Integrated copper clamp and power module

Abstract

The utility model provides an integrated copper clamp and a power module, and the integrated copper clamp comprises a plurality of copper clamp single bodies which are arranged at intervals. The connecting parts are in butt joint between every two adjacent copper clamp single bodies, so that the copper clamp single bodies and the connecting parts form an integrated structure; wherein the connecting part is arranged in a raised manner towards the direction of one side, far away from the copper clamp single body for connection, of the copper clamp single body. According to the layout design of the integrated copper clamp structure provided by the utility model, the structure is more stable and reliable, and the overall reliability of the power module can be improved at the same time.

Description

Technical Field

[0001] The utility model relates to the technical field of power modules, in particular to an integrated copper clip and a power module. Background Art

[0002] Currently, the signal lines inside the power module are mainly led out by bonding wires. It is found that the bonding wires are prone to detachment or breakage during the use of the power module. In addition, when the chips in the same phase inside the module lead out the signal lines in series through multiple bonding wires, if a bonding wire of a certain chip breaks, there is currently no non-destructive detection method to detect it. Only when all the bonding wires break, the Vds signal (differential signal) of the power module will jitter. The breakage of the bonding wires has a great impact on the short-circuit ability of the module.

[0003] In the power module, the source electrodes of the parallel chips are connected by wire bonding. The more the number of wire bonds, the lower the parasitic impedance of the drive circuit and the lower the risk of gate oscillation. Therefore, in the short-circuit condition of the power module, if any bonding wire breaks, it will cause an increase in the parasitic impedance of the drive circuit. Especially in the short-circuit condition, the influence brought by gate oscillation will be amplified, increasing the short-circuit failure risk of the power module. That is to say, there is a probability that the gate signal will not be able to turn off the module normally due to gate signal oscillation, thus causing the module to be damaged. Summary of the Utility Model

[0004] In view of the above-mentioned disadvantages of the prior art, the purpose of the present utility model is to provide an integrated copper clip and a power module, which are used to solve the problem in the prior art that if any bonding wire breaks in the power module, it will cause an increase in the parasitic impedance of the drive circuit. Especially in the short-circuit condition, the influence brought by gate oscillation will be amplified, increasing the short-circuit failure risk of the power module.

[0005] To achieve the above purpose and other related purposes, the present utility model provides an integrated copper clip, including: copper clip monomers, a plurality of copper clip monomers are arranged at intervals; and a connecting part, the connecting part is docked between two adjacent copper clip monomers to form an integrated structure by the copper clip monomers and the connecting part; wherein, the connecting part bulges towards the direction away from the side for connection of the copper clip monomer.

[0006] In an embodiment of the present utility model, the copper clip monomer is a lower-bridge copper clip.

[0007] In an embodiment of the present utility model, the copper clip monomer includes: a lower bridge middle part; a first lower bridge connecting part, which is arranged on the first side of the lower bridge middle part; and a second lower bridge connecting part, a plurality of second lower bridge connecting parts are arranged on the second side of the lower bridge middle part opposite to the first side; wherein, the first lower bridge connecting part, the lower bridge middle part and the second lower bridge connecting part are connected integrally in sequence, and the lower bridge middle part bulges towards the direction away from the first lower bridge connecting part and the second lower bridge connecting part.

[0008] In an embodiment of the present utility model, the connecting part includes: a lower bridge middle connecting piece, which is butted between adjacent lower bridge middle parts to form an integral lower bridge middle part; a first lower bridge connecting piece, which is butted between adjacent first lower bridge connecting parts to form an integral first lower bridge connecting part; and a second lower bridge connecting piece, which is butted between adjacent second lower bridge connecting parts to form an integral second lower bridge connecting part; wherein, the lower bridge middle connecting piece, the first lower bridge connecting piece and the second lower bridge connecting piece all bulge towards the side away from the first lower bridge connecting part and the second lower bridge connecting part.

[0009] In an embodiment of the present utility model, the copper clip monomer is an upper bridge copper clip.

[0010] In an embodiment of the present utility model, the copper clip monomer includes: a confluence copper piece, a plurality of confluence copper pieces are integrally connected through a connecting part to form an integral confluence structure; and a bridging copper piece, one end of the bridging copper piece is connected to the corresponding end of the confluence copper piece to form an integral bridging structure.

[0011] In an embodiment of the present utility model, the confluence copper piece includes: an upper bridge middle part; a first upper bridge connecting part, which is arranged on the first side of the upper bridge middle part, and one end of the bridging copper piece is integrally connected to the first upper bridge connecting part; and a second upper bridge connecting part, which is arranged on the second side of the upper bridge middle part opposite to its first side; wherein, the upper bridge middle part bulges towards the direction away from the first upper bridge connecting part and the second upper bridge connecting part, and the first upper bridge connecting part, the upper bridge middle part and the second upper bridge connecting part are connected integrally in sequence.

[0012] In an embodiment of the present utility model, the connecting part includes: an upper bridge middle connecting piece, which is butted between adjacent upper bridge middle parts to form an integral upper bridge middle part; and a first upper bridge connecting piece, which is butted between adjacent second upper bridge connecting parts to form an integral first upper bridge connecting part; wherein, the upper bridge middle connecting piece and the first upper bridge connecting piece both bulge towards the direction away from the first upper bridge connecting part and the second upper bridge connecting part.

[0013] In an embodiment of the present utility model, the bridging copper piece is a convex structure with its middle bulging towards the side away from its two ends for connection.

[0014] The present utility model further provides a power module, which includes the aforementioned integrated copper clip; and further includes: a substrate; and a chip disposed on the substrate; the copper clip monomers of the integrated copper clip are connected to the substrate and the chip, and the connecting portion of the integrated copper clip bulges away from the substrate and the chip to maintain an insulating distance therebetween and the chip.

[0015] In an embodiment of the present utility model, when the copper clip monomer is a lower-bridge copper clip, the first lower-bridge connecting portion of the copper clip monomer is connected to the substrate, and the second lower-bridge connecting portion of the copper clip monomer is connected to the chip.

[0016] In an embodiment of the present utility model, when the copper clip monomer is an upper-bridge copper clip, the first upper-bridge connecting portion of the copper clip monomer is connected to the substrate, the second upper-bridge connecting portion of the copper clip monomer is connected to the chip, and the middle of the bridging copper piece of the copper clip monomer straddles the groove on the substrate and its two ends are respectively connected to the substrate.

[0017] Advantages of the present utility model: For the integrated copper clip and the power module proposed by the present utility model, through the integrated copper design of the copper clip monomer and the connecting portion, and also adopting an integrated design for the confluence copper piece and the bridging copper piece, it can realize leading out the internal signal lines of the module by using the connecting portion integrated with the copper clip monomer, thereby canceling the bonding wires between the chips, making the corresponding structure more stable and reliable, and at the same time, it can also improve the overall reliability of the power module. Description of the Drawings

[0018] Figure 1 It is a schematic structural diagram of the lower-bridge copper clip of a preferred embodiment of the present utility model.

[0019] Figure 2 Shown is the present utility model Figure 1 A schematic structural diagram from another perspective.

[0020] Figure 3 It is a schematic structural diagram of the upper-bridge copper clip of a preferred embodiment of the present utility model.

[0021] Figure 4 Shown is the present utility model Figure 3 A schematic structural diagram from another perspective.

[0022] Figure 5 It is a schematic structural diagram of the power module of a preferred embodiment of the present utility model.

[0023] Description of Component Labels

[0024] Copper clip monomer 1; connecting portion 2; lower bridge middle portion 11a; first lower bridge connecting portion 12a; second lower bridge connecting portion 13a; lower bridge middle connecting member 21a; first lower bridge connecting member 22a; second lower bridge connecting member 23a; integral lower bridge middle portion 110a; integral first lower bridge connecting portion 120a; integral second lower bridge connecting portion 130a; confluence copper piece 11b; cross-connecting copper piece 12b; integral cross-connecting structure 130b; integral confluence structure 140b; upper bridge middle portion 111b; first upper bridge connecting portion 112b; second upper bridge connecting portion 113b; integral upper bridge middle portion 110b; upper bridge middle connecting member 21b; first upper bridge connecting member 22b; substrate 10; chip 20. Detailed implementation mode

[0025] The following uses specific specific examples to illustrate the implementation mode of the present utility model. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. The present utility model can also be implemented or applied through other different specific implementation modes. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present utility model. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0026] It should be noted that the diagrams provided in the following embodiments only illustrate the basic concept of the present utility model in a schematic manner. Therefore, only the components related to the present utility model are shown in the diagrams, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and ratio of each component in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0027] In the following description, a large number of details are explored to provide a more thorough explanation of the embodiments of the present invention. However, it is obvious to those skilled in the art that the embodiments of the present invention can be implemented without these specific details. In other embodiments, well-known structures and devices are shown in the form of block diagrams rather than in detail to avoid making the embodiments of the present invention difficult to understand.

[0028] Please refer to Figures 1-4 , the integral copper clip provided by the present utility model includes: a copper clip monomer 1, and a plurality of copper clip monomers 1 are arranged at intervals; and a connecting portion 2, and the connecting portion 2 is butted between two adjacent copper clip monomers 1 so that the copper clip monomer 1 and the connecting portion 2 form an integral structure; wherein, the connecting portion 2 bulges in the direction away from the side for connection of the copper clip monomer 1.

[0029] It is not difficult to find from the above that in the integrated copper clip layout design structure of the present utility model, according to the design of the AMB (active metal brazing) substrate of the power module and the chip 20, a plurality of copper clip monomers 1 can be provided. And when establishing a connection between the copper clip monomers 1, by using the integral molding between the connecting portion 2 and the copper clip monomer 1, an integral copper clip monomer 1 and the connecting portion 2 are formed. In order to further ensure the corresponding parallel connection effect of the connecting portion 2 on the connection area on the copper clip monomer 1, when the connecting portion 2 establishes a connection with each copper clip monomer 1, the connecting portion 2 is in a shape bulging to one side. Thus, when connecting the corresponding side for connection on the copper clip monomer 1 to the AMB substrate and the chip 20, the connecting portion 2 will not contact the chip 20 or the AMB copper layer and other structures on the lower side, thereby ensuring the insulation distance. Specifically, when the copper clip monomer 1 is connected to the AMB substrate and the chip 20, a sintering process can be used for connection. Of course, connection can also be made by other means.

[0030] As Figure 1 and 2 shown, the copper clip monomer 1 is a lower bridge copper clip.

[0031] Furthermore, the copper clip monomer 1 includes: a lower bridge middle portion 11a; a first lower bridge connecting portion 12a, the first lower bridge connecting portion 12a being provided on the first side of the lower bridge middle portion 11a; and a second lower bridge connecting portion 13a, a plurality of second lower bridge connecting portions 13a being provided on the second side of the lower bridge middle portion 11a opposite to the first side; wherein, the first lower bridge connecting portion 12a, the lower bridge middle portion 11a and the second lower bridge connecting portion 13a are connected integrally in sequence, and the lower bridge middle portion 11a bulges in a direction away from the first lower bridge connecting portion 12a and the second lower bridge connecting portion 13a.

[0032] In an embodiment of the present utility model, when the copper clip monomer 1 serves as the lower bridge copper clip, in its integrated structure, it includes a lower bridge middle part 11a, a first lower bridge connection part 12a, and a second lower bridge connection part 13a. Among them, the first lower bridge connection part 12a and the second lower bridge connection part 13a are respectively butted on both sides of the lower bridge middle part 11a, and the lower surfaces of the first lower bridge connection part 12a and the second lower bridge connection part 13a respectively correspond to the sides for connecting the AMB substrate and the chip 20. Since there are several chips 20 corresponding to one copper clip monomer 1, the number of the second lower bridge connection parts 13a also corresponds to that of the chips 20. Moreover, in order to ensure an insulating distance between the lower bridge middle part 11a and the AMB copper layer as well as the chip 20, the lower bridge middle part 11a is in a shape bulging towards the first lower bridge connection part 12a and the second lower bridge connection part 13a. Specifically, the lower bridge middle part 11a can be in a "C" shape, with the first lower bridge connection part 12a connected to one end of the "C" shape and the second lower bridge connection part 13a connected to the other end. Of course, the lower bridge middle part 11a can also be in other shapes that can achieve separation from the AMB copper layer and the chip 20.

[0033] Specifically, the connection part 2 includes: a lower bridge middle connecting piece 21a, which is butted between adjacent lower bridge middle parts 11a to form an integrated lower bridge middle part 110a; a first lower bridge connecting piece 22a, which is butted between adjacent first lower bridge connection parts 12a to form an integrated first lower bridge connection part 120a; and a second lower bridge connecting piece 23a, which is butted between adjacent second lower bridge connection parts 13a to form an integrated second lower bridge connection part 130a. Among them, the lower bridge middle connecting piece 21a, the first lower bridge connecting piece 22a, and the second lower bridge connecting piece 23a all bulge towards the side away from the first lower bridge connection part 12a and the second lower bridge connection part 13a.

[0034] In an embodiment of the present utility model, when the connecting portion 2 is docked with the copper clip monomer 1, the adjacent two copper clip monomers 1 are connected through the lower bridge intermediate connecting member 21a, the first lower bridge connecting member 22a, and the second lower bridge connecting member 23a. Specifically, the end sides of the lower bridge intermediate portions 11a of the adjacent two copper clip monomers 1 are connected through the lower bridge intermediate connecting member 21a, so as to form an integrated lower bridge intermediate portion 110a. Moreover, the lower bridge intermediate connecting member 21a can have the same "C" shape structure as the lower bridge intermediate portion 11a to ensure the convenience during integrated molding and the insulation isolation from the AMB copper layer and the chip 20 respectively. The first lower bridge connecting member 22a can connect the end sides of the adjacent two first lower bridge connecting portions 12a, so as to form an integrated first lower bridge connecting portion 120a. In order to ensure the insulation isolation between the integrated first lower bridge connecting portion 120a and the AMB copper layer, the first lower bridge connecting portion 12a is in a raised shape, such as a "C" shape, etc. The second lower bridge connecting member 23a can connect the end sides of the adjacent two second lower bridge connecting portions 13a, so as to form an integrated second lower bridge connecting portion 130a. In order to ensure the insulation isolation between the second lower bridge connecting member 23a and the chip 20, the second lower bridge connecting member 23a can be designed in a raised shape. Specifically, the area close to the chip 20 can be designed as a sunken shape that bulges to one side, such as a hemispherical concave shape. Specifically, the raised height of the second lower bridge connecting member 23a can be set to be greater than 0.3 mm.

[0035] As Figure 3 and 4 shown, the copper clip monomer 1 is an upper bridge copper clip.

[0036] Furthermore, the copper clip monomer 1 includes: a merging copper piece 11b, and a plurality of merging copper pieces 11b are integrally connected through the connecting portion 2 to form an integrated merging structure body 140b; and a bridging copper piece 12b, one end of the bridging copper piece 12b is connected to the corresponding end of the merging copper piece 11b to form an integrated bridging structure body 130b.

[0037] In an embodiment of the present utility model, when the copper clip unit 1 is an upper bridge copper clip, in its integrated structure, it is composed of a merging copper piece 11b and a bridging copper piece 12b. The merging copper pieces 11b are integrally connected through the connecting portion 2. Specifically, the merging copper piece 11b is equivalent to a Source clip, that is, a copper piece for merging the power currents of multiple parallel chips. The bridging copper piece 12b is equivalent to a Clip T (Clip Trans-conduct), which is a copper piece for power current bridging. Since the AMB substrate can only be designed by layout through upper layer etching, Clip T is required for bridging at the intersection points of different paths.

[0038] Specifically, the confluence copper part 11b includes: an upper bridge middle part 111b; a first upper bridge connection part 112b, which is arranged on the first side of the upper bridge middle part 111b, and one end of the bridging copper part 12b is integrally connected to the first upper bridge connection part 112b; and a second upper bridge connection part 113b, which is arranged on the second side of the upper bridge middle part 111b opposite to its first side; wherein, the upper bridge middle part 111b bulges in the direction away from the first upper bridge connection part 112b and the second upper bridge connection part 113b, and the first upper bridge connection part 112b, the upper bridge middle part 111b and the second upper bridge connection part 113b are connected in sequence integrally.

[0039] In an embodiment of the present utility model, in terms of its composition, the confluence copper part 11b mainly includes an upper bridge middle part 111b, a first upper bridge connection part 112b and a second upper bridge connection part 113b. Among them, the first upper bridge connection part 112b and the second upper bridge connection part 113b are respectively butted on both sides of the upper bridge middle part 111b, and the lower surfaces of the first upper bridge connection part 112b and the second upper bridge connection part 113b respectively correspond to the sides for connecting the AMB substrate and the chip 20. Since there are several chips 20 connected to one copper clip monomer 1, the second upper bridge connection part 113b also has the same number as the chips 20. Moreover, in order to ensure an insulating distance between the upper bridge middle part 111b and the AMB copper layer as well as the chip 20, the upper bridge middle part 111b is in a shape that bulges towards the first upper bridge connection part 112b and the second upper bridge connection part 113b. Specifically, the upper bridge middle part 111b can be in a "C" shape, with the first upper bridge connection part 112b connected to one end of the "C" shape and the second upper bridge connection part 113b connected to the other end. Of course, the upper bridge middle part 111b can also be in other shapes that can achieve separation from the AMB copper layer and the chip 20.

[0040] Furthermore, the connection part 2 includes: an upper bridge middle connecting piece 21b, which is butted between adjacent upper bridge middle parts 111b to form an integral upper bridge middle part 110b; and a first upper bridge connecting piece 22b, which is butted between adjacent second upper bridge connection parts 113b to form an integral first upper bridge connection part 120b; wherein, both the upper bridge middle connecting piece 21b and the first upper bridge connecting piece 22b bulge in the direction away from the first upper bridge connection part 112b and the second upper bridge connection part 113b.

[0041] In an embodiment of the present utility model, when the connecting portion 2 connects the confluent cylinder body 11b to form an integrated confluent structure 140b, the adjacent upper bridge intermediate portions 111b are connected through the upper bridge intermediate connecting piece 21b, thereby forming an integrated upper bridge intermediate portion 110b. The adjacent second upper bridge connecting portions 113b are connected through the first upper bridge connecting portion 22b, and then an integrated first upper bridge connecting portion 120b is formed. Moreover, in order to achieve the insulation isolation between the upper bridge intermediate connecting piece 21b, the AMB copper layer, and the chip 20, the upper bridge intermediate connecting piece 21b can be designed in a "C" shape corresponding to the upper bridge intermediate portion 111b. Similarly, in order to achieve the insulation isolation between the first upper bridge connecting piece 22b and the chip 20, the first upper bridge connecting piece 22b can also be designed in a "C" shape. Of course, the upper bridge intermediate connecting piece 21b and the first upper bridge connecting piece 22b can also be in other shapes that can achieve the insulation isolation between the upper bridge intermediate connecting piece 21b, the first upper bridge connecting piece 22b, the AMB copper layer, and the chip 20. Specifically, the raised height of the first upper bridge connecting piece 22b is greater than 0.3 mm.

[0042] Preferably, the bridging copper piece 12b is a convex structure with the middle bulging towards the side away from the two ends for its connection. That is to say, the middle of the bridging copper piece 12b corresponds to the AMB copper layer. Therefore, by designing the middle of the bridging copper piece 12b to be bulging, the middle of the bridging copper piece 12b can also achieve insulation isolation from the AMB copper layer below it.

[0043] As Figure 5 shown, the present utility model also provides a power module, including the aforementioned integrated copper clamp; further including: a substrate 10; and a chip 20 disposed on the substrate 10; the copper clamp monomer 1 of the integrated copper clamp is connected to the substrate 10 and the chip 20, and the connecting portion 2 of the integrated copper clamp bulges towards the direction away from the substrate 10 and the chip 20 to maintain an insulation distance between it and the substrate 10 and the chip 20.

[0044] In an embodiment of the present utility model, in the power module formed by encapsulating with the integrated copper clamp, the copper clamp monomer 1 is connected to the substrate 10 (which can be an AMB substrate) and the chip 20 through a connection process such as a sintering process. In order for the connecting portion 2 to form an insulation distance from the substrate 10 and the chip 20, the connecting portion 2 needs to be designed on the side away from the substrate 10 and the chip 20, and the connecting portion 2 and the substrate 10 and the chip 20 are designed to have a certain insulation distance.

[0045] Further, when the copper clamp monomer 1 is a lower bridge copper clamp, the first lower bridge connecting portion 12a of the copper clamp monomer 1 is connected to the substrate 10, and the second lower bridge connecting portion 13a of the copper clamp monomer 1 is connected to the chip 20.

[0046] In an embodiment of the present utility model, when connecting the copper clip monomer 1, which serves as the lower bridge copper clip, to the substrate 10 and the chip 20, the four-parallel or six-parallel first lower bridge connection portions 12a on one side of the lower bridge middle portion 11a (i.e., a parallel structure formed by four or six first lower bridge connection portions 12a) are connected to the substrate 10 through a connection process such as a sintering process, and the second lower bridge connection portion 13a on the other side of the lower bridge middle portion 11a is connected to the chip 20 through a connection process such as a sintering process. Moreover, after the first lower bridge connection portion 12a and the second lower bridge connection portion 13a connect the substrate 10 and the chip 20, the bulge formed by the second lower bridge connecting member 23a keeps a certain insulation distance from the chip 20, the bulge formed by the first lower bridge connecting member 22a keeps a certain insulation distance from the substrate 10, and the bulge formed by the lower bridge middle portion 11a and the lower bridge middle connecting member 21a keeps a certain insulation distance from the substrate 10.

[0047] Furthermore, when the copper clip monomer 1 is an upper bridge copper clip, the first upper bridge connection portion 112b of the copper clip monomer 1 is connected to the substrate 10, the second upper bridge connection portion 113b of the copper clip monomer 1 is connected to the chip 20, and the middle of the bridging copper piece 12 of the copper clip monomer 1 straddles the groove on the substrate 10 and its two ends are respectively connected to the substrate 10.

[0048] In an embodiment of the present utility model, when connecting the copper clip monomer 1, which serves as the upper bridge copper clip, to the substrate 10 and the chip 20, the four-parallel or six-parallel first upper bridge connection portions 112b on one side of the upper bridge middle portion 111b (i.e., a parallel structure formed by four or six first upper bridge connection portions 112b) are connected to the substrate 10 through a connection process such as a sintering process, the second upper bridge connection portion 113b on the other side of the upper bridge middle portion 111b is connected to the chip 20 through a connection process such as a sintering process, and then the two ends of the bridging copper piece 12a connected to one side of the first upper bridge connection portion 112b are connected to the substrate 10 through a connection process such as a sintering process.

[0049] Please refer to Figure 5In a preferred embodiment, a chip 20, an upper bridge copper clip, and a lower bridge copper clip are provided on a substrate 10, i.e., an AMB substrate. Among them, the lower bridge copper clip corresponds to being connected to the upper half of the substrate 10 through, for example, a sintering process. Specifically, the lower bridge copper clip is composed of two copper clip monomers 1 and a connecting portion 2. In the upper half of the substrate 10, 6 chips 20 (two groups, 3 in each group), that is, the chips are connected in parallel six by six, are arranged. Three second upper bridge connecting portions 13a are provided on one copper clip monomer 1 and connected to the chips. The first upper bridge connecting portion 12a is connected to the substrate 10 through a sintering process. The upper bridge copper clip corresponds to the lower half of the substrate 10. Specifically, it is composed of two copper clip monomers 1 and a connecting portion 2. Among them, three second upper bridge connecting portions 113b are provided on the confluence copper piece 11b of each copper clip monomer 1, and the 6 chips 20 on the substrate 10 are connected to the second upper bridge connecting portions 113b through a sintering process, that is, the chips are connected in parallel six by six. The first upper bridge connecting portion 112b on the confluence copper piece 11b is connected to the substrate 10 through a sintering process. The bridging copper piece 12b integrally connected to the confluence copper piece 11b is welded to the substrate 10 at both ends, and the middle is in a raised shape.

[0050] It should be noted that the integrated clip of the chip includes the chips connected in parallel four by four and the chips connected in parallel six by six. Among them, for the chips connected in parallel four by four, there are four chips both on the upper bridge and the lower bridge. For the chips connected in parallel six by six, there are six chips both on the upper bridge and the lower bridge. Of course, it is not limited to the above situation, and other chip parallel connection situations are also possible. In the wire bonding package and the integrated clip package under the chips connected in parallel four by four, the ESL and ESR of the integrated clip package in the overall circuit can be improved. In terms of the power circuit, the influence on di / dt (the derivative of current with respect to time) and dv / dt (the derivative of voltage with respect to time) is very small, and the voltage spike and switching oscillation will not deteriorate.

[0051] Furthermore, under the chips connected in parallel four by four and six by six, the integrated copper clip is also superior to the original design scheme in which two Sourceclips are connected by three aluminum wire bonds in terms of stray inductance. The switching losses Eon and Eoff of the integrated clip package can also reach the corresponding levels of the wire bonding package. Under the same switching boundaries (temperature / bus voltage / switching current / drive parameters), the waveforms of the integrated clip package can be kept consistent with those of the wire bonding package, and the switching losses of the integrated clip package can be further reduced compared with the wire bonding package. Therefore, the new integrated clip package scheme is superior to the wire bonding package scheme in terms of electrical performance. Similarly, the integrated copper clip design scheme is also superior to the adopted wire bonding package scheme in terms of current sharing characteristics.

[0052] In summary, in the present utility model, by integrally forming between the copper clip monomer 1 and the connecting portion 2, and making the connecting portion 2 bulge outward from the substrate 10 and the chip 20 to form the upper bridge copper clip and the lower bridge copper clip, the copper clip structure can be made more stable and reliable, and the overall reliability of the power module can be improved. It solves the problems such as the wire bonding points falling off and the wire bonds breaking more easily in the production process due to the wire bonding connection form, thereby reducing the production scrap rate. Therefore, the present utility model effectively overcomes various disadvantages in the prior art and has high industrial utilization value.

[0053] The above embodiments are merely illustrative of the principles and effects of the present utility model, and are not intended to limit the present utility model. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present utility model. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present utility model should still be covered by the claims of the present utility model.

Claims

1. An integrated copper clip, characterized in that: include: A copper clip monomer (1), wherein a plurality of the copper clip monomers (1) are arranged at intervals; as well as A connecting portion (2), the connecting portion (2) being butt-jointed between two adjacent copper clip monomers (1) so that the copper clip monomers (1) and the connecting portion (2) form an integrated structure; Wherein, the connecting portion (2) is arranged to be raised in a direction away from a side of the copper clip unit (1) used for connection.

2. The integrated copper clip according to claim 1, characterized in that: The copper clip monomer (1) is a lower bridge copper clip.

3. The integrated copper clip according to claim 2, characterized in that: The copper clip monomer (1) comprises: a middle portion of the lower bridge (11a); A first lower bridge connection portion (12a), the first lower bridge connection portion (12a) being arranged on a first side of the lower bridge middle portion (11a); and A second lower bridge connection portion (13a), wherein a plurality of the second lower bridge connection portions (13a) are arranged on a second side of the lower bridge middle portion (11a) opposite to the first side; The first lower bridge connection portion (12a), the lower bridge middle portion (11a) and the second lower bridge connection portion (13a) are sequentially connected as one, and the lower bridge middle portion (11a) bulges in a direction away from the first lower bridge connection portion (12a) and the second lower bridge connection portion (13a).

4. The integrated copper clip according to claim 3, characterized in that: The connecting portion (2) comprises: A lower bridge middle connecting piece (21a), wherein the lower bridge middle connecting piece (21a) is butt-jointed between adjacent lower bridge middle parts (11a) to form an integrated lower bridge middle part (110a); A first lower bridge connection member (22a), wherein the first lower bridge connection member (22a) is butt-jointed between adjacent first lower bridge connection portions (12a) to form an integrated first lower bridge connection portion (120a); and A second lower bridge connection member (23a), wherein the second lower bridge connection member (23a) is butt-jointed between adjacent second lower bridge connection portions (13a) to form an integrated second lower bridge connection portion (130a); Wherein, the lower bridge intermediate connecting member (21a), the first lower bridge connecting member (22a) and the second lower bridge connecting member (23a) all bulge in a direction away from the first lower bridge connecting portion (12a) and the second lower bridge connecting portion (13a).

5. The integrated copper clip according to claim 1, characterized in that: The copper clip monomer (1) is an upper bridge copper clip.

6. The integrated copper clip according to claim 5, characterized in that: The copper clip monomer (1) comprises: A converging copper piece (11b), wherein a plurality of the converging copper pieces (11b) are integrally connected via the connecting portion (2) to form an integral converging structure (140b); and A bridging copper piece (12b), one end of which is connected to a corresponding end of the converging copper piece (11b) to form an integrated bridging structure (130b).

7. The integrated copper clip according to claim 6, characterized in that: The converging copper piece (11b) comprises: the middle part of the upper bridge (111b); A first upper bridge connection portion (112b), the first upper bridge connection portion (112b) being arranged on a first side of the upper bridge middle portion (111b), and one end of the bridging copper piece (12b) being integrally connected to the first upper bridge connection portion (112b); and A second upper bridge connection portion (113b), the second upper bridge connection portion (113b) being arranged on a second side of the upper bridge middle portion (111b) opposite to the first side thereof; The upper bridge middle portion (111b) bulges in a direction away from the first upper bridge connection portion (112b) and the second upper bridge connection portion (113b), and the first upper bridge connection portion (112b), the upper bridge middle portion (111b) and the second upper bridge connection portion (113b) are sequentially connected as one.

8. The integrated copper clip according to claim 7, characterized in that: The connecting portion (2) comprises: An upper bridge middle connecting piece (21b), the upper bridge middle connecting piece (21b) being butt-jointed between adjacent upper bridge middle parts (111b) to form an integrated upper bridge middle part (110b); and A first upper bridge connection member (22b), wherein the first upper bridge connection member (22b) is butt-jointed between adjacent second upper bridge connection portions (113b) to form an integrated first upper bridge connection portion (120b); Wherein, the upper bridge intermediate connecting member (21b) and the first upper bridge connecting member (22b) both bulge in a direction away from the first upper bridge connecting portion (112b) and the second upper bridge connecting portion (113b).

9. The integrated copper clip according to claim 6, characterized in that: The bridging copper piece (12b) is a convex structure with a middle portion protruding toward one side away from the two ends for connection.

10. A power module, characterized in that: The integrated copper clip comprises any one of claims 1 to 9; and further comprises: a substrate (10); and A chip (20), wherein the chip (20) is disposed on the substrate (10); The copper clip unit (1) of the integrated copper clip is connected to the substrate (10) and the chip (20), and the connecting portion (2) of the integrated copper clip is raised in a direction away from the substrate (10) and the chip (20) so as to maintain an insulation distance between the connecting portion (2) and the substrate (10) and the chip (20).

11. The power module according to claim 10, characterized in that: When the copper clip monomer (1) is a lower bridge copper clip, the first lower bridge connection portion (12a) of the copper clip monomer (1) is connected to the substrate (10), and the second lower bridge connection portion (13a) of the copper clip monomer (1) is connected to the chip (20).

12. The power module according to claim 10, characterized in that: When the copper clip monomer (1) is an upper bridge copper clip, the first upper bridge connection portion (112b) of the copper clip monomer (1) is connected to the substrate (10), the second upper bridge connection portion (113b) of the copper clip monomer (1) is connected to the chip (20), and the middle portion of the bridging copper piece (12b) of the copper clip monomer (1) spans the groove on the substrate (10) and the two ends thereof are respectively connected to the substrate (10).

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