Anti-oxidation automatic flushing device for electrolytic copper foil

Abstract

The utility model discloses an electrolytic copper foil anti-oxidation automatic flushing device which comprises an anti-oxidation tank body, a submerged roller is arranged in the anti-oxidation tank body, a guide roller and a conductive roller are arranged on the two sides of the top of the anti-oxidation tank body respectively and used for operating copper foil, and a flushing tank body is arranged on the top of the side wall, close to the conductive roller, of the anti-oxidation tank body. An overflow opening is formed in the bottom of the side wall, facing the interior of the anti-oxidation tank body, of the washing tank body, a spraying pipe is arranged in the washing tank body, and spraying pipes are also arranged in the positions, located above and below the submerged roller, in the anti-oxidation tank body. Therefore, impurities adhered to the surface of the conductive roller are successfully cleaned, copper foil cannot be scratched, the chromium plating quality of the conductive roller is greatly improved, chromium plating liquid in the flushing tank flows into the anti-oxidation tank through the overflow port to be collected, the situation that the environment is polluted due to scattering of the chromium plating liquid is avoided, and the device is simple in structural arrangement, efficient and suitable for application and popularization.

Description

Technical Field

[0001] The utility model relates to the technical field of copper foil making machines, and particularly relates to an automatic anti-oxidation flushing device for electrolytic copper foil. Background Technique

[0002] Electrolytic copper foil is an important material for the manufacture of copper clad laminates, printed circuit boards, and lithium-ion batteries.

[0003] A copper foil making machine is used for the production of electrolytic copper foil. In the production of electrolytic copper foil, first, a copper foil is formed on the surface of the cathode roller. After peeling, it enters the anti-oxidation tank through a guide roller for chrome plating, and then passes through an upper liquid roller, an acid squeezing roller, and subsequent drying and flattening processes before being wound into a copper foil master roll and sent to the next processing step. Among them, the anti-oxidation tank coats a layer of anti-oxidation layer on the copper foil, which is an important link in the quality of the copper foil, and the conductive roller is an indispensable component.

[0004] However, before the copper foil enters the anti-oxidation tank for chrome plating operation, since the surface of the copper foil will carry impurities such as copper powder, it will affect the chrome plating quality. Also, since the conductive roller is always in contact with the just-chrome-plated copper foil during the electroplating process in the anti-oxidation tank, some impurities brought by the copper foil will adhere to the surface of the upper liquid roller, and the smoothness of the surface of the upper liquid roller will be greatly affected. As a result, the copper foil passing through the upper liquid roller will be locally scratched, and further affect the quality of the copper foil, resulting in a low yield. Therefore, an automatic anti-oxidation flushing device for electrolytic copper foil is proposed. Content of the Utility Model

[0005] The purpose of the utility model is to provide an automatic anti-oxidation flushing device for electrolytic copper foil to solve the problems that the chrome plating quality of the copper foil is low due to the copper powder carried on the surface of the copper foil and the copper foil is scratched due to the impurities adhered to the conductive roller, resulting in a reduction in the chrome plating quality of the copper foil as mentioned in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: an automatic anti-oxidation flushing device for electrolytic copper foil, including an anti-oxidation tank body, an under-liquid roller is arranged inside the anti-oxidation tank body, guide rollers and conductive rollers are respectively arranged on both sides of the top of the anti-oxidation tank body for running the copper foil, a flushing tank body is arranged on the top of the side wall of the anti-oxidation tank body close to the conductive roller, and an overflow port is opened at the bottom of the side wall of the flushing tank body facing the inside of the anti-oxidation tank body;

[0007] A spray pipe is arranged inside the flushing tank body, and spray pipes are also arranged above and below the under-liquid roller inside the anti-oxidation tank body;

[0008] A number of spray nozzles are opened on the spray pipe;

[0009] The spray nozzles opened on the spray pipe located inside the rinsing tank body face the conductive roller, the spray nozzles opened on the spray pipe located above the submerged roller face one side of the copper foil, and the spray nozzles opened on the spray pipe located below the submerged roller face the other side of the copper foil.

[0010] Preferably: a liquid leakage port is opened on the bottom surface of the anti-oxidation tank body, the spray pipes located inside the rinsing tank body extend out of the side wall of the rinsing tank body, and the spray pipes located inside the anti-oxidation tank body all extend out of the side wall of the anti-oxidation tank body.

[0011] Preferably: the top area of the rinsing tank body is larger than its bottom area, the top surface of the rinsing tank body is open, and the lower part of the roller surface of the conductive roller is located inside the rinsing tank body.

[0012] Preferably: a circulation assembly is provided at the bottom of the anti-oxidation tank body;

[0013] The circulation assembly includes an addition tank, a cross plate is fixedly connected to the top of the addition tank, and a bottom pipe is arranged between the cross plate and the liquid leakage port;

[0014] A pump body is arranged inside the addition tank, and the output end of the pump body is connected to the port of the spray pipe through a connecting pipe.

[0015] Preferably: a filter column frame is arranged at the bottom surface of the cross plate at the position of the bottom pipe.

[0016] Preferably: both sides of the top surface of the addition tank are fixedly connected to the bottom surface of the anti-oxidation tank body through connecting plates.

[0017] Compared with the prior art, the beneficial effects of the present utility model are:

[0018] 1. This device utilizes the chromium plating solution to be sprayed onto the conductive roller through the spray pipe and the spray nozzles, thus successfully realizing the cleaning of impurities adhered to the surface of the conductive roller, so that the copper foil will not be scratched, and the quality of chromium plating is greatly improved. The chromium plating solution in the rinsing tank body flows into the anti-oxidation tank body through the overflow port and is collected, avoiding the pollution of the environment caused by the scattering of the chromium plating solution, making the rinsing process more environmentally friendly, with a simple and efficient structure setting, and is suitable for popularization and use.

[0019] 2. This device utilizes the spray pipes located above and below the submerged roller to spray towards the copper foil, which is not only used to inject the chromium plating solution into the anti-oxidation tank body to submerge the submerged roller and immerse the copper foil, but also used to flush and clean impurities such as copper powder on the surface of the copper foil, improving the chromium plating quality of the copper foil. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is the overall structure view of the present utility model;

[0021] Figure 2Schematic half-sectional view of the present utility model;

[0022] Figure 3 Schematic structural view of the spray pipe in the present utility model;

[0023] Figure 4 Schematic structural view of the circulation assembly in the present utility model;

[0024] Figure 5 Schematic structural view of the addition tank in the present utility model.

[0025] In the figure: 1. Anti-oxidation tank body; 101. Guide roller; 102. Conductive roller; 103. Copper foil; 104. Submerged roller; 105. Liquid leakage port; 106. Mechanical seal; 107. Bottom pipe; 2. Flushing tank body; 201. Overflow port; 3. Spray pipe; 301. Spray orifice; 4. Connecting pipe; 5. Addition tank; 501. Filter column frame; 502. Horizontal plate; 503. Connecting plate; 6. Pump body. Specific embodiments

[0026] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0027] Refer to Figures 1-5 As shown, the present utility model provides a technical solution for an automatic flushing device for preventing oxidation of electrolytic copper foil:

[0028] Refer to Figure 1 And Figure 2 As shown, an automatic flushing device for preventing oxidation of electrolytic copper foil includes an anti-oxidation tank body 1 with an open top surface. A submerged roller 104 is arranged inside the anti-oxidation tank body 1. A guide roller 101 and a conductive roller 102 are respectively arranged on both sides of the top of the anti-oxidation tank body 1 for running the copper foil 103. Among them, a mechanical seal 106 is arranged at the connection between the submerged roller 104 and the anti-oxidation tank body 1 to prevent the chromium plating solution inside the anti-oxidation tank body 1 from leaking out. A flushing tank body 2 is arranged at the top of one side wall of the anti-oxidation tank body 1 close to the conductive roller 102, and an overflow port 201 is opened at the bottom of the side wall of the flushing tank body 2 facing the inside of the anti-oxidation tank body 1.

[0029] Among them, a spray pipe 3 is arranged inside the flushing tank body 2, and spray pipes 3 are also arranged above and below the submerged roller 104 inside the anti-oxidation tank body 1. Refer to Figure 3 As shown, a plurality of spray orifices 301 are opened on the spray pipe 3.

[0030] It should be noted that, with reference to Figure 2 the arrow direction at the spray pipe 3 in , the spray openings 301 formed on the spray pipe 3 inside the rinsing tank body 2 face the conductive roller 102, the spray openings 301 formed on the spray pipe 3 above the submerged roller 104 face one side of the copper foil 103, and the spray openings 301 formed on the spray pipe 3 below the submerged roller 104 face the other side of the copper foil 103.

[0031] Among them, a liquid leakage port 105 is formed on the bottom surface of the anti-oxidation tank body 1, the spray pipe 3 inside the rinsing tank body 2 extends out of the side wall of the rinsing tank body 2, and the spray pipes 3 inside the anti-oxidation tank body 1 all extend out of the side wall of the anti-oxidation tank body 1. The setting of the liquid leakage port 105 facilitates the discharge of the chromium plating solution inside the anti-oxidation tank body 1.

[0032] With reference to Figure 1 and Figure 2 as shown in , the top area of the rinsing tank body 2 is larger than its bottom area, the top surface of the rinsing tank body 2 is open, and the lower part of the roller surface of the conductive roller 102 is located inside the rinsing tank body 2, so that when the spray pipe 3 inside the rinsing tank body 2 sprays the chromium plating solution, it is not easy to scatter outside the rinsing tank body 2, and the chromium plating solution is more accurately sprayed on the conductive roller 102, further improving the rinsing efficiency of the device.

[0033] Through the settings of the rinsing tank body 2, the spray pipe 3, the overflow port 201, etc., the chromium plating solution is sprayed onto the conductive roller 102 through the spray pipe 3 and the spray openings 301, thereby successfully realizing the cleaning of the impurities adhered to the surface of the conductive roller 102, so that the copper foil 103 will not be scratched, and the chromium plating quality thereof is greatly improved. The chromium plating solution in the rinsing tank body 2 flows into the anti-oxidation tank body 1 through the overflow port 201 and is collected, avoiding the pollution of the environment caused by the scattering of the chromium plating solution, making the rinsing process more environmentally friendly, with a simple and efficient structural setting, and being suitable for popularization and use.

[0034] Through the settings of the two spray pipes 3 inside the anti-oxidation tank body 1, when the device starts to chromium plate the copper foil 103, only the chromium plating solution needs to be sprayed into the anti-oxidation tank body 1 through the spray pipe 3. Since the spray pipes 3 above and below the submerged roller 104 spray towards the copper foil 103, it is not only used to inject the chromium plating solution into the anti-oxidation tank body 1 to submerge the submerged roller 104 and immerse the copper foil 103, but also used to wash and clean the impurities such as copper powder on the surface of the copper foil 103, so that the chromium plating quality of the copper foil 103 is improved. It should be noted that the spray pipe 3 below the submerged roller 104 will be submerged by the chromium plating solution during the chromium plating process because there are fewer copper powder impurities on the back of the copper foil 103 and direct spraying is not required. After the copper foil 103 is immersed in the chromium plating solution, the spray pipe 3 below the submerged roller 104 only needs to cause slight liquid disturbance to the back of the copper foil 103 to sweep away the attached copper powder and other impurities.

[0035] Refer to Figure 4 and Figure 5 As shown, a circulation component is provided at the bottom of the anti-oxidation tank body 1. Among them, the circulation component includes an addition tank 5. A cross plate 502 is fixedly connected to the top of the addition tank 5. A bottom pipe 107 is provided between the cross plate 502 and the liquid leakage port 105. It should be added that a pump body 6 is provided inside the addition tank 5. The output end of the pump body 6 is connected to the port of the spray pipe 3 through a connecting pipe 4. A filter column frame 501 is provided at the bottom surface of the cross plate 502 at the position of the bottom pipe 107, which is used to filter impurities in the chromium plating solution passing through the bottom pipe 107 for convenient recycling. Both sides of the top surface of the addition tank 5 are fixedly connected to the bottom surface of the anti-oxidation tank body 1 through connecting plates 503.

[0036] When using this device to perform chromium plating operation on the copper foil 103, only need to add chromium plating solution into the addition tank 5 and start the pump body 6, then the chromium plating solution can be transported into the spray pipe 3 through the connecting pipe 4, and input into the anti-oxidation tank body 1 through the spray port 301, and return to the addition tank 5 through the liquid leakage port 105 and the bottom pipe 107. When the speed of the chromium plating solution pumped into the anti-oxidation tank body 1 is greater than the speed of the reflux from the liquid leakage port 105, the chromium plating solution will accumulate in the anti-oxidation tank body 1. At this time, reduce the output power of the pump body 6 to maintain an appropriate liquid level of the chromium plating solution in the anti-oxidation tank body 1. Control the copper foil 103 to start running. This is the prior art and will not be elaborated here. The spray pipe 3 sprays the chromium plating solution on the conductive roller 102 and the copper foil 103. The chromium plating solution in the rinsing tank 2 will flow into the anti-oxidation tank body 1 along the overflow port 201. Since the conductive roller 102 is always rotating, it not only realizes the rinsing and cleaning of the impurities attached to the conductive roller 102, but also avoids the scattering of the chromium plating solution. The copper foil 103 entering the anti-oxidation tank body 1 through the guide roller 101 is mainly flushed by the front of the spray pipe 3 located above the submerged roller 104. After the attachments such as more copper powder on the front of the copper foil 103 are cleaned, it is dyed by the chromium plating solution in the anti-oxidation tank body 1 to complete the chromium plating operation, and enters the next process through the conductive roller 103.

[0037] The chromium plating solution refluxed from the bottom pipe 107 is filtered by the filter column frame 107 and then pumped out again by the pump body 6. It can not only make full use of the chromium plating solution, but also reduce the impurities in the chromium plating solution in the anti-oxidation tank 1, thereby improving the chromium plating quality.

[0038] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An anti-oxidation automatic flushing device for electrolytic copper foil, comprising an anti-oxidation tank body (1), wherein a submerged roller (104) is arranged inside the anti-oxidation tank body (1), and guide rollers (101) and conductive rollers (102) are arranged on both sides of the top of the anti-oxidation tank body (1) for running copper foil (103), characterized in that: A flushing tank body (2) is arranged at the top of a side wall of the anti-oxidation tank body (1) close to the conductive roller (102), and an overflow port (201) is provided at the bottom of the side wall of the flushing tank body (2) facing the inside of the anti-oxidation tank body (1); The flushing tank body (2) is provided with a spray pipe (3) inside, and the anti-oxidation tank body (1) is also provided with spray pipes (3) above and below the submerged roller (104); The spray pipe (3) is provided with a plurality of spray ports (301); The spray port (301) provided on the spray pipe (3) located inside the flushing tank (2) faces the conductive roller (102), the spray port (301) provided on the spray pipe (3) located above the submerged roller (104) faces one side of the copper foil (103), and the spray port (301) provided on the spray pipe (3) located below the submerged roller (104) faces the other side of the copper foil (103).

2. The electrolytic copper foil anti-oxidation automatic flushing device according to claim 1, characterized in that: The bottom surface of the anti-oxidation tank body (1) is provided with a liquid leakage port (105), the spray pipe (3) located inside the flushing tank body (2) extends out of the side wall of the flushing tank body (2), and the spray pipes (3) located inside the anti-oxidation tank body (1) extend out of the side wall of the anti-oxidation tank body (1).

3. The electrolytic copper foil anti-oxidation automatic flushing device according to claim 1, characterized in that: The top area of ​​the flushing trough body (2) is larger than the bottom area thereof; the top surface of the flushing trough body (2) is open; and the lower part of the roller surface of the conductive roller (102) is located inside the flushing trough body (2).

4. The electrolytic copper foil anti-oxidation automatic flushing device according to claim 2, characterized in that: A circulation component is provided at the bottom of the anti-oxidation tank body (1); The circulation assembly comprises an addition tank (5), a transverse plate (502) is fixedly connected to the top of the addition tank (5), and a bottom pipe (107) is arranged between the transverse plate (502) and the liquid leakage port (105); A pump body (6) is arranged inside the adding tank (5), and the output end of the pump body (6) is connected to the port of the spray pipe (3) through a connecting pipe (4).

5. The electrolytic copper foil anti-oxidation automatic washing device according to claim 4, characterized in that: A filter column frame (501) is provided on the bottom surface of the transverse plate (502) at the bottom tube (107).

6. The electrolytic copper foil anti-oxidation automatic washing device according to claim 5, characterized in that: Both sides of the top surface of the adding tank (5) are fixedly connected to the bottom surface of the anti-oxidation tank body (1) via connecting plates (503).

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