Carrier

Abstract

The utility model provides a carrier, and relates to the technical field of semiconductor detection, the carrier comprises a carrier plate, a frame and a pressing plate which are stacked in sequence, a plurality of accommodating grooves are formed in the carrier plate, a plurality of device structures are arranged on the frame, the plurality of accommodating grooves are used for accommodating the plurality of device structures for limiting, and the device structures are used for arranging chips. When the carrier is used for being matched with the tester to detect the binding force of the chip, the push broach of the tester pushes the chip, the chip is stripped from the device structure, and the accommodating groove plays a role in limiting the device structure, so that forces acting on the device structure in different directions can be better converted and absorbed; the device structure can be effectively prevented from being deformed due to the force of pushing the chip by the push broach, meanwhile, the chip binding force read by the tester can be ensured to be real and effective data, and the detection accuracy is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor detection technology, and specifically relates to a carrier. Background Art

[0002] When performing a lossy detection of the bonding force of a DB chip, generally, a carrier plate is used to load a frame. After being attached to a pressure plate, it is pressed by a certain spring force. The push knife of a multi-functional shear force tester is pushed uniformly against the side of the chip, so that the chip is peeled off from the frame base island, thereby judging the strength of the welding joint surface between the chip and the frame base island; alternatively, the side of the chip can also be manually pushed to judge the strength of the welding joint surface between the chip and the frame base island.

[0003] When the bonding force strength between the chip and the frame base island ≤ 600 g, the copper frame substrate is subjected to less force and has less deformation; when the chip bonding force strength > 600 g, the copper frame substrate is subjected to greater force and the plastic deformation amount of the material is larger, seriously damaging the authenticity of the chip bonding force strength data; it cannot well reflect the process capability of the product. When manually testing, manually pushing the side of the chip can only qualitatively judge, and cannot quantitatively judge the bonding force strength between the chip and the frame base island. Utility Model Content

[0004] The purpose of the embodiment of this application is to provide a carrier that can accurately obtain chip bonding force detection data.

[0005] On the one hand, the embodiment of this application provides a carrier, including a carrier plate, a frame, and a pressure plate stacked in sequence. A plurality of accommodation grooves are formed on the carrier plate, and a plurality of device structures are arranged on the frame. The plurality of accommodation grooves are used to respectively accommodate the plurality of device structures for positioning, and the device structures are used to set chips.

[0006] Optionally, the accommodation grooves include a first accommodation groove and a second accommodation groove, the device structures include base islands and pins, the plurality of first accommodation grooves are used to respectively accommodate the plurality of base islands, the plurality of second accommodation grooves are used to respectively accommodate the plurality of pins, and the chip is welded to the base island.

[0007] Optionally, the depth of the accommodation groove is at least equal to 90% of the thickness of the frame.

[0008] Optionally, the gap between the groove wall of the accommodation groove and the corresponding side wall of the device structure is less than ±0.02 mm.

[0009] Optionally, a plurality of protruding structures protruding from the surface of the carrier plate are formed on the carrier plate, and adjacent two of the protruding structures are arranged at intervals, and the accommodation grooves are formed in the interval area between adjacent two of the protruding structures.

[0010] Optionally, a plurality of the convex structures are arranged to form a rectangle. The frame includes two oppositely arranged frame edges. A plurality of the device structures are located between the two frames. The two frame edges are clamped outside the rectangle formed by the plurality of convex structures, and the plurality of device structures are correspondingly clamped in the accommodating grooves.

[0011] Optionally, the pressing plate forms a hollowed-out area. The pressing plate is pressed against the frame, and the device structure is exposed through the hollowed-out area.

[0012] Optionally, an anti-corrosion layer is provided on the surface of the frame.

[0013] Optionally, the material of the frame includes metal.

[0014] In the carrier provided by the embodiment of the present application, the carrier board, the frame, and the pressing plate are stacked in sequence. A plurality of accommodating grooves are formed on the carrier board, and a plurality of device structures are correspondingly provided on the frame. The accommodating grooves are used to accommodate the device structures to limit the device structures, and the device structures are used to set the chips. When the carrier is used to cooperate with a tester to detect the chip bonding force, the pushing blade of the tester pushes the chip, and the chip is peeled off from the device structure. The accommodating grooves play a role in limiting the device structure, so that the forces acting on the device structure in different directions can be better converted and absorbed. It can effectively ensure that the device structure does not deform due to the force of the pushing blade pushing the chip. At the same time, it can also ensure that the chip bonding force read by the tester is real and effective data, improving the accuracy of the detection. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments of the present application. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0016] Figure 1 is a schematic structural diagram of the carrier provided in this embodiment;

[0017] Figure 2 is a schematic structural diagram of the frame of the carrier provided in this embodiment;

[0018] Figure 3 is an exploded view of the carrier provided in this embodiment;

[0019] Figure 4 is one of the pin force analysis diagrams of the carrier provided in this embodiment;

[0020] Figure 5 is the second pin force analysis diagram of the carrier provided in this embodiment;

[0021] Figure 6 It is the force analysis diagram of the base island of the vehicle provided by this embodiment. Detailed implementation manners

[0022] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application.

[0023] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "inside", "outside", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship when the product of this application is usually placed. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application. In addition, terms such as "first", "second", etc. are only used for distinguishing descriptions, and cannot be understood as indicating or implying relative importance.

[0024] It should also be noted that unless otherwise clearly specified and limited, the terms "set", "connect" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0025] In the current detection technology, the SOD series of chips use a multi-functional shear force tester to detect the bonding force of chip 1. Since the thickness of the copper frame base material is 0.11 mm, the pin width is 0.3 mm, and the pin length is 1.06 mm, which are theoretical data; when the chip bonding force strength ≤ 600 g, the forces on the copper frame base material in the two directions of F1 or F2 are small, the deformation amount is small, and the ability to resist bending and deformation is weak; when the chip bonding force strength > 600 g, the forces on the copper frame base material in the two directions of F1 or F2 are large, the plastic deformation amount of the material is large, seriously damaging the authenticity of the chip bonding force strength data; it cannot well reflect the manufacturing process ability of the product.

[0026] When using manual pushing of the chip for testing, similarly, due to the thickness of the copper frame base material being 0.11 mm, the ability to resist bending and deformation is weak. For products with a relatively high bonding force strength, when manually pushing the side of the chip, only qualitative judgment can be made, and quantitative judgment cannot be made.

[0027] To solve the above problems, the embodiment of the present application provides a vehicle. A high-precision accommodation groove is processed on the carrier plate 4, so that the base island 2a and the pins 2b of the frame 2 are embedded in the accommodation groove; the pressure plate 3 has a high-precision window design, so that the pressing surface completely presses the base island 2a and the pin 2b surfaces of the frame 2; thereby avoiding the plastic deformation of the frame 2 base material and obtaining accurate chip 1 bonding force detection data.

[0028] Specifically, please refer to Figure 1 and Figure 3 As shown, the vehicle provided by the embodiment of the present application includes: a carrier plate 4, a frame 2, and a pressing plate 3 stacked in sequence. A plurality of accommodating grooves are formed on the carrier plate 4, and a plurality of device structures are provided on the frame 2. The plurality of accommodating grooves are respectively used to accommodate the plurality of device structures for limiting, and the device structures are used to arrange the chip 1.

[0029] The frame 2 is located on the carrier plate 4, and the pressing plate 3 presses and fixes the frame 2; a plurality of accommodating grooves arranged in an array are provided on the carrier plate 4, and correspondingly, a plurality of device structures are provided on the frame 2. One device structure corresponds to one accommodating groove; the device structure is arranged in the accommodating groove, and the accommodating groove can limit the device structure. Exemplarily, in the present application, the device structure includes a base island 2a and a lead 2b.

[0030] The chip 1 is welded on the device structure. Specifically, the chip 1 is welded on the base island 2a; when used for the tester to detect the bonding force of the chip 1, the whole vehicle is moved into the tester, and the push knife of the tester pushes the chip 1, so that the chip 1 is peeled off from the base island 2a. Due to the limitation of the accommodating groove on the base island 2a and the lead 2b, the forces acting on the lead 2b and the base island 2a in different directions can be better converted and absorbed, so that the lead 2b and the base island 2a do not deform; the bonding force of the chip 1 read by the tester is real and effective data.

[0031] Therefore, for the vehicle provided by the embodiment of the present application, the carrier plate 4, the frame 2, and the pressing plate 3 are stacked in sequence. A plurality of accommodating grooves are formed on the carrier plate 4, and a plurality of corresponding device structures are provided on the frame 2. The accommodating grooves are used to accommodate the device structures to limit the device structures, and the device structures are used to arrange the chip 1. When the vehicle is used to cooperate with the tester to detect the bonding force of the chip 1, the push knife of the tester pushes the chip 1, and the chip 1 is peeled off from the device structure. The accommodating groove plays a role in limiting the device structure, so that the forces acting on the device structure in different directions can be better converted and absorbed, which can effectively ensure that the device structure does not deform due to the force of the push knife pushing the chip 1, and at the same time, it can also ensure that the bonding force of the chip 1 read by the tester is real and effective data, improving the detection accuracy.

[0032] Further, it is mentioned above that the device structure includes a base island 2a and a lead 2b. Correspondingly, the accommodating groove includes a first accommodating groove 4a and a second accommodating groove 4b. The plurality of first accommodating grooves 4a are respectively used to accommodate the plurality of base islands 2a, and the plurality of second accommodating grooves 4b are respectively used to accommodate the plurality of leads 2b. The chip 1 is welded to the base island 2a.

[0033] Exemplarily, in the present application, multiple base islands 2a are arranged side by side in the center of the vehicle, and the pins 2b are located on one side of the base islands 2a. The base islands 2a are accommodated in the first accommodation grooves 4a, and the pins 2b are accommodated in the second accommodation grooves 4b. Therefore, the arrangement rules of the first accommodation grooves 4a and the second accommodation grooves 4b on the carrier board 4 correspond to the arrangement rules of the base islands 2a and the pins 2b on the frame 2.

[0034] Moreover, in order to ensure that the accommodation grooves can stably accommodate the corresponding base islands 2a and pins 2b, the depth of the accommodation grooves is at least equal to 90% of the thickness of the frame 2, so that only a small part of the base islands 2a and pins 2b protrudes from the accommodation grooves, which can improve the limiting degree of the accommodation grooves for the base islands 2a and pins 2b.

[0035] Similarly, the gap between the groove wall of the accommodation groove and the corresponding side wall of the device structure is less than ±0.02 mm, ensuring that the gap between the base islands 2a and pins 2b and the corresponding accommodation grooves is as small as possible, further ensuring that the accommodation grooves stably accommodate the base islands 2a and pins 2b, and at the same time ensuring the stability of the frame 2 and preventing the frame 2 from shaking.

[0036] For the carrier board 4, please refer to Figure 3 As shown, a plurality of protruding structures 4c protruding from the surface of the carrier board 4 are formed on the carrier board 4. Adjacent two protruding structures 4c are arranged at intervals, and the accommodation grooves are formed in the interval area between adjacent two protruding structures 4c.

[0037] The carrier board 4 is a flat plate body, and an array formed by a plurality of protruding structures 4c is formed on its upper surface. The protruding structures 4c protrude from the upper surface of the carrier board 4, and due to the interval arrangement of adjacent two protruding structures 4c, a recessed area can be formed between adjacent protruding structures 4c, and this area is the accommodation groove. The shape and position of the accommodation groove are set according to the shape and position of the base islands 2a and pins 2b to be accommodated.

[0038] In addition, a plurality of protruding structures 4c are arranged to form a rectangle. As Figure 2 shown, the frame 2 includes two relatively arranged frame edges 2c. A plurality of device structures are located between the two frames 2. The two frame edges 2c are clamped outside the rectangle formed by the plurality of protruding structures 4c, and the plurality of device structures are correspondingly clamped in the accommodation grooves.

[0039] The whole frame 2 is adapted to the array formed by the protruding structures 4c on the carrier board 4. The frame edges 2c on both sides of the frame 2 are clamped on both sides of the rectangular array of protruding structures 4c for initial positioning, and the base islands 2a and pins 2b on the frame 2 are clamped into the corresponding accommodation grooves to complete the limiting.

[0040] As Figure 3As shown, a pressing plate 3 is provided on the frame 2. The pressing plate 3 forms a hollowed-out area. The pressing plate 3 is pressed against the frame 2 so that the frame 2 is stably fixed. The device structure is exposed through the hollowed-out area, so that the chip 1 can be set on the base island 2a to facilitate the subsequent smooth pushing of the chip 1.

[0041] Since the chip 1 is set on the base island 2a, in order to maintain the cleanliness of the chip 1, an anti-corrosion layer needs to be set on the surface of the frame 2 to prevent the frame 2 from being corroded and contaminating the chip 1.

[0042] At the same time, in order to further ensure that the base island 2a and the pins 2b on the frame 2 do not deform during the test of the chip 1, the material of the frame 2 includes metal, and a frame 2 with better rigidity and better strength is also required to ensure that the frame 2 is not easily deformed in terms of material.

[0043] The carrier provided by the embodiment of the present application has the following process steps:

[0044] Step 1: According to the local array of the frame 2, a receiving groove is made on the plane of the carrier board 4 by using a carving machine engraving process. The depth of the receiving groove is 90% of the thickness of the frame 2 to ensure that the frame 2 is tightly pressed; the gap of the width of the receiving groove is <±0.02 mm to ensure that the frame 2 cannot shake left and right;

[0045] Step 2: Load the frame 2 onto the plane of the carrier board 4, move it into the workbench of the thrust tester, and install the pressing plate 3; confirm that the base island 2a of the frame 2 is in place, without protrusions and virtual position shaking;

[0046] Step 3: The pushing blade of the tester pushes the chip 1 so that the chip 1 is peeled off from the base island 2a. The forces acting on the pins 2b and the base island 2a in different directions can be better converted and absorbed, so that the pins 2b and the base island 2a do not deform; the bonding force of the chip 1 read by the thrust tester is real and effective data.

[0047] The carrier provided by the embodiment of the present application, through the provision of a receiving groove on the carrier board 4, after the pins 2b and the base island 2a of the frame 2 fall into the receiving groove of the carrier board 4, the sides of the pins 2b and the base island 2a are limited and protected by the receiving groove. The force transmitted from the pushing blade of the tester is effectively released to the carrier, thus avoiding the deformation of the pins 2b and the base island 2a of the frame 2.

[0048] Figure 4 Two directions of the force F1 or F2 in the width direction of the pin 2b part are shown, and are Figure 5 The reverse force F11 or F12 of the side wall of the carrier acupoint (the second receiving groove 4b) acts in the reverse direction and is offset; in the length direction of the pin 2b part, the forces F3 and F4 in the up and down directions are also received; Figure 6The force directions F1 or F2 on the base island 2a are shown, and the reverse forces F11 or F12 on the side walls of the vehicle acupoints (the first accommodating groove 4a) are counteracted by the reverse action; due to the vehicle provided in the embodiment of the present application, the anti-deformation strength of the side wall of the vehicle accommodating groove ≥ 2.5 kg / Unit. When the frame 2 is made of copper, the anti-bending deformation force of the copper ≤ 600 g / Unit; the lifting capacity > 4 times; during the test, the operation is simple, the data of the thrust of the chip 1 is accurate, which is helpful for the SPC process capability analysis, and at the same time, the quality risk is avoided.

[0049] Moreover, multiple different types of accommodating grooves are provided on the carrier plate 4, which can be applicable to the situations of multiple production line packaging types and multiple types of frames 2. It can comprehensively solve the deformation of the frame 2 while ensuring the compatibility, universality and rapid switching of different frames 2; the vehicle accommodating groove needs to meet the rapid picking and placing and positioning of the frame 2, the frame 2 does not adhere to the accommodating groove, the frame 2 does not deform, and the non-detected chip 1 cannot be damaged; at the same time, the gaps between the pins 2b of the frame 2 and the base island 2a in the accommodating groove should be as small as possible to reduce the attenuation of the bonding force of the chip 1.

[0050] The above are only the embodiments of the present application and are not used to limit the protection scope of the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A carrier, characterized in that: include: A carrier plate, a frame and a pressure plate are stacked in sequence, a plurality of accommodating grooves are formed on the carrier plate, a plurality of device structures are arranged on the frame, the plurality of accommodating grooves are used to respectively accommodate the plurality of device structures for limiting positions, and the device structures are used to set chips.

2. The carrier according to claim 1, characterized in that: The containing grooves include a first containing groove and a second containing groove, the device structure includes a base island and pins, the plurality of the first containing grooves are used to respectively contain the plurality of the base islands, the plurality of the second containing grooves are used to respectively contain the plurality of pins, and the chip is welded to the base island.

3. The carrier according to claim 1, characterized in that: The depth of the receiving groove is at least equal to 90% of the thickness of the frame.

4. The carrier according to claim 1, characterized in that: The gap between the groove wall of the accommodating groove and the corresponding side wall of the device structure is less than ±0.02 mm.

5. The carrier according to any one of claims 1 to 4, characterized in that: The carrier plate is formed with a plurality of protruding structures protruding from the surface of the carrier plate, two adjacent protruding structures are arranged at intervals, and the receiving groove is formed in the interval area between two adjacent protruding structures.

6. The carrier according to claim 5, characterized in that: The plurality of protruding structures are arranged to form a rectangle, the frame includes two oppositely disposed frame edges, the plurality of device structures are located between the two frames, the two frame edges are engaged with the outside of the rectangle formed by the plurality of protruding structures, and the plurality of device structures are correspondingly engaged in the accommodating grooves.

7. The carrier according to claim 5, characterized in that: The pressing plate forms a hollow area, the pressing plate is pressed onto the frame, and the device structure is exposed through the hollow area.

8. The carrier according to any one of claims 1 to 4, characterized in that: An anti-corrosion layer is arranged on the surface of the frame.

9. The carrier according to any one of claims 1 to 4, characterized in that: The material of the frame includes metal.

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