Dispensing device for semiconductor packaging

Abstract

The utility model discloses a dispensing device for semiconductor packaging, which relates to the field of semiconductor packaging dispensing and comprises a double-station reciprocating dispensing component, and a self-cleaning dispensing dustproof component is arranged on the outer surface of the upper end of the double-station reciprocating dispensing component. According to the glue dispensing device for semiconductor packaging, the double-station reciprocating glue dispensing assembly comprises a driving control base, a sliding glue dispensing support, a glue dispenser, a first feeding plate, a second feeding plate, a threaded driving rod and a semiconductor feeding clamping groove, and alternate feeding, packaging and glue dispensing work is adopted when the glue dispensing device is used; the self-cleaning adhesive dispensing dustproof assembly comprises a protective shell, an air inlet fan, an exhaust fan, a dust filtering net, a plasma dust removal fan, a transparent bin door and a rotating shaft, so that the internal dust removal work can be completed during use, the dust is prevented from adhering to the semiconductor packaging adhesive dispensing position, and the service life of the semiconductor packaging adhesive dispensing device is prolonged. Therefore, the dispensing packaging quality is ensured.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor packaging dispensing production, and particularly relates to a dispensing device for semiconductor packaging. Background Art

[0002] Semiconductor packaging is to mount the cut wafers on the islands of the corresponding substrate holder with glue. When performing dispensing packaging on semiconductors, a dispensing device is required to perform the dispensing work in order to improve production quality and dispensing efficiency.

[0003] The existing dispensing device for semiconductor packaging has certain drawbacks when in use. Firstly, the dispensing efficiency is slow, and secondly, it cannot be cleaned during use. When performing dispensing packaging, dust is easily adhered to its interior, affecting the quality of dispensing packaging.

[0004] Therefore, it is necessary to propose a dispensing device for semiconductor packaging to solve the above problems. Summary of the Utility Model

[0005] The main purpose of the utility model is to provide a dispensing device for semiconductor packaging, which can effectively solve the problems in the background art.

[0006] To achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0007] A dispensing device for semiconductor packaging includes a double-station reciprocating dispensing assembly, and a self-cleaning dispensing dust-proof assembly is arranged on the upper outer surface of the double-station reciprocating dispensing assembly. The double-station reciprocating dispensing assembly includes a drive control base, a sliding dispensing bracket, a dispenser, a first feeding plate, a second feeding plate, a threaded drive rod, and a semiconductor feeding slot. The self-cleaning dispensing dust-proof assembly includes a protective housing, an intake fan, an exhaust fan, a dust filter net, a plasma dust removal fan, a transparent cabin door, and a rotating shaft.

[0008] Preferably, a sliding dispensing bracket is arranged on the upper outer surface of the drive control base, a dispenser is arranged in the middle of the front end of the sliding dispensing bracket, a first feeding plate and a second feeding plate are arranged in the middle of the upper end of the drive control base, the second feeding plate is located on one side of the first feeding plate, a threaded drive rod is arranged between the drive control base and both the first feeding plate and the second feeding plate, and semiconductor feeding slots are arranged in the middle of both the first feeding plate and the second feeding plate.

[0009] Preferably, the upper outer surface of the drive control base is detachably connected to the lower outer surface of the sliding dispensing bracket, and the middle of the front end of the sliding dispensing bracket is movably connected to the middle of the rear end of the dispenser.

[0010] Preferably, the middle parts of the upper ends of the driving control bases are movably connected to the middle parts of the lower ends of the first feeding plate and the second feeding plate through threaded driving rods, and the middle parts of the first feeding plate and the second feeding plate are detachably connected to the outer surface of the lower end of the semiconductor feeding slot.

[0011] Preferably, an intake fan is arranged in the middle of one side of the protective housing, an exhaust fan is arranged in the middle of the other side of the protective housing, dust filter nets are arranged on the inner surfaces around the intake fan and the exhaust fan, a plasma dust removal fan is arranged in the middle of the upper end of the protective housing, transparent cabin doors are arranged on the inner surfaces around the protective housing, and a rotating shaft is arranged between the protective housing and the transparent cabin doors.

[0012] Preferably, the middle part of one side of the protective housing is detachably connected to the outer surface around the intake fan, the middle part of the other side of the protective housing is detachably connected to the outer surface around the exhaust fan, and the inner surfaces around the intake fan and the exhaust fan are detachably connected to the outer surface around the dust filter net.

[0013] Preferably, the middle part of the upper end of the protective housing is detachably connected to the outer surface of the lower end of the plasma dust removal fan, and the inner surface around the protective housing is movably connected to the outer surface of one side of the transparent cabin door through a rotating shaft.

[0014] Preferably, the outer surface of the upper end of the double-station reciprocating dispensing assembly is detachably connected to the outer surface of the lower end of the self-cleaning dispensing dust-proof assembly. Beneficial effects

[0015] Compared with the prior art, the utility model has the following beneficial effects:

[0016] For the dispensing device for semiconductor packaging, by providing the double-station reciprocating dispensing assembly including a driving control base, a sliding dispensing bracket, a dispenser, a first feeding plate, a second feeding plate, a threaded driving rod and a semiconductor feeding slot, the alternate feeding, packaging and dispensing work is adopted during use, thereby improving the efficiency of packaging and dispensing.

[0017] 2. For the dispensing device for semiconductor packaging, by providing the self-cleaning dispensing dust-proof assembly including a protective housing, an intake fan, an exhaust fan, a dust filter net, a plasma dust removal fan, a transparent cabin door and a rotating shaft, the removal of internal dust can be completed during use, thereby preventing dust from adhering to the semiconductor packaging and dispensing positions, and ensuring the quality of dispensing and packaging. Description of the drawings

[0018] Figure 1 It is a schematic diagram of the overall structure of the dispensing device for semiconductor packaging of the utility model;

[0019] Figure 2 For the dispensing device for semiconductor packaging of the utility modelFigure 1 Schematic diagram of the structure of the double-station reciprocating dispensing assembly 1

[0020] Figure 3 A dispensing device for semiconductor packaging according to the present utility model Figure 1 Schematic diagram of the structure of the self-cleaning dispensing dust-proof assembly 2

[0021] In the figure: 1. Double-station reciprocating dispensing assembly; 2. Self-cleaning dispensing dust-proof assembly; 101. Driving control base; 102. Sliding dispensing bracket; 103. Dispenser; 104. First loading plate; 105. Second loading plate; 106. Threaded drive rod; 107. Semiconductor loading slot; 201. Protective housing; 202. Inlet fan; 203. Exhaust fan; 204. Dust filter net; 205. Plasma dust removal fan; 206. Transparent cabin door; 207. Rotating shaft Specific embodiments

[0022] In order to make the technical means, creative features, achieved purposes and effects of the present utility model easy to understand, the present utility model will be further described below in conjunction with specific embodiments

[0023] As Figures 1-3 shown, a dispensing device for semiconductor packaging includes a double-station reciprocating dispensing assembly 1. A self-cleaning dispensing dust-proof assembly 2 is arranged on the outer surface of the upper end of the double-station reciprocating dispensing assembly 1. The double-station reciprocating dispensing assembly 1 includes a driving control base 101, a sliding dispensing bracket 102, a dispenser 103, a first loading plate 104, a second loading plate 105, a threaded drive rod 106 and a semiconductor loading slot 107. The self-cleaning dispensing dust-proof assembly 2 includes a protective housing 201, an inlet fan 202, an exhaust fan 203, a dust filter net 204, a plasma dust removal fan 205, a transparent cabin door 206 and a rotating shaft 207

[0024] It should be noted that the present utility model is a dispensing device for semiconductor packaging. The double-station reciprocating dispensing assembly 1 provided includes a drive control base 101, a sliding dispensing bracket 102, a dispenser 103, a first loading plate 104, a second loading plate 105, a threaded drive rod 106, and a semiconductor loading slot 107. During use, the drive control base 101 alternately drives the first loading plate 104 and the second loading plate 105. First, the drive control base 101 drives the first loading plate 104 to place the semiconductor to be dispensed in the semiconductor loading slot 107 of the first loading plate 104. After placement, the drive control base 101 drives the first loading plate 104 to move the semiconductor to the bottom of the sliding dispensing bracket 102. At the same time, the drive control base 101 drives the second loading plate 105 to extend. After extension, the placement work of the second group of semiconductors is completed. While placing, the dispenser 103 performs the packaging and dispensing work on the semiconductor on the first loading plate 104. After dispensing, the first loading plate 104 extends to complete the removal work of the semiconductor on it. At the same time, the second loading plate 105 moves to the bottom of the sliding dispensing bracket 102 for the dispenser 103 to perform the packaging and dispensing work on the second semiconductor. Repeating the above operations completes the continuous packaging and dispensing work. During use, an alternating loading, packaging, and dispensing work is adopted to improve the efficiency of its packaging and dispensing. The self-cleaning dispensing dust-proof assembly 2 provided includes a protective housing 201, an intake fan 202, an exhaust fan 203, a dust filter 204, a plasma dust removal fan 205, a transparent door 206, and a rotating shaft 207. During use, first, the rotating shaft 207 rotates the transparent door 206 to seal the protective housing 201. After sealing, the plasma dust removal fan 205 ionizes the air and blows the ionized gas towards the semiconductor to blow off the dust on its surface. After blowing off, the intake fan 202 on one side of the protective housing 201 blows the gas containing dust inside the protective housing 201, and the exhaust fan 203 discharges it. During use, the removal work of the internal dust can be completed, thereby avoiding dust sticking to the semiconductor packaging and dispensing position and ensuring the quality of dispensing and packaging.

[0025] The above shows and describes the basic principles, main features, and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. A glue dispensing device for semiconductor packaging, comprising a double-station reciprocating glue dispensing assembly (1), characterized in that: The upper outer surface of the double-station reciprocating glue dispensing component (1) is provided with a self-cleaning glue dispensing dust-proof component (2). The double-station reciprocating glue dispensing component (1) comprises a drive control base (101), a sliding glue dispensing bracket (102), a glue dispenser (103), a No. 1 loading plate (104), a No. 2 loading plate (105), a threaded drive rod (106) and a semiconductor loading slot (107). The self-cleaning glue dispensing dust-proof component (2) comprises a protective housing (201), an air inlet fan (202), an exhaust fan (203), a dust filter (204), a plasma dust removal fan (205), a transparent door (206) and a rotating shaft (207).

2. A semiconductor packaging glue dispensing device according to claim 1, characterized in that: The outer surface of the upper end of the driving control base (101) is provided with a sliding dispensing bracket (102), and a dispensing device (103) is provided in the middle of the front end of the sliding dispensing bracket (102). A first loading plate (104) and a second loading plate (105) are provided in the middle of the upper end of the driving control base (101), and the second loading plate (105) is located on one side of the first loading plate (104). A threaded driving rod (106) is provided between the driving control base (101) and the first loading plate (104) and the second loading plate (105), and a semiconductor loading card slot (107) is provided in the middle of the first loading plate (104) and the second loading plate (105).

3. A semiconductor packaging glue dispensing device according to claim 1, characterized in that: The upper outer surface of the driving control base (101) is detachably connected to the lower outer surface of the sliding dispensing bracket (102), and the front middle portion of the sliding dispensing bracket (102) is movably connected to the rear middle portion of the dispensing device (103).

4. A semiconductor packaging glue dispensing device according to claim 1, characterized in that: The middle part of the upper end of the driving control base (101) is movably connected to the middle parts of the lower ends of the first loading plate (104) and the second loading plate (105) via a threaded driving rod (106), and the middle parts of the first loading plate (104) and the second loading plate (105) are detachably connected to the outer surface of the lower end of the semiconductor loading slot (107).

5. The semiconductor packaging dispensing device according to claim 1, characterized in that: An inlet fan (202) is arranged in the middle of one side of the protective shell (201), an exhaust fan (203) is arranged in the middle of the other side of the protective shell (201), dust filters (204) are arranged on the inner surfaces of the four sides of the inlet fan (202) and the exhaust fan (203), a plasma dust removal fan (205) is arranged in the middle of the upper end of the protective shell (201), a transparent door (206) is arranged on the inner surfaces of the four sides of the protective shell (201), and a rotating shaft (207) is arranged between the protective shell (201) and the transparent door (206).

6. The semiconductor packaging dispensing device according to claim 1, characterized in that: The middle portion of one side of the protective shell (201) is detachably connected to the outer surfaces of the inlet fan (202), the middle portion of the other side of the protective shell (201) is detachably connected to the outer surfaces of the exhaust fan (203), and the inner surfaces of the inlet fan (202) and the exhaust fan (203) are detachably connected to the outer surfaces of the dust filter (204).

7. The semiconductor packaging dispensing device according to claim 1, characterized in that: The middle portion of the upper end of the protective shell (201) is detachably connected to the outer surface of the lower end of the plasma dust removal fan (205), and the inner surface of the protective shell (201) is movably connected to the outer surface of one side of the transparent door (206) via a rotating shaft (207).

8. The semiconductor packaging glue dispensing device according to claim 1, characterized in that: The upper outer surface of the double-station reciprocating glue dispensing component (1) is detachably connected to the lower outer surface of the self-cleaning glue dispensing dust-proof component (2).

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