Multi-layer circuit board lamination automatic pre-stacking machine

Abstract

The utility model discloses a multilayer circuit board lamination automatic pre-stacking machine comprising a main body assembly which comprises an arranged pressing block; the cleaning assembly comprises a movable groove formed in the left side wall of the outer surface of the pressing block, a first movable shaft slidably connected to the interior of the movable groove, a connecting plate rotationally connected to the outer surface of the first movable shaft, and a second movable shaft rotationally penetrating through the outer surface of the upper end of the connecting plate; the detection assembly comprises a second guide rail welded to the right side of the middle section of the upper surface of the operation table. According to the utility model, the problems that an existing pre-stacking machine places raw materials of a multilayer circuit board in the middle of an operation table and carries out pressing through a pressing block, but the multilayer circuit board needs to use an adhesive during pressing, the adhesive can be adhered to the outer surface of the pressing block after pressing, non-uniform pressure distribution is possibly caused due to the fact that the adhesive is adhered to the pressing block, and the pressing block is damaged are solved. Therefore, the problems of circuit board distortion, poor interlayer contact or interlayer discontinuity and the like can be caused by non-uniform lamination of the multi-layer circuit board.

Description

Technical Field

[0001] The utility model relates to the technical field of pre-stacking machines, in particular to an automatic pre-stacking machine for pressing multi-layer circuit boards. Background Art

[0002] The multi-layer circuit board lamination automatic pre-stacking machine is a machine equipment specially used for the lamination and pre-folding process of multi-layer circuit boards. It can accurately press and fold different layers of circuit boards and dielectric materials when manufacturing multi-layer circuit boards to ensure the structural stability and electrical connectivity of the circuit boards.

[0003] However, it still has the following disadvantages in actual use:

[0004] The existing pre-stacking machine places the multi-layer circuit board raw materials in the middle of the operating table and presses them together through a pressing block. However, adhesive is required when pressing the multi-layer circuit board. After pressing, the adhesive will adhere to the outer surface of the pressing block. The adhesive adhesion to the pressing block may cause uneven pressure distribution, which may cause uneven pressing of the multi-layer circuit board, resulting in problems such as circuit board distortion, poor contact between layers or disconnection between layers.

[0005] Therefore, a new multi-layer circuit board lamination automatic pre-stacking machine is proposed to solve the above problems. Utility Model Content

[0006] Technical issues to be solved

[0007] The utility model aims to provide an automatic pre-stacking machine for laminating multi-layer circuit boards, so as to solve the problem raised in the above-mentioned background technology that the existing pre-stacking machine places the raw materials of the multi-layer circuit boards in the middle of the operating table and performs lamination through a pressing block, but an adhesive is required when laminating the multi-layer circuit boards, and the adhesive will adhere to the outer surface of the pressing block after lamination. The adhesive adhering to the pressing block may cause uneven pressure distribution, which may cause uneven lamination of the multi-layer circuit boards, resulting in problems such as distortion of the circuit boards, poor contact between layers or disconnection between layers.

[0008] Technical Solution

[0009] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0010] The utility model is a multi-layer circuit board lamination automatic pre-stacking machine, comprising:

[0011] A main body component, the main body component includes a set pressing block and an operating table hinged at the lower end of the pressing block;

[0012] A cleaning assembly, the cleaning assembly comprising a movable groove opened on the left side wall of the outer surface of the pressing block, a first movable shaft slidably connected to the inside of the movable groove, a connecting plate rotatably connected to the outer surface of the first movable shaft, a second movable shaft rotatably passing through the outer surface of the upper end of the connecting plate, a rotating column fixedly passing through the outer surface of the second movable shaft, a scraper fixed to the outer surface of the rotating column, and a fixed hook rotatably connected to the rear side wall of the pressing block;

[0013] The detection component includes a second guide rail welded to the right side of the middle section of the upper surface of the operating table.

[0014] Furthermore, the main body assembly also includes a side frame fixed to the right side wall of the outer surface of the operating table, a first guide rail fixed to the upper surface of the side frame, a first slider slidably connected to the outer surface of the first guide rail, an electric push rod fixed to the lower surface of the first slider, a grab plate fixed to the lower surface of the electric push rod, a grab clamp movably connected to the side wall of the outer surface of the grab plate, and a base fixed to the lower surface of the operating table;

[0015] Specifically, the first slide block is slidably guided by the first guide rail, and two first slide blocks are provided and slide synchronously, and the electric push rod performs telescopic movement to pre-stack the raw materials of the multi-layer circuit board.

[0016] Furthermore, the movable grooves are provided with two, which are respectively located on the left and right side walls of the pressing block, and the first movable shaft slides inside the movable grooves;

[0017] Specifically, the multi-layer circuit board is pressed by rotating the pressing block toward the front side.

[0018] Furthermore, two fixing hooks are provided, which are respectively located on the left and right sides of the rear side wall of the pressing block, and the fixing hooks can rotate 180 degrees;

[0019] Specifically, the connecting plate is fixed by a rotating fixing hook.

[0020] Furthermore, the scrapers are provided with three pieces, which are equally spaced on the outer surface of the rotating cylinder, and the second movable shaft rotates, and the scrapers also rotate;

[0021] Specifically, the first movable shaft is rotated to drive the rotating column to rotate, and the scraper is driven to rotate to clean the adhesive remaining on the front surface of the pressing block.

[0022] Furthermore, the detection assembly also includes a second slider slidably connected to the outer surface of the second guide rail, a first infrared detector fixed inside the upper end of the second slider, a third guide rail welded to the front end of the upper surface of the operating table, a third slider slidably connected to the outer surface of the third guide rail, a second infrared detector fixed inside the upper end of the third slider, a first alarm light fixed to the right side of the front side wall of the operating table, and a second alarm light fixed to the right side of the front side wall of the operating table;

[0023] Specifically, the pre-stacked multilayer boards are inspected by the first infrared detector and the second infrared detector. When it is found that the overlapping position is inaccurate, an alarm is sounded by the first alarm light and the second alarm light to remind the staff to align manually.

[0024] Furthermore, the second slider slides back and forth on the outer surface of the second guide rail, and the third slider slides left and right on the outer surface of the third guide rail, the first infrared detector is electrically connected to the first alarm light, and the second infrared detector is electrically connected to the second alarm light.

[0025] Beneficial Effects

[0026] Compared with the prior art, the advantages of the present invention are:

[0027] 1. The utility model, through the provision of the movable groove, the first movable shaft, the connecting plate, the second movable shaft, the rotating column, the scraper and the fixed hook, after the pressing block is pressed on the circuit board, the adhesive will adhere to the front side wall of the pressing block, and the fixed hook will be rotated 180 degrees. At this time, the connecting plate can be rotated to the front side of the pressing block under the rotation connection of the first movable shaft. At this time, the rotating column also rotates to the front side of the pressing block, and the scraper contacts the front side wall of the pressing block, and then the connecting plate and the first movable shaft are pulled downward to move in the movable groove, and the second movable shaft is driven to rotate, and the rotating column is driven to rotate, and the scraper cleans the front side wall of the pressing block, which helps to ensure the flatness of the circuit board and the stability of the interlayer connection, and improve the reliability and consistency of production.

[0028] 2. Based on beneficial effect 1, by setting the second guide rail, the second slider, the first infrared detector, the third guide rail, the third slider, the second infrared detector, the first alarm light and the second alarm light, the second slider drives the first infrared detector to move forward and backward on the second guide rail, and the third slider drives the second infrared detector to move left and right on the third guide rail, the front, back, left and right sides of the multi-layer circuit board can be detected to see if they are aligned, and reminders are issued by the first alarm light and the second alarm light, so that the operator can respond quickly, adjust and correct the alignment problems in time, and reduce production downtime, which helps to improve production efficiency, shorten delivery cycle, and increase the output of the production line.

[0029] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 This is a schematic diagram of the main components of the utility model;

[0032] Figure 2 This is a rear view of the main assembly of the utility model;

[0033] Figure 3 This is a structural diagram of the cleaning component of the utility model;

[0034] Figure 4 This is a structural diagram of the detection component of the utility model.

[0035] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0036] 11. Press block; 12. Operating table; 13. Side frame; 14. First guide rail; 15. First slide block; 16. Electric push rod; 17. Grab plate; 18. Grab clamp; 19. Base;

[0037] 21. movable groove; 22. first movable shaft; 23. connecting plate; 24. second movable shaft; 25. rotating column; 26. scraper; 27. fixing hook;

[0038] 31. Second guide rail; 32. Second slider; 33. First infrared detector; 34. Third guide rail; 35. Third slider; 36. Second infrared detector; 37. First alarm light; 38. Second alarm light. DETAILED DESCRIPTION

[0039] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0040] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific implementation methods disclosed below.

[0041] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the implementation of the present invention, for the sake of convenience, the cross-sectional diagram showing the device structure will not be partially enlarged according to the general scale, and the schematic diagram is only an example, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0042] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.

[0043] Example 1

[0044] See also Figure 1-Figure 3 As shown, this embodiment is a multi-layer circuit board lamination automatic pre-stacking machine, comprising:

[0045] The main body component includes a set pressing block 11, an operating table 12 hinged at the lower end of the pressing block 11, a side frame 13 fixed to the right side wall of the outer surface of the operating table 12, a first guide rail 14 fixed to the upper surface of the side frame 13, a first slider 15 slidably connected to the outer surface of the first guide rail 14, an electric push rod 16 fixed to the lower surface of the first slider 15, a grab plate 17 fixed to the lower surface of the electric push rod 16, a grab clamp 18 movably connected to the side wall of the outer surface of the grab plate 17, and a base 19 fixed to the lower surface of the operating table 12. When in use, it is used for pre-stacking of multi-layer circuit boards;

[0046] A cleaning assembly, the cleaning assembly includes a movable groove 21 opened on the left side wall of the outer surface of the pressing block 11, a first movable shaft 22 slidably connected to the inside of the movable groove 21, a connecting plate 23 rotatably connected to the outer surface of the first movable shaft 22, a second movable shaft 24 rotatably passing through the outer surface of the upper end of the connecting plate 23, a rotating column 25 fixedly passing through the outer surface of the second movable shaft 24, a scraper 26 fixed to the outer surface of the rotating column 25, and a fixed hook 27 rotatably connected to the rear side wall of the pressing block 11;

[0047] To understand how to use the cleanup component, follow these steps:

[0048] After the multi-layer circuit board is pressed, there will be residual adhesive attached to the pressing block 11;

[0049] First, the staff rotates the fixing hook 27 180 degrees. At this time, the connecting plate 23 can be rotated to the front side of the pressing block 11 under the rotation connection of the first movable shaft 22.

[0050] At this time, under the connection of the connecting plate 23, the rotating column 25 also rotates to the front side of the pressing block 11, and the scraper 26 contacts the front side wall of the pressing block 11.

[0051] Then pull the connecting plate 23 downward, the first movable shaft 22 moves in the movable groove 21, and drives the second movable shaft 24 to rotate.

[0052] The second movable shaft 24 drives the rotating column 25 to rotate, and the scraper 26 cleans the front side wall of the pressing block 11.

[0053] This step helps ensure the flatness of the circuit board and the stability of the interlayer connection, improving the reliability and consistency of production.

[0054] Example 2

[0055] See also Figure 4 As shown, this embodiment is based on the above embodiment 1 and also includes:

[0056] A detection component, the detection component includes a second guide rail 31 welded to the right side of the middle section of the upper surface of the operating table 12, a second slider 32 slidably connected to the outer surface of the second guide rail 31, a first infrared detector 33 fixed inside the upper end of the second slider 32, a third guide rail 34 welded to the front end of the upper surface of the operating table 12, a third slider 35 slidably connected to the outer surface of the third guide rail 34, a second infrared detector 36 fixed inside the upper end of the third slider 35, a first alarm light 37 fixed to the right side of the front side wall of the operating table 12, and a second alarm light 38 fixed to the right side of the front side wall of the operating table 12;

[0057] To understand how to use the detection component, the following steps are posted:

[0058] First, the staff controls the second slider 32 and the third slider 35 to move on the second guide rail 31 and the third guide rail 34 through the external control module.

[0059] Furthermore, the second slider 32 drives the first infrared detector 33 to move forward and backward on the second guide rail 31, and the third slider 35 drives the second infrared detector 36 to move left and right on the third guide rail 34.

[0060] In this way, the front, back, left, and right sides of the multilayer circuit board can be checked for alignment, and a reminder can be issued through the first alarm light 37 and the second alarm light 38.

[0061] This step avoids operators from responding quickly, adjusting and correcting alignment problems in a timely manner, and reducing production downtime, which helps improve production efficiency, shorten delivery cycles, and increase production line output.

[0062] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0063] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A multi-layer circuit board lamination automatic pre-stacking machine, characterized in that: include: A main body component, the main body component comprising a set pressing block (11) and an operating table (12) hinged at the lower end of the pressing block (11); A cleaning assembly, the cleaning assembly comprising a movable groove (21) provided on the left side wall of the outer surface of the pressing block (11), a first movable shaft (22) slidably connected to the inside of the movable groove (21), a connecting plate (23) rotatably connected to the outer surface of the first movable shaft (22), a second movable shaft (24) rotatably passing through the outer surface of the upper end of the connecting plate (23), a rotating column (25) fixedly passing through the outer surface of the second movable shaft (24), a scraper (26) fixed to the outer surface of the rotating column (25), and a fixing hook (27) rotatably connected to the rear side wall of the pressing block (11); The detection component comprises a second guide rail (31) welded to the right side of the middle section of the upper surface of the operating table (12).

2. The multi-layer circuit board automatic pre-stacking machine according to claim 1, characterized in that: The main body assembly also includes a side frame (13) fixed to the right side wall of the outer surface of the operating table (12), a first guide rail (14) fixed to the upper surface of the side frame (13), a first slider (15) slidably connected to the outer surface of the first guide rail (14), an electric push rod (16) fixed to the lower surface of the first slider (15), a grab plate (17) fixed to the lower surface of the electric push rod (16), a grab clamp (18) movably connected to the side wall of the outer surface of the grab plate (17), and a base (19) fixed to the lower surface of the operating table (12).

3. The automatic lamination machine for laminating multi-layer circuit boards according to claim 1, characterized in that: The movable grooves (21) are provided with two, which are respectively located on the left and right side walls of the pressing block (11), and the first movable shaft (22) slides inside the movable grooves (21).

4. The automatic lamination machine for laminating multi-layer circuit boards according to claim 1, characterized in that: Two fixing hooks (27) are provided, which are respectively located on the left and right sides of the rear side wall of the pressing block (11), and the fixing hooks (27) can rotate 180 degrees.

5. The automatic lamination machine for laminating multi-layer circuit boards according to claim 1, characterized in that: The scrapers (26) are provided in three numbers and are distributed at equal distances on the outer surface of the rotating column (25). When the second movable shaft (24) rotates, the scrapers (26) also rotate.

6. The automatic lamination machine for laminating multi-layer circuit boards according to claim 1, characterized in that: The detection assembly further comprises a second slider (32) slidably connected to the outer surface of the second guide rail (31), a first infrared detector (33) fixed inside the upper end of the second slider (32), a third guide rail (34) welded to the front end of the upper surface of the operating table (12), a third slider (35) slidably connected to the outer surface of the third guide rail (34), a second infrared detector (36) fixed inside the upper end of the third slider (35), a first alarm light (37) fixed to the right side of the front side wall of the operating table (12), and a second alarm light (38) fixed to the right side of the front side wall of the operating table (12).

7. The multi-layer circuit board automatic lamination machine according to claim 6, characterized in that: The second slider (32) slides forward and backward on the outer surface of the second guide rail (31), and the third slider (35) slides left and right on the outer surface of the third guide rail (34). The first infrared detector (33) is electrically connected to the first alarm light (37), and the second infrared detector (36) is electrically connected to the second alarm light (38).

Images