Magnetic semiconductor refrigeration assembly

Abstract

The utility model provides a magnetic attraction semiconductor refrigeration assembly which comprises a semiconductor refrigeration sheet, the semiconductor refrigeration sheet comprises a refrigeration surface and a heating surface, the semiconductor refrigeration sheet is provided with a concave cavity extending from one side of the refrigeration surface to one side of the heating surface, and a cavity bottom refrigeration surface and a cavity top refrigeration surface with height difference are formed. According to the structure and the structural characteristics of the semiconductor chilling plate, the semiconductor chilling plate forms the cavity bottom refrigeration surface and the cavity top refrigeration surface with height difference, so that the concave cavity can be used for accommodating the charging coil, the magnet and the like, and the cooling capacity generated by the cavity bottom refrigeration surface can cool the charging coil, the magnet and the like, so that the charging coil is kept at a relatively low temperature; the cooling capacity generated by the cavity top refrigeration surface can directly act on the mobile terminal, and conduction through a charging coil and a magnet is not needed, so that the refrigeration effect is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wireless charging devices, and particularly relates to a magnetic adsorption semiconductor refrigeration component. Background Art

[0002] With the demand of mobile terminal users for fast charging technology, each manufacturer has increased the research on fast charging technology. With the in-depth research, it is found that while increasing the charging power, the heat generation at the contact between the mobile terminal and the wireless charging device is particularly serious. When the temperature reaches a certain value, the charging power cannot be increased and the expected effect cannot be achieved. Therefore, it is necessary to find a way to cool down.

[0003] Due to the advantages of small volume and fast refrigeration, semiconductor refrigeration chips are widely used for dissipating heat from components that need to be cooled. In the patent document with the authorization announcement number CN218352234U, a cooling device for a vehicle-mounted wireless charging seat is disclosed, which includes a semiconductor refrigeration plate and a control unit. The semiconductor refrigeration plate is installed on the vehicle-mounted wireless charging seat. When the wireless charging seat works, the control unit is used to control the semiconductor refrigeration plate to export the heat of the vehicle-mounted wireless charging seat. This solution actively exports the heat accumulated in the area of the vehicle-mounted wireless charging seat during the charging process and then dissipates the heat by setting the semiconductor refrigeration plate, so that the cooling fan is far away from the vehicle-mounted wireless charging seat, ensuring heat dissipation and avoiding noise pollution at the same time.

[0004] However, whether it is a vehicle-mounted wireless charging seat, a desktop wireless charging seat, or a movable power bank, a charging coil and a magnet are required. For the cooling devices with the above structures, the charging coil and the magnet can only be arranged on the semiconductor refrigeration plate. That is, the cold generated by the semiconductor refrigeration plate needs to be transferred to the mobile terminal through the charging coil and the magnet, which will cause a large amount of cold loss and result in poor refrigeration effect.

[0005] Therefore, it is necessary to design a new structure to solve the problem of poor refrigeration effect. Summary of the Utility Model

[0006] To solve the problems existing in the prior art, the utility model provides a magnetic adsorption semiconductor refrigeration component. By setting the semiconductor refrigeration chip into a structure with a cavity, the semiconductor refrigeration chip has a bottom cooling surface and a top cooling surface of the cavity. The bottom cooling surface of the cavity is used to cool the coil, and the top cooling surface of the cavity is used to directly cool the mobile terminal, thereby improving the refrigeration effect.

[0007] To achieve the above object, the technical solution of the present utility model is: a magnetic adsorption semiconductor refrigeration component, including a semiconductor refrigeration chip. The semiconductor refrigeration chip includes a refrigerating surface and a heating surface. The semiconductor refrigeration chip has a concave cavity extending from one side of the refrigerating surface to the heating surface side. The refrigerating surface forms a cavity bottom refrigerating surface and a cavity top refrigerating surface with a height difference. On the heating surface side, a heat dissipation device is provided. The heat dissipation device includes a heat conducting member with a length. One end of the heat conducting member is in contact with the heating surface for heat transfer; at the other end of the heat conducting member, a heat dissipating member for increasing the heat dissipation area or heat storage capacity is provided; in the concave cavity, a magnetic member with magnetism is provided.

[0008] With the above settings, the structural characteristics of the semiconductor refrigeration chip enable the semiconductor refrigeration chip to form a cavity bottom refrigerating surface and a cavity top refrigerating surface with a height difference. Then, the concave cavity can be used to accommodate a charging coil, a magnet, etc. Moreover, the cold generated by the cavity bottom refrigerating surface can cool the charging coil, the magnet, etc., so that the charging coil is maintained at a lower temperature. At the same time, the semiconductor refrigeration chip, the charging coil, and the magnet can be arranged substantially in the same plane. Then, the cold generated by the cavity top refrigerating surface can directly act on the mobile terminal without being conducted through the charging coil and the magnet, greatly improving the refrigeration effect; at the same time, the heat conducting member can timely conduct the heat generated by the heating surface to the heat dissipating member, and the heat is dissipated through the heat dissipating member, which can maintain the refrigeration effect of the semiconductor refrigeration chip. Moreover, the semiconductor refrigeration chip, the heat conducting member, and the heat dissipating member do not need to be stacked in the height direction, which can effectively reduce the thickness of the entire refrigeration component; setting a magnetic member in the concave cavity can realize magnetic adsorption of the mobile terminal and improve the convenience of mobile terminal charging. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram of the overall structure of Embodiment 1 of the present utility model;

[0010] Figure 2 It is a schematic diagram of the exploded structure of Embodiment 1 of the present utility model;

[0011] Figure 3 It is a cross-sectional view of the semiconductor refrigeration chip in Embodiment 1 of the present utility model;

[0012] Figure 4 It is a schematic diagram of the overall structure of Embodiment 2 of the present utility model;

[0013] Figure 5 It is a schematic diagram of the exploded structure of Embodiment 2 of the present utility model;

[0014] Figure 6 It is a schematic diagram of another structure of the semiconductor refrigeration chip in the embodiments of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0015] The present utility model will be further described in detail below in conjunction with the drawings and specific embodiments.

[0016] Example 1: As Figures 1 to 3 shown, a magnetic adsorption semiconductor refrigeration component includes a semiconductor refrigeration chip 1. The semiconductor refrigeration chip 1 includes a refrigerating surface 10 and a heating surface 11. After being powered on, the temperature of the refrigerating surface 10 drops rapidly to achieve refrigeration, and the temperature of the heating surface 11 rises rapidly. The principle of semiconductor refrigeration is a publicly known prior art and will not be elaborated here.

[0017] In this embodiment, the semiconductor refrigeration chip 1 has a concave cavity 100 extending from one side of the refrigerating surface 10 to one side of the heating surface 11, forming a cavity bottom refrigerating surface 101 and a cavity top refrigerating surface 102 with a height difference.

[0018] Then, the concave cavity 100 can be used to accommodate a charging coil 2, a magnet 3, etc. The cold generated by the cavity bottom refrigerating surface 101 can cool both the charging coil 2 and the magnet 3, and can also cool the wireless terminal, keeping the charging coil 2, the magnet 3, and the wireless terminal at a lower temperature. At the same time, the semiconductor refrigeration chip 1, the charging coil 2, and the magnet 3 can be arranged substantially in the same plane; the cold generated by the cavity top refrigerating surface 102 can directly act on the mobile terminal without being conducted through the charging coil 2 and the magnet 3, greatly improving the refrigeration effect on the mobile terminal. The above-mentioned mobile terminal can be a mobile phone, a tablet computer, or a notebook computer.

[0019] To increase the contact area between the refrigerating surface and the mobile terminal, as Figure 6 shown, the outer shape of the semiconductor refrigeration chip 1c is made into a rectangle, that is, the outer shape of the cavity top refrigerating surface 102c is a rectangle; the cross-section of the cavity bottom refrigerating surface 101c is a circle. When the magnetic adsorption semiconductor refrigeration component applying this kind of semiconductor refrigeration chip is used in a charger or a power bank, the cavity top refrigerating surface 102c can be directly in contact with the mobile terminal. In this way, the contact area is larger and the refrigeration effect is better.

[0020] A heat dissipation device is provided on one side of the heating surface 11. The heat dissipation device includes a heat conducting member 41 with a length. One end of the heat conducting member 41 is in contact with the heating surface 11 for heat transfer.

[0021] In this embodiment, the heat conducting member 41 is a VC liquid cooling heat spreader. The shape of the end of the VC liquid cooling heat spreader in contact with the semiconductor refrigeration chip 1 matches the shape of the semiconductor refrigeration chip 1.

[0022] The VC liquid cooling heat spreader is also called a vacuum chamber heat spreader or a heat equalizing plate. The English name of VC is Vapor Chamber. The VC liquid cooling heat spreader is a component for efficiently transferring heat, which is a mature prior art and its specific structure will not be elaborated here.

[0023] To improve the heat conduction and heat storage effects, the heat dissipation device may further include a heat storage member 42. The heat storage member 42 is located at the bottom of the heat conduction member 41, and one end of the heat conduction member 41 may be embedded in the heat storage member 42.

[0024] As another embodiment of the heat conduction member, the heat conduction member is a copper tube, and the copper tube is embedded in the heat storage member. The heat storage member can be an aluminum block or a copper block, which can also play the role of heat conduction and heat storage.

[0025] During assembly, thermal grease is coated between the heating surface 11 and the heat conduction member 41 to improve the heat conduction efficiency.

[0026] In this embodiment, the magnet 3 is provided in the cold surface 101 at the bottom of the cavity. The magnet 3 can be made into individual small pieces or an entire ring, and it can be used to adsorb the mobile terminal.

[0027] In this embodiment, a heat conduction member 5 that can simultaneously cover the thermoelectric cooler 1 and the magnet 3 is provided on one side of the cold surface 10 of the annular thermoelectric cooler 1.

[0028] The heat conduction member 5 can be made of a metal material or made of thermal conductive silicone, etc. The heat conduction member 5 is used to contact the mobile terminal.

[0029] In this embodiment, the heat conduction member 5 is formed by deep drawing and stamping of aluminum alloy. Thermal grease is coated on the surface of the heat conduction member 5 in contact with the thermoelectric cooler 1 to improve the heat conduction efficiency.

[0030] The charging coil 2 is also provided in the cold surface 101 at the bottom of the cavity, and the charging coil 2 is located inside the magnet 3. To shield the charging coil 2, a non-metallic face cover is usually provided outside the charging coil 2.

[0031] A heat dissipation member 6 for increasing the heat dissipation area or heat storage capacity is provided at one end of the heat conduction member 41 away from the thermoelectric cooler 1.

[0032] In this embodiment, the heat dissipation member 6 is a heat dissipation fin group. The heat dissipation fin group is closely connected to the heat conduction member 41 to achieve heat dissipation. To reduce costs, usually, the heat dissipation fin group is made of aluminum alloy. Of course, the heat dissipation fin group can also be made of copper alloy.

[0033] To enhance the heat dissipation intensity of the heat dissipation fin group, a heat dissipation fan 7 is further provided on the heat dissipation fin group. The air inlet of the heat dissipation fan 7 is close to the heat dissipation fin group to strengthen air convection and improve the heat dissipation effect.

[0034] Embodiment 2: As Figure 4 and Figure 5As shown, except for the different settings of the heat dissipation component, the other structures are the same as those in the first embodiment. When the refrigeration power is low, the heat dissipation component can be a heat dissipation block 6b. Slots are formed on the surface of the heat dissipation block 6b to increase the heat dissipation area. In this way, there is no need to equip a heat dissipation fan for the heat dissipation block 6b, which can reduce the production cost.

[0035] Figure 5 The schematic structural diagram of the non-metal face cover 8 is shown.

[0036] With the above settings, the heat conducting component 41 can timely conduct the heat generated by the heating surface 11 to the heat dissipation component 6 or 6b, and the heat is dissipated through the heat dissipation component 6 or 6b, so as to maintain the refrigeration effect of the semiconductor refrigeration chip 1.

Claims

1. A magnetic semiconductor refrigeration component, comprising a semiconductor refrigeration sheet, the semiconductor refrigeration sheet comprising a cooling surface and a heating surface, characterized in that: The semiconductor refrigeration plate has a concave cavity extending from a cooling surface side to a heating surface side, and the cooling surface forms a cavity bottom cooling surface and a cavity top cooling surface with a height difference; a heat dissipation device is provided on the heating surface side, and the heat dissipation device includes a heat conductive member with a length, one end of the heat conductive member contacts the heating surface for heat transfer; a heat dissipation member for increasing the heat dissipation area or the heat storage is provided at the other end of the heat conductive member; and a magnetic member with magnetism is provided in the concave cavity.

2. The magnetic semiconductor refrigeration component according to claim 1, characterized in that: The heat dissipation device also includes a heat storage component, and one end of the heat conductive component is embedded in the heat storage component.

3. The magnetic semiconductor refrigeration component according to claim 1, characterized in that: The magnetic component is a magnet, and a cooling conductive component capable of covering both the semiconductor refrigeration plate and the magnet is provided on one side of the cooling surface of the annular semiconductor refrigeration plate.

4. The magnetic semiconductor refrigeration component according to claim 3, characterized in that: The cooling member is made of aluminum alloy or silicone.

5. The magnetic semiconductor refrigeration component according to claim 1, characterized in that: The heat conducting member is a VC liquid cooling soaking plate, and one end of the VC liquid cooling soaking plate that contacts the annular semiconductor refrigeration plate forms a ring shape that matches the shape of the annular semiconductor refrigeration plate.

6. The magnetic semiconductor refrigeration component according to claim 2, characterized in that: The heat conducting member is a copper tube; the heat storing member is an aluminum block, and the copper tube is embedded in the aluminum block.

7. The magnetic semiconductor refrigeration component according to claim 1, characterized in that: The heat sink is a heat sink fin group or a heat sink block.

8. The magnetic semiconductor refrigeration component according to claim 1, characterized in that: It also includes a heat dissipation fan, which is used to dissipate heat from the heat dissipation fin group.

9. The magnetic semiconductor refrigeration component according to claim 1, characterized in that: Apply thermal conductive silicone grease between the semiconductor refrigeration sheet and the heat conducting member; apply thermal conductive silicone grease between the semiconductor refrigeration sheet and the heat conducting member.

10. The magnetic semiconductor refrigeration component according to claim 1, characterized in that: The shape of the cavity top cooling surface is rectangular; the cross section of the cavity bottom cooling surface is circular.

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