Electromagnetic shielding structure of semiconductor power device

Abstract

The utility model discloses an electromagnetic shielding structure of a semiconductor power device, which comprises a mounting plate and a device body fixedly mounted at the upper end of the mounting plate, an assembly plate is mounted at the upper end of the mounting plate positioned on the outer wall of the device body, and an adaptive shielding structure is arranged at the upper end of the assembly plate. The adaptive shielding structure comprises a first shielding cover and a second shielding cover which are installed on the two sides of the upper end of the assembly plate, a first copper plate is fixedly arranged on the inner wall of the first shielding cover, a second copper plate is fixedly arranged on the inner wall of the second shielding cover, transverse plates are arranged on one side of the first shielding cover and one side of the second shielding cover, and rotary knobs are arranged in the transverse plates. A plurality of sets of threaded holes are formed in the two sides of the upper end of the assembling plate. According to the electromagnetic shielding structure of the semiconductor power device, shielding installation of device bodies with different sizes can be realized, and the electromagnetic shielding structure has practicability.

Description

Technical Field

[0001] The utility model relates to the field of electromagnetic shielding, and particularly relates to an electromagnetic shielding structure for a semiconductor power device lead. Background Technique

[0002] Electromagnetic shielding is a measure to weaken the field strength caused by certain sources in a certain area of space. In most cases, the shielding body can be made of metals such as copper, aluminum, and steel. However, for constant and extremely low-frequency magnetic fields, materials such as ferrite can also be used as the shielding body. When electromagnetic shielding is carried out on semiconductor devices, a shielding structure is required to avoid external electromagnetic interference to the semiconductor devices.

[0003] After the existing semiconductor devices are installed, a shielding cover needs to be installed at the upper end of the semiconductor devices. The existing shielding covers are generally integrally and fixedly installed at the upper end of the devices and cannot be adaptively adjusted according to the size of the semiconductor devices, and the use is relatively single. Content of the Utility Model

[0004] The main purpose of the utility model is to provide an electromagnetic shielding structure for a semiconductor power device lead, which can effectively solve the technical problems in the background technique.

[0005] To achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0006] An electromagnetic shielding structure for a semiconductor power device lead includes a mounting plate and a device body fixedly installed at the upper end of the mounting plate. An assembly plate is installed at the upper end of the mounting plate on the outer wall of the device body. An adaptation shielding structure is arranged at the upper end of the assembly plate. The adaptation shielding structure includes a first shielding cover and a second shielding cover installed on both sides of the upper end of the assembly plate. A first copper plate is fixedly arranged on the inner wall of the first shielding cover, and a second copper plate is fixedly arranged on the inner wall of the second shielding cover. A cross plate is arranged on one side of each of the first shielding cover and the second shielding cover, and a knob is arranged inside the cross plate. A plurality of threaded holes are opened on both sides of the upper end of the assembly plate.

[0007] As a further scheme of the utility model, a docking groove is opened on one side of the second shielding cover close to the first shielding cover, and one end of the first shielding cover enters into the docking groove.

[0008] As a further scheme of the utility model, stabilizing plates are fixedly arranged on both sides of the upper end of the assembly plate, and stabilizing grooves are opened at the lower ends of the first shielding cover and the second shielding cover located at the upper ends of the stabilizing plates.

[0009] As a further scheme of the utility model, the ends of the two stabilizing plates close to each other are rectangular.

[0010] As a further scheme of the utility model, a plurality of heat dissipation grooves are opened at the upper ends of the first shielding cover and the second shielding cover.

[0011] As a further solution of the present utility model, a plurality of heat dissipation holes are provided on one side of both the first shielding cover and the second shielding cover.

[0012] As a further solution of the present utility model, two screws are installed at the rear end of the upper end of the assembly board, and the output ends of the screws pass through the assembly board and enter the interior of the mounting board.

[0013] The beneficial effects of the present utility model are as follows:

[0014] By providing an adapted shielding structure, when electromagnetic shielding is required for the upper end of the device body, the distance between the two shielding covers can be adjusted according to the size of the device body, so that electromagnetic shielding can be achieved for device bodies of different sizes, improving the scope of use.

[0015] By providing heat dissipation grooves, heat dissipation holes and the front ends of the first shielding cover and the second shielding cover being through-shaped, heat dissipation of the device body can be achieved, improving the heat dissipation effect and ensuring a longer service life of the device body. Description of the Drawings

[0016] Figure 1 It is a schematic diagram of the overall structure of an electromagnetic shielding structure for a semiconductor power device lead of the present utility model;

[0017] Figure 2 It is a partial exploded view of an electromagnetic shielding structure for a semiconductor power device lead of the present utility model;

[0018] Figure 3 It is an exploded view of the first shielding cover and the second shielding cover of an electromagnetic shielding structure for a semiconductor power device lead of the present utility model;

[0019] Figure 4 It is an exploded view of the first shielding cover and the first copper plate of an electromagnetic shielding structure for a semiconductor power device lead of the present utility model.

[0020] In the figure: 1, mounting board; 2, device body; 3, assembly board; 4, adapted shielding structure; 5, first shielding cover; 6, second shielding cover; 7, first copper plate; 8, second copper plate; 9, threaded hole; 10, cross plate; 11, knob; 12, docking groove; 13, stabilizing plate; 14, stabilizing groove; 15, heat dissipation groove; 16, heat dissipation hole; 17, screw. Detailed Embodiments

[0021] In order to make the technical means, creative features, achieved purposes and effects of the present utility model easy to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0022] Such as Figures 1-4As shown in the figure, an electromagnetic shielding structure for a semiconductor power device lead includes a mounting plate 1 and a device body 2 fixedly mounted on the upper end of the mounting plate 1. A mounting plate 3 is mounted on the upper end of the mounting plate 1 on the outer wall of the device body 2. An adaptor shielding structure 4 is provided at the upper end of the mounting plate 3. The adaptor shielding structure 4 includes a first shielding cover 5 and a second shielding cover 6 mounted on both sides of the upper end of the mounting plate 3. A first copper plate 7 is fixedly provided on the inner wall of the first shielding cover 5, and a second copper plate 8 is fixedly provided on the inner wall of the second shielding cover 6. A cross plate 10 is provided on one side of both the first shielding cover 5 and the second shielding cover 6. A knob 11 is provided inside the cross plate 10. A plurality of threaded holes 9 are provided on both sides of the upper end of the mounting plate 3.

[0023] In this embodiment, a docking groove 12 is provided on the side of the second shielding cover 6 close to the first shielding cover 5, and one end of the first shielding cover 5 enters into the docking groove 12.

[0024] The docking groove 12 facilitates the entry of one end of the first shielding cover 5, thus ensuring the firm connection between the first shielding cover 5 and the second shielding cover 6.

[0025] In this embodiment, stabilizing plates 13 are fixedly provided on both sides of the upper end of the mounting plate 3. Stabilizing grooves 14 are provided at the lower ends of the first shielding cover 5 and the second shielding cover 6 located above the stabilizing plates 13.

[0026] The two stabilizing plates 13 facilitate the smooth movement of the first shielding cover 5 and the second shielding cover 6, and the stabilizing grooves 14 are used to facilitate the entry of the stabilizing plates 13.

[0027] In this embodiment, the ends of the two stabilizing plates 13 close to each other are rectangular.

[0028] One end of the stabilizing plate 13 being rectangular limits the first shielding cover 5.

[0029] In this embodiment, a plurality of heat dissipation grooves 15 are provided at the upper ends of both the first shielding cover 5 and the second shielding cover 6.

[0030] The heat dissipation grooves 15 facilitate the diffusion of the heat of the device body 2.

[0031] In this embodiment, a plurality of heat dissipation holes 16 are provided on one side of both the first shielding cover 5 and the second shielding cover 6.

[0032] The heat dissipation holes 16 improve the heat dissipation efficiency of the device body 2.

[0033] In this embodiment, two screws 17 are mounted at the rear end of the upper end of the mounting plate 3, and the output ends of the screws 17 pass through the mounting plate 3 and enter into the mounting plate 1.

[0034] The screws 17 connect the mounting plate 3 and the mounting plate 1.

[0035] It should be noted that the present utility model is an electromagnetic shielding structure for a semiconductor power device. When in use, the assembly board 3 is installed on the upper end of the mounting board 1 through the screw 17. Then, pick up the first shielding cover 5 and the second shielding cover 6 and respectively sleeved them on the upper ends of the two groups of assembly boards 3. According to the length dimension of the device body 2, simultaneously push the first shielding cover 5 and the second shielding cover 6 towards the middle, and use the knob 11 to pass through the cross plate 10 and enter the interior of the threaded hole 9, so as to realize the closing and shielding of the device body 2 of different sizes.

[0036] Since the front ends of the first shielding cover 5 and the second shielding cover 6 are in a through state, when the air source passes by, the air source enters the interiors of the first shielding cover 5 and the second shielding cover 6 and dissipates from the heat dissipation grooves 15 and the heat dissipation holes 16, accelerating the heat dissipation of the device body 2.

[0037] The above shows and describes the basic principles, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. The above embodiments and the descriptions in the specification only illustrate the principles of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. An electromagnetic shielding structure for a semiconductor power device, comprising a mounting plate (1) and a device body (2) fixedly mounted on the upper end of the mounting plate (1), an assembly plate (3) being mounted on the upper end of the mounting plate (1) located on the outer wall of the device body (2), characterized in that: An adaptable shielding structure (4) is provided at the upper end of the assembly plate (3), and the adaptable shielding structure (4) comprises a first shielding cover (5) and a second shielding cover (6) installed on both sides of the upper end of the assembly plate (3); a first copper plate (7) is fixedly provided on the inner wall of the first shielding cover (5), and a second copper plate (8) is fixedly provided on the inner wall of the second shielding cover (6); a transverse plate (10) is provided on one side of the first shielding cover (5) and the second shielding cover (6), and a knob (11) is provided inside the transverse plate (10); and a plurality of groups of threaded holes (9) are provided on both sides of the upper end of the assembly plate (3).

2. The electromagnetic shielding structure of a semiconductor power device according to claim 1, characterized in that: A docking groove (12) is provided on a side of the second shielding cover (6) close to the first shielding cover (5), and one end of the first shielding cover (5) enters into the docking groove (12).

3. The electromagnetic shielding structure of a semiconductor power device according to claim 1, characterized in that: Stabilizing plates (13) are fixedly arranged on both sides of the upper end of the assembly plate (3), and stabilizing grooves (14) are provided at the lower ends of the first shielding cover (5) and the second shielding cover (6) located at the upper end of the stabilizing plate (13).

4. The electromagnetic shielding structure of a semiconductor power device according to claim 3, characterized in that: The ends of the two sets of stabilizing plates (13) that are close to each other are rectangular.

5. The electromagnetic shielding structure of a semiconductor power device according to claim 1, characterized in that: A plurality of heat dissipation slots (15) are provided at the upper ends of the first shielding cover (5) and the second shielding cover (6).

6. The electromagnetic shielding structure of a semiconductor power device according to claim 5, characterized in that: A plurality of heat dissipation holes (16) are provided on one side of the first shielding cover (5) and the second shielding cover (6).

7. The electromagnetic shielding structure of a semiconductor power device according to claim 1, characterized in that: Two screws (17) are installed at the upper rear end of the assembly plate (3), and the output ends of the screws (17) pass through the assembly plate (3) and enter into the interior of the installation plate (1).

Images