Cooling liquid temperature control device

Abstract

The utility model discloses a cooling liquid temperature control device which is used for wafer processing equipment, the wafer processing equipment comprises a liquid supply device and a grinding device, the grinding device comprises a grinding motor, and the cooling liquid temperature control device comprises a first liquid supply system, a second liquid supply system and a cooling system. The cooling system comprises a first main circuit, a first auxiliary circuit and a second auxiliary circuit, the first auxiliary circuit and the second auxiliary circuit are connected in parallel, the two ends of the first auxiliary circuit and the two ends of the second auxiliary circuit are connected with the first main circuit in series, a compressor and a condenser are arranged on the first main circuit, and the condenser is located on the downstream of the compressor. The first auxiliary loop is provided with a first evaporator which is located in a first water tank of the first liquid supply system, and the second auxiliary loop is provided with a second evaporator which is located in a second water tank of the second liquid supply system. According to the cooling liquid temperature control device, not only is the cooling effect of the grinding motor improved, but also the precision of wafer grinding and thinning is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a coolant temperature control device. Background Art

[0002] In the related art, when grinding and thinning a wafer, the grinding motor rotates at a high speed, and the heat generated by the grinding motor and the frictional heat of the bearing are inevitable. In order to make the grinding motor work within a stable temperature range, cooling water must be introduced into the grinding motor, and the heat generated by the grinding motor is quickly carried away by the circulating cooling water. In addition, when grinding and thinning the wafer, cooling water is provided for the wafer to play a role in cooling, lubricating and cleaning. However, the cooling water provided by the factory facility has problems such as inaccurate temperature control and insufficient liquid supply pressure, which affect the grinding and thinning accuracy of the wafer. Summary of the Utility Model

[0003] The utility model aims to at least solve one of the technical problems existing in the prior art. For this reason, an object of the utility model is to provide a coolant temperature control device, which provides coolant with constant temperature and pressure for the grinding motor and wafer grinding and thinning, improves the cooling effect of the grinding motor, thereby improving the grinding efficiency of the grinding motor, and at the same time improves the grinding and thinning accuracy of the wafer.

[0004] The coolant temperature control device according to an embodiment of the utility model is used for a wafer processing device, the wafer processing device includes: a liquid supply device and a grinding device, the grinding device includes a grinding motor, and the coolant temperature control device includes: a first liquid supply system, a second liquid supply system and a cooling system. The first liquid supply system includes: a first water tank and a liquid supply flow path, and the liquid supply flow path is used for connecting the first water tank with the liquid supply device; the second liquid supply system includes: a second water tank and a cooling circuit, the inlet and outlet of the cooling circuit are both connected with the first water tank, and the cooling circuit is used for cooling the grinding motor; the cooling system includes: a first main path, a first auxiliary circuit and a second auxiliary circuit, the first auxiliary circuit and the second auxiliary circuit are connected in parallel and both ends of the first auxiliary circuit and the second auxiliary circuit are connected in series with the first main path, a compressor and a condenser are arranged on the first main path, the condenser is located downstream of the compressor, a first evaporator is arranged on the first auxiliary circuit, the first evaporator is located in the first water tank, and a second evaporator is arranged on the second auxiliary circuit, the second evaporator is located in the second water tank.

[0005] According to the coolant temperature control device of the embodiment of the present utility model, the cooling system can cool the coolant in the first water tank and the second water tank simultaneously, and the first evaporator controls the temperature of the coolant in the first water tank, and the second evaporator controls the temperature of the coolant in the second water tank, so as to independently control the temperature of the coolant for grinding motor cooling and the coolant for wafer grinding and thinning, provide coolant with constant temperature and pressure for the grinding motor and wafer grinding and thinning, improve the cooling effect of the grinding motor, thereby improving the grinding efficiency of the grinding motor, and at the same time improve the precision of wafer grinding and thinning, and while ensuring wafer grinding and thinning, reduce the manufacturing cost of the wafer processing equipment, reduce energy consumption, simplify the control logic, and save floor space.

[0006] According to some embodiments of the present utility model, the cooling system includes a cooling pipeline that exchanges heat with the condenser. The cooling pipeline is provided with a pressure control valve, and the pressure control valve is also communicated with the outlet of the condenser. The pressure control valve is used to control the cooling water flow rate in the cooling pipeline.

[0007] According to some embodiments of the present utility model, the first auxiliary circuit is provided with a first refrigerant solenoid valve and a first expansion valve. The first expansion valve is located downstream of the first refrigerant solenoid valve and upstream of the first evaporator. The first refrigerant solenoid valve is used to control the connection or disconnection of the first auxiliary circuit; the second auxiliary circuit is provided with a second refrigerant solenoid valve and a second expansion valve. The second expansion valve is located downstream of the second refrigerant solenoid valve and upstream of the second evaporator. The second refrigerant solenoid valve is used to control the connection or disconnection of the second auxiliary circuit.

[0008] According to some embodiments of the present utility model, the cooling system further includes a first circuit that is connected between the first main circuit and the first auxiliary circuit. The inlet of the first circuit is located downstream of the first expansion valve, and the outlet of the first circuit is located between the compressor and the condenser. A bypass valve is provided on the first circuit.

[0009] According to some embodiments of the present utility model, the first liquid supply system further includes: a second circuit that is used to connect the liquid supply flow path and the first water tank. The liquid supply flow path is provided with a first water pump and a first pressure gauge. The first pressure gauge is located downstream of the first water pump. The inlet of the second circuit is located between the first water pump and the first pressure gauge. The second circuit is provided with a first safety valve, and the first safety valve is used to control the connection or disconnection of the second circuit.

[0010] According to some embodiments of the present utility model, the second liquid supply system further includes: a third circuit. The cooling circuit includes a first flow path, a second flow path, and a connecting flow path that are connected. The connecting flow path is located inside the grinding motor. The first flow path is connected between the second water tank and the inlet of the connecting flow path. The second flow path is connected between the outlet of the connecting flow path and the second water tank. The third circuit is used to connect the first flow path and the second flow path and is located outside the grinding motor. The first flow path is provided with a second water pump and a second pressure gauge. The second pressure gauge is located downstream of the second water pump. The liquid inlet of the third circuit is located between the second water pump and the second pressure gauge. The third circuit is provided with a second safety valve, and the second safety valve is used to control the connection or disconnection of the third circuit.

[0011] According to some embodiments of the present utility model, the first liquid supply system further includes: a first filter, which is located on the liquid supply flow path and is used to filter the coolant in the liquid supply flow path; the second liquid supply system further includes: a second filter, which is located on the cooling circuit and is used to filter the coolant in the cooling circuit.

[0012] According to some embodiments of the present utility model, the first liquid supply system further includes: a first liquid level sensor and a first temperature sensor. The first liquid level sensor is used to detect the liquid level height of the coolant in the first water tank. The first temperature sensor is used to detect the temperature of the coolant in the first water tank; the second liquid supply system further includes: a second liquid level sensor and a second temperature sensor. The second liquid level sensor is used to detect the liquid level height of the coolant in the second water tank. The second temperature sensor is used to detect the temperature of the coolant in the second water tank.

[0013] According to some embodiments of the present utility model, the first liquid supply system further includes: a first heater, which is located in the first water tank and is used to heat the coolant in the first water tank; the second liquid supply system further includes: a second heater, which is located in the second water tank and is used to heat the coolant in the second water tank.

[0014] According to some embodiments of the present utility model, the coolant temperature control device further includes: a liquid inlet pipeline, which includes a first liquid inlet pipeline and a second liquid inlet pipeline connected in parallel. The first liquid inlet pipeline is connected to the first water tank. The first liquid inlet pipeline is provided with a first electromagnetic water valve, and the first electromagnetic water valve is used to control the connection or closing of the first liquid inlet pipeline. The second liquid inlet pipeline is connected to the second water tank. The second liquid inlet pipeline is provided with a second electromagnetic water valve, and the second electromagnetic water valve is used to control the connection or closing of the second liquid inlet pipeline.

[0015] Additional aspects and advantages of the present utility model will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present utility model. Description of the Drawings

[0016] The above and / or additional aspects and advantages of the present utility model will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, where:

[0017] Figure 1 is a schematic diagram of a coolant temperature control device according to some embodiments of the present utility model.

[0018] Reference Numerals:

[0019] 100, coolant temperature control device;

[0020] 001, first liquid supply system; 011, liquid supply flow path; 012, second circuit; 01, first water pump; 02, first safety valve; 03, first filter; 04, first pressure gauge; 05, first liquid level sensor; 06, first temperature sensor; 07, first water tank; 08, first heater; 33, first liquid level gauge;

[0021] 002, second liquid supply system; 021, cooling circuit; 022, first flow path; 023, second flow path; 024, third circuit; 025, communication flow path; 10, second water pump; 11, second safety valve; 12, second filter; 13, second pressure gauge; 14, flow switch; 15, second liquid level sensor; 16, second temperature sensor; 17, second water tank; 18, second heater; 34, second liquid level gauge;

[0022] 003, cooling system; 031, first main path; 032, first auxiliary circuit; 033, second auxiliary circuit; 034, cooling pipeline; 035, first circuit; 20, compressor; 21, high pressure pressure switch; 22, low pressure pressure switch; 23, condenser; 24, liquid storage dryer; 25, first refrigerant solenoid valve; 26, second refrigerant solenoid valve; 27, first expansion valve; 28, second expansion valve; 29, first evaporator; 30, second evaporator; 31, bypass valve; 32, pressure control valve;

[0023] 40, liquid inlet pipeline; 41, first liquid inlet pipeline; 09, first electromagnetic water valve; 42, second liquid inlet pipeline; 19, second electromagnetic water valve;

[0024] 35, liquid supply device; 36, grinding device; 361, grinding motor. Detailed Embodiments

[0025] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present utility model and should not be construed as limiting the present utility model.

[0026] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as limiting the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality" means two or more unless otherwise specifically defined.

[0027] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "mounted", "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0028] Next, reference is made to Figure 1 describe a coolant temperature control device 100 according to an embodiment of the present utility model.

[0029] The coolant temperature control device 100 according to an embodiment of the present invention is used for a wafer processing device. The wafer processing device includes a liquid supply device 35 and a grinding device 36. The grinding device 36 includes a grinding motor 361. When grinding a wafer, the grinding motor 361 thins the wafer by grinding. During the operation of the grinding motor 361, the grinding motor 361 generates heat. When the heat is severe, it will cause thermal deformation of the mechanical components of the grinding motor 361, and more seriously, it will reduce the processing accuracy of the grinding device 36. Therefore, in order to make the grinding motor 361 work within a stable temperature range, it is necessary to cool down the grinding motor 361. On the other hand, when grinding a wafer, the liquid supply device 35 provides coolant for the wafer to cool, lubricate and clean the wafer. However, the coolant provided by the factory has problems such as inaccurate temperature control and insufficient liquid supply pressure. In order to ensure the thermal stability of the grinding device 36, ensure the stable flow rate and pressure of the coolant, and thus ensure the processing accuracy of the grinding device 36, this application proposes a coolant temperature control device 100.

[0030] The coolant temperature control device 100 includes a first liquid supply system 001, a second liquid supply system 002 and a cooling system 003. The first liquid supply system 001 provides coolant for the liquid supply device 35, and the coolant can be transported to the wafer through the liquid supply device 35. The second liquid supply system 002 provides coolant for the grinding motor 361 to cool the grinding motor 361. The cooling system 003 is used to cool the coolant.

[0031] The first liquid supply system 001 includes a first water tank 07 and a liquid supply flow path 011. The liquid supply flow path 011 is used to connect the first water tank 07 and the liquid supply device 35. The first water tank 07 is used to store the coolant. The liquid supply flow path 011 can transport the coolant in the first water tank 07 to the liquid supply device 35, and the liquid supply device 35 provides coolant for the grinding and thinning of the wafer.

[0032] The second liquid supply system 002 includes a second water tank 17 and a cooling circuit 021. The inlet and outlet of the cooling circuit 021 are both connected to the second water tank 17. The cooling circuit 021 is used to cool the grinding motor 361. The second water tank 17 is used to store the coolant. The coolant in the second water tank 17 flows through the grinding motor 361 through the cooling circuit 021 and then is transported back to the second water tank 17 to cool the grinding motor 361. For example, when the grinding motor 361 grinds and thins the wafer, the electric spindle of the grinding motor 361 generates heat, and the cooling circuit 021 passes through the electric spindle of the grinding motor 361 to cool the electric spindle of the grinding motor 361.

[0033] The cooling system 003 includes a first main path 031, a first auxiliary loop 032, and a second auxiliary loop 033. The first auxiliary loop 032 and the second auxiliary loop 033 are in parallel, and both ends of the first auxiliary loop 032 and the second auxiliary loop 033 are connected in series with the first main path 031. That is, both ends of the first auxiliary loop 032 are respectively connected and communicated with both ends of the first main path 031, and both ends of the second auxiliary loop 033 are respectively connected and communicated with both ends of the first main path 031. The refrigerant in the first main path 031 can be transported to the first auxiliary loop 032 and then flow back to the first main path 031 through the first auxiliary loop 032; the refrigerant in the first main path 031 can also be transported to the second auxiliary loop 033 and then flow back to the first main path 031 through the second auxiliary loop 033.

[0034] A compressor 20 and a condenser 23 are provided on the first main path 031. The condenser 23 is located downstream of the compressor 20. The first auxiliary loop 032 is provided with a first evaporator 29, and the first evaporator 29 is located in the first water tank 07. The second auxiliary loop 033 is provided with a second evaporator 30, and the second evaporator 30 is located in the second water tank 17. The compressor 20 can compress the low-temperature and low-pressure refrigerant in the first main path 031 into a high-temperature and high-pressure refrigerant. The condenser 23 exchanges heat of the high-temperature and high-pressure refrigerant into a high-pressure liquid refrigerant. The high-pressure liquid refrigerant is transported into the first auxiliary loop 032 and the second auxiliary loop 033. The first evaporator 29 absorbs the heat of the coolant in the first water tank 07 to cool the coolant in the first water tank 07, and the refrigerant after heat exchange then flows back into the first main path 031; the second evaporator 30 absorbs the heat of the coolant in the second water tank 17 to cool the coolant, and the refrigerant after heat exchange then flows back into the first main path 031. The cooling system 003 can cool the coolants in the first water tank 07 and the second water tank 17 simultaneously. The first evaporator 29 is used to control the temperature of the coolant in the first water tank 07, and the second evaporator 30 is used to control the temperature of the coolant in the second water tank 17 to independently control the temperatures of the coolant for cooling the grinding motor 361 and the coolant for wafer grinding and thinning.

[0035] The coolant temperature control device 100 provides coolant with constant temperature and pressure for the grinding motor 361 and wafer grinding and thinning, improves the cooling effect of the grinding motor 361, thereby improving the grinding efficiency of the grinding motor 361. At the same time, it also improves the precision of wafer grinding and thinning, and while ensuring wafer grinding and thinning, reduces the manufacturing cost of wafer processing equipment, reduces energy consumption, simplifies the control logic, and saves floor space.

[0036] According to the coolant temperature control device 100 of the embodiments of the present utility model, the cooling system 003 can cool the coolant in the first water tank 07 and the second water tank 17 simultaneously, and the first evaporator 29 controls the temperature of the coolant in the first water tank 07, and the second evaporator 30 controls the temperature of the coolant in the second water tank 17, so as to independently control the temperature of the coolant for cooling the grinding motor 361 and the coolant for wafer grinding and thinning, and provide coolant with constant temperature and pressure for the grinding motor 361 and wafer grinding and thinning, improve the cooling effect of the grinding motor 361, thereby improving the grinding efficiency of the grinding motor 361, and at the same time improving the precision of wafer grinding and thinning, and while ensuring wafer grinding and thinning, reduce the manufacturing cost of the wafer processing equipment, reduce energy consumption, simplify the control logic, and save floor space.

[0037] According to some embodiments of the present utility model, referring to Figure 1 , the cooling system 003 includes a cooling pipeline 034, and the cooling pipeline 034 is used for heat exchange with the condenser 23 to cool the refrigerant in the condenser 23. The cooling pipeline 034 is provided with a pressure control valve 32, and the pressure control valve 32 is also communicated with the liquid outlet of the condenser 23. The pressure control valve 32 is used for detecting the pressure of the refrigerant at the liquid outlet of the condenser 23 and adjusting the cooling water flow rate in the cooling pipeline 034 according to the pressure of the refrigerant.

[0038] For example, when the compressor 20 operates at a low load or does not operate, the pressure control valve 32 detects that the refrigerant pressure at the liquid outlet of the condenser 23 decreases, and the pressure control valve 32 reduces the valve core opening, and the cooling water flow rate through the cooling pipeline 034 becomes lower, so as to reduce the consumption of the cooling water in the cooling pipeline 034 and achieve the purpose of water saving.

[0039] For another example, when the compressor 20 operates normally or overloaded, the pressure control valve 32 detects that the refrigerant pressure at the liquid outlet of the condenser 23 remains unchanged or increases, and the pressure control valve 32 keeps the valve core opening unchanged or increases the valve core opening, and the cooling water flow rate through the cooling pipeline 034 remains unchanged or increases, which can ensure the heat exchange efficiency of the condenser 23, thereby ensuring the normal operation of the cooling system 003.

[0040] According to some embodiments of the present utility model, referring to Figure 1 , the first auxiliary circuit 032 is provided with a first refrigerant solenoid valve 25 and a first expansion valve 27. The first expansion valve 27 is located downstream of the first refrigerant solenoid valve 25 and upstream of the first evaporator 29. The first refrigerant solenoid valve 25 is used for controlling the connection or disconnection of the first auxiliary circuit 032.

[0041] When it is necessary to cool the coolant in the first water tank 07, the first refrigerant solenoid valve 25 is used to control the connection of the first auxiliary circuit 032. The refrigerant in the first auxiliary circuit 032 can flow through the first expansion valve 27. After the refrigerant passes through the first expansion valve 27, the pressure of the refrigerant drops sharply, so that it becomes a low-temperature and low-pressure refrigerant. The low-temperature and low-pressure refrigerant flows into the first evaporator 29 to cool the coolant in the first water tank 07.

[0042] When it is not necessary to cool the coolant in the first water tank 07, the first refrigerant solenoid valve 25 controls the disconnection of the first auxiliary circuit 032. The refrigerant in the first auxiliary circuit 032 cannot flow into the first evaporator 29, and the first evaporator 29 cannot cool the coolant in the first water tank 07.

[0043] The second auxiliary circuit 033 is provided with a second refrigerant solenoid valve 26 and a second expansion valve 28. The second expansion valve 28 is located downstream of the second refrigerant solenoid valve 26 and upstream of the second evaporator 30. The second refrigerant solenoid valve 26 is used to control the connection or disconnection of the second auxiliary circuit 033.

[0044] When it is necessary to cool the coolant in the second water tank 17, the second refrigerant solenoid valve 26 is used to control the connection of the second auxiliary circuit 033. The refrigerant in the second auxiliary circuit 033 can flow through the second expansion valve 28. After the refrigerant passes through the second expansion valve 28, the pressure of the refrigerant drops sharply, so that it becomes a low-temperature and low-pressure refrigerant. The low-temperature and low-pressure refrigerant flows into the second evaporator 30 to cool the coolant in the second water tank 17.

[0045] When it is not necessary to cool the coolant in the second water tank 17, the second refrigerant solenoid valve 26 controls the disconnection of the second auxiliary circuit 033. The refrigerant in the second auxiliary circuit 033 cannot flow into the second evaporator 30, and the second evaporator 30 cannot cool the coolant in the second water tank 17.

[0046] In a specific example, a high-pressure pressure sensor 21 and a low-pressure pressure sensor 22 are provided on the first main circuit 031. The high-pressure pressure sensor 21 and the low-pressure pressure sensor 22 are respectively located on both sides of the compressor 20. The high-pressure pressure sensor 21 is arranged adjacent to the outlet of the compressor 20, and the low-pressure pressure sensor 22 is arranged adjacent to the inlet of the compressor 20. The high-pressure pressure sensor 21 can detect the outlet gas pressure of the compressor 20, and the low-pressure pressure sensor 22 can detect the inlet gas pressure of the compressor 20. The opening degrees of the first expansion valve 27 and the second expansion valve 28 are adjusted according to the outlet gas pressure and the inlet gas pressure; at the same time, if the outlet gas pressure and the inlet gas pressure are too high or too low, the alarm system can be triggered or the standby system can be started.

[0047] According to some embodiments of the present invention, refer to Figure 1, the cooling system 003 further includes a first circuit 035. The first circuit 035 is connected between the first main path 031 and the first auxiliary circuit 032. The liquid inlet of the first circuit 035 is located downstream of the first expansion valve 27, and the liquid outlet of the first circuit 035 is located between the compressor 20 and the condenser 23. A bypass valve 31 is provided on the first circuit 035.

[0048] The liquid supply flow path 011 can transport the coolant in the first water tank 07 to the liquid supply device 35, and the liquid supply device 35 provides coolant for wafer grinding and thinning. When grinding and thinning the wafer, a large amount of coolant for wafer grinding and thinning is consumed, and it is necessary to continuously replenish the coolant to the first water tank 07. At the same time, it is also necessary for the first evaporator 29 to continuously cool the coolant in the first water tank 07. When the first evaporator 29 is continuously operating, it may cause the temperature of the first evaporator 29 to be too low, resulting in frosting on the surface of the first evaporator 29 and a pressure drop, thereby freezing the first evaporator 29. The first circuit 035 directly passes the high-temperature and high-pressure refrigerant flowing out of the liquid outlet of the compressor 20 into the first evaporator 29, preventing the first evaporator 29 from being frozen due to frosting on the surface of the first evaporator 29 and a pressure drop caused by long-term operation; at the same time, it also increases the outlet temperature and pressure of the first evaporator 29, improving the operating conditions of the compressor 20 in a low-temperature environment.

[0049] According to some embodiments of the present invention, referring to Figure 1 , a liquid storage dryer 24 is provided on the first main path 031. The liquid storage dryer 24 is located downstream of the condenser 23, and the liquid storage dryer 24 is used to store, filter, and dry the refrigerant in the first main path 031. During the shutdown period of the cooling system 003, the liquid storage dryer 24 can accommodate the refrigerant to ensure sufficient refrigerant supply when the cooling system 003 is restarted. The liquid storage dryer 24 can also filter out impurities in the refrigerant, such as metal chips, oil stains, etc., which may come from the wear of the cooling system 003 or residues during the manufacturing process.

[0050] According to some embodiments of the present invention, referring to Figure 1 , the first liquid supply system 001 further includes: a second circuit 012. The second circuit 012 is used to connect the liquid supply flow path 011 and the first water tank 07. The liquid supply flow path 011 is provided with a first water pump 01 and a first pressure gauge 04. The first pressure gauge 04 is located downstream of the first water pump 01. The liquid inlet of the second circuit 012 is located between the first water pump 01 and the first pressure gauge 04. The second circuit 012 is provided with a first safety valve 02, and the first safety valve 02 is used to control the connection or disconnection of the second circuit 012 to control the coolant flow rate of the liquid supply flow path 011.

[0051] The first water pump 01 is used to pump the coolant in the first water tank 07 into the liquid supply device 35. The first pressure gauge 04 can detect the coolant flow rate in the liquid supply flow path 011 to observe whether the working state of the first water pump 01 is normal. When grinding and thinning the wafer, if the liquid supply device 35 fails, it may cause the first liquid supply system 001 to be unable to provide coolant for wafer grinding and thinning through the liquid supply device 35. At this time, since the first water pump 01 is in the working state, the first water pump 01 pumps the coolant in the first water tank 07 into the liquid supply flow path 011, but the coolant in the liquid supply flow path 011 cannot be transported to the wafer through the liquid supply device 35, which may cause the pressure in the liquid supply flow path 011 to be too high, resulting in a failure of the liquid supply flow path 011. At this time, the first safety valve 02 is used to control the connection of the second circuit 012, and the coolant in the liquid supply flow path 011 can flow back to the first water tank 07 through the second circuit 012 to avoid the failure of the first liquid supply system 001.

[0052] When grinding and thinning the wafer and the liquid supply device 35 is working properly, the first safety valve 02 is used to control the disconnection of the second circuit 012, so that all the coolant in the liquid supply flow path 011 flows to the liquid supply device 35.

[0053] According to some embodiments of the present invention, referring to Figure 1 , the second liquid supply system 002 further includes: a third circuit 024. The cooling circuit 021 includes a connected first flow path 022, a second flow path 023, and a connecting flow path 025. The connecting flow path 025 is located in the grinding motor 361. The first flow path 022 is connected between the second water tank 17 and the inlet of the connecting flow path 025, and the second flow path 023 is connected between the outlet of the connecting flow path 025 and the second water tank 17. The connecting flow path 025 has a cooling inlet a and a cooling outlet b. The first flow path 022 is connected to the cooling inlet a of the connecting flow path 025, and the second flow path 023 is connected to the cooling outlet b of the connecting flow path 025. The coolant flows from the first flow path 022 to the connecting flow path 025 of the grinding motor 361. The coolant flows through the connecting flow path 025 of the grinding motor 361, takes away the heat generated by the grinding motor 361, flows from the cooling outlet b of the grinding motor 361 to the second flow path 023, and flows back to the second water tank 17 from the second flow path 023 to form a cooling circulation circuit.

[0054] For example, a water-cooled jacket can be arranged on the circumferential outer side of the grinding motor 361, and the connecting flow path 025 is located in the water-cooled jacket; the connecting flow path 025 can also be arranged inside the grinding motor 361, and the connecting flow path 025 can be arranged around the electric spindle of the grinding motor 361.

[0055] The third circuit 024 is used to connect the first flow path 022 and the second flow path 023 and is located outside the grinding motor 361. The first flow path 022 is provided with a second water pump 10 and a second pressure gauge 13. The second pressure gauge 13 is located downstream of the second water pump 10. The liquid inlet of the third circuit 024 is located between the second water pump 10 and the second pressure gauge 13. The third circuit 024 is provided with a second safety valve 11, and the second safety valve 11 is used to control the connection or disconnection of the third circuit 024 to control the coolant flow rate of the cooling circuit 021.

[0056] The second water pump 10 is used to pump the coolant in the second water tank 17 into the interior of the grinding motor 361. The second pressure gauge 13 can detect the coolant flow rate in the first flow path 022 to observe whether the working state of the first water pump 01 is normal. When grinding and thinning the wafer, if the grinding motor 361 fails, it may cause the second liquid supply system 002 to be unable to cool the grinding motor 361. At this time, since the second water pump 10 is in the working state, the second water pump 10 pumps the coolant in the second water tank 17 into the first flow path 022, and the coolant in the first flow path 022 cannot flow back to the second water tank 17 through the connecting flow path 025 and the second flow path 023, which may cause the pressure in the first flow path 022 to be too high, resulting in a failure of the first flow path 022. At this time, the second safety valve 11 is used to control the connection of the third circuit 024, and the coolant in the first flow path 022 can flow back to the second water tank 17 through the third circuit 024, avoiding a failure of the second liquid supply system 002.

[0057] When the wafer grinding and thinning works normally, the second safety valve 11 is used to control the disconnection of the third circuit 024, and all the coolant in the first flow path 022 flows to the connecting flow path 025.

[0058] For example, a flow switch 14 is provided on the second flow path 023. The flow switch 14 is located upstream of the liquid inlet of the third circuit 024. When the coolant flow rate in the second flow path 023 is lower than the set value of the flow switch 14, the flow switch 14 issues an alarm to remind the operator.

[0059] According to some embodiments of the present invention, referring to Figure 1 , the first liquid supply system 001 further includes: a first filter 03. The first filter 03 is located on the liquid supply flow path 011 and upstream of the first pressure gauge 04. The first filter 03 is used to filter the coolant in the liquid supply flow path 011 to filter out impurities in the coolant in the liquid supply flow path 011, such as solid particles such as dust, rust, and metal chips.

[0060] The second liquid supply system 002 further includes: a second filter 12, which is located on the cooling circuit 021 and upstream of the second pressure gauge 13, for filtering the coolant in the cooling circuit 021, and for filtering out impurities in the coolant in the cooling circuit 021, such as solid particles like dust, rust, metal chips, etc.

[0061] In a specific example, the coolant for cooling the grinding motor 361 can be tap water, deionized water, distilled water, or ultrapure water, etc.; the coolant for wafer grinding and thinning can be deionized water, distilled water, or ultrapure water, etc. Components in contact with the coolant, such as the liquid supply flow path 011, the first water pump 01, the first safety valve 02, the first filter 03, the first pressure gauge 04, the cooling circuit 021, the second water pump 10, the second safety valve 11, the second filter 12, and the second pressure gauge 13 of the coolant temperature control device 100, are all made of stainless steel to prevent the device from contaminating deionized water, distilled water, or ultrapure water.

[0062] According to some embodiments of the present invention, with reference to Figure 1 , the first liquid supply system 001 further includes a first liquid level sensor 05 and a first temperature sensor 06. The first liquid level sensor 05 is used to detect the liquid level height of the coolant in the first water tank 07, and the first temperature sensor 06 is used to detect the temperature of the coolant in the first water tank 07.

[0063] The first liquid level sensor 05 detects the liquid level of the coolant in the first water tank 07, and replenishes the coolant to the first water tank 07 according to the liquid level of the coolant. For example, when the first liquid level sensor 05 detects that the liquid level of the coolant in the first water tank 07 drops to the set value L12, the first water tank 07 is replenished with coolant. When the liquid level of the coolant rises to the set value L11, the replenishment of coolant to the first water tank 07 stops; if the liquid level of the coolant in the first water tank 07 drops to the set value L13, the first liquid level sensor 05 issues a low liquid level alarm, and the coolant temperature control device 100 stops working.

[0064] For example, when the first temperature sensor 06 detects that the temperature of the coolant drops to the temperature set value, the first refrigerant solenoid valve 25 is closed, and the coolant in the first water tank 07 is no longer refrigerated.

[0065] The second liquid supply system 002 further includes a second liquid level sensor 15 and a second temperature sensor 16. The second liquid level sensor 15 is used to detect the liquid level height of the coolant in the second water tank 17, and the second temperature sensor 16 is used to detect the temperature of the coolant in the second water tank 17.

[0066] The second liquid level sensor 15 detects the liquid level of the coolant in the second water tank 17, and replenishes the coolant to the second water tank 17 according to the liquid level of the coolant. For example, when the second liquid level sensor 15 detects that the liquid level of the coolant in the second water tank 17 drops to the set value L22, the second water tank 17 is replenished with coolant. When the liquid level of the coolant rises to the set value L21, the replenishment of coolant into the second water tank 17 stops; if the liquid level of the coolant in the second water tank 17 drops to the set value L23, the second liquid level sensor 15 issues a low liquid level alarm, and the coolant temperature control device 100 stops working.

[0067] For example, when the second temperature sensor 16 detects that the temperature of the coolant has dropped to the temperature set value, the second refrigerant solenoid valve 26 is closed, and the coolant in the second water tank 17 is no longer refrigerated.

[0068] The first liquid supply system 001 further includes a first liquid level gauge 33. The first liquid level gauge 33 is located on the side wall of the first water tank 07. The first liquid level gauge 33 is used to detect the liquid level height of the coolant in the first water tank 07, facilitating the operator to observe the liquid level height of the coolant in the first water tank 07 in real time, providing auxiliary assistance to the first liquid level sensor 05, and facilitating the operator to manually replenish water to the first water tank 07 or regularly check the actual liquid level of the coolant in the first water tank 07.

[0069] The second liquid supply system 002 further includes a second liquid level gauge 34. The second liquid level gauge 34 is located on the side wall of the second water tank 17. The second liquid level gauge 34 is used to detect the liquid level height of the coolant in the second water tank 17, facilitating the operator to observe the liquid level height of the coolant in the second water tank 17 in real time, providing auxiliary assistance to the second liquid level sensor 15, and facilitating the operator to manually replenish water to the second water tank 17 or regularly check the actual liquid level of the coolant in the second water tank 17.

[0070] According to some embodiments of the present invention, with reference to Figure 1 , the first liquid supply system 001 further includes a first heater 08. The first heater 08 is located in the first water tank 07. The first heater 08 is used to heat the coolant in the first water tank 07.

[0071] When the temperature of the coolant in the first water tank 07 is lower than the set temperature, the first heater 08 operates and stops heating the coolant to the set temperature, thereby ensuring that the temperature of the coolant in the first water tank 07 is always stable at the set value, ensuring that the temperature of the coolant during wafer thinning grinding is moderate and constant within the normal range.

[0072] The second liquid supply system 002 further includes a second heater 18. The second heater 18 is located in the second water tank 17. The second heater 18 is used to heat the coolant in the second water tank 17.

[0073] When the temperature of the coolant in the second water tank 17 is lower than the set temperature, the second heater 18 operates to heat the coolant to the set temperature and then stops, thereby ensuring that the temperature of the coolant in the second water tank 17 is always stable at the set value, ensuring that the temperature of the coolant for the grinding motor 361 is moderate and remains constant within the normal range.

[0074] According to some embodiments of the present invention, with reference to Figure 1 , the coolant temperature control device 100 further includes a liquid inlet pipeline 40. The liquid inlet pipeline 40 includes a first liquid inlet pipeline 41 and a second liquid inlet pipeline 42 connected in parallel. The first liquid inlet pipeline 41 is connected to the first water tank 07, and a first electromagnetic water valve 09 is provided on the first liquid inlet pipeline 41. The first electromagnetic water valve 09 is used to control the connection or disconnection of the first liquid inlet pipeline 41. The second liquid inlet pipeline 42 is connected to the second water tank 17, and a second electromagnetic water valve 19 is provided on the second liquid inlet pipeline 42. The second electromagnetic water valve 19 is used to control the connection or disconnection of the second liquid inlet pipeline 42.

[0075] When the first liquid level sensor 05 detects that the liquid level of the coolant in the first water tank 07 drops to the set value L12, the first electromagnetic water valve 09 opens to control the connection of the first liquid inlet pipeline 41 to supplement the coolant to the first water tank 07; when the liquid level of the coolant rises to the set value L11, the first electromagnetic water valve 09 opens to control the disconnection of the first liquid inlet pipeline 41 to stop supplementing the coolant to the first water tank 07.

[0076] When the second liquid level sensor 15 detects that the liquid level of the coolant in the second water tank 17 drops to the set value L22, the first electromagnetic water valve 09 opens to control the connection of the first liquid inlet pipeline 41 to supplement the coolant to the second water tank 17; when the liquid level of the coolant rises to the set value L21, the second electromagnetic water valve 19 opens to control the disconnection of the second liquid inlet pipeline 42 to stop supplementing the coolant to the second water tank 17.

[0077] In the description of this specification, the descriptions with reference to terms such as "some embodiments", "optionally", "further", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0078] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A coolant temperature control device for wafer processing equipment, characterized in that: The wafer processing equipment comprises: a liquid supply device and a grinding device, the grinding device comprises a grinding motor, and the coolant temperature control device comprises: a first liquid supply system, a second liquid supply system and a cooling system. The first liquid supply system comprises: a first water tank and a liquid supply flow path, wherein the liquid supply flow path is used to connect the first water tank and the liquid supply device; The second liquid supply system comprises: a second water tank and a cooling circuit, the inlet and outlet of the cooling circuit are both connected to the second water tank, and the cooling circuit is used to cool the grinding motor; The cooling system includes: a first main circuit, a first auxiliary circuit and a second auxiliary circuit, the first auxiliary circuit and the second auxiliary circuit are connected in parallel, and both ends of the first auxiliary circuit and the second auxiliary circuit are connected in series with the first main circuit, a compressor and a condenser are provided on the first main circuit, the condenser is located downstream of the compressor, the first auxiliary circuit is provided with a first evaporator, and the first evaporator is located in the first water tank, and the second auxiliary circuit is provided with a second evaporator, and the second evaporator is located in the second water tank.

2. The coolant temperature control device according to claim 1, characterized in that: The cooling system includes a cooling pipeline for heat exchange with the condenser. The cooling pipeline is provided with a pressure control valve. The pressure control valve is also connected to the outlet of the condenser. The pressure control valve is used to control the cooling water flow in the cooling pipeline.

3. The coolant temperature control device according to claim 1, characterized in that: The first auxiliary circuit is provided with a first refrigerant solenoid valve and a first expansion valve, wherein the first expansion valve is located downstream of the first refrigerant solenoid valve, and the first expansion valve is located upstream of the first evaporator, and the first refrigerant solenoid valve is used to control the connection or disconnection of the first auxiliary circuit; The second auxiliary circuit is provided with a second refrigerant solenoid valve and a second expansion valve, wherein the second expansion valve is located downstream of the second refrigerant solenoid valve and the second expansion valve is located upstream of the second evaporator, and the second refrigerant solenoid valve is used to control the connection or disconnection of the second auxiliary circuit.

4. The coolant temperature control device according to claim 3, characterized in that: The cooling system also includes a first circuit, which is connected between the first main circuit and the first auxiliary circuit, the liquid inlet of the first circuit is located downstream of the first expansion valve, the liquid outlet of the first circuit is located between the compressor and the condenser, and a bypass valve is provided on the first circuit.

5. The coolant temperature control device according to claim 1, characterized in that: The first liquid supply system also includes: a second circuit, the second circuit is used to connect the liquid supply flow path and the first water tank, the liquid supply flow path is provided with a first water pump and a first pressure gauge, the first pressure gauge is located downstream of the first water pump, the liquid inlet of the second circuit is located between the first water pump and the first pressure gauge, the second circuit is provided with a first safety valve, and the first safety valve is used to control the connection or disconnection of the second circuit.

6. The coolant temperature control device according to claim 1, characterized in that: The second fluid supply system also includes: a third circuit, the cooling circuit includes a first flow path, a second flow path and a connecting flow path that are connected, the connecting flow path is located in the grinding motor, the first flow path is connected between the second water tank and the inlet of the connecting flow path, the second flow path is connected between the outlet of the connecting flow path and the second water tank, the third circuit is used to connect the first flow path and the second flow path and is located outside the grinding motor, the first flow path is provided with a second water pump and a second pressure gauge, the second pressure gauge is located downstream of the second water pump, the liquid inlet of the third circuit is located between the second water pump and the second pressure gauge, the third circuit is provided with a second safety valve, and the second safety valve is used to control the connection or disconnection of the third circuit.

7. The coolant temperature control device according to claim 1, characterized in that: The first liquid supply system further includes: a first filter, the first filter being located on the liquid supply flow path and configured to filter the coolant in the liquid supply flow path; The second liquid supply system further includes: a second filter, which is located on the cooling circuit and is used to filter the coolant in the cooling circuit.

8. The coolant temperature control device according to claim 1, characterized in that: The first liquid supply system further includes: a first liquid level sensor and a first temperature sensor, wherein the first liquid level sensor is used to detect the liquid level height of the coolant in the first water tank, and the first temperature sensor is used to detect the temperature of the coolant in the first water tank; The second liquid supply system further includes: a second liquid level sensor and a second temperature sensor, wherein the second liquid level sensor is used to detect the liquid level of the coolant in the second water tank, and the second temperature sensor is used to detect the temperature of the coolant in the second water tank.

9. The coolant temperature control device according to claim 8, characterized in that: The first liquid supply system further includes: a first heater, the first heater is located in the first water tank, and the first heater is used to heat the coolant in the first water tank; The second liquid supply system further includes: a second heater, which is located in the second water tank and is used to heat the coolant in the second water tank.

10. The coolant temperature control device according to claim 8, characterized in that: Also includes: The liquid inlet pipeline comprises a first liquid inlet pipeline and a second liquid inlet pipeline connected in parallel, the first liquid inlet pipeline is connected to the first water tank, the first liquid inlet pipeline is provided with a first electromagnetic water valve, the first electromagnetic water valve is used to control the connection or disconnection of the first liquid inlet pipeline, the second liquid inlet pipeline is connected to the second water tank, the second liquid inlet pipeline is provided with a second electromagnetic water valve, the second electromagnetic water valve is used to control the connection or disconnection of the second liquid inlet pipeline.

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