LED lamp bead and vehicle lamp

Abstract

The utility model discloses an LED lamp bead, which relates to the technical field of LED lighting and comprises a substrate and an LED chip, a base is arranged on the substrate and is of a cup-mouth-shaped structure, the LED chip is arranged on the substrate and is positioned in the base, and a packaging adhesive layer is filled in the base; the packaging adhesive layer comprises a transparent adhesive layer and a fluorescent powder adhesive layer, the transparent adhesive layer is of a layered structure formed by transparent colloid, and a first additive is uniformly distributed in the transparent colloid and is used for dodging; the fluorescent powder glue layer is of a layered structure formed by packaging glue, and fluorescent powder is evenly distributed in the packaging glue. The light color quality and the brightness of the LED lamp bead are improved, and the phenomenon that the LED lamp bead emits light unevenly or light rings and light spots appear is improved. The utility model further discloses a vehicle lamp which at least comprises the LED lamp bead.

Description

Technical Field

[0001] The utility model relates to the technical field of LED lighting, in particular to an LED lamp bead and a vehicle lamp. Background Technique

[0002] As the fourth-generation green lighting product, LED lighting products are widely used in various fields such as indication, display, decoration, backlight, general lighting, and urban night scene due to their high photoelectric conversion efficiency, no stroboscopic, anti-glare, high color rendering, and a series of advantages such as high energy efficiency and long life.

[0003] According to the different use functions of LED lighting products, they can be divided into five categories: information display, signal lamp, vehicle lamp, LCD backlight, and general lighting. Among them, for the automotive industry market, the current mainstream three major automotive light source products include: ceramic, PLCC, and EMC; the basic production methods are: ① ceramic direct-mounted products (without cup mouth) + secondary optics; ② ceramic flip-chip products + PIS / PIG or spraying process + filling white glue; ③ based on ceramic substrates with CSP process + filling and covering white glue; ④ bowl cup products (such as PLCC or EMC), etc.

[0004] Although significant progress has been made in LED lighting technology in recent years, for products matching vehicle specifications, there are still some problems with existing LED lighting products, mainly the problems of uneven light output and the appearance of light spots and light circles (the light emitted by LED lighting products is normal light as Figure 1 shown, the light emitted by LED lighting products shows a light circle phenomenon as Figure 2 shown, the light emitted by LED lighting products shows light spots, astigmatism, and uneven distribution as Figure 3 shown). For example, for existing vehicle lamp beads (including daytime running lights, display lights, etc.), due to the appearance of light circles and light spots, uneven light output rate, yellowing, etc. of the lamp beads themselves, during the night driving of the vehicle, it will cause eye fatigue or short-term vision loss of the driver, and even cause adverse reactions such as dizziness and headache of the driver, affecting driving safety. Content of the Utility Model

[0005] The purpose of the utility model is to provide an LED lamp bead and a vehicle lamp to solve the problems existing in the above-mentioned prior art, improve the light color quality and brightness of the LED lamp bead, and improve the phenomenon of uneven light output or the appearance of light circles and light spots of the LED lamp bead.

[0006] To achieve the above purpose, the utility model provides the following scheme:

[0007] The present utility model provides an LED lamp bead, which includes a substrate and an LED chip. A pedestal is arranged on the substrate. The pedestal has a cup-shaped structure. The LED chip is arranged on the substrate and is located inside the pedestal, and an encapsulation glue layer is filled inside the pedestal. The encapsulation glue layer includes a transparent glue layer and a phosphor glue layer. Among them, the transparent glue layer is a layered structure formed by a transparent colloid, and first additives are evenly distributed in the transparent colloid. The first additives are used for light homogenization. The phosphor glue layer is a layered structure formed by encapsulation glue, and phosphors are evenly distributed in the encapsulation glue.

[0008] Preferably, the transparent colloid is transparent silica gel.

[0009] Preferably, the first additives are light diffusing agents.

[0010] Preferably, the transparent glue layer covers the bottom of the pedestal and can wrap the LED chip. The phosphor glue layer covers the top of the transparent glue layer.

[0011] Preferably, the thickness of the transparent glue layer accounts for 30%-70% of the thickness of the encapsulation glue layer.

[0012] Preferably, the thickness range of the transparent glue layer is 1um-1mm.

[0013] Preferably, the thickness range of the phosphor glue layer is 1um-1mm.

[0014] Preferably, second additives are evenly distributed in the encapsulation glue of the phosphor glue layer. The second additives are used for light homogenization.

[0015] Preferably, the second additives are light diffusing agents.

[0016] The present utility model also provides a vehicle lamp, which at least includes the above-mentioned LED lamp bead.

[0017] The present utility model has achieved the following technical effects compared with the prior art:

[0018] The LED lamp bead provided by the present utility model comprises a substrate and an LED chip. A pedestal is arranged on the substrate, and an encapsulation glue layer is filled in the pedestal. The encapsulation glue layer includes a transparent glue layer and a phosphor glue layer. Taking the transparent glue layer as the bottom layer, the phosphor glue layer covers the top of the transparent glue layer. The technical effects of the present utility model are described as follows: When the blue light emitted by a conventional LED chip after encapsulation enters the phosphor glue layer, since the blue light spectrum is within the excitation spectrum of the phosphor, the phosphor will strongly absorb the blue light. After a part of the absorbed blue light is converted into the emission light of the phosphor (generally yellow-green light), it is mixed with the blue light directly transmitted through the phosphor glue layer to form white light. However, due to the position difference between the LED chip and different phosphor particles, there will be some situations such as light circles, light spots or uneven light emission. The problem point of this difference is that the LED blue light does not well match the difference in the full excitation or excitation after reflection of the phosphor, resulting in inconsistent colors after reflection. Therefore, in the present utility model, the phosphor can be coated and dispersed in the light-emitting layer (upper reflection layer) through the bottom transparent glue layer, and the light reflected at the bottom can more evenly excite the phosphor glue layer, with high color concentration, thereby effectively improving the light color quality and brightness of the LED lamp bead, and improving the phenomenon of uneven light emission or the appearance of light circles and light spots of the LED lamp bead; It is proved by experimental tests that if the positions of the transparent glue layer and the phosphor glue layer are interchanged, so that the light emitted by the LED chip first excites the phosphor glue layer and then uniformly emits through the transparent glue layer, the effect of improving light circles and light spots can also be achieved. Brief Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the following described drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0020] Figure 1 Schematic diagram of the light emitted by an existing LED lighting product being normal light;

[0021] Figure 2 Schematic diagram of the light emitted by an existing LED lighting product showing a light circle phenomenon;

[0022] Figure 3 Schematic diagram of the light emitted by an existing LED lighting product showing light spot, light scattering and uneven distribution phenomena;

[0023] Figure 4 Cross-sectional view of the LED lamp bead provided by the embodiment of the present utility model;

[0024] Figure 5Schematic diagram of the LED lighting product before optimization corresponding to Table 1;

[0025] Figure 6 Schematic diagram of the optimized LED lighting product corresponding to Table 1.

[0026] In the figure: 1 - Substrate, 2 - LED chip, 3 - Base, 4 - Connecting wire, 5 - Transparent adhesive layer, 6 - Phosphor adhesive layer, 601 - Phosphor, 602 - Second additive. Specific implementation mode

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0028] The purpose of the present invention is to provide an LED lamp bead and a vehicle lamp, so as to solve the problems existing in the prior art, improve the light color quality and brightness of the LED lamp bead, and improve the phenomenon of uneven light output or the appearance of light circles and light spots of the LED lamp bead.

[0029] To make the above objects, features and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation modes.

[0030] As Figure 4 shown, taking the PLCC material product as an example, this embodiment provides an LED lamp bead, including a substrate 1 and an LED chip 2. A base 3 is arranged on the substrate 1. The base 3 is in a cup-shaped structure. The LED chip 2 is arranged on the substrate 1 (in this embodiment, the LED chip 2 is electrically connected to the substrate 1 through a connecting wire 4. If a flip-chip is used, the flip-chip can be directly connected to the substrate 1 without wire bonding), and is located inside the base 3, and the inside of the base 3 is filled with a packaging adhesive layer; the packaging adhesive layer includes a transparent adhesive layer 5 and a phosphor adhesive layer 6. Among them, the transparent adhesive layer 5 is a layered structure formed by transparent silicone, and a first additive is evenly distributed in the transparent silicone. The first additive is used for light homogenization; the phosphor adhesive layer 6 is a layered structure formed by packaging adhesive, and a phosphor 601 and a second additive 602 are evenly distributed in the packaging adhesive. The first additive and the second additive 602 in this embodiment are both light diffusing agents.

[0031] Furthermore, in this embodiment, the transparent adhesive layer 5 covers the bottom of the base 3 and can wrap the LED chip 2; the phosphor adhesive layer 6 covers the top of the transparent adhesive layer 5.

[0032] In this embodiment, the thickness of the transparent adhesive layer 5 accounts for 30%-70% of the thickness of the encapsulating adhesive layer.

[0033] In this embodiment, the height from the substrate to completely cover or overflow the LED chip 2 and the connecting wire 4 is within the control range. Specifically, the thickness range of the transparent adhesive layer 5 is 1um-1mm, and the thickness range of the phosphor adhesive layer 6 is 1um-1mm, including all planar headlight LED products.

[0034] In this embodiment, through the bottom transparent adhesive layer 5, the phosphor 601 can be coated and dispersed in the light-emitting layer (upper reflective layer). The light reflected from the bottom can more evenly excite the phosphor adhesive layer 6, with high color concentration, thus effectively improving the light color quality and brightness of the LED lamp bead, and improving the phenomenon of uneven light emission or the appearance of light circles and light spots of the LED lamp bead.

[0035] It should be noted that through experimental verification, if the positions of the transparent adhesive layer 5 and the phosphor adhesive layer 6 are interchanged, so that the light emitted by the LED chip 2 first excites the phosphor adhesive layer 6 and then evenly emits through the transparent adhesive layer 5, the effect of improving the light circle and light spot can also be achieved.

[0036] It should be noted that the substrate 1 in this embodiment is preferably a PCB aluminum substrate, and those skilled in the art can also select substrates made of materials such as ceramics, glass, or metals, and either a planar substrate or a concave substrate can be selected.

[0037] It should be noted that the pedestal 3 in this embodiment is preferably a resin enclosure (generating a cup mouth), and those skilled in the art can also select a silicone white glue enclosure, a dam, etc.

[0038] It should be noted that the LED chip 2 in this embodiment is preferably a blue light chip, and those skilled in the art can also select other color mixed light chips.

[0039] It should be noted that the material of the connecting wire 4 is Au, Ag, Cu, or other alloy type wire materials.

[0040] It should be noted that in this embodiment, the transparent adhesive layer 5 formed of transparent silicone is a key part of this design. For the first additive added to the transparent adhesive layer 5, in addition to a light diffusing agent, titanium dioxide, anti-precipitation powder, or light scattering powder can also be selected; by adding a certain proportion of light diffusing agent to the transparent adhesive layer 5, the light is refracted and then penetrated countless times, and the strong light is evenly dispersed, making the point light source become a surface light source, expanding the light-emitting surface, and at the same time, making the light soft and uniform. Also, since the light can penetrate the light diffusing agent powder particles, the light loss is extremely small. Therefore, the light diffusing agent plays the role of homogenizing and transmitting light.

[0041] It should be noted that the addition ratio of the first additive added to the transparent silicone (the ratio of the weight of the first additive to the weight of the transparent silicone) is 1% - 100%, and the normal range is 1% - 70%. For example, if the weight of the transparent silicone is 10 g and the addition ratio is 5%, then 10 g * 5% = 0.5 g, that is, the weight of the first additive to be added is 0.5 g.

[0042] It should be noted that the ratio of the thickness of the transparent adhesive layer 5 around the LED chip 2 to the thickness of the upper phosphor adhesive layer 6 is 0.1%:99.9% - 99.9%:0.1%. Preferably, the thickness of the transparent adhesive layer 5 is 30% - 70%, and the thickness of the phosphor adhesive layer 6 is 30% - 70%. For example, if the thickness of the transparent adhesive layer 5 accounts for 30%, then the thickness of the phosphor adhesive layer 6 accounts for 70%.

[0043] It should be noted that for the encapsulating adhesive of the phosphor adhesive layer 6, those skilled in the art can choose encapsulating silicone, resin or epoxy mixed adhesive; for the phosphor 601 of the phosphor adhesive layer 6, those skilled in the art can choose a single type of phosphor or a mixture of multiple phosphors, mainly to match the solid phosphor film to excite white light or other color light, and play the role of encapsulation and protection, and can increase the mixed light beam and improve the light output brightness of the product, etc.

[0044] It should be noted that if the ceramic product technology is improved in the future, filling the transparent silicone inside and coating the phosphor adhesive above after the ceramic substrate dam is built all belong to this idea; or continuing the solid phosphor adhesive technology and directly encapsulating traditional LED light sources (including using different color chips with different phosphors to produce white light or monochromatic light) all belong to this idea.

[0045] As shown in Table 1 and Figures 5 - 6 as shown, based on the light-emitting surface, the light output distribution of the product, the uniformity index and color difference (or yin-yang color) of each area color (ΔxΔy / CCT) reflected; usually lit with a small current, the software takes pictures according to the set 8 areas, calculates the u', v' (average value of u, v) of each area; calculates the sum of the squared differences between the u', v' of each area and the u', v' of the entire light-emitting surface to obtain the du'v' of each area, and multiplies the maximum value of the du'v' of each area by 350 to obtain the Cu value. By comparison, it can be seen that the Cu value (0.89261) of the optimized LED lighting product using this design is significantly smaller than the Cu value (1.81122) of the LED lighting product before optimization, that is, the light output of the optimized LED lighting product is more uniform and the light color quality is better.

[0046] Table 1

[0047]

[0048] This embodiment also provides a vehicle lamp, which at least includes the above-mentioned LED lamp beads.

[0049] In summary, the advantages of the LED lamp beads and the vehicle lamp provided in this embodiment are as follows:

[0050] First, by stacking the transparent silicone body on the bottom layer, the phosphor 601 can be coated and dispersed in the light-emitting layer (the upper reflective layer), and the light reflected from the bottom can more evenly excite the phosphor 601, which can effectively improve the light color quality and brightness of the vehicle-mounted LED, improve the conditions such as uneven aperture, light spot or light emission, and improve the overall yield of the product.

[0051] Second, through the transparent adhesive layer 5 and the phosphor adhesive layer 6, the airtightness of the LED base structure can be maintained, and it can be protected from the humidity and temperature in the surrounding environment, effectively preventing the components from being damaged and vulcanized due to mechanical vibration and impact, and avoiding changes in the characteristics of the components.

[0052] In the present utility model, specific examples are used to elaborate on the principle and implementation manner of the present utility model. The description of the above embodiments is only used to help understand the method and its core idea of the present utility model; at the same time, for those of ordinary skill in the art, according to the idea of the present utility model, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present utility model.

Claims

1. An LED lamp bead, comprising a substrate and an LED chip, wherein a base is arranged on the substrate, the base is a cup-shaped structure, the LED chip is arranged on the substrate and located in the base, and the base is filled with a packaging glue layer; characterized in that: The encapsulation adhesive layer includes a transparent adhesive layer and a phosphor adhesive layer, wherein the transparent adhesive layer is a layered structure formed by a transparent colloid, and a first additive is evenly dispersed in the transparent colloid, and the first additive is used for uniform light; the phosphor adhesive layer is a layered structure formed by an encapsulation adhesive, and phosphor is evenly dispersed in the encapsulation adhesive; the thickness of the transparent adhesive layer accounts for 30%-70% of the thickness of the encapsulation adhesive layer.

2. The LED lamp bead according to claim 1, characterized in that: The transparent colloid is transparent silica gel.

3. The LED lamp bead according to claim 1, characterized in that: The first additive is a light diffuser.

4. The LED lamp bead according to claim 1, characterized in that: The transparent adhesive layer covers the bottom of the base and can wrap the LED chip; the fluorescent powder adhesive layer covers the top of the transparent adhesive layer.

5. The LED lamp bead according to claim 1, characterized in that: The thickness of the transparent adhesive layer ranges from 1 um to 1 mm.

6. The LED lamp bead according to claim 1, characterized in that: The thickness of the phosphor glue layer is in the range of 1 um to 1 mm.

7. The LED lamp bead according to claim 1, characterized in that: A second additive is evenly distributed in the packaging adhesive of the phosphor adhesive layer, and the second additive is used for light uniformity.

8. The LED lamp bead according to claim 7, characterized in that: The second additive is a light diffusing agent.

9. A vehicle lamp, characterized in that: At least comprises the LED lamp bead as described in any one of claims 1-8.

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