Rotary gas circuit device

By designing a rotary gas circuit device of logic components and adapter components, the space occupation problem caused by the inability to twist the air pipe structure in the existing devices is solved, and the use of smaller-sized motors and system motion performance is improved.

CN222958450UActive Publication Date: 2025-06-10SCHNEEBERGER PRECISION SYSTEMS (SHENZHEN) CO LTD
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Patent Information

Application Number
CN202422008512.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-19
Publication Date
2025-06-10
Estimated Expiration
2034-08-19

AI Technical Summary

Technical Problem

The existing spiral gas circuit device cannot be twisted unlimitedly due to the inability to rotate the air pipe structure, which requires the use of a larger specification of drive motor, which increases the load and footprint.

Method used

A gyro gas circuit device is designed. Through the combination of logic components and adapter components, the flexible adapter of the gas circuit and the integration of vacuum logic valves are realized, reducing the space requirements of the gas circuit structure.

Benefits of technology

By reducing the space requirements of the gas circuit structure, smaller motors can be selected to reduce the overall load and improve the system's motion performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a rotary gas circuit device, which relates to the technical field of rotary vacuum gas circuits and comprises a supporting table top, a logic component is mounted at the bottom of the supporting table top and comprises a gas circuit switching block, and the gas circuit switching block is mounted at the bottom of the supporting table top. An inner ring gas path connector and an outer ring gas path connector are installed at the top of the gas path switching block, a single-way gas path sliding ring, a gas pipe connector B and a vacuum logic valve are installed at the bottom of the gas path switching block, a gas pipe connector A is installed at the bottom of the single-way gas path sliding ring, and a gas path plug is installed on the outer side of the gas pipe connector B. The vacuum logic valve is installed on the outer side of the gas pipe connector B. An air pipe joint C is mounted at the bottom of the vacuum logic valve; the vacuum air path of the outer ring can be automatically opened and closed, the space required by the air path structure is greatly reduced, the motion performance of the whole system is indirectly improved, and the vacuum adsorption device is suitable for adsorbing wafers of different sizes and specifications and improves the vacuum adsorption effect.
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Description

Technical Field

[0001] The utility model relates to the technical field of rotary vacuum air circuits, and particularly relates to a rotary air circuit device. Background Technique

[0002] The rotary vacuum air circuit is a device used to realize the vacuum adsorption and release of materials. On a high-speed moving platform, the load mass of the moving platform is an important parameter determining the dynamic performance. Minimizing the unnecessary load on the high-speed moving platform as much as possible is an important way to improve the motion performance. This solution specifically relates to a rotary air circuit device;

[0003] When the existing rotary air circuit device is in use, since the trachea structure itself cannot be twisted infinitely, a driving motor with a hollow structure in the middle is usually used. This space is used to install an air circuit slip ring for trachea connection. In many cases of use, the load on the upper rotary platform only requires a smaller specification of rotary motor. However, due to the necessary space required for installing the air circuit slip ring in the middle, the motor can only be passively selected with a larger specification to meet the space requirements of the air circuit. Content of the Utility Model

[0004] The main purpose of the utility model is to provide a rotary air circuit device, which can effectively solve the technical problems in the background technique.

[0005] To achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0006] A rotary air circuit device includes a support tabletop. A logic component is installed at the bottom of the support tabletop. The logic component includes an air circuit adapter block. The air circuit adapter block is installed at the bottom of the support tabletop. An inner ring air circuit joint and an outer ring air circuit joint are respectively installed at the top of the air circuit adapter block. A single-channel air circuit slip ring, an air pipe joint B, and a vacuum logic valve are installed at the bottom of the air circuit adapter block. An air pipe joint A is installed at the bottom of the single-channel air circuit slip ring. An air circuit plug is installed outside the air pipe joint B. An air pipe joint C is installed at the bottom of the vacuum logic valve. A U-shaped air pipe is connected and installed between the air pipe joint B and the air pipe joint C.

[0007] As a further solution of the utility model, the inner ring air circuit joint and the air pipe joint B communicate with each other through the air circuit adapter block and the inside of the single-channel air circuit slip ring. The air circuit adapter block is movably connected to the air pipe joint A through the single-channel air circuit slip ring.

[0008] As a further solution of the utility model, the outer ring air circuit joint communicates with the inside of the air pipe joint C. The air pipe joint B communicates with the inside of the air pipe joint C through the U-shaped air pipe.

[0009] As a further solution of the utility model, a adapter assembly is installed inside the support table, and the adapter assembly includes an inner ring vacuum suction cup and an outer ring vacuum air path, the inner ring vacuum suction cup is installed at the top center of the support table, the outer ring vacuum air path runs through the inside of the support table, and an outer ring vacuum suction cup A and an outer ring vacuum suction cup B are respectively installed at both ends of the top of the support table near the edge and running through the outside of the outer ring vacuum air path, and the same air path plugs are installed at both ends of the outer ring vacuum air path.

[0010] As a further solution of the utility model, the inner circle vacuum suction cup passes through the bottom of the support table and is connected to the inner circle air path joint, and the support frame on the top of the support table is higher than other planes.

[0011] As a further solution of the utility model, the outer ring vacuum air path runs through the interior of the support table and is staggered with the position of the inner ring vacuum suction cup. The middle part of the outer ring vacuum air path runs through the bottom of the support table and is connected to the outer ring air path joint.

[0012] The beneficial effects of the utility model are as follows:

[0013] By setting up logic components, one vacuum air path provides negative pressure for adsorption through the inner vacuum suction cup, and the other vacuum air path opens and closes the outer air path connector through the vacuum logic valve, which can automatically open and close the outer vacuum air path, merging the original two vacuum structures that need to be controlled separately into one lead-out control, greatly reducing the space required for the air path structure, so that smaller motors can be selected, reducing the overall load, and indirectly improving the motion performance of the entire system;

[0014] By integrating the vacuum logic valve into a single channel, the original large-sized multi-channel pneumatic slip ring is replaced, reducing the space used for the rotary air channel and reducing the motor specifications synchronously;

[0015] By setting up the adapter assembly, the wafer is placed on the support table and directly adsorbed by the inner ring vacuum suction cup. The opening and closing of the outer ring vacuum air path enables the outer ring vacuum suction cup A and the outer ring vacuum suction cup B to adsorb large-sized wafers. It is suitable for adsorbing wafers of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of a rotary gas path device of the utility model;

[0017] Figure 2 This is a schematic diagram of the structure of a logic component in a rotary gas circuit device of the utility model;

[0018] Figure 3 The utility model is a schematic diagram of the internal structure of a switching component in a rotary gas path device.

[0019] In the figure: 1. Support tabletop; 2. Logic component; 3. Adapter component; 4. Pneumatic circuit adapter block; 5. Inner ring pneumatic circuit joint; 6. Outer ring pneumatic circuit joint; 7. Single-vent pneumatic slip ring; 8. Pipe joint A; 9. Pipe joint B; 10. Pneumatic circuit plug; 11. Vacuum logic valve; 12. Pipe joint C; 13. U-shaped air pipe; 14. Inner ring vacuum suction cup; 15. Outer ring vacuum pneumatic circuit; 16. Outer ring vacuum suction cup A; 17. Outer ring vacuum suction cup B. Specific implementation mode

[0020] In order to make the technical means, creative features, achieved purposes and effects realized by the present utility model easy to understand, the present utility model will be further described below in conjunction with specific implementation modes.

[0021] As Figures 1-3 shown, a rotary pneumatic circuit device includes a support tabletop 1. A logic component 2 is installed at the bottom of the support tabletop 1. The logic component 2 includes a pneumatic circuit adapter block 4. The pneumatic circuit adapter block 4 is installed at the bottom of the support tabletop 1. An inner ring pneumatic circuit joint 5 and an outer ring pneumatic circuit joint 6 are respectively installed at the top of the pneumatic circuit adapter block 4. A single-vent pneumatic slip ring 7, a pipe joint B 9 and a vacuum logic valve 11 are installed at the bottom of the pneumatic circuit adapter block 4. A pipe joint A 8 is installed at the bottom of the single-vent pneumatic slip ring 7. A pneumatic circuit plug 10 is installed on the outside of the pipe joint B 9. A pipe joint C 12 is installed at the bottom of the vacuum logic valve 11. A U-shaped air pipe 13 is connected and installed between the pipe joint B 9 and the pipe joint C 12.

[0022] In this embodiment, the inner ring pneumatic circuit joint 5 and the pipe joint B 9 communicate with each other through the pneumatic circuit adapter block 4 and the inside of the single-vent pneumatic slip ring 7. The pneumatic circuit adapter block 4 is movably connected to the pipe joint A 8 through the single-vent pneumatic slip ring 7. The pneumatic circuit adapter block 4 and the support tabletop 1 can be rotated by a motor. The pipe joint A 8 is connected to the air source and is relatively fixed in the whole device. The pipe joint A 8 and the pneumatic circuit adapter block 4 are connected and communicate with each other through the single-vent pneumatic slip ring 7.

[0023] In this embodiment, the outer ring pneumatic circuit joint 6 communicates with the inside of the pipe joint C 12. The pipe joint B 9 communicates with the inside of the pipe joint C 12 through the U-shaped air pipe 13. The pneumatic circuit of the single-vent pneumatic slip ring 7 is divided into two parts by the pneumatic circuit adapter block 4 and is respectively connected to the inner ring pneumatic circuit joint 5 and the pipe joint B 9.

[0024] In this embodiment, a transfer component 3 is installed inside the support tabletop 1. The transfer component 3 includes an inner ring vacuum chuck 14 and an outer ring vacuum air path 15. The inner ring vacuum chuck 14 is installed at the center of the top of the support tabletop 1. The outer ring vacuum air path 15 runs through the inside of the support tabletop 1. Outer ring vacuum chucks A 16 and outer ring vacuum chucks B 17 are respectively installed at positions near the edge of the top of the support tabletop 1 and outside and at both ends of the outer ring vacuum air path 15. Air path plugs 10 of the same type are installed at both ends of the outer ring vacuum air path 15. The inner ring vacuum chuck 14 is used to adsorb wafers of small size specifications, and the outer ring vacuum chucks A 16 and outer ring vacuum chucks B 17 are used to adsorb wafers of larger size specifications. The vacuum logic valve 11 is used to identify the generated air pressure difference to open and close the outer ring air path joint 6.

[0025] In this embodiment, the inner ring vacuum chuck 14 runs through the bottom of the support tabletop 1 and is connected to the inner ring air path joint 5. The support frame on the top of the support tabletop 1 is higher than other planes. Through the connection of the inner ring air path joint 5, the air path passing through the single - air - path slip ring 7 is directly connected to the inner ring vacuum chuck 14 to provide a negative pressure environment.

[0026] In this embodiment, the outer ring vacuum air path 15 runs through the inside of the support tabletop 1 and intersects with the position of the inner ring vacuum chuck 14. The middle part of the outer ring vacuum air path 15 runs through the bottom of the support tabletop 1 and is connected to the outer ring air path joint 6. Through the connection of the outer ring air path joint 6 and the outer ring vacuum air path 15, a negative pressure environment is provided for the outer ring vacuum chucks A 16 and outer ring vacuum chucks B 17.

[0027] It should be noted that the present utility model is a rotary air path device. When in use, when a small - size wafer is placed on the support tabletop 1, by starting the vacuum air path, one vacuum air path directly provides negative pressure through the inner ring vacuum chuck 14 for adsorption, and the other vacuum air path passes through the vacuum logic valve 11 to the outer ring vacuum chucks A 16 and outer ring vacuum chucks B 17. Since these two outer ring vacuum chucks are directly connected to the atmosphere without adsorbing workpieces, the vacuum logic valve 11 generates an air pressure difference on both sides and automatically locks, preventing the vacuum air path from being directly connected to the atmosphere and causing failure. When a large - size wafer is placed on the support tabletop 1, by starting the vacuum air path, one vacuum directly provides negative pressure through the inner ring vacuum chuck 14 for adsorption, and the other passes through the vacuum logic valve 11 and is connected to the outer ring vacuum chucks A 16 and outer ring vacuum chucks B 17. Since these two outer ring vacuum chucks adsorb the wafers, the vacuum logic valve 11 cannot generate an air pressure difference on both sides to lock it, so the vacuum negative pressure of the air path will be normally conducted to adsorb the wafers.

[0028] The foregoing has shown and described the basic principles, main features, and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above-mentioned embodiments. The above-mentioned embodiments and the descriptions in the specification only illustrate the principles of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. A rotary gas path device, comprising a support table (1), a logic component (2) being installed at the bottom of the support table (1), characterized in that: The logic component (2) comprises an air circuit adapter block (4), the air circuit adapter block (4) being mounted at the bottom of the support table (1), the top of the air circuit adapter block (4) being respectively mounted with an inner ring air circuit joint (5) and an outer ring air circuit joint (6), the bottom of the air circuit adapter block (4) being mounted with a single-pass air circuit slip ring (7), an air pipe joint B (9) and a vacuum logic valve (11), the bottom of the single-pass air circuit slip ring (7) being mounted with an air pipe joint A (8), the outer side of the air pipe joint B (9) being mounted with an air circuit plug (10), the bottom of the vacuum logic valve (11) being mounted with an air pipe joint C (12), and a U-shaped air pipe (13) being connected and mounted between the air pipe joint B (9) and the air pipe joint C (12).

2. A rotary gas path device according to claim 1, characterized in that: The inner ring gas path joint (5) and the gas pipe joint B (9) are interconnected through the gas path adapter block (4) and the interior of the single-pass gas path slip ring (7), and the gas path adapter block (4) is movably connected to the gas pipe joint A (8) through the single-pass gas path slip ring (7).

3. A rotary gas path device according to claim 1, characterized in that: The outer ring gas path joint (6) is interconnected with the interior of the gas pipe joint C (12), and the gas pipe joint B (9) is interconnected with the interior of the gas pipe joint C (12) through the U-shaped gas pipe (13).

4. A rotary gas path device according to claim 1, characterized in that: An adapter assembly (3) is installed inside the support table (1), and the adapter assembly (3) includes an inner ring vacuum suction cup (14) and an outer ring vacuum air path (15). The inner ring vacuum suction cup (14) is installed at the top center of the support table (1), and the outer ring vacuum air path (15) runs through the inside of the support table (1). An outer ring vacuum suction cup A (16) and an outer ring vacuum suction cup B (17) are installed at both ends of the top of the support table (1) near the edge and running through the outside of the outer ring vacuum air path (15). Both ends of the outer ring vacuum air path (15) are installed with the same air path plug (10).

5. A rotary gas path device according to claim 4, characterized in that: The inner circle vacuum suction cup (14) passes through the bottom of the support table (1) and is connected to the inner circle air path joint (5), and the support frame at the top of the support table (1) is higher than other planes.

6. A rotary gas path device according to claim 4, characterized in that: The outer ring vacuum air path (15) runs through the interior of the support table (1) and is interlaced with the position of the inner ring vacuum suction cup (14); the middle part of the outer ring vacuum air path (15) runs through the bottom of the support table (1) and is connected to the outer ring air path connector (6).