Automatic clamping and positioning device for semiconductor device

Abstract

The utility model discloses an automatic clamping and positioning device for a semiconductor device, which comprises a positioning block, a sliding block, a spring and an ejector rod, the top of the positioning block is concavely provided with a positioning groove, the side wall of the positioning groove is provided with a guide hole horizontally extending to the outer side of the positioning block, the sliding block is horizontally arranged on the positioning block in a sliding manner, and the spring is arranged in the guide hole. A guide hole is formed in the positioning block, a push plate extending downwards to the outer side of the guide hole is arranged at the tail of the sliding block, the ejector rod is arranged in the guide hole and connected with the push plate, a guide column horizontally penetrating through the push plate is arranged on the side face of the positioning block, a first nut located on the outer side of the push plate is arranged on the guide column, and the spring is arranged between the first nut and the push plate. According to the automatic clamping and positioning device for the semiconductor device, the ejector rod is driven by the sliding block to move forwards, automatic clamping and positioning of the side face of the semiconductor device are achieved, and the structural stability is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor device processing, in particular to an automatic clamping and positioning device for semiconductor devices. Background Art

[0002] During the processing of semiconductor devices, a carrier is usually required to position the semiconductor devices to ensure the processing accuracy.

[0003] Corresponding positioning grooves can be designed on the carrier to position the bottom of the semiconductor device, but it cannot be fastened. The stability of the semiconductor device during processing and movement is poor, and it is easy to break away from the carrier and cause damage, affecting the automatic processing of the semiconductor device. To improve the stability of the semiconductor device on the carrier, suction cups can be added, but an air circuit also needs to be added for control, which is more complex and needs to be improved. Summary of the Utility Model

[0004] The purpose of the utility model is to provide an automatic clamping and positioning device for semiconductor devices, which positions and clamps the semiconductor devices to improve the structural stability and clamping automation.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] An automatic clamping and positioning device for semiconductor devices, comprising: a positioning block, a slider, a spring and a ejector rod. The top of the positioning block is concavely provided with a positioning groove, and a guiding hole horizontally extending to the outside of the positioning block is provided on the side wall of the positioning groove. The slider is horizontally slidably arranged on the positioning block. A push plate extending downward to the outside of the guiding hole is arranged at the tail of the slider. The ejector rod is arranged in the guiding hole and is connected to the push plate. A guide post horizontally penetrating the push plate is arranged on the side of the positioning block, and a first nut located outside the push plate is arranged on the guide post. The spring is arranged between the first nut and the push plate.

[0007] Wherein, rollers in rolling contact with the top surface of the positioning block are arranged in the slider.

[0008] Wherein, the ejector rod horizontally penetrates the push plate, and second nuts located on both sides of the push plate are arranged on the ejector rod.

[0009] Wherein, through holes corresponding to the ejector rod are arranged in the push plate.

[0010] Wherein, a rubber column is arranged at the front end of the ejector rod.

[0011] Wherein, an inclined surface extending downward is arranged at the front end of the slider.

[0012] Wherein, the spring is concentrically sleeved on the guide post.

[0013] Wherein, mounting plates are arranged at the bottoms on both sides of the positioning block, and mounting holes are arranged on the mounting plates.

[0014] Advantages of the present utility model: An automatic clamping and positioning device for semiconductor devices. By manually or using a manipulator to press or push out the slider, the ejector rod is moved outwards. Then, the semiconductor device is placed into the positioning groove for positioning. After releasing the slider, the ejector rod is driven to move forward by the slider, realizing automatic clamping and fixing of the side of the semiconductor device. The structure is stable. After processing, by manually or using a manipulator to press or push out the slider, the ejector rod is driven to move outwards, releasing the clamping of the side of the semiconductor device, and the operation is simple. Description of the Drawings

[0015] Figure 1 is a structural schematic diagram of the present utility model;

[0016] Figure 2 is Figure 1 a structural schematic diagram of the ejector rod moving forward in Detailed Embodiments

[0017] Next, in conjunction with Figures 1 - 2 and through specific embodiments, the technical solution of the present utility model will be further described.

[0018] Such as Figure 1 the automatic clamping and positioning device for semiconductor devices shown, including: a positioning block 1, a slider 10, a spring 7, and an ejector rod 9. Mounting plates 2 are arranged at the bottoms on both sides of the positioning block 1, and mounting holes 3 are arranged on the mounting plates 2, which are convenient for installation on semiconductor device processing or conveying equipment.

[0019] A positioning groove 15 is concavely arranged at the top of the positioning block 1. The semiconductor device 16 can be placed into the positioning groove 15 for precise positioning, which is beneficial to improving the processing accuracy of the semiconductor device 16.

[0020] A guiding hole 14 extending horizontally to the outside of the positioning block 1 is arranged on the side wall of the positioning groove 15. The slider 10 is horizontally slidably arranged on the positioning block 1. In this embodiment, rollers 12 that rollingly contact the top surface of the positioning block 1 are arranged in the slider 10, and the resistance of the horizontal movement of the slider 10 can be reduced through the rollers 12.

[0021] A push plate 4 extending downward to the outside of the guiding hole 14 is arranged at the tail of the slider 10. An inclined surface 11 extending downward is arranged at the front end of the slider 10, which is convenient for manually or using a manipulator to press or push out the slider 10, so that the push plate 4 moves outwards.

[0022] The ejector rod 9 is arranged in the guiding hole 14 and is connected to the push plate 4, and moves horizontally along with the push plate 4. Such as Figure 2As shown, the semiconductor device 16 is clamped and fixed on the side in the positioning groove 15 through the front end of the ejector rod 9. In this embodiment, a rubber column 13 is provided at the front end of the ejector rod 9. By using the rubber column 13 to contact the side of the semiconductor device 16, it can not only avoid squeezing and damaging the semiconductor device 16, but also increase the friction on the semiconductor device 16, improve the stability of the semiconductor device 16 in the positioning groove 15, and prevent the semiconductor device 16 from disengaging from the positioning groove 15 during the processing.

[0023] In this embodiment, the ejector rod 9 horizontally penetrates through the push plate 4. A through hole corresponding to the ejector rod 9 is provided in the push plate 4, which is convenient for assembly. Second nuts 8 are provided on both sides of the push plate 4 on the ejector rod 9, facilitating the axial adjustment and fixation of the ejector rod 9 on the push plate 4.

[0024] In order to maintain the elastic locking of the ejector rod 9, a guide post 6 horizontally penetrating through the push plate 4 is provided on the side of the positioning block 1 to guide the movement of the push plate 4. A first nut 5 is provided on the guide post 6 outside the push plate 4. The spring 7 is arranged between the first nut 5 and the push plate 4 to elastically push the push plate 4, forcing the push plate 4 to maintain a forward pushing force on the ejector rod 9. In this embodiment, the spring 7 is concentrically sleeved on the guide post 6, with stable structure and convenient assembly.

[0025] After the semiconductor device 16 is placed in the positioning groove 15 for positioning by manual or mechanical means, the slider 10 is released. The spring 7 is used to drive the slider 10 and the ejector rod 9 to move forward, realizing the automatic clamping and fixing of the side of the semiconductor device 16, with stable structure. After processing, the slider is pressed or pushed out manually or by mechanical means to drive the ejector rod 9 to move outwards, releasing the clamping on the side of the semiconductor device 16, facilitating the smooth removal of the semiconductor device 16.

[0026] The above content is only the preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manners and application scopes. The content of this specification should not be construed as a limitation to the present invention.

Claims

1. A semiconductor device automatic clamping and positioning device, characterized in that: include: A positioning block, a slider, a spring and a push rod, wherein the top of the positioning block is concavely provided with a positioning groove, the side wall of the positioning groove is provided with a guide hole extending horizontally to the outside of the positioning block, the slider can be horizontally slidably arranged on the positioning block, the tail of the slider is provided with a push plate extending downward to the outside of the guide hole, the push rod is arranged in the guide hole and connected to the push plate, the side of the positioning block is provided with a guide column horizontally passing through the push plate, the guide column is provided with a first nut located on the outside of the push plate, and the spring is arranged between the first nut and the push plate.

2. The automatic clamping and positioning device for semiconductor devices according to claim 1, characterized in that: The sliding block is provided with a roller which is in rolling contact with the top surface of the positioning block.

3. The automatic clamping and positioning device for semiconductor devices according to claim 1, characterized in that: The push rod passes through the push plate horizontally, and the push rod is provided with second nuts located on both sides of the push plate.

4. The automatic clamping and positioning device for semiconductor devices according to claim 3, characterized in that: The push plate is provided with a through hole corresponding to the push rod.

5. The automatic clamping and positioning device for semiconductor devices according to claim 1, characterized in that: The front end of the push rod is provided with a rubber column.

6. The automatic clamping and positioning device for semiconductor devices according to claim 1, characterized in that: The front end of the sliding block is provided with an inclined surface extending downward.

7. The automatic clamping and positioning device for semiconductor devices according to claim 1, characterized in that: The spring is concentrically sleeved on the guide column.

8. The automatic clamping and positioning device for semiconductor devices according to claim 1, characterized in that: The bottoms of both sides of the positioning block are provided with mounting plates, and the mounting plates are provided with mounting holes.

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