Buffer device for reducing abrasion of sieve plate of granular silicon product sieve
By setting a hollow structure buffer device between the granular silicon product screen plate and the material inlet, the problem of wear of the granular silicon product screen plate is solved, and the effect of reducing wear and improving product quality is achieved.
Patent Information
- Application Number
- CN202421796916.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-29
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-07-29
AI Technical Summary
In the prior art, granular silicon products will generate impact forces when they pass through the screen plate, causing wear and deformation of the screen plate and affecting product quality.
A buffering device is designed to be arranged between the screen plate and the material inlet for buffering before the granular silicon initial product contacts the screen plate. The buffering device is a hollow structure, with a side wall, a top opening and a bottom seal. The top opening diameter is 1 to 3 times the diameter of the material inlet. The side wall is equipped with a screen hole of the same size as the screen plate.
By adding a buffer mechanism, the impact force of particulate silicon on the screen plate is reduced, the wear of the screen plate is reduced, the generation of impurities is avoided, and the product quality is improved.
Smart Images
Figure CN222970329U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a buffer device, in particular to a buffer device for reducing the wear of the sieve plate of a granular silicon product sieve. Background Art
[0002] Granular silicon is a raw material for producing solar photovoltaic panels. It is a granular spherical polysilicon product produced by the FBR method. The initially produced granular silicon needs to go through a series of subsequent processing operations such as powder removal and packaging to obtain the final granular silicon product that meets the quality requirements. After the product is screened, most of the large particles are used as normal products, and a small part of the small particle products enter the grinder to be ground into seed crystals, and the seed crystals are reused in the fluidized bed to make effective use of the small particles. Before the small particles enter the grinder, they will be screened by a product sieve to remove blocky materials or sundries, etc., to prevent damage to the grinder. The sieve plate inside the product sieve is in a flat form, and a certain number and diameter of small holes are distributed on the sieve plate to screen out larger blocky materials.
[0003] The sieve plate inside the product sieve is in a flat form. The small particles fall from the vertical pipe onto the sieve plate. When the small particles in the pipe contact the sieve plate during the descent, there will be a certain impact force, causing the sieve plate to wear and deform, generating impurities and affecting the product quality. Summary of the Utility Model
[0004] Object of the Invention: The technical problem to be solved by the utility model is to provide a buffer device for reducing the wear of the sieve plate of a granular silicon product sieve in view of the deficiencies of the prior art.
[0005] To solve the above technical problem, the utility model discloses a buffer device for reducing the wear of the sieve plate of a granular silicon product sieve. The granular silicon product sieve includes: a product sieve housing respectively connected to a material inlet and a material outlet. The product sieve housing is a hollow shell, and a sieve plate is arranged inside it. The sieve plate is provided with sieve holes. The initially produced granular silicon product entering from the material inlet passes through the sieve plate and then enters the material outlet. A buffer mechanism is arranged between the sieve plate and the material inlet for buffering the initially produced granular silicon product before it contacts the sieve plate.
[0006] Further, the buffer mechanism is of a hollow structure, having a side wall, an open top, and a closed bottom.
[0007] Further, the opening diameter of the top of the buffer mechanism is 1 to 3 times the diameter of the material inlet.
[0008] Further, the top diameter of the buffer mechanism is larger than the bottom diameter, and the bottom diameter is 1 / 4 to 3 / 4 of the top diameter.
[0009] Further, the side wall of the buffer mechanism is provided with sieve holes of the same size as the sieve plate.
[0010] Furthermore, the bottom thickness of the buffer mechanism is less than or equal to one-third of the height of the buffer mechanism.
[0011] Furthermore, the buffer mechanism is directly disposed on the sieve plate or connected to the sieve plate through the buffer mechanism bracket, and the number of the buffer mechanism brackets is one or two.
[0012] Furthermore, the buffer mechanism is fixedly connected to the sieve plate.
[0013] Furthermore, the longitudinal section of the buffer mechanism is circular, hyperbolic, Y-shaped, square or triangular.
[0014] Furthermore, the buffer mechanism and the sieve plate are made of polyurethane.
[0015] Beneficial effects:
[0016] In the utility model, a buffer mechanism is added on the sieve plate. When the descending small particles fill the buffer mechanism, the descending small particles in the pipeline first contact the small particles in the buffer mechanism, and the impact force directly acts on the small particles in the buffer mechanism, thereby having a certain buffering effect on the sieve plate and reducing the friction with the sieve plate. Therefore, the utility model can eliminate the wear and deformation of the sieve plate of the product sieve, thereby reducing the generation of foreign matters and improving the product quality. Description of the drawings
[0017] The following further specifically describes the present utility model in conjunction with the drawings and specific embodiments, and the above and / or other advantages of the present utility model will become clearer.
[0018] Figure 1 It is a side view of the buffer mechanism directly placed on the sieve plate in one embodiment.
[0019] Figure 2 It is a top view of the buffer mechanism directly placed on the sieve plate in one embodiment.
[0020] Figure 3 It is a side view of the buffer mechanism placed on the sieve plate through a bracket in one embodiment.
[0021] Figure 4 It is a top view of the buffer mechanism placed on the sieve plate through a bracket in one embodiment.
[0022] Figure 5 It is a side view of the buffer mechanism placed on the sieve plate through a double bracket in one embodiment.
[0023] Figure 6 It is a side view of the circular buffer mechanism in one embodiment.
[0024] Figure 7Side view of the Y-shaped buffer mechanism in an embodiment.
[0025] Figure 8 Side view of the hyperbolic buffer mechanism in an embodiment.
[0026] Figure 9 Side view of the square buffer mechanism in an embodiment.
[0027] Figure 10 Side view of the triangular buffer mechanism in an embodiment.
[0028] In the figure, 1 is the material inlet, 2 is the material outlet, 3 is the product sieve housing, 4 is the sieve plate, 5 is the sieve plate support, 6 is the buffer mechanism, 7 is the sieve hole, and 8 is the buffer mechanism support. Detailed implementation mode
[0029] The design principle of the present utility model is that the sieve plate of the product sieve is changed from a planar form to a three-dimensional form sieve plate with a buffer mechanism added on its surface, thereby reducing the wear of the sieve plate caused by the impact force. The technical solution of the present utility model is as follows:
[0030] As Figure 1 shown, the granular silicon product sieve includes: a product sieve housing 3 respectively connected to the material inlet 1 and the material outlet 2, and the product sieve housing 3 is a hollow shell with a sieve plate 4 arranged inside.
[0031] As Figure 2 shown, the sieve plate 4 is provided with sieve holes 7 for screening the initial granular silicon products entering from the material inlet 1;
[0032] A buffer mechanism 6 is arranged between the sieve plate 4 and the material inlet 1 for buffering the initial granular silicon products before they contact the sieve plate 4.
[0033] The buffer mechanism 6 is a hollow structure with a side wall, an open top, and a closed bottom. The opening diameter of the top of the buffer mechanism 6 is 1 to 3 times the diameter of the material inlet 1; the top diameter of the buffer mechanism 6 is larger than the bottom diameter. The side wall of the buffer mechanism 6 is provided with the sieve holes 7 of the same size as the sieve plate 4. The bottom thickness of the buffer mechanism 6 is less than or equal to one-third of the height of the buffer mechanism 6.
[0034] The buffer mechanism 6 is directly arranged on the sieve plate 4, or as Figure 3 and Figure 4 shown, it is connected to the sieve plate 4 through the buffer mechanism support 8.
[0035] The buffer mechanism support 8 is one or as Figure 5 shown, there are two.
[0036] The buffer mechanism 6 is fixedly connected to the sieve plate 4.
[0037] The longitudinal section of the buffer mechanism 6 is circular, hyperbolic, Y-shaped, square or triangular.
[0038] The buffer mechanism 6 and the sieve plate 4 are made of polyurethane material or other materials used for cleaning supplies.
[0039] Embodiment:
[0040] In a specific embodiment, a buffer mechanism 6 protruding from the surface is added at the middle position (opposite to the upper pipeline nozzle) of the sieve plate 4 of the granular silicon product sieve. The buffer mechanism 6 can be of various shapes, such as Figure 6 shown as circular, such as Figure 8 shown as hyperbolic, such as Figure 7 shown as Y-shaped, such as Figure 9 shown as square, such as Figure 10 shown as triangular and other shapes. The buffer mechanism 6 is hollow and solid at the bottom, as Figure 1 shown. The part of the buffer mechanism 6 can be directly placed on the sieve plate 4, or as Figure 3 、 Figure 5 and Figure 7 shown, the bottom is supported on the sieve plate 4 by the buffer mechanism bracket 8. The buffer mechanism 6 and the sieve plate 4 are made of polyurethane material or other materials used for cleaning supplies. The upper diameter of the buffer mechanism 6 is 1 - 3 times the diameter of the material inlet 1 pipe, and the bottom diameter of the buffer mechanism 6 is 1 / 4 - 3 / 4 of the upper diameter. The sieve plate 4 is horizontally embedded inside the product sieve and fixed by the sieve plate bracket 5. The small particles in the pipeline fall into the buffer mechanism 6. When the buffer mechanism 6 is filled, the small particles overflow from the buffer mechanism 6 and fall onto the sieve plate 4 for screening.
[0041] When the descending small particles fill the buffer mechanism 6, the descending small particles in the pipeline first contact the small particles in the buffer mechanism 6, and the impact force directly acts on the small particles in the buffer mechanism 6, thereby having a certain buffering effect on the sieve plate 4 and reducing the friction on the sieve plate 4.
[0042] The present invention provides an idea and method for a buffer device to reduce the wear of the sieve plate of the granular silicon product sieve. There are many methods and ways to specifically implement this technical solution. The above is only the preferred embodiment of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention. Each component not clearly defined in this embodiment can be implemented by existing technologies.
Claims
1. A buffer device for reducing wear of a sieve plate of a granular silicon product sieve, the granular silicon product sieve comprising: A product sieve shell (3) connected to a material inlet (1) and a material outlet (2) respectively, wherein the product sieve shell (3) is a hollow shell having a sieve plate (4) disposed therein, wherein the sieve plate (4) is provided with sieve holes (7), and the granular silicon primary product entering the material inlet (1) passes through the sieve plate (4) and enters the material outlet (2), wherein a buffer mechanism (6) is disposed between the sieve plate (4) and the material inlet (1) for buffering the granular silicon primary product before it contacts the sieve plate (4).
2. A buffer device for reducing wear of a sieve plate of a granular silicon product according to claim 1, characterized in that: The buffer mechanism (6) is a hollow structure with side walls, an open top and a closed bottom.
3. A buffer device for reducing wear of a sieve plate of a granular silicon product according to claim 2, characterized in that: The diameter of the top opening of the buffer mechanism (6) is 1 to 3 times the diameter of the material inlet (1).
4. A buffer device for reducing wear of a sieve plate of a granular silicon product according to claim 2, characterized in that: The top diameter of the buffer mechanism (6) is larger than the bottom diameter, and the bottom diameter is 1 / 4 to 3 / 4 of the top diameter.
5. A buffer device for reducing wear of a sieve plate of a granular silicon product according to claim 2, characterized in that: The side wall of the buffer mechanism (6) is provided with the sieve hole (7) having the same size as the sieve plate (4).
6. A buffer device for reducing wear of a sieve plate of a granular silicon product according to claim 2, characterized in that: The bottom thickness of the buffer mechanism (6) is less than or equal to one third of the height of the buffer mechanism (6).
7. A buffer device for reducing wear of a sieve plate of a granular silicon product according to claim 1, characterized in that: The buffer mechanism (6) is directly arranged on the sieve plate (4), or is connected to the sieve plate (4) via a buffer mechanism bracket (8), and there are one or two buffer mechanism brackets (8).
8. The buffer device for reducing wear of a sieve plate of a granular silicon product according to claim 1, characterized in that: The buffer mechanism (6) is fixedly connected to the sieve plate (4).
9. The buffer device for reducing wear of a sieve plate of a granular silicon product according to claim 1, characterized in that: The longitudinal section of the buffer mechanism (6) is circular, hyperbolic, Y-shaped, square or triangular.
10. The buffer device for reducing wear of a sieve plate of a granular silicon product according to claim 1, characterized in that: The buffer mechanism (6) and the sieve plate (4) are made of polyurethane.