Etching equipment with waste liquid recovery processing function

Abstract

The utility model discloses etching equipment with a waste liquid recovery treatment function. The etching equipment comprises a processing table, a sliding rail frame, a circuit board clamp, a fixed baffle, an etching spraying assembly, a waste gas recovery assembly and a waste liquid recovery assembly, the processing table is provided with a liquid collecting tank, the sliding rail frame stands on the processing table and is located above the liquid collecting tank, the circuit board clamp is clamped on the sliding rail frame and can slide left and right along the upper portion of the liquid collecting tank, and the fixed baffles are fixedly arranged on the front side and the rear side of the liquid collecting tank. The etching spraying assembly is arranged on the fixed baffle and located on the front side and the rear side of the circuit board clamp. The waste gas recycling assembly and the waste liquid recycling assembly are both located on one side of the machining table. The waste gas recovery assembly comprises a waste gas dissolving tank, a gas pump and a gas suction pipeline. According to the utility model, the waste gas recovery assembly with waste gas absorption, storage and dissolution functions is designed and is matched with the fixed baffle plate to capture most volatile waste gas in the etching process; the utility model has the advantages of strong practicability and strong popularization significance.

Description

Technical Field

[0001] The utility model relates to a circuit board processing device, in particular to an etching device with a waste liquid recovery and processing function. Background Art

[0002] Etching is one of the basic processes in the circuit board production process. Its main principle is to cover the base copper with an anti-corrosion layer. The copper that is not protected by the anti-corrosion layer reacts with the etchant and is corroded away, eventually forming the designed circuit pattern and pad.

[0003] The current mainstream etching method is horizontal transmission spray, which can achieve the greatest degree of production automation and reduce costs. However, the commonly used etching solution contains volatile components, and the use of spray etching will also atomize the etching solution, which further aggravates the volatilization of the etching solution. However, most conventional etching equipment ignores the volatilization problem of the etching solution, which not only causes a waste of etching solution, but also is not friendly to the production environment. Utility Model Content

[0004] Based on this, it is necessary to provide an etching device with waste liquid recovery and processing function to address the deficiencies in the prior art.

[0005] An etching device with waste liquid recovery and processing function includes a processing table, a slide rail frame, a circuit board fixture, a fixed baffle, an etching spray assembly, a waste gas recovery assembly and a waste liquid recovery assembly. The processing table is provided with a liquid collecting tank, the slide rail frame is erected on the processing table and is located above the liquid collecting tank, the circuit board fixture is mounted on the slide rail frame and can slide left and right along the top of the liquid collecting tank, the fixed baffle is fixedly mounted on the front and rear sides of the liquid collecting tank, the etching spray assembly is mounted on the fixed baffle and is located on the front and rear sides of the circuit board fixture, and the waste gas recovery assembly and the waste liquid recovery assembly are both located on one side of the processing table. The waste gas recovery assembly includes a waste gas dissolving tank, an air pump and an air suction pipe, the waste gas dissolving tank is arranged on one side of the processing table, the air pump is installed above the waste gas dissolving tank and is connected to the waste gas dissolving tank gas path, one end of the air suction pipe is connected to the air pump, and the other end is passed through the fixed baffle and extends to the inner side of the fixed baffle.

[0006] Furthermore, the slide rail frame includes a fixed frame, a sliding rail and a plurality of transmission rods. The fixed frame is fixedly mounted on the processing table, the sliding rail is installed at the bottom of the fixed frame and corresponds to the liquid collecting tank up and down, and the upper ends of the plurality of transmission rods are all clamped and installed in the sliding rail and can slide left and right along the sliding rail. The circuit board fixture is clamped and installed at the lower end of the transmission rod.

[0007] Furthermore, the circuit board fixture includes a fixture seat, a first clamping plate, a second clamping plate and a limit locking knob. A rotation engaging hole is provided at the upper end of the fixture seat, and the fixture seat can be sleeved on the lower end of the transmission rod along the rotation engaging hole and can be rotated to limit the position. The first clamping plate and the second clamping plate are both designed in an "n"-shaped structure, wherein the first clamping plate is integrally provided at the lower end of the fixture seat, and the second clamping plate is axially connected to the lower end of the fixture seat and can be movably opened and closed. The limit locking knob is fixedly mounted on one side of the lower end of the first clamping plate, and the lower end of the second clamping plate is correspondingly provided with limit through holes penetrating on both sides, and the limit locking knob can be inserted into the limit through hole and can be rotated to limit the position.

[0008] Furthermore, the etching spray assembly is symmetrically designed, and includes a plurality of telescopic cylinders and a spray plate. The telescopic cylinder is arranged on the side of the fixed baffle and extends on the inner side of the fixed baffle, the spray plate is installed on the inner side end of the telescopic cylinder and corresponds to the circuit board fixture horizontally, and a plurality of atomizing nozzles are arranged on the inner side of the spray plate.

[0009] Furthermore, the waste liquid recovery component includes a waste liquid storage tank and a drainage pipe. The waste liquid storage tank is arranged on one side of the processing table. One end of the drainage pipe is connected to the inside of the waste liquid storage tank, and the other end is connected to the bottom of the liquid collecting tank.

[0010] Furthermore, the etching equipment with waste liquid recovery and processing function also includes a flushing component, which includes a plurality of high-pressure flushing nozzles, and the plurality of high-pressure flushing nozzles are all installed on the inner side of the fixed baffle and located above the circuit board fixture.

[0011] Furthermore, the bottom of one side of the liquid collecting tank is designed to be inclined downward, and a filter screen is also provided on the inclined surface of the liquid collecting tank.

[0012] In summary, the beneficial effects of the etching equipment with waste liquid recovery and treatment function of the utility model are: by designing a waste gas recovery component with waste gas absorption and storage and dissolution functions, it can capture most of the volatile waste gas in the etching process in cooperation with the fixed baffle, which can not only reduce the waste of etching liquid by recycling the waste gas, but also better protect the environment; the design of a sliding rail frame with slidable transmission and a flexible disassembly and assembly circuit board fixture makes the loading and unloading operations during circuit board etching easier; the design of a symmetrical etching spray component can realize double-sided etching of the circuit board, which can effectively improve the efficiency of the etching process; the waste liquid recovery component can recover and store the waste liquid in the liquid collection tank, further reducing the waste and pollution of the etching liquid; the flushing component can flush the etched circuit board and fixture, reduce the excessive erosion of the etching liquid on the fixture or circuit board, and also reduce the waste of etching liquid to a certain extent; the utility model is highly practical and has a strong promotion significance. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the structure of an etching device with waste liquid recovery and processing function according to the utility model;

[0014] Figure 2 for Figure 1 Schematic diagram of the decomposition structure;

[0015] Figure 3 for Figure 2 Schematic diagram of the exploded structure of the middle processing table;

[0016] Figure 4 for Figure 2 Schematic diagram of the exploded structure of the middle slide rail frame;

[0017] Figure 5 for Figure 2 Schematic diagram of the exploded structure of the circuit board fixture;

[0018] Figure 6 for Figure 2 Schematic diagram of the exploded structure of the etching spray assembly;

[0019] Figure 7 for Figure 2 A schematic diagram of the structure of the exhaust gas recovery component;

[0020] Figure 8 for Figure 2 A schematic diagram of the structure of the waste liquid recovery component;

[0021] Fig. 9 for Figure 2 Schematic diagram of the structure of the flushing component. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0023] like Figures 1 to 9As shown, the utility model provides an etching device 100 with a waste liquid recovery and processing function, which includes a processing table 10, a slide rail frame 20, a circuit board fixture 30, a fixed baffle 40, an etching spray assembly 50, an exhaust gas recovery assembly 60 and a waste liquid recovery assembly 70. The processing table 10 is provided with a liquid collecting tank 11, the slide rail frame 20 stands on the processing table 10 and is located above the liquid collecting tank 11, the circuit board fixture 30 is mounted on the slide rail frame 20 and can slide left and right along the top of the liquid collecting tank 11, the fixed baffle 40 is fixedly mounted on the front and rear sides of the liquid collecting tank 11, the etching spray assembly 50 is mounted on the fixed baffle 40 and is located on the front and rear sides of the circuit board fixture 30, and the exhaust gas recovery assembly 60 and the waste liquid recovery assembly 70 are both located on one side of the processing table 10. Specifically, in the utility model, a variety of driving devices, liquid supply devices, sensors, waste liquid treatment devices and intelligent control systems are also provided, and since they are all conventional contents in the technical field, they are not described here.

[0024] The slide rail frame 20 includes a fixed frame 21, a sliding rail 22 and a plurality of transmission rods 23. The fixed frame 21 is fixedly mounted on the processing table 10, the sliding rail 22 is installed at the bottom of the fixed frame 21 and corresponds to the liquid collecting tank 11 up and down, and the upper ends of the plurality of transmission rods 23 are all mounted in the sliding rail 22 and can slide left and right along the sliding rail 22. The circuit board fixture 30 is mounted in the lower end of the transmission rod 23. The transmission rod 23 that can slide left and right along the sliding rail 22 can drive the circuit board fixture 30 and the circuit board into the spray chamber surrounded by the fixed baffle 40 and the liquid collecting tank 11 for spray etching after loading on one side of the processing table 10, and can drive the circuit board fixture 30 and the circuit board to unload from the other side of the processing table 10 after etching is completed. The automatic transmission loading and unloading method is safer and more efficient than manual operation.

[0025] The circuit board fixture 30 includes a fixture seat 31, a first clamping plate 32, a second clamping plate 33 and a limit locking knob 34. A rotation engaging hole 311 is provided at the upper end of the fixture seat 31, and the fixture seat 31 can be sleeved on the lower end of the transmission rod 23 along the rotation engaging hole 311 and can be rotated to limit the position. The first clamping plate 32 and the second clamping plate 33 are both designed in an "n"-shaped structure, wherein the first clamping plate 32 is integrally provided at the lower end of the fixture seat 31, and the second clamping plate 33 is axially connected to the lower end of the fixture seat 31 and can be movably opened and closed. The limit locking knob 34 is fixedly mounted on one side of the lower end of the first clamping plate 32, and the lower end of the second clamping plate 33 is correspondingly provided with limit through holes 331 penetrating on both sides, and the limit locking knob 34 can be inserted into the limit through hole 331 and can be rotated to limit the position.

[0026] When clamping the circuit board, first rotate the second clamping plate 33 to keep it in an open state, then fit the circuit board to the inner side of the first clamping plate 32, and the lower end of the circuit board is lifted and limited by the limit locking knob 34, and finally the second clamping plate 33 is rotated to clamp and fix the circuit board together with the first clamping plate 32, and the first clamping plate 32 and the second clamping plate 33 are locked by the limit locking knob 34. When etching and feeding are required, just align the rotating engaging hole 311 on the clamp seat 31 with the lower end of the transmission rod 23, and then rotate the clamp seat 31 90 degrees along the axial direction of the transmission rod 23 to make the circuit board clamp 30 firmly mounted on the transmission rod 23, and if the circuit board clamp 30 needs to be removed from the transmission rod 23, just reverse the operation.

[0027] The etching spray assembly 50 is symmetrically designed, and includes a plurality of telescopic cylinders 51 and a spray plate 52. The telescopic cylinder 51 is arranged on the side of the fixed baffle 40 and extends on the inner side of the fixed baffle 40. The spray plate 52 is installed on the inner side end of the telescopic cylinder 51 and corresponds to the circuit board fixture 30 horizontally. A plurality of atomizing nozzles 521 are arranged on the inner side of the spray plate 52. When spray etching is performed, the telescopic cylinder 51 can drive the spray plate 52 to press against both sides of the circuit board fixture 30 to etch the surface of the circuit board, and the spray plate 52 can be separated from the circuit board fixture 30 after the etching is completed. The symmetrically designed etching spray assembly 50 can process both sides of the circuit board at the same time, which greatly improves the efficiency of the etching process.

[0028] The waste gas recovery assembly 60 includes a waste gas dissolving tank 61, an air pump 62 and an air suction pipe 63. The waste gas dissolving tank 61 is arranged on one side of the processing table 10. The air pump 62 is installed above the waste gas dissolving tank 61 and is connected to the waste gas dissolving tank 61 through its air path. One end of the air suction pipe 63 is connected to the air pump 62, and the other end is passed through the fixed baffle 40 and extends to the inner side of the fixed baffle 40. During the etching process, the waste gas volatilized from the etching liquid is constrained by the fixed baffle 40 to reduce the speed of escaping to the external environment. At this time, starting the air pump 62 can pump the volatilized gas inside the fixed baffle 40 into the waste gas dissolving tank 61 along the air suction pipe 63, and the waste gas dissolving tank 61 filled with clean water can dissolve the volatilized gas in the water under the action of air pressure to obtain etching waste liquid, which can be recycled after subsequent treatment, thereby achieving the purpose of saving etching liquid and protecting the environment.

[0029] The waste liquid recovery assembly 70 includes a waste liquid storage tank 71 and a drainage pipe 72. The waste liquid storage tank 71 is arranged on one side of the processing table 10. One end of the drainage pipe 72 is connected to the inside of the waste liquid storage tank 71, and the other end is connected to the bottom of the liquid collecting tank 11. Specifically, in this embodiment, the bottom of one side of the liquid collecting tank 11 is designed to be inclined downward, and a filter screen 12 is also provided on the inclined surface of the liquid collecting tank 11. The etching waste liquid dripping during the etching process is collected in the liquid collecting tank 11, and then flows through the filter screen 12 under the inclined surface design structure of the liquid collecting tank 11. After filtering the solid impurities in the waste liquid, the remaining etching waste liquid is all introduced into the waste liquid storage tank 71 through the drainage pipe 72 for further processing and utilization.

[0030] The etching equipment 100 with waste liquid recovery and processing function also includes a flushing component 80, and the flushing component 80 includes a plurality of high-pressure flushing nozzles 81, and the plurality of high-pressure flushing nozzles 81 are installed on the inner side of the fixed baffle 40 and located above the circuit board fixture 30. The high-pressure flushing nozzle 81 can spray high-pressure water flow, and the high-pressure water flow flushes the circuit board fixture 30 and the circuit board from top to bottom at an inclined angle, which can clean the circuit board and the fixture after etching, and effectively avoid the residual etching liquid from causing damage to the circuit board or the fixture.

[0031] In summary, the beneficial effects of the etching equipment 100 with waste liquid recovery and processing function of the utility model are: by designing a waste gas recovery component 60 with waste gas absorption and storage and dissolution functions, it is possible to capture most of the volatile waste gases in the etching process in cooperation with the fixed baffle 40, which can not only reduce the waste of etching liquid by recycling the waste gas, but also better protect the environment; the design of a slidable slide rail frame 20 is combined with a flexible and disassembled circuit board fixture 30, so that the loading and unloading operations during circuit board etching are easier; the design of a symmetrical etching spray component 50 can realize double-sided etching of the circuit board, which can effectively improve the efficiency of the etching process; the waste liquid recovery component 70 can recover and store the waste liquid in the liquid collecting tank 11, further reducing the waste and pollution of the etching liquid; the flushing component 80 can flush the etched circuit board and fixture, reduce the excessive erosion of the etching liquid on the fixture or circuit board, and also reduce the waste of etching liquid to a certain extent; the utility model is highly practical and has a strong promotion significance.

[0032] The above-mentioned embodiment only expresses one implementation method of the utility model, and its description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An etching device with waste liquid recovery and processing function, characterized in that: It includes a processing table, a slide rail frame, a circuit board fixture, a fixed baffle, an etching spray assembly, a waste gas recovery assembly and a waste liquid recovery assembly; the processing table is provided with a liquid collecting tank, the slide rail frame is erected on the processing table and is located above the liquid collecting tank, the circuit board fixture is mounted on the slide rail frame and can slide left and right along the top of the liquid collecting tank, the fixed baffle is fixedly mounted on the front and rear sides of the liquid collecting tank, the etching spray assembly is mounted on the fixed baffle and is located on the front and rear sides of the circuit board fixture, the waste gas recovery assembly and the waste liquid recovery assembly are both located on one side of the processing table; the waste gas recovery assembly includes a waste gas dissolving tank, an air pump and an air suction pipe, the waste gas dissolving tank is arranged on one side of the processing table, the air pump is installed above the waste gas dissolving tank and is connected to the air path of the waste gas dissolving tank, one end of the air suction pipe is connected to the air pump, and the other end is passed through the fixed baffle and extends to the inner side of the fixed baffle.

2. The etching equipment with waste liquid recovery function as claimed in claim 1, characterized in that: The slide rail frame includes a fixed frame, a sliding rail and a plurality of transmission rods; the fixed frame is fixedly mounted on the processing table, the sliding rail is installed at the bottom of the fixed frame and corresponds to the liquid collecting tank up and down, the upper ends of the plurality of transmission rods are all engaged and installed in the sliding rail and can slide left and right along the sliding rail; the circuit board clamp is engaged and installed at the lower end of the transmission rod.

3. The etching equipment with waste liquid recovery function as claimed in claim 2, characterized in that: The circuit board clamp comprises a clamp seat, a first clamp plate, a second clamp plate and a limit locking knob; a rotation engaging hole is provided at the upper end of the clamp seat, and the clamp seat can be sleeved on the lower end of the transmission rod along the rotation engaging hole and can be rotated to limit the position; the first clamp plate and the second clamp plate are both designed in an "n" shape structure, wherein the first clamp plate is integrally arranged at the lower end of the clamp seat, and the second clamp plate is axially connected to the lower end of the clamp seat and can be movably opened and closed; the limit locking knob is fixedly mounted on one side of the lower end of the first clamp plate, and the lower end of the second clamp plate is correspondingly provided with limit through holes penetrating on both sides, and the limit locking knob can be inserted into the limit through hole and can be rotated to limit the position.

4. The etching equipment with waste liquid recovery function as claimed in claim 1, characterized in that: The etching spray assembly is symmetrically designed, and includes a plurality of telescopic cylinders and a spray plate; the telescopic cylinder is penetrated through the side of the fixed baffle and extends to the inner side of the fixed baffle, the spray plate is installed at the inner end of the telescopic cylinder and corresponds horizontally to the circuit board fixture, and a plurality of atomizing nozzles are provided on the inner side of the spray plate.

5. The etching equipment with waste liquid recovery function as claimed in claim 1, characterized in that: The waste liquid recovery component includes a waste liquid storage box and a drainage pipe. The waste liquid storage box is arranged on one side of the processing table. One end of the drainage pipe is connected to the inside of the waste liquid storage box, and the other end is connected to the bottom of the liquid collecting tank.

6. The etching equipment with waste liquid recovery function as claimed in claim 1, characterized in that: It also includes a flushing component, which includes a plurality of high-pressure flushing nozzles. The plurality of high-pressure flushing nozzles are all installed on the inner side of the fixed baffle and located above the circuit board fixture.

7. The etching equipment with waste liquid recovery function as claimed in claim 1, characterized in that: The bottom of one side of the liquid collecting tank is designed to be tilted downward, and a filter screen is also arranged on the tilted surface of the liquid collecting tank.

Images