High-precision intelligent silicon wafer flaw detection equipment

Abstract

The utility model discloses high-precision intelligent silicon wafer flaw detection equipment, which belongs to the technical field of silicon wafer detection equipment and comprises a base, a placing tray is fixedly mounted at the top of the base, a movable frame is slidably connected to the top of the base, and a flaw detector is fixedly mounted on the inner side of the top of the movable frame. A flaw detector is arranged on the base, the flaw detector is matched with the placing disc, a material changing mechanism is arranged on the base, the material changing mechanism is in transmission connection with the moving frame, a moving mechanism is arranged on the base, a motor is fixedly installed on one side of the base, and an output shaft of the motor is in transmission connection with the moving mechanism. Through rotary connection of the push rod, the swing rod and the moving frame, the moving moving frame can drive the swing rod to carry out angle change, then silicon wafers can be carried out, meanwhile, a rack and a positioning gear are meshed with each other, the two suction cups can be driven by the driving air cylinder to be switched, and then material replacement can be carried out on the two silicon wafers.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer detection equipment, and specifically relates to a high-precision silicon wafer defect intelligent detection equipment. Background Art

[0002] Silicon wafer is a term in the field of microelectronics technology. 160,000 transistors can be integrated on a silicon wafer as small as a grain of rice, which is another milestone in the progress of science and technology.

[0003] The silicon content in the earth's crust is 25.8%, which provides an inexhaustible source for the production of monocrystalline silicon. Since silicon is one of the most abundant elements in the earth's crust, the advantage of reserves is also one of the reasons why silicon has become the main material for photovoltaics, which is destined to enter the mass market for products such as solar cells.

[0004] After production and processing, existing silicon wafers need to undergo high-precision defect quality inspection. During the inspection, the equipment generally needs to be stopped after the inspection is completed, and then the silicon wafers are loaded and unloaded by a robotic arm, which results in slow operation efficiency.

[0005] In order to solve the above problems, this application proposes a high-precision silicon wafer defect intelligent detection device. Utility Model Content

[0006] In view of the problems in the related technology, the utility model proposes a high-precision silicon wafer defect intelligent detection device to overcome the above technical problems existing in the existing related technology.

[0007] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0008] A high-precision intelligent silicon wafer defect detection device comprises a base, a placement plate is fixedly installed on the top of the base, a mobile frame is slidably connected to the top of the base, a defect detector is fixedly installed on the inner side of the top of the mobile frame, the defect detector cooperates with the placement plate, a material changing mechanism is provided on the base, the material changing mechanism is transmission connected with the mobile frame, a mobile mechanism is provided on the base, a motor is fixedly installed on one side of the base, the output shaft of the motor is transmission connected with the mobile mechanism, a placement table is fixedly installed on one side of the base, the placement table and the material changing mechanism cooperate with each other, a display screen is installed on the top of the base, and the display screen is connected to the defect detector.

[0009] Preferably, the material changing mechanism includes a rocker arm, a support rod is fixedly installed on the top of the base, the rocker arm is rotatably connected to the support rod, a lifting cylinder is fixedly installed on the top of the rocker arm, a lifting rod is rotatably connected to the piston of the lifting cylinder, a mounting rod is fixedly installed on the bottom end of the lifting rod, two suction cups are installed on the bottom end of the mounting rod, and the two suction cups respectively cooperate with the placement plate.

[0010] The piston of the lifting cylinder drives the lifting rod to move downward. The lifting rod drives two suction cups to move downward through the mounting rod, so that the silicon wafer can be adsorbed and positioned by the suction cups, and can be lifted and moved by the lifting cylinder. At the same time, the swing rod is rotationally connected to the support rod, so that it can move and carry.

[0011] Preferably, a driving cylinder is fixedly installed at the bottom of the swing rod. A rack is fixedly installed on the piston of the driving cylinder. A positioning gear is slidably connected to the lifting rod, and the positioning gear meshes with the rack.

[0012] The piston of the driving cylinder drives the rack to move. The rack meshes with the positioning gear, so that the lifting rod can be driven to change the angle, and then the two silicon wafers adsorbed on the mounting rod can be converted for loading.

[0013] Preferably, a positioning box is fixedly installed at the bottom of the swing rod. The positioning box is movably connected to the lifting rod and slidably connected to the rack. The positioning gear is rotatably connected to the inner wall of the positioning box.

[0014] The setting of the positioning box can facilitate the stability of the meshing state of the rack and the positioning gear, and can also position the positioning gear.

[0015] Preferably, a push rod is rotatably connected to the top of the moving frame, and the push rod is rotatably connected to the swing rod.

[0016] The moving moving frame is rotationally connected to the push rod, and the push rod is rotationally connected to the swing rod, so that the swing rod can be driven to change the angle.

[0017] Preferably, the moving mechanism includes two screws. Two sliding grooves are opened at the top of the base. The two screws are respectively rotatably connected to the inner walls of the corresponding sliding grooves, and the output shaft of the motor is fixedly connected to the corresponding screw. A moving block is threadedly connected to the screw, and the two moving blocks are fixedly connected to the moving frame.

[0018] The rotating screw is threadedly connected to the moving block, so that the moving frame can be driven to move, and then the flaw detector can be driven to move and detect.

[0019] Preferably, a pulley is fixedly sleeved on the screw, and the same belt is drivingly connected to the two pulleys.

[0020] The output shaft of the motor is drivingly connected to the belt through the two pulleys, so that the two screws can be driven to rotate simultaneously.

[0021] In summary, the technical effects and advantages of the present utility model:

[0022] Through the rotational connection between the push rod, the rocker arm and the mobile frame, the moving frame can drive the rocker arm to change its angle, thereby transporting the silicon wafer. At the same time, the rack and the positioning gear are engaged with each other, so that the two suction cups can be driven by the driving cylinder to convert, thereby replacing the materials of the two silicon wafers.

[0023] Through the transmission connection of the pulley and the belt, the output shaft of the motor drives the two screws to rotate simultaneously, and then drives the moving frame to move through the screws and the moving block, so that the defect detector can perform mobile inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0025] Figure 2 This is a schematic diagram of the structure of the utility model when viewed from above;

[0026] Figure 3 This is a schematic diagram of the structure of the material changing mechanism of the utility model;

[0027] Figure 4 It is a schematic diagram of the top view structure of the base of the utility model.

[0028] In the figure:

[0029] 1. Base; 2. Mobile rack; 3. Defect detector; 4. Placement plate; 5. Support rod; 6. Rocker rod; 7. Lifting cylinder; 8. Lifting rod; 9. Mounting rod; 10. Suction cup; 11. Positioning box; 12. Driving cylinder; 13. Rack; 14. Positioning gear; 15. Placement table; 16. Sliding groove; 17. Screw; 18. Moving block; 19. Motor; 20. Pulley; 21. Belt; 22. Display screen; 23. Push rod. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0031] Reference Figures 1-4A high-precision silicon wafer defect intelligent detection device includes a base 1, a placement plate 4 is fixedly installed on the top of the base 1, a moving frame 2 is slidably connected to the top of the base 1, a defect detector 3 is fixedly installed on the inner side of the top of the moving frame 2, the defect detector 3 cooperates with the placement plate 4, a material changing mechanism is provided on the base 1, the material changing mechanism is transmission connected with the moving frame 2, a moving mechanism is provided on the base 1, a motor 19 is fixedly installed on one side of the base 1, the output shaft of the motor 19 is transmission connected with the moving mechanism, a placement table 15 is fixedly installed on one side of the base 1, the placement table 15 cooperates with the material changing mechanism, a display screen 22 is installed on the top of the base 1, and the display screen 22 is connected with the defect detector 3.

[0032] Reference Figure 1 and Figure 4 The material changing mechanism includes a rocker arm 6, a support rod 5 is fixedly installed on the top of the base 1, the rocker arm 6 is rotatably connected to the support rod 5, a lifting cylinder 7 is fixedly installed on the top of the rocker arm 6, a lifting rod 8 is rotatably connected to the piston of the lifting cylinder 7, a mounting rod 9 is fixedly installed on the bottom end of the lifting rod 8, two suction cups 10 are installed on the bottom end of the mounting rod 9, and the two suction cups 10 respectively cooperate with the placement plate 4, the piston of the lifting cylinder 7 drives the lifting rod 8 to move downward, and the lifting rod 8 drives the two suction cups 10 to move downward through the mounting rod 9, so that the silicon wafer can be adsorbed and positioned through the suction cup 10, and can be lifted and moved by the lifting cylinder 7, and at the same time, the rocker arm 6 is rotatably connected to the support rod 5, so that it can be moved and transported.

[0033] Reference Figure 4 A driving cylinder 12 is fixedly installed at the bottom of the rocker arm 6, and a rack 13 is fixedly installed on the piston of the driving cylinder 12. A positioning gear 14 is slidably connected to the lifting rod 8. The positioning gear 14 and the rack 13 are meshed with each other. The piston of the driving cylinder 12 drives the rack 13 to move. The rack 13 is meshed with the positioning gear 14, thereby driving the lifting rod 8 to change its angle, and then driving the two silicon wafers adsorbed on the mounting rod 9 to convert and load.

[0034] Reference Figure 2 A positioning box 11 is fixedly installed at the bottom of the swing rod 6. The positioning box 11 is movably connected to the lifting rod 8, and the positioning box 11 is slidingly connected to the rack 13. The positioning gear 14 is rotatably connected to the inner wall of the positioning box 11. The setting of the positioning box 11 can facilitate stabilizing the meshing state of the rack 13 and the positioning gear 14, and can also position the positioning gear 14.

[0035] Reference Figure 2 The top of the movable frame 2 is rotatably connected with a push rod 23, and the push rod 23 is rotatably connected with the swing rod 6. The movable frame 2 is rotatably connected with the push rod 23, and the push rod 23 is rotatably connected with the swing rod 6, thereby being able to drive the swing rod 6 to change its angle.

[0036] Referring to Figure 2 , the moving mechanism includes two screws 17. Two sliding grooves 16 are formed in the top of the base 1. The two screws 17 are respectively rotatably connected to the inner walls of the corresponding sliding grooves 16, and the output shaft of the motor 19 is fixedly connected to the corresponding screw 17. A moving block 18 is threadedly connected to the screw 17. The two moving blocks 18 are fixedly connected to the moving frame 2. The rotating screw 17 can drive the moving frame 2 to move through the threaded connection with the moving block 18, and then can drive the defect detector 3 to move for detection.

[0037] Referring to Figure 3 , a pulley 20 is fixedly sleeved on the screw 17. The same belt 21 is drivingly connected to the two pulleys 20. The output shaft of the motor 19 is drivingly connected to the belt 21 through the two pulleys 20, so as to drive the two screws 17 to rotate simultaneously.

[0038] Working principle: During operation, the switch of the motor 19 is turned on. The output shaft of the motor 19 is drivingly connected to the belt 21 through the two pulleys 20, so as to drive the two screws 17 to rotate simultaneously. The output shaft is drivingly connected to the belt 21 through the two pulleys 20, so as to drive the two screws 17 to rotate simultaneously. The moving moving frame 2 is rotatably connected to the push rod 23, and the push rod 23 is rotatably connected to the swing rod 6, so as to drive the swing rod 6 to change the angle. The piston of the lifting cylinder 7 drives the lifting rod 8 to move downward. The lifting rod 8 drives the two suction cups 10 to move downward through the mounting rod 9, and then can adsorb and position the silicon wafer through the suction cups 10, and can be lifted and moved through the lifting cylinder 7. At the same time, the swing rod 6 is rotatably connected to the support rod 5, so as to move and carry. The piston of the driving cylinder 12 drives the rack 13 to move. The rack 13 meshes with the positioning gear 14, so as to drive the lifting rod 8 to change the angle, and then can drive the two silicon wafers adsorbed on the mounting rod 9 to be transferred and loaded, so that when the moving frame 2 moves back and forth, the silicon wafers can be automatically replaced and unloaded.

[0039] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high-precision silicon wafer defect intelligent detection device, comprising a base (1), characterized in that: A placement plate (4) is fixedly mounted on the top of the base (1), a moving frame (2) is slidably connected to the top of the base (1), a defect detector (3) is fixedly mounted on the inner side of the top of the moving frame (2), and the defect detector (3) cooperates with the placement plate (4). A material changing mechanism is provided on the base (1), and the material changing mechanism is transmission-connected to the moving frame (2). A moving mechanism is provided on the base (1), a motor (19) is fixedly mounted on one side of the base (1), and the output shaft of the motor (19) is transmission-connected to the moving mechanism. A placement table (15) is fixedly mounted on one side of the base (1), and the placement table (15) cooperates with the material changing mechanism. A display screen (22) is mounted on the top of the base (1), and the display screen (22) is connected to the defect detector (3).

2. The high-precision silicon wafer defect intelligent detection device according to claim 1, characterized in that: The material changing mechanism comprises a rocker arm (6), a support rod (5) is fixedly mounted on the top of the base (1), the rocker arm (6) is rotatably connected to the support rod (5), a lifting cylinder (7) is fixedly mounted on the top of the rocker arm (6), a lifting rod (8) is rotatably connected to the piston of the lifting cylinder (7), a mounting rod (9) is fixedly mounted on the bottom end of the lifting rod (8), two suction cups (10) are mounted on the bottom end of the mounting rod (9), and the two suction cups (10) respectively cooperate with the placement plate (4).

3. The high-precision silicon wafer defect intelligent detection device according to claim 2, characterized in that: A driving cylinder (12) is fixedly mounted on the bottom of the swing rod (6), a rack (13) is fixedly mounted on the piston of the driving cylinder (12), a positioning gear (14) is slidably connected to the lifting rod (8), and the positioning gear (14) and the rack (13) are meshed with each other.

4. The high-precision silicon wafer defect intelligent detection device according to claim 3, characterized in that: A positioning box (11) is fixedly installed at the bottom of the swing rod (6); the positioning box (11) is movably connected to the lifting rod (8); the positioning box (11) is slidably connected to the rack (13); and the positioning gear (14) is rotatably connected to the inner wall of the positioning box (11).

5. The high-precision silicon wafer defect intelligent detection device according to claim 1, characterized in that: The top of the movable frame (2) is rotatably connected to a push rod (23), and the push rod (23) is rotatably connected to the swing rod (6).

6. The high-precision silicon wafer defect intelligent detection device according to claim 1, characterized in that: The moving mechanism comprises two screw rods (17), two sliding grooves (16) are provided on the top of the base (1), the two screw rods (17) are rotatably connected to the inner walls of the corresponding sliding grooves (16), and the output shaft of the motor (19) is fixedly connected to the corresponding screw rods (17), a moving block (18) is threadedly connected to the screw rods (17), and the two moving blocks (18) are fixedly connected to the moving frame (2).

7. The high-precision silicon wafer defect intelligent detection device according to claim 6, characterized in that: A belt pulley (20) is fixedly mounted on the screw rod (17), and the two belt pulleys (20) are connected to the same belt (21) for transmission.

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