board into a drive side and a control side, and can prevent the electromagnetic interference or noise generated by the drive side of the circuit board from being transmitted to the control side of the circuit board to affect the control effect of the controlled element (switch tube). Among them, the drive output welding point of the isolation controller welding position and the gate welding point of the switch tube welding position 10 are electrically connected through a signal line, so the isolation driver chip in the welded circuit board can output a drive signal to the switch tube to control the on-off state of the switch tube.

[0066] It should be noted that the driving side of the isolated driver chip requires the driver circuit to provide sufficient driving voltage to work normally, but the driving voltage required by the isolated driver chip is different for switch tubes of different packages, and the system voltage that can be provided in the product is generally a fixed value. Without modifying the overall electrical structure design of the product, the system voltage provided in the product does not match the driving voltage required by the switch tube of another package, that is, it is impossible to directly replace the switch tubes of different packages. To solve the above problem, a plurality of drive circuit soldering positions 30 can be provided on the circuit board, and each drive circuit soldering position 30 is electrically connected to the drive input soldering point of the isolated driver chip soldering position 20. Each drive circuit welding position 30 can be used to weld a drive circuit that can output a corresponding drive voltage. When the package of the switch tube to be welded at the switch tube welding position 10 is determined, the corresponding drive circuit welding position 30 can be selected according to the package of the switch tube, and only the corresponding required components are welded to the corresponding drive circuit welding position 30, so that the drive circuit formed by the circuit board circuit and various components after welding can convert the system voltage into a drive voltage that matches the package of the current switch tube, so as to drive the isolation drive chip to generate a drive signal that matches the drive voltage required by the package of the switch tube to control the on and off state of the switch tube.

[0067] It is easy to understand that in this embodiment, the on-off state of the switch tube includes an on state and an off state, and the drive signal output by the isolation driver chip can be understood as a PWM signal. When the PWM signal is at a high level, the gate of the switch tube is at a high level, and the switch tube enters the on state, and when the PWM signal is at a low level, the gate of the switch tube is at a low level, and the switch tube enters the off state. In actual situations, the switch tube has a linear working area. If the received low level is not low enough, it is not enough to completely turn off the switch tube. Correspondingly, if the received high level is not high enough, it is not enough to completely turn on the switch tube. Therefore, the drive voltage corresponding to the drive signal should not be less than the voltage difference between the voltage required to turn on the switch tube completely and the voltage required to turn off the switch tube completely.

[0068] The embodiment of the present application provides a printed circuit board, the printed circuit board includes: a switch tube welding position, which is used to weld switch tubes of any package of the same type; an isolation driver chip welding position, which is respectively connected to a plurality of drive circuit welding positions and the switch tube welding position, and is used to weld the isolation driver chip; each of the drive circuit welding positions is used to weld the drive circuits corresponding to the switch tubes of various packages; wherein the drive circuit welded on each of the drive circuit welding positions matches the switch tube welded on the switch tube welding position. By providing switch tube welding positions capable of welding switch tubes of various packages and drive circuit welding positions capable of welding drive circuits matching various packages on the circuit board, products welded with switch tubes of different packages and their corresponding drive circuits can be produced through the same circuit board, and there is no need to redesign or modify the circuit board for switch tubes with different packaging requirements, thereby saving costs.

[0069] Based on the first embodiment of the present application, in the second embodiment of the present application, the same or similar contents as those in the above-mentioned embodiment 1 can refer to the above introduction, and will not be repeated later. Figure 2 Each of the driving circuit welding positions 30 includes: a first driving circuit welding position 31 and a second driving circuit welding position 32, and the printed circuit board also includes: a driving power supply welding position 40, and the driving power supply welding position 40 is used to weld the driving power supply;

[0070] The driving power supply welding position 40 is respectively connected to the first driving circuit welding position 31 and the second driving circuit welding position 32, and the first driving circuit welding position 31 and the second driving circuit welding position 32 are also connected to the power input welding point of the isolation driving chip welding position 20;

[0071] The driving power supply is used to output a first driving voltage;

[0072] The first driving circuit welding position 31 is used to weld the first driving circuit when the first switching tube is welded to the switching tube welding position 10, and the first driving circuit transmits the first driving voltage to the power input welding point;

[0073] The second driving circuit welding position 32 is used to weld a second driving circuit when the second switching tube is welded to the switching tube welding position 10, and the second driving circuit converts the first driving voltage into a second driving voltage and transmits the second driving voltage to the power input welding point;

[0074] The first switch tube and the second switch tube have different packages.

[0075] It should be noted that there are at least two types of packages for the switch tube, which can be divided into a first switch tube and a second switch tube, wherein the drive voltage corresponding to the drive signal required by one package (the first switch tube) is the first drive voltage, and the drive voltage corresponding to the drive signal required by the other package (the second switch tube) is the second drive voltage. In this embodiment, the driving power supply can be understood as the system power supply inside the product. If the system voltage in the current product is the first driving voltage (that is, the driving power supply outputs the first driving voltage), and the driving voltage required by the package of the switch tube to be welded on the circuit board is the second driving voltage, then the corresponding components can be used to weld the second driving circuit welding position 32, so that the first driving voltage output by the driving power supply is converted into the second driving voltage through the second driving circuit formed by various components and circuit board lines, and the second driving voltage is transmitted to the isolation driving chip through the power input welding point of the isolation driving chip welding position 20, so that the isolation driving chip can output the corresponding second driving voltage. A driving signal is sent to the switch tube to control the on-off state of the switch tube; if the system voltage in the current product is the first driving voltage (that is, the driving power supply outputs the first driving voltage), and the driving voltage required by the package of the switch tube to be welded on the circuit board is also the first driving voltage, then the corresponding components can be used to weld the first driving circuit welding position 31, so that the first driving voltage output by the driving power supply is transmitted to the isolation driving chip through the power input welding point of the isolation driving chip welding position 20 through the first driving circuit formed by various components and circuit board lines, so that the isolation driving chip can output a driving signal corresponding to the first driving voltage to the switch tube to control the on-off state of the switch tube.

[0076] It is easy to understand that, as a specific implementation method, reference Figure 3, the first driving circuit welded at the first driving circuit welding position 31 may be a zero-ohm resistor R0. If the zero-ohm resistor R0 is welded between the welding point connected to the power input welding point and the welding point connected to the driving power supply welding position 40, the power input welding point and the driving power supply welding position 40 can be short-circuited, which is equivalent to the isolation driving chip being able to directly receive the first driving voltage output by the driving power supply U1; the second driving circuit welded at the second driving circuit welding position 32 is more complicated, and specifically, an N-type transistor Qn, a first capacitor C1, a first resistor R1, a second resistor R2 and a first voltage regulator diode Dw1 can be used as the components to be welded, and the circuit board circuit is used to make the first driving circuit of the second driving circuit be connected to the first driving circuit of the second driving circuit. A first end of a resistor R1 is connected to a driving power supply welding position 40, a second end of the first resistor R1 is respectively connected to a first end of a second resistor R2 and a collector of an N-type transistor Qn, a second end of the second resistor R2 is respectively connected to a base of the N-type transistor Qn and a cathode of a first voltage-stabilizing diode Dw1, an emitter of the N-type transistor Qn is respectively connected to a first end of a first capacitor C1 and a power input welding point, a second end of the first capacitor C1 and an anode of the first voltage-stabilizing diode Dw1 are commonly connected to a ground line GND1 on a driving side of the circuit board, and the first driving voltage output by the driving power supply U1 can be converted into a second driving voltage through the second driving circuit structure formed above, and transmitted to the isolation driving chip.

[0077] It is worth noting that in a specific implementation, as one scenario, the first drive circuit and the second drive circuit are equivalent to being connected in parallel between the power input soldering point and the drive power supply soldering position 40. As another scenario, the components required for soldering of the first drive circuit and the second drive circuit and the circuit board lines used can be partially shared. Specifically, the first resistor R1 in the second drive circuit serves as a shared current limiting resistor, the first capacitor C1 serves as a shared filter capacitor, the soldering point at one end of the zero-ohm resistor R0 is connected to the soldering point of the emitter of the N-type transistor Qn, and the soldering point at the other end of the zero-ohm resistor R0 is connected to the soldering point of the collector of the N-type transistor Qn. Figure 3 The second situation mentioned above is mainly reflected in this paper.

[0078] Furthermore, in this embodiment, the first driving circuit welding position 31 is also used for not welding the first driving circuit when the second switching tube is welded to the switching tube welding position 10;

[0079] The second driving circuit welding position 32 is further used for not welding the second driving circuit when the first switching tube is welded to the switching tube welding position 10 .

[0080] It is easy to understand that in this embodiment, if the switch tube welding position 10 is welded with a second switch tube, it is necessary to weld the second drive circuit on the second drive circuit welding position 32, so that the isolation drive chip can receive the second drive voltage output by the second drive circuit to form a corresponding drive signal, and output the drive signal corresponding to the second drive voltage to the switch tube welding position 10, so as to control the on-off state of the second switch tube; if the switch tube welding position 10 is welded with a first switch tube, it is necessary to weld the first drive circuit on the first drive circuit welding position 31, so that the isolation drive chip can receive the first drive voltage transmitted by the first drive circuit to form a corresponding drive signal, and output the drive signal corresponding to the first drive voltage to the switch tube welding position 10, so as to control the on-off state of the first switch tube. It can also be understood that the above two situations cannot exist on the same printed circuit board at the same time.

[0081] Further, in this embodiment, the printed circuit board further includes: a voltage clamping circuit welding position 50;

[0082] The voltage clamp circuit welding position 50 is respectively connected to the driving output welding point of the isolation driver chip welding position 20 and the gate welding point of the switch tube welding position 10;

[0083] The voltage clamping circuit welding position 50 is used for welding the voltage clamping circuit;

[0084] The isolation driving chip is further used to transmit the corresponding driving signal to the gate pad through the voltage clamping circuit when receiving the second driving voltage;

[0085] The voltage clamping circuit is used to clamp the high level voltage of the driving signal transmitted to the gate pad at a preset on-voltage, and clamp the low level voltage of the driving signal at a preset off-voltage;

[0086] Wherein, the switch tube is used to enter a fully on state when receiving the preset on voltage, and to enter a fully off state when receiving the preset off voltage.

[0087] It should be noted that the voltage clamping circuit welding position 50 is set between the switch tube welding position and the isolation driver chip welding position 20, and is used to weld a series of components, so that each component and the circuit board circuit together form a voltage clamping circuit. The voltage clamping circuit is mainly used to stabilize the drive signal output by the isolation driver chip at a preset on-voltage when it is at a high level, so that the switch tube can be stably in a fully on state when it receives the preset on-voltage, and stabilize at a preset cut-off voltage when it is at a low level, so that the switch tube can be stably in a fully cut-off state when it receives the preset cut-off voltage. In this embodiment, the drive signals required by switch tubes of different packages are not the same. For example, the high and low level voltages of the drive signal required by the package of one switch tube are 12V / 0V, and the high and low level voltages of the drive signal required by the package of another switch tube are 6V / -3V. Therefore, different voltage clamping circuits can be set for switch tubes of different packages.

[0088] It is easy to understand that, as a situation, Figure 4 As shown, the components to be welded in the voltage clamping circuit welded at the voltage clamping circuit welding position 50 may be a second capacitor C2, a third resistor R3, a second voltage zener diode Dw2 and a third voltage zener diode Dw3. In the welded circuit board, the second capacitor C2 and the third resistor R3 are connected in parallel through the circuit board circuit to form a parallel RC circuit structure. One side of the RC circuit structure is respectively connected to the cathode of the second voltage zener diode Dw2 and the gate welding point of the switch tube welding position, and the other side of the RC circuit structure is connected to the drive output welding point of the isolation transformer welding position. The anode of the third voltage zener diode Dw3 is connected to the anode of the second voltage zener diode Dw2, and the cathode of the third voltage zener diode Dw3 is connected to the ground wire GND1 on the driving side of the circuit board. When the transmitted driving signal is at a high level, the second voltage zener diode Dw2 and the third voltage zener diode Dw3 are turned on to generate a voltage drop, clamping the voltage at the gate solder joint at the preset turn-on voltage required when the switch tube is fully turned on; when the transmitted driving signal is at a low level, the second voltage zener diode Dw2 and the third voltage zener diode Dw3 are turned on to generate a voltage drop, and the voltage across the second capacitor C2 in the RC circuit cannot change suddenly, and the two work together to clamp the voltage at the gate solder joint at the preset turn-off voltage required when the switch tube is fully turned off.

[0089] Based on the first embodiment and / or the second embodiment of the present application, in the third embodiment of the present application, the same or similar contents as those of the above-mentioned first and second embodiments can refer to the above introduction, and will not be repeated later. Figure 5 , the printed circuit board also includes: a switch speed regulation circuit welding position 60;

[0090] The switch speed regulation circuit welding position 60 is respectively connected to the driving output welding point of the isolation driving chip welding position 20 and the gate welding point of the switch tube welding position 10;

[0091] The switch speed regulating circuit welding position 60 is used for welding the switch speed regulating circuit;

[0092] The switch speed regulating circuit is used to adjust the switching time taken for switching between high level and low level in the drive signal sent by the isolation drive chip to the gate pad according to the impedance inside the switch speed regulating circuit.

[0093] It should be noted that, in this embodiment, the switch speed regulating circuit welding position 60 is also arranged between the driving output welding point of the isolation driver chip welding position 20 and the gate welding point of the switch tube welding position 10, and can be arranged in series with the voltage clamping circuit welding position 50 described above, and can be specifically arranged between the driving output welding point and the voltage clamping circuit welding position 50. The switch speed regulating circuit welding position 60 can use an impedance device as a component to be welded, and the impedance provided by the impedance device can be used to adjust the switching time spent in the high level and low level switching process of the driving signal output by the isolation driver chip. The greater the impedance, the longer the switching time, and the slower the switching speed between the high level and the low level.

[0094] It is easy to understand that, as a situation, reference Figure 6 , Figure 6 An overall circuit structure diagram provided for the third embodiment of the printed circuit board of the present application can be used to explain the overall technical solution or part of the technical solution constituted by the third embodiment of the present technical solution. The components to be welded required for the switch speed regulation circuit welded at the switch speed regulation circuit welding position 60 may include a fourth resistor R4, a fifth resistor R5 and a Schottky diode Dx. In the switch speed regulation circuit formed by the components to be welded and the circuit board circuit after welding, the fourth resistor R4 is connected in series with the Schottky diode Dx and then connected in parallel with the fifth resistor R5, wherein the fourth resistor R4 is connected to the cathode of the Schottky diode Dx, the anode of the Schottky diode Dx is respectively connected to the first end of the fifth resistor R5 and the gate welding point G, and the second end of the fifth resistor R5 is connected to the drive output welding point. Through the fast conduction speed and fast recovery speed characteristics of the Schottky diode Dx, the switching time spent in the process of changing from a high level to a low level or from a low level to a high level of the drive signal transmitted at the drive output welding point can be adjusted by changing the impedance values ​​of the fourth resistor R4 and the fifth resistor R5.

[0095] It is worth noting that in this embodiment, if the voltage clamping circuit welding position 50 mentioned above is also present between the driving output welding point and the gate welding point G of the switch tube welding position 10, the second end of the fifth resistor R5 is connected to the voltage clamping circuit welding position 50, and then connected to the gate welding point of the switch tube welding position 10 by the voltage clamping circuit welding position 50.

[0096] Furthermore, in this embodiment, the printed circuit board further includes: a filter circuit soldering position 70;

[0097] The filter circuit welding position 70 is arranged between the switch speed regulation circuit welding position 60 and the gate welding point of the switch tube welding position 10;

[0098] The filter circuit welding position 70 is used for welding the filter circuit;

[0099] Wherein, the filtering circuit is used to filter the driving signal and transmit the filtered driving signal to the gate pad.

[0100] It should be noted that, in this embodiment, in order to ensure that the switch tube can stably switch the on-off state based on the received drive signal, a filter circuit welding position 70 can also be provided between the drive output welding point and the gate welding point for welding the filter circuit. The filter circuit is used to filter the drive signal transmitted between the drive output welding point and the gate welding point to filter out high-frequency noise or electromagnetic interference. If the switch speed regulation circuit welding position 60, or the voltage clamping circuit welding position 50, or the above two welding positions are also provided between the drive output welding point and the gate welding point, the filter circuit welding position 70 is preferably arranged close to the gate welding point to improve the filtering effect, that is, the connection line formed on the circuit board can be any one of "drive output welding point-switch speed regulation circuit welding position 60-filter circuit welding position 70-gate welding point", "drive output welding point-voltage clamping circuit welding position 50-filter circuit welding position 70-gate welding point" and "drive output welding point-switch speed regulation circuit welding position 60-voltage clamping circuit welding position 50-filter circuit welding position 70-gate welding point".

[0101] It is easy to understand that, as a situation, Figure 6 As shown, the components to be welded in the filter circuit welded at the filter circuit welding position 70 may include a magnetic bead L, a sixth resistor R6, and a third capacitor C3. In the filter circuit formed by the components to be welded and the circuit board circuit after welding, if the circuit board is also provided with a switch speed regulating circuit welding position 60, one end of the magnetic bead L is connected to the switch speed regulating circuit welding position 60 (and then connected to the drive output welding point by the switch speed regulating circuit welding position 60), and the other end of the magnetic bead L is respectively connected to the first end of the sixth resistor R6, the first end of the third capacitor C3 and the gate welding point G, and the second end of the sixth resistor R6 and the second end of the third capacitor C3 are connected to the ground wire on the driving side of the circuit board. The parallel RC circuit composed of the sixth resistor R6 and the third capacitor C3 can filter out the high-frequency noise in the circuit, and the magnetic bead L can also filter out the high-frequency noise in the circuit, and can prevent the impact of electrostatic discharge on the components in the circuit.

[0102] It is worth noting that if a voltage clamping circuit soldering point 50 is further provided in the circuit board, the first end of the sixth resistor R6 is connected to the voltage clamping circuit soldering point 50 , and then connected to the driving output soldering point through the voltage clamping circuit soldering point 50 .

[0103] Furthermore, in this embodiment, the printed circuit board further includes: a control signal source welding position 80 and a control side power supply welding position 90;

[0104] The control signal source welding position 80 is connected to the control input welding point of the isolation driver chip welding position 20, and the control side power supply is connected to the control side power supply welding point of the isolation driver chip welding position 20;

[0105] The control signal source welding position 80 is used for welding the control signal source;

[0106] The control side power supply welding position 90 is used for welding the control side power supply;

[0107] The control signal source welding position 80 and the control side power supply welding position 90 are arranged on one side of the isolation driver chip welding position 20 , and the driving circuit welding positions 30 and the switch tube welding position 10 are arranged on the other side of the isolation driver chip welding position 20 .

[0108] It should be noted that, in this embodiment, the control side of the circuit board is also provided with a control signal source welding position 80 and a control side power supply welding position 90, which are arranged on the other side of the isolation driver chip welding position 20, and are arranged opposite to each welding position on the driving side of the circuit board (including the first drive circuit welding position 31, the second drive circuit welding position 32, the switch speed regulation circuit welding position 60, the voltage clamping circuit welding position 50, the filter circuit welding position 70 and the switch tube welding position 10 mentioned above). Among them, the control side power supply welding position 90 is connected to the control side power supply welding point of the isolation driver chip welding position 20, and is used to weld the control side power supply, and the control side power supply is used to output the control side power supply voltage to support the relevant circuits on the control side of the circuit board to work. The control signal source welding position 80 is connected to the control input welding point of the isolation driver chip welding position 20, and is used to weld the control signal source, and the control signal source is used to output the control signal to the isolation driver chip. The control signal is a PWM signal, and the isolation driver chip can generate and output the corresponding drive signal based on the received control signal combined with the received drive voltage to control the switch tube to switch on and off.

[0109] It is easy to understand that, as a situation, Figure 6As shown, in order to improve the stability of the control side power supply voltage provided by the control side power supply U2, a fourth capacitor C4 can be additionally welded on the control side of the circuit board to filter the control side power supply voltage provided by the control side power supply U2. Specifically, the first end of the fourth capacitor C4 can be connected to the control side power supply soldering point and the control side power supply soldering position 90, respectively, and the second end of the fourth capacitor C4 is connected to the ground wire GND2 on the control side of the circuit board. In order to limit the current or voltage of the control signal output by the control signal source U3 from being too large, a seventh resistor R7 and an eighth resistor R8 can also be additionally welded on the control side of the circuit board, the first end of the seventh resistor R7 is connected to the control signal source soldering position 80, the second end of the seventh resistor R7 is respectively connected to the first end of the eighth resistor R8 and the control input soldering point, and the second end of the eighth resistor R8 is connected to the ground wire GND2 on the control side of the circuit board.

[0110] It is worth noting that, in this embodiment, the ground line GND2 on the control side of the circuit board is not connected to the ground line GND1 on the drive side.

[0111] Furthermore, in this embodiment, the switch tube welding position 10 includes:

[0112] A plurality of gate soldering points, each of which is interconnected and connected to the isolation driver chip soldering position 20;

[0113] A plurality of source electrode soldering points S, each of the source electrode soldering points S being interconnected;

[0114] A plurality of drain electrode soldering points D, each of the drain electrode soldering points D being interconnected;

[0115] Among them, each of the gate welding points G is used to weld the gate of the switching tube of the corresponding package, wherein each of the source welding points S is used to weld the source of the switching tube of the corresponding package, and each of the drain welding points D is used to weld the drain of the switching tube of the corresponding package.

[0116] It should be noted that, in this embodiment, Figure 6As shown, since the shapes of the packages of the switch tube FET are different, there should be multiple gate welding points G for welding the gate pins of the corresponding switch tube FET in the switch tube welding position 10, and each gate welding point G corresponds to the position of the gate pins of one or more switch tube FET packages. The gate welding points G are connected to each other through the circuit board circuit, so any gate welding point G is welded to the gate pin of the switch tube FET, so that the gate pin of the switch tube FET package can receive the drive signal output by the isolation driver chip IDR. Similar to the gate welding point G described above, since the shapes of the packages of the switch tube FET are different, there should be multiple source welding points S corresponding to the source pins of the corresponding switch tube FET and drain welding points D corresponding to the drain pins in the switch tube welding position 10, each source welding point S corresponds to the position of the source pins of one or more switch tube FET packages, and each drain welding point D corresponds to the position of the drain pins of one or more switch tube FET packages. Similarly, the source welding points S are connected to each other through the circuit board circuit, and the drain welding points D are also connected to each other through the circuit board circuit.

[0117] Further, in this embodiment, the switch tube includes any one of a first gallium nitride component with integrated driving and a second gallium nitride component without integrated driving.

[0118] It should be understood that, in this embodiment, the switch tube may specifically include any one of a first gallium nitride component with integrated driver and a second gallium nitride component without integrated driver, which correspond to the first switch tube and the second switch tube described above, respectively. The driving voltage required by the first gallium nitride component with integrated driver may be the first driving voltage described above, and the driving voltage required by the second gallium nitride component without integrated driver may be the second driving voltage described above.

[0119] In addition, it should be noted that the switch tube described in this embodiment is not limited to a single power tube, but may also be a combination of multiple power tubes, such as a combination of a certain MOS tube and any type of gallium nitride package.

[0120] In addition, to achieve the above purpose, the embodiment of the present application also proposes a vehicle charger, which adopts all the embodiments of the printed circuit board described above. Compared with the prior art, the beneficial effects of the vehicle charger provided by the embodiment of the present application are the same as the beneficial effects of the printed circuit board provided by the above embodiment, which will not be repeated here.

[0121] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent processing scope of the present application.

Claims

1. A printed circuit board, characterized in that: The printed circuit board comprises: Switch tube welding position, used for welding switch tubes of the same type with any package; The isolation driver chip welding position is respectively connected to a plurality of driver circuit welding positions and the switch tube welding position and is used for welding the isolation driver chip; Each of the driving circuit welding positions is used to weld the driving circuits corresponding to the switching tubes of various packages; Wherein, the driving circuit welded on each of the driving circuit welding positions matches the switching tube welded on the switching tube welding position.

2. The printed circuit board according to claim 1, wherein: Each of the driving circuit welding positions includes: a first driving circuit welding position and a second driving circuit welding position, and the printed circuit board also includes: a driving power supply welding position, and the driving power supply welding position is used to weld the driving power supply; The driving power supply welding position is respectively connected to the first driving circuit welding position and the second driving circuit welding position, and the first driving circuit welding position and the second driving circuit welding position are also connected to the power input welding point of the isolation driving chip welding position; The driving power supply is used to output a first driving voltage; The first driving circuit welding position is used to weld the first driving circuit when the first switching tube is welded to the switching tube welding position, and the first driving circuit transmits the first driving voltage to the power input welding point; The second driving circuit welding position is used to weld a second driving circuit when a second switching tube is welded to the switching tube welding position, and the second driving circuit converts the first driving voltage into a second driving voltage and transmits the second driving voltage to the power input welding point; The first switch tube and the second switch tube have different packages.

3. The printed circuit board according to claim 2, wherein: The first driving circuit welding position is further used for not welding the first driving circuit when the second switching tube is welded to the switching tube welding position; The second driving circuit welding position is further used for not welding the second driving circuit when the first switching tube is welded to the switching tube welding position.

4. The printed circuit board according to claim 2, wherein: The printed circuit board also includes: a voltage clamping circuit welding position; The voltage clamp circuit welding position is respectively connected to the driving output welding point of the isolation driver chip welding position and the gate welding point of the switch tube welding position; The voltage clamping circuit welding position is used for welding the voltage clamping circuit; The isolation driving chip is further used to transmit the corresponding driving signal to the gate pad through the voltage clamping circuit when receiving the second driving voltage; The voltage clamping circuit is used to clamp the high level voltage of the driving signal transmitted to the gate pad at a preset on-voltage, and clamp the low level voltage of the driving signal at a preset off-voltage; Wherein, the switch tube is used to enter a fully on state when receiving the preset on voltage, and to enter a fully off state when receiving the preset off voltage.

5. The printed circuit board according to claim 1, wherein: The printed circuit board also includes: a switch speed regulation circuit welding position; The switch speed regulation circuit welding position is respectively connected to the driving output welding point of the isolation drive chip welding position and the gate welding point of the switch tube welding position; The switch speed regulating circuit welding position is used for welding the switch speed regulating circuit; The switch speed regulating circuit is used to adjust the switching time taken for switching between high level and low level in the drive signal sent by the isolation drive chip to the gate pad according to the impedance inside the switch speed regulating circuit.

6. The printed circuit board according to claim 5, characterized in that The printed circuit board also includes: a filter circuit welding position; The filter circuit welding position is arranged between the switch speed regulation circuit welding position and the gate welding point of the switch tube welding position; The filter circuit welding position is used for welding the filter circuit; Wherein, the filtering circuit is used to filter the driving signal and transmit the filtered driving signal to the gate pad.

7. The printed circuit board according to claim 1, wherein: The printed circuit board also includes: a control signal source welding position and a control side power supply welding position; The control signal source welding position is connected to the control input welding point of the isolation driver chip welding position, and the control side power supply is connected to the control side power supply welding point of the isolation driver chip welding position; The control signal source welding position is used for welding the control signal source; The control side power supply welding position is used for welding the control side power supply; The control signal source welding position and the control side power supply welding position are arranged on one side of the isolation driver chip welding position, and the driving circuit welding positions and the switch tube welding positions are arranged on the other side of the isolation driver chip welding position.

8. The printed circuit board according to claim 1, wherein: The switch tube welding position includes: A plurality of gate soldering points, each of which is interconnected and connected to the isolation driver chip soldering position; A plurality of source electrode soldering points, each of the source electrode soldering points being interconnected; A plurality of drain electrode soldering points, each of the drain electrode soldering points being interconnected; Among them, each of the gate welding points is used to weld the gate of the switching tube of the corresponding package, each of the source welding points is used to weld the source of the switching tube of the corresponding package, and each of the drain welding points is used to weld the drain of the switching tube of the corresponding package.

9. The printed circuit board according to claim 1, wherein: The switch tube includes any one of a first gallium nitride element with integrated driving and a second gallium nitride element without integrated driving.

10. A vehicle charger, characterized in that: The on-board charger adopts the printed circuit board as claimed in any one of claims 1 to 9.

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