Heat dissipation structure of computer case

Abstract

The utility model relates to the technical field of heat dissipation of computer cases, and particularly discloses a heat dissipation structure of a computer case. Comprising a box body, a radiator and a fan, the radiator is fixedly connected to the box body, a heat conduction copper plate is fixedly connected to the side, located on the box body, of the radiator, and the fan is fixedly connected into a case and right faces the heat conduction copper plate. The utility model has the following beneficial effects: the radiator and the fan are arranged in the box body, so that the box body is better cooled, and cold air circulates in the box body; the heat conduction copper plate is arranged in the box body, and the copper fins are arranged outside the box body, so that the temperature in the box body can be better conducted, and the box body can be better cooled.

Description

Technical Field

[0001] The utility model relates to the technical field of computer chassis heat dissipation, and specifically discloses a computer chassis heat dissipation structure. Background Art

[0002] It is a common phenomenon that a computer chassis generates heat. Appropriate heat generation is normal, but overheating may cause problems such as system instability and hardware damage. Most chassis designs are not conducive to air circulation, which limits the heat dissipation effect. Especially for low-end chassis, they are often designed to be short and lack sufficient fans or heat dissipation channels.

[0003] The heat dissipation of the existing chassis often uses a single fan to dissipate heat from the components inside the chassis. However, the heat dissipation effect is often unsatisfactory. When high-performance CPUs, graphics cards and other hardware run large games, video editing software or other application programs that require a large amount of computing resources for a long time, relying solely on the fan for cooling results in a slow cooling effect, which is not obvious and easily leads to computer crashes. Content of the Utility Model

[0004] To solve the above problems, the utility model discloses a computer chassis heat dissipation structure, which is realized through the following technical solutions.

[0005] A computer chassis heat dissipation structure includes a box body, a radiator and a blower. The top and bottom of the box body are evenly provided with air exhaust ports. On one side of the top plate of the box body inside the box, blowers are symmetrically fixed in the front, back, left and right directions. On one side of the bottom plate of the box body inside the box, blowers are symmetrically fixed in the front, back, left and right directions. The right side of the box body is evenly provided with air exhaust ports. On one side of the right side plate of the box body inside the box, a blower is fixed. The center of the front side of the box body is fixedly connected with a radiator. On one side of the radiator located in the box body, a first heat-conducting copper plate is fixedly connected. On the first heat-conducting copper plate, a second heat-conducting copper plate corresponding to the blower is fixedly connected.

[0006] Further, the radiator includes a heat dissipation shell, a semiconductor refrigeration sheet and a heat dissipation fan. The semiconductor refrigeration sheet is fixedly connected to the rear side of the heat dissipation shell, and the first heat-conducting copper plate is fixedly connected to the rear side of the semiconductor refrigeration sheet. The heat dissipation fan is fixedly connected inside the heat dissipation shell and is located in front of the semiconductor refrigeration sheet.

[0007] Further, a filtering dust-proof net is magnetically attracted to the air exhaust port.

[0008] Further, the heat-conducting copper plate is provided with evenly distributed air inlet holes.

[0009] Further, the bottom of the box body is fixedly connected with support feet, and the bottom of the support feet is fixedly connected with anti-slip pads.

[0010] Further, copper fins are fixedly connected to the front and rear sides of the box body.

[0011] The technical solution provided by the present utility model has the following beneficial effects compared with the known public technologies: By arranging a radiator and a fan inside the box body, the box body can be better cooled to make cold air circulate inside the box body; By arranging a heat-conducting copper plate inside the box body and copper fins outside the box body, the temperature inside the box body can be better conducted, so as to better dissipate the heat of the box body. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solution of the present utility model, the drawings required for use in the description of the specific embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0013] Figure 1 Isometric view of a computer chassis heat dissipation structure according to the present utility model;

[0014] Figure 2 Cross-sectional view of a computer chassis heat dissipation structure according to the present utility model;

[0015] Figure 3 Half cross-sectional view of the chassis according to the present utility model;

[0016] Figure 4 Cross-sectional view of the radiator according to the present utility model.

[0017] The reference numerals are as follows: 1. Box body; 11. Air outlet; 12. First heat-conducting copper plate; 13. Second heat-conducting copper plate; 14. Filter dust screen; 15. Air inlet hole; 16. Support feet; 17. Copper fins; 2. Radiator; 21. Heat dissipation shell; 22. Semiconductor refrigeration sheet; 23. Heat dissipation fan; 3. Fan. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts belong to the scope of protection of the present utility model.

[0019] As Figures 1-4As shown in the figure, the utility model provides a technical solution: a heat dissipation structure for a computer case, which includes a case body 1, a radiator 2 and a fan 3. The top and bottom of the case body 1 are evenly provided with air vents 11. On one side of the top plate of the case body 1 inside the case, fans 3 are symmetrically fixed in the front, back, left and right directions. On one side of the bottom plate of the case body 1 inside the case, fans 3 are symmetrically fixed in the front, back, left and right directions. The right side of the case body 1 is evenly provided with air vents 11. On one side of the right side plate of the case body 1 inside the case, a fan 3 is fixed. The center of the front side of the case body 1 is fixedly connected with a radiator 2. On one side of the radiator 2 located on the case body 1, a first heat conducting copper plate 12 is fixedly connected. On the first heat conducting copper plate 12, a second heat conducting copper plate 13 corresponding to the fan 3 is fixedly connected.

[0020] Preferably, the radiator 2 includes a heat dissipation shell 21, a semiconductor refrigeration sheet 22 and a heat dissipation fan 23. The semiconductor refrigeration sheet 22 is fixedly connected to the rear side of the heat dissipation shell 21. The first heat conducting copper plate 12 is fixedly connected to the rear side of the semiconductor refrigeration sheet 22. The heat dissipation fan 23 is fixedly connected inside the heat dissipation shell 21, and the heat dissipation fan 23 is located on the front side of the semiconductor refrigeration sheet 22.

[0021] By arranging the radiator 2 on the case body 1, the low temperature on the semiconductor refrigeration sheet 22 is conducted to the heat conducting copper plate, so that the hot air in the case contacts the heat conducting copper plate, the hot air is cooled, and then the computer components in the case are cooled.

[0022] Preferably, a filter dust-proof net 14 is magnetically attracted on the air vent 11.

[0023] By arranging the filter dust-proof net 14 on the air vent 11, dust and fluff in the air are blocked, and the filter dust-proof net 14 can be removed at any time for cleaning to prevent dust from getting stuck in the mesh holes and affecting the heat dissipation of the case.

[0024] Preferably, the heat conducting copper plate is provided with evenly distributed air inlet holes 15.

[0025] By arranging the air inlet holes 15 on the heat conducting copper plate, the contact area between the heat conducting copper plate and the air in the case is increased, the air in the case can be better cooled, and it is convenient for the fan 3 to blow the external air through the heat conducting copper plate for cooling and then blow it into the case to dissipate heat from the case.

[0026] Preferably, the bottom of the case body 1 is fixedly connected with support feet 16, and anti-slip pads are fixedly connected to the bottoms of the support feet 16.

[0027] The anti-slip pads make the case body 1 not easy to slide when placed on a slippery surface, so as to play a role in protecting the case body 1.

[0028] Preferably, copper fins 17 are fixedly connected to the front and rear sides of the case body 1.

[0029] The copper fins 17 fixedly connected to the case body 1 can help the case body 1 better conduct heat, so as to dissipate heat from the case.

[0030] A specific embodiment of the present utility model is as follows:

[0031] When performing chassis heat dissipation activities, when the temperature of the chassis is on the high side, the fan inside the chassis is turned on to allow the air inside the chassis to circulate with the external air, thereby cooling the temperature of the electronic components inside the chassis. When the temperature of the chassis is too high, the radiator 2 is started, and the semiconductor refrigeration sheet 22 starts to work. The side of the semiconductor refrigeration sheet 22 close to the inside of the box will absorb heat, thereby cooling the heat-conducting copper plate. The air inside the chassis will come into contact with the heat-conducting copper plate and cool itself. The fan 3 will also drive the external air to blow towards the electronic components through the air inlet on the heat-conducting copper plate, so as to cool the electronic components inside the box. The side of the semiconductor refrigeration sheet 22 close to the outside of the box will dissipate heat, and the heat will be discharged outside the box through the heat dissipation fan 23 on the radiator 2.

[0032] The preferred embodiments of the present utility model disclosed above are only used to help illustrate the present utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the present utility model to only the specific embodiments. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification in order to better explain the principle and practical application of the present utility model, so that those skilled in the relevant technical field can well understand and utilize the present utility model. The present utility model is only limited by the claims and their full scope and equivalents.

Claims

1. A computer case heat dissipation structure, characterized in that: The invention comprises a box body (1), a radiator (2) and a fan (3), wherein the top and bottom of the box body (1) are evenly provided with exhaust ports (11), the top plate of the box body (1) is located on one side of the box body and is symmetrically fixed to the fan (3) in front and back, left and right directions, the bottom plate of the box body (1) is located on one side of the box body and is symmetrically fixed to the fan (3) in front and back, left and right directions, the right side of the box body (1) is evenly provided with exhaust ports (11), the right side plate of the box body (1) is located on one side of the box body and is fixed to the fan (3), the front center of the box body (1) is fixedly provided with the radiator (2), the side of the radiator (2) located in the box body (1) is fixedly provided with a first heat-conducting copper plate (12), and the first heat-conducting copper plate (12) is fixedly provided with a second heat-conducting copper plate (13) corresponding to the fan (3) is fixedly provided on the first heat-conducting copper plate (12).

2. A computer case heat dissipation structure according to claim 1, characterized in that: The heat sink (2) comprises a heat dissipation shell (21), a semiconductor cooling sheet (22) and a heat dissipation fan (23); the semiconductor cooling sheet (22) is fixedly connected to the rear side of the heat dissipation shell (21); the first heat-conducting copper plate (12) is fixedly connected to the rear side of the semiconductor cooling sheet (22); the heat dissipation shell (21) has a heat dissipation fan (23) fixedly connected therein; and the heat dissipation fan (23) is located at the front side of the semiconductor cooling sheet (22).

3. A computer case heat dissipation structure according to claim 1, characterized in that: The air outlet (11) is provided with a filtering dust-proof net (14) magnetically attracted thereto.

4. A computer case heat dissipation structure according to claim 1, characterized in that: The heat-conducting copper plate is provided with evenly distributed air inlet holes (15).

5. The computer case heat dissipation structure according to claim 1, characterized in that: The bottom of the box body (1) is fixedly connected to a support foot (16), and the bottom of the support foot (16) is fixedly connected to an anti-slip pad.

6. A computer case heat dissipation structure according to claim 1, characterized in that: Copper fins (17) are fixedly connected to the front and rear sides of the box body (1).

Images