Turnover marking mechanism and marking machine

Abstract

The utility model discloses a turnover marking mechanism and a marking machine. And the turnover marking mechanism is used for turnover and marking of the chip. The marking mechanism comprises a marking part and an overturning part. And the marking part is used for marking the chip. In the first direction, the overturning part is arranged on the downstream portion of the marking part, the overturning part comprises a connecting assembly and an overturning assembly, the connecting assembly comprises a conveying piece, the conveying piece is used for bearing the chip, the overturning assembly is connected with the conveying piece, and the overturning assembly is configured to be capable of driving the conveying piece to overturn by 180 degrees. After one surface of the chip is marked by the marking part, the chip can be overturned through the overturning part, so that the other surface of the chip can be marked by the marking part, the chip marking speed is increased, the chip overturning automation is improved, and the production efficiency is improved.

Description

Technical Field

[0001] This application relates to the technical field of chip marking, and particularly to a flipable marking mechanism and a marking machine. Background Art

[0002] A marking machine can mark different types of chips, thereby improving the aesthetics and recognition of the chips.

[0003] CN115781034A discloses an array-type chip marking machine, including a conveyor belt and a laser marking machine. Two laser marking machines are symmetrically arranged on the conveyor belt bracket. The two laser marking machines are respectively located on the brackets on both sides of the conveyor belt. The marking machine also includes a plurality of cleaning mechanisms. A first mounting frame is erected and installed on the conveyor belt bracket. The cleaning mechanism is installed on the first mounting frame. The cleaning mechanism is connected to the conveyor belt bracket. The cleaning mechanism is used to temporarily fix and clean the chips conveyed on the conveyor belt. Through the above technical solution, the problem in the prior art that when there are impurities such as dust on the surface of the chip, it is easy to cause the laser to be covered by the dust when irradiating the chip, resulting in defects in chip marking, making the imprint on the surface of the marked chip unclear and unable to be normally packaged and sold is solved.

[0004] However, the marking machine in the above solution can only mark one surface of the chip. If it is necessary to mark two surfaces of the chip, after flipping the surface of the chip, a marking process needs to be carried out again, and its marking efficiency is low. Therefore, how to achieve rapid marking of chips is one of the problems that need to be solved urgently at present. Utility Model Content

[0005] This application aims to solve at least one of the technical problems existing in the prior art. For this reason, the first aspect embodiment of this application proposes a flipable marking mechanism and a marking machine, which can rapidly mark chips and improve production efficiency.

[0006] A flipable marking mechanism according to the first aspect embodiment of this application is used for flipping and marking chips. The marking mechanism includes a marking part and a flipping part. The marking part is used for marking chips. Along the first direction, the flipping part is arranged downstream of the marking part. The flipping part includes a connecting component and a flipping component. The connecting component includes a conveying member, and the conveying member is used for carrying the chips. The flipping component is connected to the conveying member, and the flipping component is configured to be able to drive the conveying member to flip 180°.

[0007] A flipable marking mechanism according to an embodiment of the present application can flip a chip through a flipping part after the marking part marks one surface of the chip, so that the marking part can mark the other surface of the chip, improving the speed of chip marking and the automation of chip flipping, and improving production efficiency.

[0008] In some embodiments, the flipping assembly includes a rotating plate and a first power member. The conveying member is disposed on the rotating plate, and the first power member is connected to the rotating plate to drive the rotating plate to rotate around a second direction. The first direction, the second direction, and the thickness direction of the chip are perpendicular to each other in pairs.

[0009] In some embodiments, the first power member includes a driving motor and a speed reducer, and the driving motor, the speed reducer, and the rotating plate are connected in sequence.

[0010] In some embodiments, the number of the conveying members is two, and the two conveying members are oppositely disposed along the second direction for respectively carrying two ends of the chip in the second direction. The number of the rotating plates is two, and the two rotating plates are correspondingly connected to the two conveying members.

[0011] In some embodiments, the flipping assembly further includes an adjusting member, and the adjusting member is connected to at least one of the rotating plates, and the adjusting member can drive the rotating plate to move along the second direction.

[0012] In some embodiments, the connecting assembly further includes a pressing member, and the pressing member can move along the thickness direction of the chip to contact the chip.

[0013] In some embodiments, the connecting assembly further includes a lifting cylinder, and an output end of the lifting cylinder is connected to the pressing member to drive the pressing member to move along the thickness direction of the chip.

[0014] In some embodiments, the conveying member is a transmission belt, and the connecting assembly further includes a plurality of magnetic wheels. The plurality of magnetic wheels are arranged along the first direction, and the conveying member is wound around the plurality of magnetic wheels.

[0015] In some embodiments, the connecting assembly further includes a second power member, and the second power member is in power connection with the magnetic wheels to drive the conveying member to move along the first direction around the magnetic wheels.

[0016] A marking machine according to an embodiment of the second aspect of the present application is used for chip processing. The marking machine includes a loading end, an unloading end, and a flipable marking mechanism as in the embodiment of the first aspect. The loading end is connected to an end of the marking part away from the flipping part. The unloading end is connected to an end of the flipping part away from the marking part.

[0017] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. Description of the Drawings

[0018] The present application will be further described below in conjunction with the drawings and embodiments, where:

[0019] Figure 1 is a schematic structural diagram of a marking machine according to an embodiment of the present application;

[0020] Figure 2 is a schematic structural diagram of a flipping component according to an embodiment of the present application.

[0021] Reference numerals: marking machine 1;

[0022] marking mechanism 10, marking part 11, flipping part 12, connecting component 121, conveying member 1211, pressing member 1212, lifting cylinder 1213, magnetic wheel 1214, second power member 1215, flipping component 122, rotating plate 1221, first power member 1222, drive motor 1223, speed reducer 1224, adjusting member 1225,

[0023] loading end 20;

[0024] unloading end 30;

[0025] first direction X, second direction Y, thickness direction Z of the chip. Detailed Embodiments

[0026] Embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation of the present application.

[0027] In the description of the present application, it should be understood that for orientation descriptions, such as up, down, front, back, left, right, etc., the orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and thus should not be construed as a limitation of the present application.

[0028] In the description of the present application, the meaning of "several" is more than one, the meaning of "multiple" is more than two, and understandings such as "greater than", "less than", "exceeding", etc. do not include the base number, and understandings such as "above", "below", "within", etc. include the base number. If there is a description of "first" and "second", it is only for the purpose of distinguishing technical features and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0029] In the description of the present application, unless otherwise clearly defined, words such as "arrangement", "installation", "connection", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present application in combination with the specific content of the technical solution.

[0030] In the description of the present application, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0031] Please refer to Figure 1 and Figure 2 , Figure 1 is a schematic structural diagram of a marking machine according to an embodiment of the present application, Figure 2 is a schematic structural diagram of a flipping component according to an embodiment of the present application.

[0032] The first aspect embodiment of the present application provides a flipable marking mechanism 10 for flipping and marking a chip. The marking mechanism 10 includes a marking part 11 and a flipping part 12. The marking part 11 is used for marking the chip. Along the first direction X, the flipping part 12 is arranged downstream of the marking part 11. The flipping part 12 includes a connecting component 121 and a flipping component 122. The connecting component 121 includes a conveying part 1211. The conveying part 1211 is used for carrying the chip. The flipping component 122 is connected to the conveying part 1211, and the flipping component 122 is configured to be able to drive the conveying part 1211 to flip 180°.

[0033] In some embodiments, after the chip is conveyed to the marking part 11, the marking part 11 marks the chip.

[0034] In some embodiments, the marking part 1 may be provided with a laser marking part 1. The working principle of laser marking is to use a laser beam to mark the surface of different types of products. After the laser beam emits a pulse beam, the material on the surface of the product is irradiated by the laser and evaporates rapidly, and the deeper material is retained, thereby leaving exquisite patterns, texts, trademarks, etc. on the product.

[0035] In some embodiments, the chip can be set on a carrier of the marking part 11 for marking, with one surface of the chip in contact with the carrier, and the other surface facing away from the carrier. After the laser marking part 1 finishes marking the surface of the chip facing away from the carrier, the chip is transported to the flipping part 12. After the flipping part 12 flips the chip 180°, the flipping part 12 transports the chip back to the carrier of the marking part 11, so that the surface of the chip that was originally in contact with the carrier becomes the surface facing away from the carrier, so that the surface of the chip that was originally facing away from the carrier becomes the surface in contact with the carrier, so that the laser marking part 1 marks the surface of the chip that was originally in contact with the carrier, so that the laser marking part 1 completes marking on both surfaces of the chip.

[0036] The thickness direction Z of the chip is the thickness direction Z of the chip when the chip is arranged on the carrier mentioned above. The two surfaces of the chip are the two surfaces of the chip in the thickness direction Z of the chip.

[0037] In some embodiments, the first direction XX can be represented by the direction indicated by the letter X in the figure. The thickness direction Z of the chip can be represented by the direction indicated by the letter Z in the figure. Among them, the first direction X can be the conveying direction of the chip. It should be noted that after marking one surface of the chip, the chip can be conveyed from the marking part 11 to the flipping part 12 along one direction. After the flipping part 12 flips the chip, the chip can be conveyed from the flipping part 12 to the marking part 11 in the opposite direction of the previous direction, so that the marking part 11 can mark the other surface of the chip. The first direction X is the extension direction of a straight line. The above two directions are parallel to one direction and in opposite directions, that is, the above two directions are both the first direction X.

[0038] In some embodiments, the conveying member 1211 can convey the chip from the marking part 11 to the flipping part 12 along the first direction X, or can convey the chip from the flipping part 12 to the marking part 11 along the first direction X.

[0039] In some embodiments, when the chip is turned over in the turning part 12 , the conveying member 1211 may remain stationary and only function to carry the chip.

[0040] In some embodiments, the flipping assembly 122 can drive the conveying member 1211 to flip 180°, and the chip can be set on the conveying member 1211, that is, the flipping assembly 122 can drive the chip to flip 180°.

[0041] A flippable marking mechanism 10 of an embodiment of the present application can flip the chip through a flipping unit 12 after the marking unit 11 marks one surface of the chip, so that the marking unit 11 can mark the other surface of the chip, thereby increasing the speed of chip marking and automating chip flipping, thereby improving production efficiency.

[0042] In some embodiments, the flip assembly 122 includes a rotating plate 1221 and a first power member 1222. The conveying member 1211 is disposed on the rotating plate 1221. The first power member 1222 is connected to the rotating plate 1221 to drive the rotating plate 1221 to rotate around the second direction Y. The first direction X, the second direction Y and the thickness direction Z of the chip are perpendicular to each other.

[0043] In some embodiments, the conveying member 1211 may be disposed on the rotating plate 1221. The rotating plate 1221 may be a plate-shaped member and disposed along the thickness direction Z of the chip.

[0044] In some embodiments, the chip can be set on the conveying member 1211, and the conveying member 1211 can be set on the rotating plate 1221. The first power member 1222 drives the rotating plate 1221 to rotate 180°, that is, the first power member 1222 drives the chip to rotate 180°.

[0045] The chip is driven to rotate 180° by the first power member 1222 , thereby improving the automation and mechanization of the flippable marking mechanism 10 and saving manpower.

[0046] In some embodiments, the first power member 1222 includes a driving motor 1223 and a reducer 1224 , and the driving motor 1223 , the reducer 1224 and the rotating plate 1221 are connected in sequence.

[0047] In some embodiments, the reducer 1224 may be a hollow type reducer 1224 .

[0048] In some embodiments, the first power member 1222 is controlled by the driving motor 1223 and the reducer 1224 to achieve a 180° flip of the chip, replacing the cylinder drive mode to facilitate wiring.

[0049] In some embodiments, there are two conveying members 1211 , which are arranged opposite to each other along the second direction Y, and are used to respectively carry two ends of the chip in the second direction Y. There are two rotating plates 1221 , which are connected to the two conveying members 1211 accordingly.

[0050] In some embodiments, the second direction Y can be represented by the direction indicated by the letter Y in the figure. Among them, the first direction X can be the length direction of the chip, and the second direction Y can be the width direction of the chip.

[0051] In some embodiments, the number of the conveying members 1211 is two. The two conveying members 1211 are arranged oppositely along the second direction Y and respectively carry both ends of the chip in the second direction Y, that is, the two conveying members 1211 respectively carry both ends of the chip in the width direction.

[0052] In some embodiments, the number of the rotating plates 1221 is two. One rotating plate 1221 is connected to one conveying member 1211, and the other rotating plate 1221 is connected to the other conveying member 1211.

[0053] In some embodiments, both of the two rotating plates 1221 are connected to the first power member 1222. The number of the first power members 1222 can be one, and one first power member 1222 drives the two rotating plates 1221 to rotate simultaneously. The number of the first power members 1222 can also be two, and the two first power members 1222 respectively drive the two rotating plates 1221 to rotate.

[0054] In some embodiments, the two rotating plates 1221 can rotate synchronously.

[0055] The chip is connected by the two rotating plates 1221 to drive the chip to flip, improving the stability of the chip flipping.

[0056] In some embodiments, the flipping assembly 122 further includes an adjusting member 1225. The adjusting member 1225 is connected to at least one rotating plate 1221, and the adjusting member 1225 can drive the rotating plate 1221 to move along the second direction Y.

[0057] In some embodiments, the adjusting member 1225 can be a guide rail extending along the second direction Y. At least one rotating plate 1221 is arranged on the guide rail so that the rotating plate 1221 can move along the second direction Y.

[0058] In some embodiments, the number of the adjusting members 1225 can be one. One adjusting member 1225 can be connected to one rotating plate 1221, so that the rotating plate 1221 can move closer to the other rotating plate 1221 along the second direction Y, thereby driving the conveying member 1211 arranged on the rotating plate 1221 to move, thereby changing the relative positions of the two conveying members 1211 in the second direction Y, so as to adapt to chips of more sizes and improve the applicability and practicality of the flipable marking mechanism 10.

[0059] In some embodiments, the number of adjusting members 1225 can be one. One adjusting member 1225 can be connected to two rotating plates 1221, so as to adjust the positions of the two rotating plates 1221 in the second direction Y, thereby adjusting the relative distance between the two rotating plates 1221 in the second direction Y.

[0060] In some embodiments, the number of adjusting members 1225 can be two. The two adjusting members 1225 can be respectively connected to the two rotating plates 1221, so as to adjust the positions of the two rotating plates 1221 in the second direction Y, thereby adjusting the relative distance between the two rotating plates 1221 in the second direction Y.

[0061] In some embodiments, the connecting assembly 121 further includes a pressing member 1212. The pressing member 1212 can move along the thickness direction Z of the chip to contact the chip.

[0062] In some embodiments, the pressing member 1212 can be a pressing wheel.

[0063] In some embodiments, the chip can be disposed on the conveying member 1211. When flipping is required, the pressing member 1212 can move along the thickness direction Z of the chip, so as to contact the surface of the chip away from the conveying member 1211, thereby pressing the chip on the conveying member 1211 and reducing the risk of the chip falling during the flipping process.

[0064] In some embodiments, before or after the chip is flipped, the pressing member 1212 can be spaced apart from the chip in the thickness direction Z of the chip, so that the chip can be conveyed by the conveying member 1211 along the first direction X.

[0065] In some embodiments, the connecting assembly 121 further includes a lifting cylinder 1213. The output end of the lifting cylinder 1213 is connected to the pressing member 1212 to drive the pressing member 1212 to move along the thickness direction Z of the chip.

[0066] Driving the pressing member 1212 to move along the thickness direction Z of the chip by the lifting cylinder 1213 improves the automation and mechanization of the flipable marking mechanism 10 and saves manpower.

[0067] In some embodiments, the conveying member 1211 is a transmission belt. The connecting assembly 121 further includes magnetic wheels 1214. The number of magnetic wheels 1214 is multiple. The multiple magnetic wheels 1214 are arranged along the first direction X, and the conveying member 1211 is wound around the multiple magnetic wheels 1214.

[0068] In some embodiments, the magnetic wheels 1214 and the transmission belt are in non-contact drive. Compared with the traditional belt drive, it has a simple structure, strong driving stability, low cost, reliable structure, and can be compatible with various different specifications of chip sizes.

[0069] In some embodiments, the connecting component 121 further includes a second power member 1215, which is power-connected to the magnetic wheel 1214 to drive the conveying member 1211 to move along the first direction X around the magnetic wheel 1214.

[0070] In some embodiments, the magnetic wheel 1214 is driven by the second power member 1215, so that the conveying member 1211 conveys the chips, improving the automation and mechanization of the flipable marking mechanism 10 and saving labor.

[0071] It should be noted that the second power member 1215 can be a motor. The second power member 1215 can rotate forward, so that the conveying member 1211 drives the chips to be conveyed from the marking part 11 to the flipping part 12 through the magnetic wheel 1214. The second power member 1215 can be flipped, so that the conveying member 1211 drives the chips to be conveyed from the flipping part 12 to the marking part 11 through the magnetic wheel 1214.

[0072] In the second aspect of the present application, an embodiment provides a marking machine for chip processing. The marking machine includes a loading end 20, an unloading end 30, and a flipable marking mechanism 10 as in the first aspect of the embodiment. The loading end 20 is connected to one end of the marking part 11 away from the flipping part 12. The unloading end 30 is connected to one end of the flipping part 12 away from the marking part 11.

[0073] In some embodiments, the way the loading end 20 conveys the chips to the marking part 11 can be realized by a conveyor belt.

[0074] In some embodiments, the way the flipping part 12 conveys the chips to the unloading end 30 can be realized by a conveyor belt.

[0075] In some embodiments, the chips are conveyed from the loading end 20 to the marking part 11, and the marking part 11 marks the first surface of the chips. After the marking is completed, the chips are conveyed from the marking part 11 to the flipping part 12. After the flipping part 12 flips the chips by 180°, the chips are conveyed from the flipping part 12 to the marking part 11, and the marking part 11 marks the second surface of the chips. After the marking is completed, the chips are conveyed from the marking part 11 through the flipping part 12 to the unloading end 30.

[0076] The above has described the embodiments of the present application in detail with reference to the drawings. However, the present application is not limited to the above embodiments. Various changes can be made without departing from the spirit of the present application within the knowledge scope of those of ordinary skill in the art. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. A reversible marking mechanism, used for chip reversal and marking, characterized in that: The marking mechanism comprises: The marking unit is used for marking chips; A flipping part is arranged downstream of the marking part along a first direction, the flipping part includes a connecting component and a flipping component, the connecting component includes a conveying member, the conveying member is used to carry the chip, the flipping component is connected to the conveying member, and the flipping component is configured to drive the conveying member to flip 180°.

2. The marking mechanism according to claim 1, characterized in that: The flip assembly includes a rotating plate and a first power member, the conveying member is arranged on the rotating plate, the first power member is connected to the rotating plate to drive the rotating plate to rotate around a second direction, and the first direction, the second direction and the thickness direction of the chip are perpendicular to each other.

3. The marking mechanism according to claim 2, characterized in that: The first power member includes a driving motor and a reducer, and the driving motor, the reducer and the rotating plate are connected in sequence.

4. The marking mechanism according to claim 2, characterized in that: The number of the conveying members is two, and the two conveying members are arranged opposite to each other along the second direction, and are used to respectively carry two ends of the chip in the second direction; The number of the rotating plates is two, and the two rotating plates are correspondingly connected to the two conveying members.

5. The marking mechanism according to claim 4, characterized in that: The flip assembly further includes an adjusting member, which is connected to at least one of the rotating plates, and the adjusting member can drive the rotating plate to move along the second direction.

6. The marking mechanism according to claim 1, characterized in that: The connection assembly further includes a pressing member, which is capable of moving along a thickness direction of the chip to contact the chip.

7. The marking mechanism according to claim 6, characterized in that: The connection assembly further comprises a lifting cylinder, the output end of which is connected to the pressing member to drive the pressing member to move along the thickness direction of the chip.

8. The marking mechanism according to claim 1, characterized in that: The conveying member is a transmission belt, and the connecting component also includes a plurality of magnetic wheels. The plurality of magnetic wheels are arranged along the first direction, and the conveying member diffracts the plurality of magnetic wheels.

9. The marking mechanism according to claim 8, characterized in that: The connecting assembly further includes a second power member, which is dynamically connected to the magnetic wheel to drive the conveying member to move around the magnetic wheel along the first direction.

10. A marking machine for chip processing, characterized in that: include: A reversible marking mechanism as claimed in any one of claims 1 to 9; A feeding end connected to an end of the marking part away from the turning part; The unloading end is connected to an end of the turning part away from the marking part.

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