High-brightness LED packaging structure

Abstract

The utility model provides a high-brightness LED packaging structure, which relates to the technical field of high-brightness LED packaging, and comprises a substrate, a heat dissipation assembly arranged on the substrate, a reflecting cover arranged in the substrate, a lampshade arranged on the substrate, a heat dissipation assembly comprising a metal plate, fins fixed at the bottom of the metal plate, a second pin groove arranged on the metal plate, and a second pin arranged on the second pin groove. An operator inserts the fins fixed on the metal plate into the grooves and inserts the pins of the LED chips into the first pin grooves and the second pin grooves, so that the pins of the LED chips can be exposed out of the bottom of the substrate and can be welded to the mainboard, the metal plate and the LED chips are separated through the insulating plate, and the LED chips are welded to the substrate through the insulating plate. According to the LED lamp, the metal plate is arranged on the LED chip, the LED chip is prevented from being directly contacted with the metal plate to influence the LED chip, the fins play a role in radiating the LED chip, and the reflecting cover is arranged to converge light generated by the LED chip to generate high brightness, so that the working temperature of the LED is reduced, the lighting effect is improved, and the service life is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of high-brightness LED packaging, in particular to a high-brightness LED packaging structure. Background Art

[0002] A high-brightness LED packaging structure should take into account the characteristics of LED's high heat generation, improve the heat dissipation efficiency through reasonable thermal conductive structure and heat sink design, use heat dissipation materials with good thermal conductivity, such as aluminum alloy, copper, etc., to improve the heat dissipation effect, and increase the heat dissipation surface area and improve the heat dissipation efficiency by increasing the area of ​​the heat sink or adopting a multi-wing design.

[0003] The existing patent (publication number: CN218647969U) proposes a high-brightness white light LED packaging structure. The white light LED packaging structure provided by the utility model excites the red fluorescent glue and the yellow-green fluorescent glue separately. The red fluorescent glue directly covers the top and around the LED chip, so that the red fluorescent glue is fully excited by the light emitted by the chip, thereby reducing the amount of red fluorescent powder added. The light excites the red fluorescent glue and then excites the yellow-green fluorescent glue above; and through the setting of the emission cup, the light emitted from the side of the chip can also fully excite the fluorescent glue and emit from the front, thereby reducing the thickness of the fluorescent glue layer and improving the excitation brightness of the LED.

[0004] However, the existing high-brightness white light LED packaging structure usually cannot dissipate heat for the LED when it is working. Excessively high operating temperature will cause the light efficiency of the LED to decrease, thereby reducing the light brightness of the LED, affecting the lighting effect, accelerating device aging, shortening the service life of the LED, reducing its reliability, and causing the color of the light-emitting chip to shift, affecting the light color consistency of the lamp. Excessively high temperature will affect the electrical performance of the LED, reduce the stability of the LED, and even cause LED failure. Therefore, the utility model proposes a high-brightness LED packaging structure to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to solve the shortcomings existing in the prior art and to provide a high-brightness LED packaging structure.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a high-brightness LED packaging structure, comprising a substrate, a heat dissipation component is arranged on the substrate, a reflector is arranged inside the substrate, and a lampshade is arranged on the substrate;

[0007] The heat dissipation component comprises a metal plate, a fin is fixed on the bottom of the metal plate, a second pin slot is opened on the metal plate, an insulating plate is arranged on the top of the metal plate, and an LED chip is arranged on the metal plate.

[0008] As a preferred implementation of a high-brightness LED packaging structure, a groove is provided on the substrate, and a first pin groove is provided on a side of the substrate close to the groove.

[0009] The beneficial effect of adopting the above further solution is that the fin can be inserted into the groove by the provided groove, and the pin of the LED chip can be inserted into the first pin groove by the opened first pin groove.

[0010] As a preferred implementation of a high-brightness LED packaging structure, the LED chip is arranged on an insulating board, the fin is inserted in a groove, the first pin groove is connected to the second pin groove, and the pins of the LED chip are inserted in the second pin groove and the first pin groove.

[0011] The beneficial effect of adopting the above further scheme is: since the fin is inserted in the groove, the bottom of the fin is in contact with the outside, which can better achieve the heat dissipation effect; since the first pin groove is connected to the second pin groove, the pins of the LED chip can be exposed from the substrate, so that the pins of the LED chip can be soldered to the mainboard.

[0012] As a preferred implementation of a high-brightness LED packaging structure, a disassembly component is provided on the substrate, the disassembly component includes a clamping block, and a clamping groove is provided on the lampshade.

[0013] The beneficial effect of adopting the above further scheme is: after the LED chip is installed on the heat dissipation component, the lampshade is covered on the substrate, and through the cooperation of the clamping block and the clamping slot, the clamping block is clamped in the clamping slot, so that the lampshade can be fixed on the substrate.

[0014] As a preferred implementation of a high-brightness LED packaging structure, the card block is snapped into the card slot, and the card block is fixed on the substrate.

[0015] The beneficial effect of adopting the above further solution is that since the clamping block is clamped in the clamping slot and the clamping block is fixed on the base plate, the clamping block fixes the lampshade on the base plate.

[0016] As a preferred implementation of a high-brightness LED packaging structure, a bottom plate is fixed to the bottom of the substrate, and a welding plate is fixed on the bottom plate.

[0017] The beneficial effect of adopting the above further solution is: through the provision of the bottom plate, the bottom plate can support and fix the base plate, and through the provision of the welding plate, the entire structure can be welded and fixed to the main board.

[0018] Compared with the prior art, the advantages and positive effects of the utility model are:

[0019] 1. The operator inserts the fins fixed on the metal plate into the groove, and inserts the pins of the LED chip into the first pin groove and the second pin groove, so that the pins of the LED chip can be exposed from the bottom of the substrate, so that the pins of the LED chip can be welded on the mainboard. The insulating plate separates the metal plate and the LED chip to prevent the LED chip from directly contacting the metal plate and affecting the LED chip. The fins play a heat dissipation role for the LED chip. Through the reflector, the reflector can gather the light generated by the LED chip to produce high brightness, thereby reducing the operating temperature of the LED, improving the light efficiency and extending the service life.

[0020] 2. After the operator installs the LED chip in the heat dissipation assembly, the lampshade is covered on the substrate. Through the cooperation of the card block and the card slot, the card block is engaged in the card slot, so that the lampshade can be fixed on the substrate, thereby achieving the technical problem of easy disassembly of the LED lampshade. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a structural schematic diagram of a high-brightness LED packaging structure of the utility model;

[0022] Figure 2 This is a schematic diagram of the split structure of a high-brightness LED packaging structure of the utility model;

[0023] Figure 3 This is a schematic diagram of the heat dissipation component structure of a high-brightness LED packaging structure of the utility model;

[0024] Figure 4 The utility model is a schematic diagram of a disassembly component structure of a high-brightness LED packaging structure.

[0025] Reference numerals

[0026] 1. Base plate; 2. Groove; 3. First pin slot; 4. Heat dissipation assembly; 41. Metal plate; 42. Fin; 43. Second pin slot; 44. Insulation plate; 5. LED chip; 6. Reflector; 7. Disassembly assembly; 71. Block; 72. Lamp cover; 73. Slot; 8. Bottom plate; 9. Welding plate. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Example 1

[0029] like Figure 1-4 As shown, the utility model provides a technical solution for a high-brightness LED packaging structure: a high-brightness LED packaging structure, comprising a substrate 1, a heat dissipation component 4 is arranged on the substrate 1, a reflector 6 is arranged inside the substrate 1, and a lampshade 72 is arranged on the substrate 1;

[0030] The heat dissipation component 4 includes a metal plate 41, a fin 42 is fixed to the bottom of the metal plate 41, a second pin groove 43 is opened on the metal plate 41, an insulating plate 44 is arranged on the top of the metal plate 41, and an LED chip 5 is arranged on the metal plate 41. The fin 42 fixed on the metal plate 41 is inserted into the groove 2, and the pins of the LED chip 5 are inserted into the first pin groove 3 and the second pin groove 43, so that the pins of the LED chip 5 can be exposed from the bottom of the substrate 1, so that the pins of the LED chip 5 can be welded on the mainboard, and the insulating plate 44 separates the metal plate 41 from the LED chip 5 to prevent the LED chip 5 from directly contacting the metal plate 41 to affect the LED chip 5, and the fin 42 has a heat dissipation effect on the LED chip 5. Through the reflector 6, the reflector 6 can gather the light generated by the LED chip 5 to generate high brightness, thereby reducing the working temperature of the LED, improving the light efficiency and extending the service life.

[0031] Example 2

[0032] like Figure 1-4As shown, a groove 2 is provided on the substrate 1, and a first pin groove 3 is provided on one side of the substrate 1 close to the groove 2. The fin 42 can be inserted into the groove 2 through the provided groove 2, and the pins of the LED chip 5 can be inserted into the first pin groove 3 through the provided first pin groove 3. The LED chip 5 is arranged on the insulating plate 44, and the fin 42 is inserted into the groove 2. The first pin groove 3 is communicated with the second pin groove 43, and the pins of the LED chip 5 are inserted into the second pin groove 43 and the first pin groove 3. Since the fin 42 is inserted into the groove 2, the bottom of the fin 42 is in contact with the outside, so as to achieve a better heat dissipation effect. Since the first pin groove 3 is communicated with the second pin groove 43, the pins of the LED chip 5 can be exposed from the substrate 1, so that the pins of the LED chip 5 can be soldered to the mainboard. A disassembly component 7 is provided on the substrate 1, and the disassembly component 7 includes a block 71 , a slot 73 is provided on the lampshade 72. After the LED chip 5 is installed in the heat dissipation component 4, the lampshade 72 is covered on the substrate 1. Through the cooperation of the clamping block 71 and the clamping slot 73, the clamping block 71 is clamped in the clamping slot 73, so that the lampshade 72 can be fixed on the substrate 1, and the clamping block 71 is clamped in the clamping slot 73. The clamping block 71 is fixed on the substrate 1. Since the clamping block 71 is clamped in the clamping slot 73 and the clamping block 71 is fixed on the substrate 1, the number of the clamping blocks 71 and the clamping slot 73 are both four, so that the clamping blocks 71 and the clamping slot 73 clamp the surrounding of the lampshade 72 on the substrate 1. A bottom plate 8 is fixed at the bottom of the substrate 1, and a welding plate 9 is fixed on the bottom plate 8. The bottom plate 8 is provided, so that the bottom plate 8 supports and fixes the substrate 1. The welding plate 9 is provided, and the welding plate 9 is made of metal, so that the welding plate 9 can be welded and fixed on the main board, so that the overall structure can be welded and fixed to the main board.

[0033] Working principle:

[0034] like Figure 1-4As shown, first, the operator inserts the fin 42 fixed on the metal plate 41 into the groove 2, and inserts the pins of the LED chip 5 into the first pin groove 3 and the second pin groove 43, so that the pins of the LED chip 5 can be exposed from the bottom of the substrate 1, so that the pins of the LED chip 5 can be soldered on the main board, and the insulating plate 44 separates the metal plate 41 and the LED chip 5 to prevent the LED chip 5 from directly contacting the metal plate 41 to affect the LED chip 5, and the fin 42 plays a heat dissipation role for the LED chip 5. Since the fin 42 is inserted in the groove 2, the bottom of the fin 42 is in contact with the outside, which is more The heat dissipation effect is well achieved. The reflector 6 is set so that the reflector 6 can converge the light generated by the LED chip 5 to generate high brightness, thereby reducing the working temperature of the LED, improving the light efficiency and extending the service life. After the LED chip 5 is installed in the heat dissipation component 4, the lampshade 72 is covered on the substrate 1. Through the cooperation of the clamping block 71 and the clamping slot 73, the clamping block 71 is clamped in the clamping slot 73, so that the lampshade 72 can be fixed on the substrate 1. Through the bottom plate 8, the bottom plate 8 supports and fixes the substrate 1. Through the welding plate 9, the overall structure can be welded and fixed to the main board.

[0035] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A high brightness LED packaging structure, characterized in that: It comprises a substrate (1), a heat dissipation assembly (4) is arranged on the substrate (1), a reflector (6) is arranged inside the substrate (1), and a lampshade (72) is arranged on the substrate (1); The heat dissipation component (4) comprises a metal plate (41), a fin (42) is fixed to the bottom of the metal plate (41), a second pin slot (43) is provided on the metal plate (41), an insulating plate (44) is provided on the top of the metal plate (41), and an LED chip (5) is provided on the metal plate (41).

2. A high brightness LED packaging structure according to claim 1, characterized in that: The substrate (1) is provided with a groove (2), and a first pin groove (3) is provided on a side of the substrate (1) close to the groove (2).

3. A high brightness LED packaging structure according to claim 2, characterized in that: The LED chip (5) is arranged on an insulating plate (44), the fin (42) is inserted into the groove (2), the first pin groove (3) is connected to the second pin groove (43), and the pins of the LED chip (5) are inserted into the second pin groove (43) and the first pin groove (3).

4. The high brightness LED packaging structure according to claim 1, characterized in that: A disassembly assembly (7) is provided on the base plate (1), the disassembly assembly (7) comprises a clamping block (71), and a clamping slot (73) is provided on the lampshade (72).

5. The high brightness LED packaging structure according to claim 4, characterized in that: The card block (71) is engaged in the card slot (73), and the card block (71) is fixed on the base plate (1).

6. The high brightness LED packaging structure according to claim 1, characterized in that: A bottom plate (8) is fixed to the bottom of the base plate (1), and a welding plate (9) is fixed on the bottom plate (8).

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