Pipeline integration module, outdoor unit and heating and ventilation equipment

Abstract

According to the pipeline integration module, the outdoor unit and the heating and ventilation equipment, a flow guide concave arc face is arranged on the inner wall face of a module body, a first included angle alpha can be formed between the outer tangent line of the flow guide concave arc face and the axis of a switching opening, and alpha meets 90 degrees lt; [alpha] [lt]; when the transfer pipe is welded, molten welding flux can be filled between the outer wall face of the transfer pipe and the inner wall face of the transfer opening to form one part of a welding flux layer, and the molten welding flux can flow to the position between the flow guide concave arc face and the outer wall face of the transfer pipe. The flow guide concave cambered surface can guide the molten solder to flow in the direction away from the transfer pipe, so that the molten solder can be stacked in the solder containing space to form the other part of the solder layer, the molten solder is prevented from flowing to the inner pipe wall face of the transfer pipe to interfere with flowing of fluid, and the flow guide concave cambered surface can guide the molten solder to flow in the direction away from the transfer pipe. The situation that molten solder is accumulated at the pipe opening of the transfer pipe can be further reduced, and therefore interference of the solder layer on fluid flowing is further reduced.

Description

Technical Field

[0001] The present application relates to the technical field of heating, ventilation and air conditioning (HVAC) equipment, and particularly to a pipeline integration module, an outdoor unit and HVAC equipment. Background Art

[0002] Currently, HVAC equipment is usually composed of multiple independent components and pipeline systems. Each component needs to be connected to the pipeline system through an adapter pipe to form a circulation loop.

[0003] In the related art, the adapter pipe and the pipeline system are usually welded by a soldering process. When soldering, the solder needs to be melted into a liquid, and the melted solder fills the gap between the adapter pipe and the pipeline. However, the melted solder will flow along the inner wall of the adapter pipe, and may also migrate to the inner wall surface of the adapter pipe, hindering the stability of the fluid flow inside the adapter pipe. Summary of the Utility Model

[0004] The main object of the present application is to provide a pipeline integration module, an outdoor unit and HVAC equipment, which can solve the technical problem that when welding the adapter pipe, the melted solder migrates to the inner wall surface of the adapter pipe, resulting in hindering the stability of the heat exchange medium flow.

[0005] On the one hand, the present application provides a pipeline integration module. The pipeline integration module includes a module body, an adapter pipe and a solder layer. The module body has a receiving cavity and an adapter opening communicating with the receiving cavity. The wall surface of the module body defining the receiving cavity includes a guiding concave arc surface. The outer tangent of the guiding concave arc surface forms a first angle α with the axis of the adapter opening, and α satisfies: 90° < α < 180°. The adapter pipe is inserted into the adapter opening, and one end of the adapter pipe is located in the receiving cavity. The solder layer fills the gap between the outer wall surface of the adapter pipe and the inner wall surface of the adapter opening, and extends to connect to the guiding concave arc surface.

[0006] In some embodiments, the module body includes a convex part and a flange. The convex part has the receiving cavity, and part of the wall surface of the convex part defining the receiving cavity forms the guiding concave arc surface. The flange protrudes from the convex part, and the flange has a flange wall surface defining the adapter opening. The flange wall surface is connected to the guiding concave arc surface.

[0007] In some embodiments, part of the wall surface of the convex part defining the receiving cavity forms a transition convex arc surface. The transition convex arc surface is connected between the guiding concave arc surface and the flange wall surface, and the transition convex arc surface protrudes toward the side where the axis of the adapter opening is located.

[0008] In some embodiments, from the flange wall surface toward the guide concave arc surface, the external tangent line of the transition convex arc surface forms a second angle β with the axis of the transfer opening, and β satisfies: 90°<β<180°; and / or, the vertical distance from the transition convex arc surface to the outer wall surface of the transfer tube is d, and d satisfies: 0.1mm≤d≤6mm.

[0009] In some embodiments, along the axial direction of the adapter opening, the length of the flange wall is a, and a satisfies: 1mm≤a≤3mm; and / or, along the axial direction of the adapter opening, the insertion depth of the adapter tube from the adapter opening into the interior of the module body is b, and b satisfies: 3mm≤b≤6mm.

[0010] In some embodiments, the module body also includes a first plate body, a second plate body and a connecting layer, the first plate body has a first flat portion and a first convex portion protruding from the first flat portion, the second plate body has a second flat portion and a second convex portion protruding from the second flat portion, the first flat portion and the second flat portion are stacked, the first convex portion and the second convex portion overlap and jointly form the convex portion, and the connecting layer is connected between the first flat portion and the second flat portion.

[0011] In some embodiments, a welding seam is provided between the inner wall surface of the adapter opening and the outer wall surface of the adapter tube, and the width of the welding seam is γ along a direction perpendicular to the axis of the adapter opening, and γ satisfies: 0mm<γ≤0.1mm.

[0012] In some embodiments, a positioning portion is provided on the outer wall surface of the adapter tube, and the end surface of the adapter opening facing the positioning portion is a first end surface, and a portion of the solder layer is sandwiched between the positioning portion and the first end surface.

[0013] In some embodiments, along the axial direction of the transfer tube, the distance from the positioning portion to the first end surface is L, and L satisfies: 0.2 mm≤L≤2 mm.

[0014] In some embodiments, the transfer tube is a stainless steel tube or an aluminum tube, and a copper layer is provided at one end of the transfer tube outside the accommodating cavity; or, the transfer tube is a copper tube.

[0015] In some embodiments, the module body has a plurality of the accommodating chambers, the accommodating chambers include oil separation chambers; and / or the accommodating chambers include filter chambers.

[0016] On the other hand, the present application further provides a technical solution to solve the above technical problems as follows: an outdoor unit, whose pipeline is connected to the indoor heat exchanger of the indoor unit to form a refrigerant circulation, and the outdoor unit includes the pipeline integrated module as described above.

[0017] In addition, the present application also provides a technical solution to solve the above technical problems as follows: a heating, ventilation and air conditioning (HVAC) device, which includes the outdoor unit as described above, and an indoor unit, and a refrigerant pipeline connecting the outdoor unit and the indoor unit.

[0018] Based on the pipeline integration module, outdoor unit and HVAC device of the embodiments of the present application, at least have the following

[0019] Beneficial effects:

[0020] By setting that the wall surface of the accommodation cavity defined by the module body includes a diversion concave arc surface, and the first included angle α formed between the outer tangent of the diversion concave arc surface and the axis of the adapter opening satisfies: 90° < α < 180°, so that in the direction perpendicular to the axis of the adapter opening, the diversion concave arc surface is on one side of the adapter opening. When the adapter pipe is inserted into the adapter opening and one end of the adapter pipe is located in the accommodation cavity, a solder accommodation space can be formed between the outer wall surface of the adapter pipe and the diversion concave arc surface. When the adapter pipe is welded by the brazing process, the molten solder fills the gap between the outer wall surface of the adapter pipe and the inner wall surface of the adapter opening, and can also flow between the diversion concave arc surface and the outer wall surface of the adapter pipe, so that the molten solder will stack in the solder accommodation space, preventing the molten solder from flowing to the inner pipe wall surface of the adapter pipe to interfere with the fluid flow, and the diversion concave arc surface can also guide the molten solder to flow away from the adapter pipe, which can further reduce the accumulation of the molten solder at the pipe orifice of the adapter pipe, thereby further reducing the interference of the solder layer on the fluid flow. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained according to these drawings.

[0022] Figure 1 Schematic three-dimensional structure diagram of a pipeline integration module provided by an embodiment of the present application;

[0023] Figure 2 Cross-sectional structure diagram of a pipeline integration module provided by an embodiment of the present application;

[0024] Figure 3 Cross-sectional structure diagram of an adapter pipe inserted into an adapter opening provided by an embodiment of the present application;

[0025] Figure 4 Cross-sectional structure diagram of an adapter pipe welded to an adapter opening provided by an embodiment of the present application;

[0026] Figure 5 Explosion structure schematic diagram of a pipeline integration module provided by an embodiment of the present application;

[0027] Figure 6 Stereoscopic structure schematic diagram of an adapter pipe provided by an embodiment of the present application.

[0028] Reference numerals in the drawings:

[0029] 100. Pipeline integration module; 1. Module body; 11. Convex part; 12. Flange; 13. First plate body; 131. First flat part; 132. First convex part; 14. Second plate body; 141. Second flat part; 142. Second convex part; 15. Connection layer; 101. Accommodation cavity; 102. Adapter opening; 103. Flow guiding concave arc surface; 104. Flange wall surface; 105. Transition convex arc surface; 106. First end face; 107. Solder accommodation space; 2. Adapter pipe; 3. Solder layer; 4. Positioning part; 5. Welding ring. Detailed implementation manners

[0030] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0031] In addition, the technical solutions between the various embodiments of the present application can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions conflicts with each other or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present application.

[0032] As Figure 1 and Figure 3 shown, it is a structural schematic diagram of a pipeline integration module 100 provided by an embodiment of the present application. The pipeline integration module 100 includes a module body 1, an adapter pipe 2, and a solder layer 3 (see Figure 4 ), the module body 1 has an accommodation cavity 101 for accommodating fluid and an adapter opening 102 communicating with the accommodation cavity 101 (see Figure 5 ), the adapter pipe 2 is inserted into the adapter opening 102, and one end of the adapter pipe 2 is located inside the accommodation cavity 101. The adapter pipe 2 is welded to the adapter opening 102 by using a brazing process to fix the adapter pipe 2 to the module body 1 and form a solder layer 3.

[0033] Specifically, an accommodation cavity 101 and a connection opening 102 are formed in the module body 1 by adopting a stamping process. The contour shape of the accommodation cavity 101 is an ellipsoid similar to a rugby ball. And a connection opening 102 is formed by stamping on the wall surface of the module body 1 that defines the accommodation cavity 101, so that the connection opening 102 communicates with the accommodation cavity 101. The wall surface of the module body 1 that defines the accommodation cavity 101 can include a diversion concave arc surface 103. An included angle α can be formed between the outer tangent of the diversion concave arc surface 103 and the axis of the connection opening 102, and α satisfies: 90° < α < 180°, so that the diversion concave arc surface 103 is recessed toward the side where the axis of the connection opening 102 is located.

[0034] The adapter tube 2 is inserted into the connection opening 102, and one end of the adapter tube 2 is located in the accommodation cavity 101, so that a part of the outer wall surface of the adapter tube 2 can be disposed opposite to the diversion concave arc surface 103. Thus, a solder accommodation space 107 can be formed between the outer wall surface of the adapter tube 2 and the diversion concave arc surface 103, and the solder accommodation space 107 communicates with the gap between the outer wall surface of the adapter tube 2 and the inner wall surface of the connection opening 102.

[0035] When brazing the adapter tube 2, the solder is disposed on the outer wall surface of the adapter tube 2, and the solder is placed on the end face of the connection opening 102. Preferably, the solder is a solder ring 5. The solder ring 5 is sleeved on the adapter tube 2. The solder ring is heated, so that the molten solder will fill the gap between the outer wall surface of the adapter tube 2 and the inner wall surface of the connection opening 102. At the same time, the molten solder will also flow to form a solder layer 3 between the diversion concave arc surface 103 and the outer wall surface of the adapter tube 2, so that the molten solder will stack in the solder accommodation space 107, preventing the molten solder from flowing to the inner pipe wall surface of the adapter tube 2 under the capillary effect to interfere with the fluid flow, and preventing a partial solder layer 3 from being formed on the inner pipe wall surface of the adapter tube 2, so that the diameter of the adapter tube 2 becomes smaller and affects the fluid flow rate. And the diversion concave arc surface 103 can also guide the molten solder to flow away from the adapter tube 2, which can further reduce the accumulation of the molten solder at the pipe orifice of the adapter tube 2, thereby further reducing the interference of the solder layer 3 on the fluid flow.

[0036] Specifically, reducing the accumulation of the molten solder at the pipe orifice of the adapter tube 2 can prevent the molten solder from forming a solder layer 3 on the end face where the adapter tube 2 extends into the accommodation cavity 101. That is, along the axial direction of the adapter tube 2, the solder layer 3 does not exceed the end face of the adapter tube 2, which can reduce the resistance generated by the solder layer 3 to the fluid flow.

[0037] More specifically, when part α < 90°, part of the arc surface of the diversion concave arc surface 103 bends and extends toward the side opposite to the axis of the connection opening 102, and the angle formed between the outer tangent of part of the diversion concave arc surface 103 and the outer tangent of the inner wall surface of the connection opening 102 is an acute angle. When the molten solder flows along the inner wall surface of the connection opening 102 to the diversion concave arc surface 103, the resistance received by the molten solder is greater than the resistance received when flowing along the outer wall surface of the adapter pipe 2 to the pipe orifice of the adapter pipe 2. As a result, the molten solder cannot flow smoothly along the inner wall surface of the connection opening 102 to the diversion concave arc surface 103, but can only flow along the outer wall surface of the adapter pipe 2 to the pipe orifice of the adapter pipe 2 and accumulate there, thus disturbing the flow of the fluid.

[0038] When part α = 90°, the outer tangent of part of the diversion concave arc surface 103 is perpendicular to the outer tangent of the inner wall surface defining the connection opening 102. When the molten solder flows from the inner wall surface of the connection opening 102 to the diversion concave arc surface 103, the resistance received by the molten solder is comparable to the resistance received when flowing along the outer wall surface of the adapter pipe 2 to the pipe orifice of the adapter pipe 2. As a result, the molten solder still flows along the outer wall surface of the adapter pipe 2 to the pipe orifice of the adapter pipe 2 and accumulates there, thus also disturbing the flow of the fluid.

[0039] When 90° < part α < 180°, the angle formed between the outer tangent of the diversion concave arc surface 103 and the outer tangent of the inner wall surface defining the connection opening 102 is an obtuse angle. When the molten solder flows from the inner wall surface of the connection opening 102 to the diversion concave arc surface 103, the resistance received by the molten solder is less than the resistance received when flowing along the outer wall surface of the adapter pipe 2 to the pipe orifice of the adapter pipe 2. As a result, the molten solder can flow smoothly along the inner wall surface of the connection opening 102 to the diversion concave arc surface 103. At the same time, as the diversion concave arc surface 103 gradually moves away from the axis of the connection opening 102, the diversion concave arc surface 103 can guide the molten solder to flow away from the adapter pipe 2, which can further reduce the accumulation of the molten solder at the pipe orifice of the adapter pipe 2, thereby further reducing the interference of the solder layer 3 on the fluid flow.

[0040] Therefore, when α satisfies: 90° < α < 180°, the adapter pipe 2 and the module body 1 can be firmly connected, while reducing the interference of the solder layer 3 on the fluid flow, improving the quality and reliability of the product.

[0041] At the same time, by providing the diversion concave arc surface 103, the molten solder can be guided to flow along the inner wall surface of the accommodation cavity 101, making the inner wall surface of the accommodation cavity 101 smoother and flatter, reducing air turbulence, and reducing the flow resistance in the accommodation cavity 101.

[0042] Such as Figure 2As shown, in some embodiments, the module body 1 may include a convex portion 11 and a flange 12, and a receiving cavity 101 is formed inside the convex portion 11. The flow direction of the fluid in the receiving cavity 101, the outer contour shape of the cross-section of the receiving cavity 101 is circular, elliptical, polygonal, etc. At the same time, a guiding concave arc surface 103 may be formed on a part of the wall surface of the receiving cavity 101 defined by the convex portion 11.

[0043] The flange 12 may be disposed on the convex portion 11. The inner wall surface of the flange 12 forms a flange wall surface 104 that defines a transfer opening 102. Along the axis of the transfer opening 102, the shape of the transfer opening 102 defined by the flange wall surface 104 is circular, elliptical or polygonal, etc. The shape of the outer wall surface of the flange 12 is similar to the shape of its inner wall surface. The flange wall surface 104 may be connected to the guiding concave arc surface 103, so that the wall surface defining the transfer opening 102 can be smoothly connected to the guiding concave arc surface 103. Thus, when the molten solder is filled between the outer wall surface of the transfer pipe 2 and the inner wall surface of the transfer opening 102, it can flow smoothly to the guiding concave arc surface 103. Under the guidance of the guiding concave arc surface 103, the molten solder will gradually move away from the pipe orifice of the transfer pipe 2, preventing the molten solder from accumulating at the pipe orifice of the transfer pipe 2 and reducing the interference of the solder layer 3 on the fluid flow.

[0044] As Figure 3 and Figure 4 As shown, in some embodiments, a part of the wall surface of the receiving cavity 101 defined by the convex portion 11 can form a transition convex arc surface 105, and the transition convex arc surface 105 can be connected between the guiding concave arc surface 103 and the flange wall surface 104, so that the molten solder will flow from the flange wall surface 104 to the transition convex arc surface 105 and from the transition convex arc surface 105 to the guiding concave arc surface 103.

[0045] Combined with Figure 2 it can be seen that the transition convex arc surface 105 protrudes toward the side where the axis of the transfer opening 102 is located, so that the bending direction of the transition convex arc surface 105 is opposite to the bending direction of the guiding concave arc surface 103, and from the direction of the flange wall surface 104 toward the guiding concave arc surface 103, the transition convex arc surface 105 gradually moves away from the axis of the transfer opening 102, so that the transition convex arc surface 105 can also form a solder receiving space 107 with the outer wall surface of the transfer pipe 2. Thus, by providing the transition convex arc surface 105, the molten solder can be better guided to flow along the guiding concave arc surface 103, so that the molten solder can be stacked more smoothly in the solder receiving space 107 instead of being scattered randomly.

[0046] As Figure 3 and Figure 4As shown, in some embodiments, the angle formed by the external tangent line of the transition convex arc surface 105 and the axis of the transfer opening 102 is a second angle β, and the second angle β is an obtuse angle like the first angle α, and because the transition convex arc surface 105 is convex toward the side where the axis of the transfer opening 102 is located, and the second angle β gradually decreases from the flange wall surface 104 toward the flow guide concave arc surface 103, the molten solder encounters very little resistance in the process of flowing from the flange wall surface 104 to the transition convex arc surface 105, and the molten solder can flow smoothly to the transition convex arc surface 105, Afterwards, as the second angle β gradually becomes smaller, the vertical distance d from the transition convex arc surface 105 to the axis of the adapter opening 102 will gradually increase, so that the cross-sectional area of ​​the solder accommodating space 107 formed by the transition convex arc surface 105 and the outer wall surface of the adapter tube 2 will gradually increase. Therefore, as the molten solder continues to flow into the solder accommodating space 107, the solder accommodating space 107 can also have enough space to accommodate the molten solder, which can prevent the molten solder from quickly filling the solder accommodating space 107 and reduce the accumulation of molten solder at the pipe mouth of the adapter tube 2.

[0047] Furthermore, since the bending direction of the guide concave arc surface 103 is opposite to the bending direction of the transition convex arc surface 105, and the angle of the first angle α from the flange wall 104 toward the guide concave arc surface 103 will gradually increase, the resistance encountered by the molten solder in the process of flowing along the guide concave arc surface 103 will become smaller and smaller, so that the molten solder can flow more and more smoothly on the guide concave arc surface 103, so that the outer surface of the solder layer 3 formed on the guide concave arc surface 103 will be very smooth, which can reduce the turbulence in the accommodating cavity 101, thereby reducing the influence of the solder layer 3 located in the accommodating cavity 101 on the fluid.

[0048] Of course, in the process of gradually increasing the first angle α from the flange wall 104 toward the flow guide concave arc surface 103, it is necessary to satisfy that the first angle α is always less than 180°, and in the process of gradually decreasing the second angle β, the value range of β needs to satisfy: 90°<β<180°. It should be noted that the value range of β needs to satisfy: 90°<β<180°. The same is true for the above-mentioned α satisfying: 90°<α<180°, which will not be repeated here, and the vertical distance from the flow guide concave arc surface 103 to the axis of the adapter opening 102 will also gradually increase, so that the cross-sectional area of ​​the solder accommodating space 107 can gradually increase.

[0049] Combination Figure 3, the vertical distance from the transitional convex arc surface 105 to the outer wall surface of the adapter pipe 2 is d, and the vertical distance from the diversion concave arc surface 103 to the outer wall surface of the adapter pipe 2 is also d. d needs to satisfy: 0.1mm ≤ d ≤ 6mm. Because the width of the weld seam between the flanging wall surface 104 and the outer wall surface of the adapter pipe 2 is generally 0.1mm, if d is less than 0.1mm, it will cause the distance between the transitional convex arc surface 105 and the outer wall surface of the adapter pipe 2 to be less than the gap between the flanging wall surface 104 and the outer wall surface of the adapter pipe 2, making the molten solder unable to flow into the solder accommodation space 107. When d is greater than 6mm, it will cause the formed accommodation cavity 101 to be too large, which is not conducive to the fluid flow in the pipeline integration module 100.

[0050] As Figure 3 and Figure 4 shown, in some embodiments, along the axis direction of the adapter opening 102, the length of the flanging wall surface 104 can be a. Preferably, the value range of a satisfies: 1mm ≤ a ≤ 3mm, so that the flanging 12 can define the adapter opening 102, and the length of the flanging 12 is not too long, which is convenient for installing other components, and the length of the flanging 12 is not too short, so that the adapter opening 102 has sufficient structural strength.

[0051] At the same time, along the axis of the adapter opening 102, the insertion depth of the adapter pipe 2 into the module body 1 from the adapter opening 102 is b. Preferably, the value range of b satisfies: 3mm ≤ b ≤ 6mm, which can make the insertion depth of the adapter pipe 2 into the module body 1 greater than the length of the flanging wall surface 104. It can also be said that one end of the adapter pipe 2 inserted into the module body 1 will extend to be opposite to the diversion concave arc surface 103, so that the outer wall surface of the adapter pipe 2 can form a solder accommodation space 107 with the diversion concave arc surface 103, and b less than 6mm can prevent the flow resistance in the accommodation cavity 101 from being too large due to the excessive insertion depth of the adapter pipe 2 into the module body 1.

[0052] Therefore, the value range of b satisfies: 3mm ≤ b ≤ 6mm, which can make the molten solder stack in the solder accommodation space 107, and can also prevent the flow resistance in the accommodation cavity 101 from being too large.

[0053] As Figures 3 to 5 shown, in some embodiments, the module body 1 may further include a first plate body 13, a second plate body 14 and a connection layer 15.

[0054] Specifically, both the first plate body 13 and the second plate body 14 can be stainless steel plates. The first plate body 13 can have a first flat portion 131 and a first convex portion 132 protruding from the first flat portion 131. The first flat portion 131 refers to the part of the first plate body 13 that is arranged in a plane, and the first convex portion 132 refers to the part that protrudes from this plane.

[0055] Similarly, the second plate body 14 may have a second flat portion 141 and a second convex portion 142 protruding from the second flat portion 141. The second flat portion 141 refers to the portion of the second plate body 14 that is arranged as a flat plate, while the second convex portion 142 refers to the portion that protrudes relative to the flat plate structure of the second plate body 14. When the first plate body 13 and the second plate body 14 are covered together, the first flat portion 131 and the second flat portion 141 are stacked, that is, along the direction perpendicular to the first flat portion 131 and the second flat portion 141, the projection of the first flat portion 131 coincides with the projection of the second flat portion 141, and the first convex portion 132 and the second convex portion 142 protrude in opposite directions, so that the first convex portion 132 and the second convex portion 142 can be covered and jointly form the convex portion 11.

[0056] The connecting layer 15 is connected between the first flat portion 131 and the second flat portion 141. In this embodiment, solder can be disposed between the first flat portion 131 and the second flat portion 141. After the solder is heated and melted, a solder layer 3 is formed between the first flat portion 131 and the second flat portion 141. At this time, the solder layer 3 is the connecting layer 15, which can firmly connect the first flat portion 131 and the second flat portion 141 together, making the structure of the pipeline integration module 100 more firm.

[0057] As Figure 3 and Figure 4 shown, in some embodiments, a weld seam may be provided between the inner wall surface of the transfer opening 102 and the outer wall surface of the transfer pipe 2. Along the direction perpendicular to the axis of the transfer opening 102, the width of the weld seam may be γ, where the value range of γ satisfies: 0mm < γ ≤ 0.1mm. γ being greater than 0mm allows the molten solder to enter between the inner wall surface of the transfer opening 102 and the outer wall surface of the transfer pipe 2, while γ being less than or equal to 0.1mm can prevent the weld seam from being too wide. If the weld seam is too wide, it may cause too much molten solder to flow into the accommodation cavity 101, thus blocking the transfer pipe 2.

[0058] Therefore, when the value range of γ satisfies: 0mm < γ ≤ 0.1mm, the molten solder can be filled between the inner wall surface of the transfer opening 102 and the outer wall surface of the transfer pipe 2, and too much molten solder can be prevented from flowing into the accommodation cavity 101.

[0059] As Figure 5 and Figure 6 shown, in some embodiments, the outer wall surface of the transfer pipe 2 may be provided with a positioning portion 4. The positioning portion 4 may be a convex point protruding outward from the outer wall surface of the transfer pipe 2, or may be a convex ring protruding outward from the outer wall surface of the transfer pipe 2.

[0060] The end face of the transfer opening 102 facing the positioning portion 4 can be the first end face 106, and the plane where the first end face 106 is located is perpendicular to the axis of the transfer opening 102. Solder can be arranged on the lower side of the positioning portion 4 and the solder is in close contact with the first end face 106. After automated welding, the solder melts, and the molten solder will flow into the space between the inner wall surface of the transfer opening 102 and the outer wall surface of the transfer pipe 2 to form part of the solder layer 3. The solder layer 3 connects the transfer pipe 2 and the transfer opening 102. By arranging the positioning portion 4 on the outer wall surface of the transfer pipe 2, it is convenient to place the solder, so that the solder can be clamped at the welding position before welding, and the solder can be prevented from shaking during the welding process, which may cause the welding to be insecure.

[0061] As Figure 4 shown, in some embodiments, along the axial direction of the transfer pipe 2, the distance between the positioning portion 4 and the first end face 106 is L, that is to say, the perpendicular distance from the positioning portion 4 to the first end face 106 is L, and the value range of L satisfies: 0.2mm ≤ L ≤ 2mm. Since the caliber of the transfer opening 102 and the diameter of the transfer pipe 2 are mutually matched, the transfer pipe 2 can be inserted into the transfer opening 102, so there is a certain gap between the inner wall surface of the transfer opening 102 and the outer wall surface of the transfer pipe 2, and a certain amount of molten solder is required to fill this gap.

[0062] When L is less than 0.2mm, the distance between the positioning portion 4 and the first end face 106 is too small, resulting in too small a volume of solder that can be clamped between the positioning portion 4 and the first end face 106. During welding, the molten solder may not be able to fill the gap between the outer wall surface of the transfer pipe 2 and the inner wall surface of the transfer opening 102, resulting in insecure welding and possible leakage.

[0063] When L is greater than 2mm, the distance between the positioning portion 4 and the first end face 106 is too large, resulting in the need for more solder to clamp the solder between the positioning portion 4 and the first end face 106. However, too much molten solder, after filling the gap between the outer wall surface of the transfer pipe 2 and the inner wall surface of the transfer opening 102 and filling the solder accommodation space 107, there will still be molten solder flowing along the guiding concave arc surface 103 into the accommodation cavity 101, forming turbulent bumps in the accommodation cavity 101, which will increase the flow resistance in the accommodation cavity 101.

[0064] Therefore, when the value range of L satisfies: 0.2mm ≤ L ≤ 2mm, the solder can be firmly clamped between the positioning portion 4 and the first end face 106, and the molten solder can fill the gap between the outer wall surface of the transfer pipe 2 and the inner wall surface of the transfer opening 102, and after the solder accommodation space 107 is filled with molten solder, there will be no excess molten solder flowing along the guiding concave arc surface 103 into the accommodation cavity 101.

[0065] In some embodiments, the adapter pipe 2 can be one of a stainless steel pipe or an aluminum pipe. When the adapter pipe 2 is a stainless steel pipe, a copper layer can be provided at one end of the adapter pipe 2 outside the accommodation cavity 101. More specifically, a copper layer can be plated on the outer wall surface of the adapter pipe 2, or a copper pipe sleeve can be sleeved at the end of the adapter pipe 2, and it can be connected to the refrigerant pipe through the copper layer. When the adapter pipe 2 is an aluminum pipe, similarly, a copper layer can be provided at one end of the adapter pipe 2 outside the accommodation cavity 101, and the copper layer can make the connection between the adapter pipe 2 and the refrigerant pipe more firm.

[0066] In other embodiments, the adapter pipe 2 can be directly a copper pipe, and the connection between the adapter pipe 2 and the refrigerant pipe can be more firm through direct connection.

[0067] As Figure 1 and Figure 5 shown, in some embodiments, the module body 1 can have a plurality of accommodation cavities 101, and each accommodation cavity 101 communicates with at least one adapter opening 102 to facilitate the smooth entry and exit of fluid.

[0068] Specifically, the first plate body 13 can be provided with a plurality of first convex portions 132, and the second plate body 14 can be provided with a plurality of second convex portions 142. When the first plate body 13 and the second plate body 14 are covered together, they can jointly form a plurality of independent convex portions 11, and a complete accommodation cavity 101 is defined inside each convex portion 11. Among them, the accommodation cavity 101 can include at least one of an oil separation cavity and a filtration cavity.

[0069] More specifically, according to actual needs, the accommodation cavity 101 can be an oil separation cavity, a filtration cavity or a cavity with other specific functions. The oil in the mixed fluid can be separated in the oil separation cavity, and the impurities in the fluid can be removed in the filtration cavity to increase the purity of the fluid.

[0070] The embodiment of the present application also provides an outdoor unit, and the outdoor unit includes the pipeline integration module 100 as described above. The pipeline integration module 100 of the outdoor unit is connected to the indoor heat exchanger through pipelines to form a refrigerant cycle.

[0071] The beneficial effects of the outdoor unit in the present application are the same as those of the pipeline integration module 100 in the present application, and will not be elaborated here.

[0072] The embodiment of the present application also provides a heating and ventilation equipment, including the outdoor unit as described above, and further including an indoor unit forming a refrigerant cycle and a refrigerant pipeline connecting the outdoor unit and the indoor unit.

[0073] The beneficial effects of the heating and ventilation equipment in the present application are the same as those of the pipeline integration module 100 in the present application, and will not be elaborated here.

[0074] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components; in the description of this application, it should be understood that if there are terms such as "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship, it is based on the orientation or positional relationship shown in the accompanying drawings. This is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the accompanying drawings are only for illustrative purposes and cannot be construed as a limitation of this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0075] The above are only the preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of this application shall be included in the protection scope of this application.

Claims

1. A pipeline integrated module, characterized in that: include: The module body has a receiving cavity and a transfer opening connected to the receiving cavity, wherein the wall surface of the receiving cavity defined by the module body includes a flow-guiding concave arc surface, and a first angle α is formed between the outer tangent line of the flow-guiding concave arc surface and the axis of the transfer opening, and α satisfies: 90°<α<180°; A transfer tube, inserted into the transfer opening, and one end of the transfer tube is located in the accommodating cavity; The solder layer fills the gap between the outer wall surface of the transfer tube and the inner wall surface of the transfer opening, and extends to connect to the concave guide arc surface.

2. The pipeline integrated module according to claim 1, characterized in that: The module body comprises: A convex portion having the accommodating cavity, wherein a portion of the wall surface of the accommodating cavity is defined by the convex portion to form the flow-guiding concave arc surface; The flange is convexly arranged on the convex portion, and the flange has a flange wall surface defining the transfer opening, and the flange wall surface is connected to the guide concave arc surface.

3. The pipeline integrated module according to claim 2, characterized in that: The convex portion defines a portion of the wall surface of the accommodating cavity to form a transition convex arc surface, the transition convex arc surface is connected between the guide concave arc surface and the flange wall surface, and the transition convex arc surface is convexly arranged toward the side where the axis of the transfer opening is located.

4. The pipeline integrated module according to claim 3, characterized in that: From the flange wall toward the concave guide arc surface, the outer tangent line of the transition convex arc surface forms a second angle β with the axis of the transition opening, and β satisfies: 90°<β<180°; and / or, The vertical distance from the transition convex arc surface to the outer wall surface of the transfer tube is d, and d satisfies: 0.1mm≤d≤6mm.

5. The pipeline integrated module according to claim 2, characterized in that: Along the axial direction of the transition opening, the length of the flange wall is a, and a satisfies: 1mm≤a≤3mm; and / or, Along the axial direction of the adapter opening, the insertion depth of the adapter tube from the adapter opening into the interior of the module body is b, and b satisfies: 3mm≤b≤6mm.

6. The pipeline integrated module according to claim 2, characterized in that: The module body also includes: A first plate body having a first flat portion and a first convex portion convexly disposed on the first flat portion; A second plate body has a second flat portion and a second convex portion convexly disposed on the second flat portion, wherein the first flat portion and the second flat portion are stacked, and the first convex portion and the second convex portion overlap and jointly form the convex portion; The connection layer is connected between the first flat portion and the second flat portion.

7. The pipeline integrated module according to claim 1, characterized in that: A welding seam is provided between the inner wall surface of the adapter opening and the outer wall surface of the adapter tube. The width of the welding seam is γ along a direction perpendicular to the axis of the adapter opening, and γ satisfies: 0mm<γ≤0.1mm.

8. The pipeline integrated module according to claim 1, characterized in that: A positioning portion is provided on the outer wall surface of the adapter tube, and the end surface of the adapter opening facing the positioning portion is a first end surface, and a portion of the solder layer is sandwiched between the positioning portion and the first end surface.

9. The pipeline integrated module according to claim 8, characterized in that: Along the axial direction of the transfer tube, the distance from the positioning portion to the first end surface is L, and L satisfies: 0.2 mm≤L≤2 mm.

10. The pipeline integrated module according to claim 1, characterized in that: The transfer tube is a stainless steel tube or an aluminum tube, and a copper layer is provided at one end of the transfer tube outside the accommodating cavity; or, The transfer tube is a copper tube.

11. The pipeline integrated module according to claim 1, characterized in that: The module body has a plurality of the accommodating cavities; The accommodating chamber includes an oil separation chamber; and / or, The accommodating cavity includes a filter cavity.

12. An outdoor unit, whose pipeline is connected to the indoor heat exchanger of the indoor unit to form a refrigerant cycle, characterized in that: A pipeline integrated module comprising any one of claims 1-11.

13. A HVAC equipment, characterized in that: It comprises the outdoor unit as claimed in claim 12, and an indoor unit, and a refrigerant pipe connecting the outdoor unit and the indoor unit.

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