Vacuum pump heat dissipation device, vacuum pump and semiconductor equipment

Abstract

The utility model provides a vacuum pump heat dissipation device, a vacuum pump and semiconductor equipment, and relates to the technical field of vacuum pump heat dissipation. The vacuum pump heat dissipation device comprises a liquid storage pipe, a first pin and a second pin, wherein the liquid storage pipe is filled with liquid metal which can expand with heat and contract with cold. The first pin is arranged on the liquid storage pipe and communicates with the interior of the liquid storage pipe, and the first pin is used for being electrically connected with a valve; the second pin is arranged on the liquid storage pipe and communicated with the interior of the liquid storage pipe, and the second pin is used for being electrically connected with the valve; the first pin and the second pin can be conducted through the liquid metal under the condition that the liquid metal is heated to expand, so that the valve is electrified and opened, and a circulating water path in the vacuum pump circulates and dissipates heat; and the first pin and the second pin can be disconnected under the condition that the liquid metal is cooled and retracts, so that the valve is powered off and closed, and a circulating water path in the vacuum pump is cut off to stop heat dissipation. The valve can be automatically controlled to be opened and closed according to temperature changes, and heat dissipation or heat dissipation stopping is carried out.

Description

Technical Field

[0001] The utility model relates to the technical field of vacuum pump heat dissipation, and in particular, to a vacuum pump heat dissipation device, a vacuum pump and a semiconductor device. Background Art

[0002] When a vacuum pump is working, heat is continuously generated. Relying solely on air heat exchange will cause the pump rotor and the cavity to expand and contract due to heat, resulting in pump jamming and further equipment downtime. Most of the existing vacuum pump heat dissipation relies on a temperature sensor to detect the equipment temperature. The CPU makes logical judgments and opens or closes the cooling water valve to cool the pump body, controlling the temperature within the required range. Most traditional vacuum pump heat dissipation systems mainly include three components: a temperature sensor block, a logic processing block, and an action execution block (such as a valve). The temperature sensor is placed at the position where the temperature needs to be controlled (such as the motor) and is connected to the CPU through a wire harness. Once the monitored temperature reaches the set value, the CPU issues a command to open the valve, and the water circuit starts to circulate for heat dissipation. When the temperature is lower than a certain value, the valve is turned off, and the temperature continues to rise. In this cycle, the temperature is controlled within a certain temperature range.

[0003] However, the existing vacuum pump heat dissipation system requires the cooperation of three components, none of which can be missing. Once a certain part is damaged, the entire system cannot work. Moreover, most of the existing vacuum pump heat dissipation systems have complex wiring, numerous components, require setting relevant parameters, and the actuator has a slow response. Summary of the Utility Model

[0004] The utility model provides a vacuum pump heat dissipation device which can automatically control the opening and closing of the valve according to temperature changes to dissipate heat or stop dissipating heat, so as to meet the working requirements of the vacuum pump and prevent the problem of pump jamming leading to equipment downtime. And the vacuum pump heat dissipation device has a simple structure, a fast response speed, and basically no delay.

[0005] The embodiments of the utility model can be implemented as follows:

[0006] The embodiments of the utility model provide a vacuum pump heat dissipation device, which includes:

[0007] A liquid storage pipe filled with a liquid metal that expands and contracts due to heat;

[0008] A first pin disposed on the liquid storage pipe and communicating with the inside of the liquid storage pipe, the first pin being used for electrically connecting to a valve;

[0009] A second pin disposed on the liquid storage pipe and communicating with the inside of the liquid storage pipe, the second pin being used for electrically connecting to the valve;

[0010] The first pin and the second pin can be electrically connected through the liquid metal when the liquid metal expands due to heat, so that the valve is powered on and opened, enabling the circulation water path in the vacuum pump to flow and dissipate heat.

[0011] The first pin and the second pin can be disconnected when the liquid metal cools down and retracts, so that the valve is powered off and closed, enabling the circulation water path in the vacuum pump to be shut off and stop dissipating heat.

[0012] In an alternative embodiment, the liquid storage tube is erected, and the height of the first pin is higher than that of the second pin.

[0013] In an alternative embodiment, at normal temperature, the liquid metal submerges the second pin, and the volume of the liquid metal is greater than or equal to the volume of the liquid storage tube between the first pin and the second pin.

[0014] In an alternative embodiment, the number of the first pins and the second pins is multiple, and the multiple first pins correspond to the multiple second pins one by one. Each group of the first pin and the second pin is respectively connected to a valve.

[0015] In an alternative embodiment, the vacuum pump heat dissipation device further includes a push cylinder, which is movably arranged in the liquid storage tube and near one end of the second pin; the push cylinder is used to move in the liquid storage tube to make the liquid metal rise or retract.

[0016] In an alternative embodiment, the shape of the liquid storage tube is "L" - shaped. The liquid storage tube includes a first tube and a second tube, and the first tube and the second tube are connected at a right angle; the first pin and the second pin are both arranged on the first tube, and the first pin and the second pin are arranged at intervals.

[0017] The push cylinder is arranged in the second tube.

[0018] In an alternative embodiment, the length of the push cylinder is the same as the length of the second tube.

[0019] In an alternative embodiment, the liquid metal is mercury.

[0020] An embodiment of the present invention further provides a vacuum pump, which includes a valve arranged on the circulation water path and the vacuum pump heat dissipation device in any of the above - mentioned embodiments. The first pin and the second pin are both electrically connected to the valve; when the first pin and the second pin are electrically connected, the valve is powered on and opened; when the first pin and the second pin are not electrically connected, the valve is powered off and closed.

[0021] An embodiment of the present utility model also provides a semiconductor device, including the vacuum pump described in the above embodiment.

[0022] The beneficial effects of the vacuum pump heat dissipation device, the vacuum pump and the semiconductor device according to the embodiment of the present utility model include:

[0023] The vacuum pump heat dissipation device includes a liquid storage tube, a first pin and a second pin. The liquid storage tube is filled with a liquid metal that expands and contracts with heat. Since the distance between the atoms of the liquid metal that expands and contracts with heat changes with the temperature, and the cross-sectional area of the liquid storage tube is fixed, the liquid metal will occupy different spaces in the liquid storage tube according to the temperature change. The first pin is arranged on the liquid storage tube and is in communication with the inside of the liquid storage tube, and the first pin is used for electrically connecting with the valve; the second pin is arranged on the liquid storage tube and is in communication with the inside of the liquid storage tube, and the second pin is used for electrically connecting with the valve; the first pin and the second pin can be conducted through the liquid metal when the liquid metal expands due to heat, so that the valve is powered on and opened, so that the circulating water path in the vacuum pump can circulate and dissipate heat; the first pin and the second pin can be disconnected when the liquid metal cools and retracts, so that the valve is powered off and closed, so that the circulating water path in the vacuum pump is shut off and the heat dissipation stops. By arranging the first pin and the second pin, the first pin and the second pin are respectively electrically connected with the valve, and the connection between the first pin and the second pin is conducted or blocked through the liquid metal to control the on-off of the valve, thereby realizing the on-off of the circulating water path in the vacuum pump and dissipating heat or stopping heat dissipation. That is, the vacuum pump heat dissipation device can automatically dissipate heat or stop heat dissipation according to the temperature change, without setting structures such as a temperature sensor block and a logic processing block, simplifying the structure of the entire vacuum pump heat dissipation device, and having a fast response speed. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0025] Figure 1 It is a schematic diagram of the vacuum pump heat dissipation device provided in the embodiment of the present utility model.

[0026] Icons: 1000 - Vacuum pump heat dissipation device; 100 - Liquid storage tube; 110 - First tube; 120 - Second tube; 200 - First pin; 300 - Second pin; 400 - Pusher; 500 - Liquid metal. Detailed Embodiment

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are some, but not all, of the embodiments of the present utility model. The components of the embodiments of the present utility model usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0028] Therefore, the detailed description of the embodiments of the present utility model provided in the accompanying drawings below is not intended to limit the scope of the claimed present utility model, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.

[0029] It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0030] In the description of the present utility model, it should be noted that if terms such as "upper", "lower", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, or the orientations or positional relationships in which the utility model product is customarily placed during use, it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.

[0031] In addition, terms such as "first", "second", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0032] It should be noted that, without conflict, the features in the embodiments of the present utility model can be combined with each other.

[0033] When the vacuum pump is working, it continuously generates heat. Relying solely on air heat exchange will cause the pump rotor and cavity to expand and contract due to temperature changes, jamming the pump and even leading to equipment downtime. Most existing vacuum pumps dissipate heat by using a temperature sensor to detect the equipment temperature. The CPU makes logical judgments and opens or closes the cooling water valve to cool the pump body, controlling the temperature within the required range. Most traditional vacuum pump cooling systems generally consist of three components: a temperature sensor block, a logic processing block, and an action execution block (such as a valve). The temperature sensor is placed at the position where the temperature needs to be controlled (such as the motor) and is connected to the CPU via a wire harness. Once the monitored temperature reaches the set value, the CPU issues a command to open the valve, and the water circuit starts to circulate for heat dissipation. When the temperature is lower than a certain value, the valve closes, and the temperature continues to rise. This cycle is repeated to control the temperature within a certain range. However, the existing vacuum pump cooling systems require the cooperation of these three components, none of which can be missing. Once a certain part is damaged, the entire system cannot work. Moreover, most current vacuum pump cooling systems have complex wiring, numerous components, require setting relevant parameters, and the actuator has a slow response speed.

[0034] Based on this, please refer to Figure 1 , in the embodiments of the present utility model, the vacuum pump cooling device 1000 provided can effectively solve the above-mentioned technical problems. The vacuum pump cooling device 1000 can automatically control the opening and closing of the valve according to temperature changes to dissipate heat or stop heat dissipation, so as to meet the working requirements of the vacuum pump and prevent problems such as pump jamming leading to equipment downtime. Moreover, the vacuum pump cooling device 1000 has a simple structure, a fast response speed, and basically no delay. The vacuum pump cooling device 1000 is applied to vacuum pumps and some equipment or systems including vacuum pumps. The vacuum pumps and equipment or systems with the vacuum pump cooling device 1000 have the same functions as described above, which will not be elaborated here.

[0035] A vacuum pump is a device that extracts gas from a closed container or system to create a vacuum inside. It has a wide range of applications in many fields. In the semiconductor manufacturing process, it is necessary to operate in a high-vacuum environment to avoid impurities and contamination. The vacuum pump can extract gas from the reaction chamber and processing equipment to create a high-vacuum state inside, thus ensuring the quality and stability of semiconductor manufacturing. In the chemical and pharmaceutical industries, it is necessary to create a vacuum state in the reactors and equipment for chemical reactions and pharmaceutical processes. The vacuum pump can extract gas from the reactors and equipment to create a vacuum state inside, thereby ensuring the quality and efficiency of the reactions and pharmaceuticals. In the vacuum metallurgy process, it is necessary to operate in a high-vacuum environment to avoid impurities and contamination. The vacuum pump can extract gas from the metallurgical equipment to create a high-vacuum state inside, thus ensuring the quality and stability of metallurgy. In the food and pharmaceutical industries, it is necessary to package products in a vacuum environment to extend their shelf life and prevent oxidation. The vacuum pump can extract gas from the packaging container to create a vacuum state inside, thereby ensuring the quality and safety of the products. In laboratory research, it is necessary to operate in a vacuum environment for physical, chemical, and biological experiments. The vacuum pump can extract gas from the experimental equipment to create a vacuum state inside, thus ensuring the accuracy and repeatability of the experiments. In short, vacuum pumps have a wide range of applications in many fields. They can extract gas from a closed container or system to create a vacuum inside, thereby ensuring the quality and stability of the products.

[0036] In this embodiment, a semiconductor device is provided, which includes a vacuum pump. Of course, it is not limited to semiconductor devices and can also be applied to devices in other fields, such as devices in the photovoltaic field, medical devices, etc., as long as the device uses a vacuum pump, which is not limited here.

[0037] Specifically, the vacuum pump in this embodiment (not shown in the figure) includes a valve and a vacuum pump heat dissipation device 1000 disposed on the circulating water path. Both the first pin 200 and the second pin 300 are electrically connected to the valve. When the first pin 200 and the second pin 300 are conducting, the valve is energized and opens. When the first pin 200 and the second pin 300 are not conducting, the valve is de-energized and closes. Of course, the vacuum pump also includes other structures to achieve various functions of the vacuum pump, which are not limited here.

[0038] The following provides a detailed description of the vacuum pump heat dissipation device 1000.

[0039] Figure 1 It is a schematic diagram of the vacuum pump heat dissipation device 1000 provided in the embodiment of the present utility model, as Figure 1As shown in the figure, the vacuum pump heat dissipation device 1000 in this embodiment includes a liquid storage tube 100, a first pin 200, and a second pin 300. The liquid storage tube 100 is filled with a liquid metal 500 that expands and contracts with heat. The first pin 200 is disposed in the liquid storage tube 100 and is in communication with the interior of the liquid storage tube 100. The first pin 200 is used to electrically connect to a valve. The second pin 300 is disposed in the liquid storage tube 100 and is in communication with the interior of the liquid storage tube 100. The second pin 300 is used to electrically connect to the valve. The first pin 200 and the second pin 300 can be conducted through the liquid metal 500 when the liquid metal 500 expands due to heat, so that the valve is powered on and opened, enabling the circulation water path in the vacuum pump to flow and dissipate heat. The first pin 200 and the second pin 300 can be disconnected when the liquid metal 500 cools and contracts, so that the valve is powered off and closed, enabling the circulation water path in the vacuum pump to be shut off and stop dissipating heat. The vacuum pump heat dissipation device 1000 can automatically control the opening and closing of the valve according to temperature changes to dissipate heat or stop dissipating heat. Specifically, when the temperature of the vacuum pump rises, the liquid metal 500 expands due to heat and conducts the first pin 200 and the second pin 300. The valve is powered on and opened, and the circulation water path for heat dissipation starts to flow and begins to cool down. Then, after the temperature of the vacuum pump decreases, the liquid metal 500 contracts, causing the first pin 200 and the second pin 300 to be disconnected. As a result, the valve is powered off and closed, leading to the shut-off of the circulation water path for heat dissipation, and the vacuum pump no longer dissipates heat. Therefore, when the vacuum pump continues to operate, the temperature will rise again, and this cycle continues to control the temperature of the vacuum pump within the required temperature range.

[0040] Since the distance between the atoms of the liquid metal 500 that expands and contracts with heat changes with the temperature, and the cross-sectional area of the liquid storage tube 100 is fixed and unchanged, the space occupied by the liquid metal 500 in the liquid storage tube 100 changes according to the temperature change. By setting the first pin 200 and the second pin 300, the first pin 200 and the second pin 300 are respectively electrically connected to the valve, and the connection between the first pin 200 and the second pin 300 is conducted or blocked through the liquid metal 500 to control the on-off of the valve, thereby realizing the conduction or blockage of the circulation water path in the vacuum pump and dissipating heat or stopping dissipating heat. That is, the vacuum pump heat dissipation device 1000 can automatically dissipate heat or stop dissipating heat according to temperature changes without setting structures such as a temperature sensor block and a logic processing block, simplifying the structure of the entire vacuum pump heat dissipation device 1000 and having a fast response speed.

[0041] The liquid metal 500 in this embodiment is mercury. Mercury, that is, quicksilver, is directly composed of mercury atoms. When the temperature rises, the space between mercury atoms will increase, resulting in volume expansion, that is, thermal expansion; on the contrary, when the temperature drops, the space between mercury atoms will decrease and the volume will contract, that is, cold contraction. This phenomenon is due to the change in the movement speed of mercury atoms caused by temperature changes, resulting in the change of the volume of mercury. Of course, the liquid metal 500 can also be liquid aluminum, liquid magnesium, etc., or a mixture of two or more liquid metals 500, which is determined according to the actual situation and is not limited here. The liquid metal 500 is in a liquid state at room temperature and all has the property of thermal expansion and cold contraction.

[0042] To improve the stability of the control of the vacuum pump heat dissipation device 1000, please refer to Figure 1 , in this embodiment, the liquid storage tube 100 is erected, and the height of the first pin 200 is higher than that of the second pin 300. The liquid storage tube 100 is erected. Affected by gravity to a certain extent, the liquid metal 500 will not conduct the first pin 200 and the second pin 300 at room temperature. Compared with other fluids, the liquid metal 500 has extremely high surface tension, so the movement of the liquid metal 500 will be restricted. Therefore, the liquid storage tube 100 can also be placed horizontally, which is not limited here. Of course, the height of the second pin 300 can also be set higher than that of the first pin 200, which is not limited here.

[0043] In addition, to improve the response speed, when the temperature of the vacuum pump rises, the vacuum pump heat dissipation device 1000 quickly opens the valve. In this embodiment, at room temperature, the liquid metal 500 submerges the second pin 300, and the volume of the liquid metal 500 is greater than or equal to the volume of the liquid storage tube 100 between the first pin 200 and the second pin 300. Specifically, at room temperature, the liquid metal 500 submerges the second pin 300, but the horizontal height of the liquid metal 500 does not reach the height of the first pin 200, that is, the liquid metal 500 is initially in conduction with the second pin 300 and not in conduction with the first pin 200. Furthermore, the valve is in a closed state and the vacuum pump cannot dissipate heat. And because the volume of the liquid metal 500 is greater than or equal to the volume of the liquid storage tube 100 between the first pin 200 and the second pin 300, therefore, when the liquid metal 500 expands due to heat, the liquid metal 500 will expand to the first pin 200 or beyond the horizontal height of the first pin 200, that is, conduct the first pin 200 and the second pin 300, and then the valve is opened and the vacuum pump starts to dissipate heat. Of course, at room temperature, the height of the liquid metal 500 can also be set below the position of the second pin 300, which is not limited here, as long as the liquid metal 500 can expand and conduct the first pin 200 and the second pin 300 when the temperature rises.

[0044] Since there are multiple components in the vacuum pump that generate heat, there may be multiple circulating water paths, and correspondingly, there may also be multiple valves. Therefore, in this embodiment, the number of the first pins 200 and the second pins 300 is multiple. The multiple first pins 200 correspond to the multiple second pins 300 one by one, and each group of the first pins 200 and the second pins 300 is respectively connected to a valve. That is, through the above design, a single vacuum pump heat dissipation device 1000 can automatically control the opening and closing of multiple valves according to the temperature, so as to control the heat dissipation conditions at multiple positions in the vacuum pump, simplify the structure and wiring, and also reduce the cost. Of course, a vacuum pump heat dissipation device 1000 can also be provided at each position of the component that needs heat dissipation, which is determined according to the actual situation and is not limited herein.

[0045] Please refer to Figure 1 , the vacuum pump heat dissipation device 1000 in this embodiment further includes a push cylinder 400. The push cylinder 400 is movably arranged in the liquid storage tube 100 and is close to one end of the second pin 300. The push cylinder 400 is used to move in the liquid storage tube 100 to make the liquid metal 500 rise or retract. By providing the push cylinder 400 and adjusting the pushing depth of the push cylinder 400, the temperature value required for the first pin 200 and the second pin 300 to conduct can be adjusted, thereby controlling the temperature of the vacuum pump. And in special cases, the push cylinder 400 can be completely pushed into the second tube 120 to achieve continuous conduction of the first pin 200 and the second pin 300, that is, the valve is in an open state all the time, that is, the circulating water path for heat dissipation is always in a heat dissipation working state.

[0046] For the convenience of the operator to operate the push cylinder 400, please continue to refer to Figure 1 , the shape of the liquid storage tube 100 in this embodiment is "L" - shaped. The liquid storage tube 100 includes a first tube 110 and a second tube 120, and the first tube 110 and the second tube 120 are connected at a right angle. The first pins 200 and the second pins 300 are both arranged in the first tube 110, and the first pins 200 and the second pins 300 are arranged at intervals. The push cylinder 400 is arranged in the second tube 120. That is, the push cylinder 400 is horizontally placed, which is convenient for the operator to pull out or push in the push cylinder 400 to change the liquid level height of the liquid metal 500 in the liquid storage tube 100. Of course, the liquid storage tube 100 can also be designed as a straight - cylinder type, and the push cylinder 400 is located below the liquid storage tube 100. In addition, the liquid storage tube 100 can also be designed into other shapes, as long as it can ensure that the first pin 200 and the second pin 300 conduct when the liquid metal 500 expands due to heat, and in normal cases, the first pin 200 and the second pin 300 do not conduct. The specific shape of the liquid storage tube 100 is not limited herein.

[0047] Specifically, the length of the push tube 400 in this embodiment is the same as that of the second tube 120. Of course, the length of the push tube 400 can also be shorter than that of the second tube 120. The length of the push tube 400 can be changed and is determined according to the actual required temperature, which is not limited here. When the mass of the liquid metal 500 in the liquid storage tube 100 remains unchanged, the length of the push tube 400 will affect the liquid level height of the liquid metal 500 in the liquid storage tube 100, thereby causing the liquid metal 500 to flood the first pin 200 more or less when expanding, that is, it can be controlled that the first pin 200 and the second pin 300 will conduct electricity at a temperature exceeding a certain value. Therefore, by changing the length of the push tube 400, the range of the temperature of the vacuum pump can be controlled.

[0048] According to a vacuum pump heat dissipation device 1000 provided in this embodiment, its working principle is as follows:

[0049] When the temperature of the vacuum pump rises, the liquid metal 500 in the liquid storage tube 100 expands due to heat, causing the first pin 200 and the second pin 300 to conduct electricity, so that the valve is powered on and opened, enabling the circulating water path in the vacuum pump to flow and dissipate heat; of course, when the temperature of the vacuum pump drops, the liquid metal 500 in the liquid storage tube 100 shrinks due to cold, causing the first pin 200 and the second pin 300 to be disconnected, so that the valve is powered off and closed, enabling the circulating water path in the vacuum pump to be shut off and stop dissipating heat. That is, the vacuum pump heat dissipation device 1000 can automatically control the opening and closing of the valve according to temperature changes to dissipate heat or stop dissipating heat.

[0050] In summary, the vacuum pump heat dissipation device 1000 includes a liquid storage tube 100, a first pin 200 and a second pin 300, and the liquid storage tube 100 is filled with liquid metal 500 that expands and contracts with heat. The first pin 200 is arranged in the liquid storage tube 100 and communicates with the inside of the liquid storage tube 100, and the first pin 200 is used to be electrically connected to the valve; the second pin 300 is arranged in the liquid storage tube 100 and communicates with the inside of the liquid storage tube 100, and the second pin 300 is used to be electrically connected to the valve; the first pin 200 and the second pin 300 can be connected through the liquid metal 500 when the liquid metal 500 expands due to heat, so that the valve is powered and opened, so that the circulating water path in the vacuum pump circulates and dissipates heat; the first pin 200 and the second pin 300 can be disconnected when the liquid metal 500 cools down and shrinks, so that the valve is powered off and closed, so that the circulating water path in the vacuum pump is shut off and stops dissipating heat. Since the distance between atoms of the liquid metal 500 that expands and contracts with heat will change with the change of temperature, and the cross-sectional area of ​​the liquid storage tube 100 is fixed, the space occupied by the liquid metal 500 in the liquid storage tube 100 will change according to the change of temperature. By setting the first pin 200 and the second pin 300, the first pin 200 and the second pin 300 are electrically connected to the valve respectively, and the connection between the first pin 200 and the second pin 300 is opened or blocked by the liquid metal 500 to control the opening and closing of the valve, thereby realizing the opening or blocking of the circulating water circuit in the vacuum pump, and dissipating or stopping the heat dissipation. The vacuum pump heat dissipation device 1000 can automatically dissipate or stop the heat dissipation according to the temperature change, without setting the temperature sensor block, the logic processing block and other structures, simplifying the structure of the entire vacuum pump heat dissipation device 1000, and the response speed is fast.

[0051] The above is only a specific implementation of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by any technician familiar with the technical field within the technical scope disclosed in the present invention should be included in the protection scope of the present invention.

Claims

1. A vacuum pump heat dissipation device, characterized in that: include: A liquid storage tube (100), wherein the liquid storage tube (100) is filled with liquid metal (500) that expands when heated and contracts when cooled; a first pin (200), the first pin (200) being disposed on the liquid storage tube (100) and communicating with the interior of the liquid storage tube (100), the first pin (200) being used for being electrically connected to a valve; a second pin (300), the second pin (300) being disposed on the liquid storage tube (100) and communicating with the interior of the liquid storage tube (100), the second pin (300) being used for being electrically connected to the valve; The first pin (200) and the second pin (300) can be connected through the liquid metal (500) when the liquid metal (500) expands due to heat, so that the valve is energized and opened, so that the circulating water path in the vacuum pump can circulate and dissipate heat; The first pin (200) and the second pin (300) can be disconnected when the liquid metal (500) cools down and shrinks, so that the valve is powered off and closed, so that the circulating water circuit in the vacuum pump is shut off and heat dissipation stops.

2. The vacuum pump heat dissipation device according to claim 1, characterized in that: The liquid storage tube (100) is arranged vertically, and the height of the first pin (200) is higher than the height of the second pin (300).

3. The vacuum pump heat dissipation device according to claim 2, characterized in that: Under normal temperature conditions, the liquid metal (500) submerges the second pin (300), and the volume of the liquid metal (500) is greater than or equal to the volume of the liquid storage tube (100) between the first pin (200) and the second pin (300).

4. The vacuum pump heat dissipation device according to claim 1, characterized in that: The number of the first pin (200) and the number of the second pin (300) are both multiple, and the multiple first pins (200) correspond to the multiple second pins (300) one by one, and each group of the first pin (200) and the second pin (300) is respectively connected to one of the valves.

5. The vacuum pump heat dissipation device according to claim 1, characterized in that: The vacuum pump heat dissipation device (1000) further comprises a push cylinder (400), which is movably disposed in the liquid storage tube (100) and close to one end of the second pin (300); the push cylinder (400) is used to move in the liquid storage tube (100) to make the liquid metal (500) rise or retract.

6. The vacuum pump heat dissipation device according to claim 5, characterized in that: The liquid storage tube (100) is in an "L" shape, and comprises a first tube (110) and a second tube (120), wherein the first tube (110) and the second tube (120) are connected at a right angle; the first pin (200) and the second pin (300) are both arranged on the first tube (110), and the first pin (200) and the second pin (300) are arranged at intervals; The push cylinder (400) is disposed in the second tube (120).

7. The vacuum pump heat dissipation device according to claim 6, characterized in that: The length of the push cylinder (400) is the same as the length of the second tube (120).

8. The vacuum pump heat dissipation device according to claim 1, characterized in that: The liquid metal (500) is metallic mercury.

9. A vacuum pump, characterized in that: The invention comprises a valve arranged on a circulating water circuit and a vacuum pump heat dissipation device (1000) according to any one of claims 1 to 8, wherein the first pin (200) and the second pin (300) are both electrically connected to the valve; when the first pin (200) and the second pin (300) are conductive, the valve is energized and opened; when the first pin (200) and the second pin (300) are not conductive, the valve is de-energized and closed.

10. A semiconductor device, characterized in that: Comprising the vacuum pump as claimed in claim 9.

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