Double-radio-frequency simulation butterfly laser

Abstract

The utility model relates to a double radio frequency simulation butterfly laser, which is characterized in that two radio frequency interfaces are oppositely distributed on the side surface of a tube shell, a ceramic circuit board is respectively arranged at the two radio frequency interfaces in the tube shell, and each ceramic circuit board is provided with a first high-frequency microstrip line and a laser chip electrically connected with the first high-frequency microstrip line; each radio frequency interface is electrically connected with the first high-frequency microstrip line on the same side with the radio frequency interface through a second high-frequency microstrip line, and a triangular reflecting prism and an optical fiber array are arranged between the two laser chips in the tube shell. Light emitted by the two laser chips is turned by 90 degrees through the two total reflection slopes of the triangular reflection prism and then is coupled into two optical fibers of the optical fiber array, and the optical fibers extend out of the tube shell through a fiber outlet in the side wall of the tube shell. The beneficial effects are that signal attenuation is reduced, gain is increased, high-frequency performance is excellent, two radio frequency heads can be connected because of the two radio frequency interfaces, that is, two paths of lasers are arranged in one same tube shell, and layout space is greatly reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of optical radio frequency conversion devices, and particularly relates to a dual-radio-frequency analog butterfly laser. Background Technique

[0002] The structure of the existing analog butterfly laser is as Figure 1 shown, which includes: a package. One side of the package is provided with a radio frequency interface. A TEC cooler is fixed inside the package. A tungsten copper heat sink is fixed on the TEC cooler. A ceramic circuit board is fixed on the tungsten copper heat sink. The ceramic circuit board has a first high-frequency microstrip line and a laser chip. The radio frequency interface is electrically connected to the first high-frequency microstrip line through a second high-frequency microstrip line. One end of the first high-frequency microstrip line far from the second high-frequency microstrip line turns 90° and is electrically connected to the laser chip. The bare optical fiber at the end of the optical fiber is fixed on the tungsten copper heat sink through a kovar tube and a kovar bracket. A collimating lens, an optical isolator and a focusing lens are sequentially arranged between the laser chip and the bare optical fiber on the tungsten copper heat sink. When a radio frequency head is externally connected to the radio frequency interface, an external radio frequency signal enters the first high-frequency microstrip line through the second high-frequency microstrip line, then turns 90° in the first high-frequency microstrip line and enters the laser chip. The laser chip converts the radio frequency signal into a corresponding optical signal. Finally, the optical signal emitted by the laser chip enters the bare optical fiber through the collimating lens, the optical isolator and the focusing lens in sequence. This solution has the following defects:

[0003] 1) The radio frequency signal turns 90° in the first high-frequency microstrip line, resulting in impedance discontinuity. At the same time, the length of the first high-frequency microstrip line is relatively long, the signal attenuation is large, and the high-frequency performance is poor;

[0004] 2) Since the first high-frequency microstrip line turns 90°, the sizes of the ceramic circuit board, the tungsten copper heat sink and the TEC cooler are large, and the overall cost is high;

[0005] 3) The optical path is equipped with a collimating lens and a focusing lens, and multiple couplings are required during assembly, which complicates the process and results in a high overall cost;

[0006] 4) Since the first high-frequency microstrip line turns 90°, the length of the bare optical fiber is small, and the stress of welding with the housing is large, resulting in an unstable optical path;

[0007] 5) This analog butterfly laser only has one radio frequency interface, so only one radio frequency head can be connected. Content of the Utility Model

[0008] The technical problem to be solved by the utility model is to provide a dual-radio-frequency analog butterfly laser to overcome the above deficiencies in the prior art.

[0009] The technical solution of the present utility model to solve the above technical problems is as follows: A dual-radio-frequency analog butterfly laser, comprising: a package, on the side of the package, two radio-frequency interfaces are provided in a relatively distributed manner, inside the package, a ceramic circuit board is provided at each of the two radio-frequency interfaces, each ceramic circuit board has a first high-frequency microstrip line and a laser chip electrically connected to the first high-frequency microstrip line, each radio-frequency interface is electrically connected to the first high-frequency microstrip line on its same side through a second high-frequency microstrip line, inside the package, a triangular reflection prism and an optical fiber array are arranged between the two laser chips, the light emitted by the two laser chips is turned by 90° after passing through the two total reflection inclined surfaces of the triangular reflection prism and then coupled into two optical fibers of the optical fiber array, and the optical fiber extends out of the package through the fiber outlet on the side wall of the package.

[0010] The beneficial effects of the present utility model are as follows:

[0011] When an external radio-frequency head is connected to each radio-frequency interface, an external radio-frequency signal enters the first high-frequency microstrip line through the second high-frequency microstrip line, and then enters the laser chip through the first high-frequency microstrip line. The laser chip converts the radio-frequency signal into a corresponding optical signal. Finally, the optical signal emitted by each laser chip is turned by 90° after passing through the total reflection inclined surface of the triangular reflection prism and then coupled into one optical fiber of the optical fiber array;

[0012] Adopting a 90-degree optical path turning design, that is, the first high-frequency microstrip line on the ceramic circuit board where the laser chip is located does not need a 90° corner, which solves the impedance discontinuity caused by the 90° corner of the first high-frequency microstrip line in the prior art. At the same time, the length of the first high-frequency microstrip line is greatly shortened, the signal attenuation is reduced, the gain is improved, and the high-frequency performance is excellent. The bandwidth can be increased from the current 20G to 25G. Introducing the triangular reflection prism into the optical path effectively reduces the optical path length. Since the first high-frequency microstrip line does not need a 90° corner, the size of the ceramic circuit board can be reduced, thereby reducing costs;

[0013] The kovar tube and the kovar bracket are cancelled and an optical fiber array is adopted, which can make the optical path more stable. Since there are two radio-frequency interfaces, two radio-frequency heads can be connected, that is, two lasers are built in the same package, greatly reducing the layout space. Since the butterfly laser generally uses 2, 4, 8 and other channels, two lasers sharing one package can save expensive packages, and the processes such as parallel capping and leak testing can double the production capacity.

[0014] On the basis of the above technical solution, the present utility model can also be improved as follows.

[0015] Further, a coupling lens and an optical isolator are sequentially coupled between each laser chip and the triangular reflection prism in the package along the light propagation direction.

[0016] The further beneficial effects are as follows: The optical signal emitted by the laser chip first enters the lens, then enters the optical isolator through the lens, and then is incident on the total reflection inclined plane of the triangular reflection prism through the optical isolator. After being turned by 90° by the total reflection inclined plane of the triangular reflection prism, it enters the optical fiber. The optical path selects a single lens, which only needs to be coupled once, simplifying the process and reducing costs.

[0017] Furthermore, a tungsten copper heat sink is fixed inside the package, and the ceramic circuit board, the triangular reflection prism, the fiber optic array, the lens, and the optical isolator are respectively fixed on the upper surface of the tungsten copper heat sink.

[0018] The further beneficial effects are as follows: The tungsten copper heat sink can dissipate heat from the ceramic circuit board and fix the triangular reflection prism, the fiber optic array, the lens, and the optical isolator, ensuring the stability of the entire optical path. In addition, when the size of the ceramic circuit board is reduced, the size of the tungsten copper heat sink can also be correspondingly reduced, thereby reducing costs.

[0019] Furthermore, a TEC cooler is fixed inside the package, and the tungsten copper heat sink is fixed on the TEC cooler.

[0020] The further beneficial effects are as follows: The TEC cooler can cool and dissipate heat from the tungsten copper heat sink. Since the size of the tungsten copper heat sink can be correspondingly reduced, the size of the TEC cooler can also be reduced accordingly, thereby reducing costs.

[0021] Furthermore, the first high-frequency microstrip line and the second high-frequency microstrip line are bonded with gold wires.

[0022] Furthermore, the side of the package has four pins on each side where the RF interface is located.

[0023] Furthermore, an optical fiber rubber tail sleeve sleeving on two optical fibers is provided outside the package, and the optical fiber rubber tail sleeve is fixed to the package. Description of the Drawings

[0024] Figure 1 is a structural diagram of a dual-RF analog butterfly laser in the prior art;

[0025] Figure 2 is a structural diagram of the dual-RF analog butterfly laser in the present utility model.

[0026] In the drawings, the list of components represented by each reference numeral is as follows:

[0027] 1. Package, 110. Pin, 2. RF interface, 3. Ceramic circuit board, 4. First high-frequency microstrip line, 5. Laser chip, 6. Triangular reflection prism, 7. Fiber optic array, 710. Optical fiber, 8. Lens, 9. Optical isolator, 10. Tungsten copper heat sink, 11. TEC cooler, 12. Second high-frequency microstrip line, 13. Optical fiber rubber tail sleeve. Detailed implementation mode

[0028] The principles and features of the present utility model will be described below in conjunction with the accompanying drawings. The examples given are only used to explain the present utility model and are not intended to limit the scope of the present utility model.

[0029] Embodiment 1

[0030] As Figure 2 shown, a dual-radio-frequency analog butterfly laser includes: a housing 1, on the side of the housing 1 there are provided two radio-frequency interfaces 2, the two radio-frequency interfaces 2 are respectively located on both sides of the housing 1 and are distributed in a relative manner;

[0031] Inside the housing 1, at each of the two radio-frequency interfaces 2, there is provided a ceramic circuit board 3, that is, there are two ceramic circuit boards 3 inside the housing 1. Each ceramic circuit board 3 has a first high-frequency microstrip line 4 and a laser chip 5 electrically connected to the first high-frequency microstrip line 4. Each radio-frequency interface 2 is electrically connected to the first high-frequency microstrip line 4 on its (this radio-frequency interface 2) same side through a second high-frequency microstrip line 12. In addition, inside the housing 1, a triangular reflection prism 6 and an optical fiber array 7 are arranged between the two laser chips 5. The light emitted by the two laser chips 5 is turned by 90° after passing through the two total reflection inclined surfaces of the triangular reflection prism 6 and then coupled into two optical fibers 710 of the optical fiber array 7. The optical fibers 710 extend out of the housing 1 through the fiber outlet on the side wall of the housing 1;

[0032] When each radio-frequency interface 2 is externally connected to a radio-frequency head, an external radio-frequency signal enters the first high-frequency microstrip line 4 through the second high-frequency microstrip line 12, and then enters the laser chip 5 through the first high-frequency microstrip line 4. The laser chip 5 converts the radio-frequency signal into a corresponding optical signal. Finally, the optical signal emitted by each laser chip 5 is turned by 90° after passing through the total reflection inclined surface of the triangular reflection prism 6 and then coupled into one optical fiber 710 of the optical fiber array 7;

[0033] Adopting a 90-degree optical path turning design, the first high-frequency microstrip line 4 on the ceramic circuit board 3 where the laser chip 5 is located does not require a 90° corner, solving the impedance discontinuity caused by the 90° corner of the first high-frequency microstrip line in the prior art. At the same time, the length of the first high-frequency microstrip line 4 is greatly shortened, the signal attenuation is reduced, the gain is increased, and the high-frequency performance is excellent. The bandwidth can be increased from the current 20G to 25G. Introducing the triangular reflection prism 6 into the optical path effectively reduces the optical path length. Since the first high-frequency microstrip line 4 does not require a 90° corner, the size of the ceramic circuit board 3 can be reduced, thereby reducing the cost;

[0034] Cancel the kovar tube and kovar bracket, and instead use the fiber optic array 7, which can make the optical path more stable. Since there are two RF interfaces 2, two RF heads can be connected, that is, two lasers are built in one same package 1, greatly reducing the layout space. Since the butterfly lasers are generally used in numbers such as 2, 4, 8, etc., two lasers sharing one package 1 can save the expensive package 1, and the processes such as parallel capping and leak detection testing can double the production capacity.

[0035] Embodiment 2

[0036] As Figure 2 shown, this embodiment is a further improvement on the basis of Embodiment 1, specifically as follows:

[0037] Inside the package 1, a coupling lens 8 and an optical isolator 9 are sequentially coupled along the light propagation direction between each laser chip 5 and the triangular reflection prism 6. The optical signal emitted by the laser chip 5 first enters the lens 8, then enters the optical isolator 9 through the lens 8, and then is incident on the total reflection inclined surface of the triangular reflection prism 6 through the optical isolator 9, and after being turned by 90° by the total reflection inclined surface of the triangular reflection prism 6, it enters the optical fiber 710. The optical path selects a single lens 8, only needs to be coupled once, simplifies the process, and reduces the cost.

[0038] Embodiment 3

[0039] As Figure 2 shown, this embodiment is a further improvement on the basis of Embodiment 2, specifically as follows:

[0040] A tungsten copper heat sink 10 is fixed inside the package 1, while the ceramic circuit board 3, the triangular reflection prism 6, the fiber optic array 7, the lens 8, and the optical isolator 9 are respectively fixed on the upper surface of the tungsten copper heat sink 10. The tungsten copper heat sink 10 can dissipate heat from the ceramic circuit board 3 and fix the triangular reflection prism 6, the fiber optic array 7, the lens 8, and the optical isolator 9 to ensure the stability of the entire optical path. In addition, when the size of the ceramic circuit board 3 is reduced, the size of the tungsten copper heat sink 10 can also be correspondingly reduced, thereby reducing the cost. The triangular reflection prism 6 is made of a high refractive index glass material.

[0041] Embodiment 4

[0042] As Figure 2 shown, this embodiment is a further improvement on the basis of Embodiment 3, specifically as follows:

[0043] A TEC cooler 11 is fixed inside the package 1, and the tungsten copper heat sink 10 is fixed on the TEC cooler 11. The TEC cooler 11 can cool and dissipate heat from the tungsten copper heat sink 10. Since the size of the tungsten copper heat sink 10 can be correspondingly reduced, the size of the TEC cooler 11 can also be reduced accordingly, thereby reducing the cost.

[0044] Embodiment 5

[0045] As Figure 2 shown, this embodiment is a further improvement based on any one of Embodiments 1 to 4, and is specifically as follows:

[0046] The first high-frequency microstrip line 4 is wire-bonded to the second high-frequency microstrip line 12. In addition, the side of the package 1 has four pins 110 on each side where the radio frequency interface 2 is located, that is, the dual-radio-frequency analog butterfly laser has eight pins. Among them, each laser chip 5 requires two pins, and since there are two laser chips 5, four pins are provided. The TEC cooler 11 requires two pins, and the thermistor requires two pins. Therefore, a total of eight pins are required. An optical fiber rubber tail sleeve 13 sleeving on two optical fibers 710 is provided outside the package 1, and the optical fiber rubber tail sleeve 13 is fixed to the package 1.

[0047] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. A dual radio frequency simulated butterfly laser, characterized in that: include: A tube shell (1), wherein two radio frequency interfaces (2) are arranged on the side of the tube shell (1) in a relatively distributed manner, wherein a ceramic circuit board (3) is arranged at each of the two radio frequency interfaces (2), wherein each ceramic circuit board (3) has a first high-frequency microstrip line (4) and a laser chip (5) electrically connected to the first high-frequency microstrip line (4), wherein each radio frequency interface (2) is electrically connected to the first high-frequency microstrip line (4) on the same side thereof via a second high-frequency microstrip line (12), wherein a triangular reflection prism (6) and an optical fiber array (7) are arranged between the two laser chips (5) in the tube shell (1), wherein light emitted by the two laser chips (5) is coupled into two optical fibers (710) of the optical fiber array (7) after being turned 90 degrees by two total reflection inclined surfaces of the triangular reflection prism (6), and wherein the optical fibers (710) extend out of the tube shell (1) via an optical fiber outlet on the side wall of the tube shell (1).

2. A dual radio frequency simulated butterfly laser according to claim 1, characterized in that: In the tube shell (1), a lens (8) and an optical isolator (9) are coupled in sequence between each laser chip (5) and the triangular reflection prism (6) along the light propagation direction.

3. A dual radio frequency simulated butterfly laser according to claim 2, characterized in that: A tungsten copper heat sink (10) is fixed inside the tube shell (1), and the ceramic circuit board (3), the triangular reflection prism (6), the optical fiber array (7), the lens (8) and the optical isolator (9) are respectively fixed on the upper surface of the tungsten copper heat sink (10).

4. A dual radio frequency simulated butterfly laser according to claim 3, characterized in that: A TEC cooler (11) is fixed inside the tube shell (1), and the tungsten copper heat sink (10) is fixed on the TEC cooler (11).

5. A dual radio frequency simulated butterfly laser according to claim 1, characterized in that: The first high-frequency microstrip line (4) and the second high-frequency microstrip line (12) are gold-wire bonded.

6. A dual radio frequency simulated butterfly laser according to claim 1, characterized in that: The side surface of the tube shell (1) has four pins (110) on the side where each radio frequency interface (2) is located.

7. A dual radio frequency simulated butterfly laser according to claim 1, characterized in that: An optical fiber rubber tail sleeve (13) sleeved on two optical fibers (710) is provided on the outside of the tube shell (1), and the optical fiber rubber tail sleeve (13) is fixed to the tube shell (1).

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