Electric leakage sensor aging measuring device

Abstract

The utility model discloses an aging measurement device for an electric leakage sensor, relates to the technical field of electric power equipment detection, improves the aging test efficiency of aging measurement of an existing electric leakage sensor, and realizes batch processing of the sensor. According to the utility model, interaction with the display terminal is realized in a wireless communication mode, so that the testing flexibility and efficiency are improved; the wireless MCU program controls the CD4067 analog switch to automatically select each sensor in sequence for detection, manual intervention is not needed, self-inspection and data acquisition of each sensor are automatically carried out under program control, and the test period is greatly shortened; a 74H573 data latch is used for quickly latching a self-checking signal of the sensor under the control of a wireless MCU (Microprogrammed Control Unit), so that the processing speed is increased; through the sensor locking socket, a large number of sensors can be connected to a test system at the same time to carry out a unified aging test, so that the test efficiency and the batch processing capability are significantly improved, and the measurement efficiency is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of power equipment detection, and more precisely relates to a leakage current sensor aging measurement device. Background Art

[0002] In the rapidly developing fields of industrial automation and intelligent manufacturing today, the requirements for electrical safety are becoming increasingly strict. As a key safety component, the performance reliability of leakage current sensors is directly related to the safe operation of the entire system. Therefore, it is particularly important to conduct aging tests and performance evaluations on these sensors. With the progress of technology and the expansion of production scale, traditional aging test methods can no longer meet the needs of modern production, especially in high-temperature or low-temperature environments. There is an urgent need for a more efficient and reliable aging measurement device.

[0003] Traditional aging test methods for leakage current sensors usually rely on being carried out in specific high-temperature or low-temperature environments to simulate the working state of sensors under extreme conditions. These tests usually require manual operations, including the installation, wiring, and data recording of sensors. Although this method can provide a basic performance evaluation, it shows obvious limitations in modern large-scale production environments. Especially when a large number of sensors need to be tested, the efficiency and accuracy of this method are difficult to meet the production requirements.

[0004] The main disadvantages of traditional leakage current sensor aging measurement devices lie in their inconvenient operation and low efficiency. First of all, since the test needs to be carried out in high-temperature or low-temperature environments, this limits the working ability of operators under these conditions, increasing the operation risk and time cost. Secondly, when the number of sensors to be tested increases, traditional wiring and control methods become extremely complex, not only increasing the wiring workload but also raising the possibility of errors. In addition, due to the lack of automated and intelligent control means, the process of data collection and analysis is cumbersome and it is difficult to achieve rapid and accurate evaluation. These disadvantages directly affect the test efficiency and the quality control of sensors, restricting the expansion of production scale and the improvement of product quality. Summary of the Utility Model

[0005] The purpose of the present invention is to design a leakage current sensor aging measurement device to improve the aging test efficiency of leakage current sensors and achieve batch processing of sensors.

[0006] In order to achieve the above technical effects, the utility model adopts the following technical solutions:

[0007] A leakage sensor aging measurement device, comprising a PCB main board, which integrates a wireless MCU, a 74H573 data latch, a CD4067 analog switch, a power management circuit, a storage unit and a sensor locking socket; the PCB main board transmits data to a display terminal wirelessly; the display terminal is used to display the test process, results and device status; a first connection side plate is connected to the left side of the PCB main board; a second connection side plate is connected to the right side of the PCB main board; a current input terminal is arranged on the side of the first connection side plate away from the PCB main board; a current input rod elastic piece is arranged on the side of the second connection side plate close to the PCB main board, and is connected to an input current connecting rod to form a transmission path for the current between sensors; the current input rod elastic piece is used to tightly clamp the input current connecting rod to ensure continuous current transmission; a power supply terminal is arranged below the PCB main board; the input current connecting rod passes through between sensors and is clamped at both ends by the current input rod elastic piece to ensure stable current transmission.

[0008] As a further description of the above technical solution:

[0009] The wireless MCU is used to receive and send wireless instructions to control the entire test process, including sending self-check signals, controlling data acquisition, result analysis and storage, and communicating with the display terminal; the wireless MCU communicates with the storage unit through an SPI communication interface and controls the 74H573 latch and the CD4067 analog switch through GPIO; the 74H573 data latch is used to temporarily store data under the control of the wireless MCU; the control pin LE of the 74H573 data latch is directly connected to the GPIO of the wireless MCU, the data input terminal of the 74H573 data latch is connected to the data output terminal of the MCU, and the output terminal of the 74H573 data latch is connected to the CD4067 analog switch; the CD4067 analog switch is used to allow the wireless MCU to access the outputs of multiple sensors through a single interface; the address control pin of the CD4067 analog switch is connected to the GPIO of the wireless MCU; the output terminal of the CD4067 analog switch is connected to the input terminal of the wireless MCU; the power management circuit is connected to the power supply terminal; the storage unit is connected to the wireless MCU through an SPI communication interface; the sensor locking socket is connected to the wireless MCU, the latch and the analog switch through traces on the PCB.

[0010] As a further description of the above technical solution:

[0011] The leakage sensor participates in the test process through the self-check pin CHK and the TRIP pin.

[0012] As a further description of the above technical solution:

[0013] The sensor locking socket is welded to the PCB main board, and the current is connected in series through the input current connecting rod and the connecting side plate.

[0014] As a further description of the above technical solution:

[0015] A lower pressing lever is arranged inside the sensor locking socket; the lower pressing lever includes a lever main body and a locking mechanism; the lever main body is in the shape of a straight rod; the locking mechanism is located below the lever main body and is connected to the lever main body through a spring.

[0016] As a further description of the above technical solution:

[0017] 32 sensor interfaces are arranged on the PCB main board for control and reading; the PCB main board accesses the sensor interfaces in turn by means of polling.

[0018] In summary, due to the adoption of the above technical solution, the beneficial effects of the present utility model are as follows: The present utility model interacts with the display terminal through a wireless communication method, quickly issues test instructions and real-time feedbacks test results, reduces the complexity of manual operations and wired connections, and improves the test flexibility and efficiency. The wireless MCU programs to control the CD4067 analog switch, automatically sequentially selects each sensor for detection without manual intervention, and the self-check and data acquisition of each sensor are automatically carried out under the control of the program, greatly shortening the test cycle. Through the 74H573 data latch, under the control of the wireless MCU, the self-check signal of the sensor is quickly latched to ensure the stability of the signal during the data acquisition stage. This mechanism supports fast data reading and processing and improves the processing speed. In addition, a special sensor locking socket is designed so that a large number of sensors can be simultaneously connected to the test system for unified aging tests, significantly improving the test efficiency and batch processing ability compared with single tests. Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to these drawings, where:

[0020] Figure 1 It is the overall working architecture diagram of the present utility model;

[0021] Figure 2 It is the schematic diagram of the working principle of the device of the present utility model;

[0022] Reference numerals in the figure: 1, sensor locking socket; 2, wireless MCU; 3, first connection side plate; 4, second connection side plate; 5, current input terminal; 6, power supply terminal; 7, current connecting rod; 8, current input rod spring piece. Specific embodiments

[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

[0024] As Figure 1 - Figure 2 shown, a leakage sensor aging measurement device includes a pcb main board, and the pcb main board integrates a wireless MCU 2, a 74H573 data latch, a CD4067 analog switch, a power management circuit, a storage unit, and a sensor locking socket 1; the pcb main board transmits data to a display terminal wirelessly; the display terminal is used to display the test process, results, and device status; a first connection side plate 3 is connected to the left side of the pcb main board; a second connection side plate 4 is connected to the right side of the pcb main board; a current input terminal 5 is provided on the side of the first connection side plate 3 away from the pcb main board; a current input rod spring piece 8 is provided on the side of the second connection side plate 4 close to the pcb main board and is connected to the input current connecting rod to form a transmission path for the current between the sensors; the current input rod spring piece 8 is used to tightly clamp the input current connecting rod to ensure continuous current transmission; a power supply terminal 6 is provided below the pcb main board; the input current connecting rod passes through between the sensors and is clamped at both ends by the current input rod spring piece 8 to ensure stable current transmission.

[0025] In a specific embodiment, the sensor-locking socket 1 is welded to the PCB main board, and the current is connected in series through the input current connecting rod and the connecting side plate. Each PCB main board controls and reads 32 sensors, and the PCB main board can define an address (experimental board number), and the sensors on the PCB main board are accessed in a polling manner; the connecting side plate, the input current connecting rod 7, and the current input rod spring piece 8 are responsible for the current connection in series between the sensors. Among them, the current input rod spring piece 8 clamps both ends of the input current connecting rod 7 to transmit current; the current input terminal 5 and the power supply terminal 6 play a role in energization. Among them, the power supply terminal 6 supplies power to the PCB main board, and current is input at the current input terminal 5, passes through the connecting side plate to the left current input rod spring piece 8, then passes through the input current connecting rod 7 and passes through the middle of the sensor to the right current input rod spring piece 8 on the 1 side, and sequentially passes through the sensors in an S shape through the connecting side plate to the left current input bar spring piece on the 4 side, and after passing through the connecting side plate, a closed loop is formed at the current input terminal and then output.

[0026] The leakage sensor aging measurement device is divided into a host (i.e., the display terminal) and an aging device (slave). The host sends and receives commands and data of the aging measurement device to realize the judgment of the parameters and good or bad status of the aging products. The communication between the host and the aging measurement device (slave) is based on the standard Modbus communication protocol.

[0027] During use, insert the sensor into the sensor-locking socket 1 on the aging measurement device board and lock it, and then put it into the aging test chamber to test whether the sensor can operate normally in the aging environment. The host gives the aging measurement device a self-check command, and the aging measurement device will give a low level of 800 ms to each sensor self-check pin and save the sensor data according to the status data output by the TRIP pin. Judge whether the level output by the trip pin meets the self-check requirements according to the saved data, and place the judgment results in the registers of the MCU one by one according to the numbers on the aging measurement device board. The aging measurement device sends the saved sensor data to the host when it receives the host polling instruction and displays the qualified status of the sensors on the aging measurement device on the host.

[0028] In the above embodiments, the wireless MCU 2 is used to receive and send wireless instructions to control the entire test process, including sending self-check signals, controlling data acquisition, result analysis and storage, and communicating with the display terminal; the wireless MCU 2 communicates with the storage unit through the SPI communication interface and controls the 74H573 latch and the CD4067 analog switch through the GPIO; the 74H573 data latch is used to temporarily store data under the control of the wireless MCU 2; the control pin LE of the 74H573 data latch is directly connected to the GPIO of the wireless MCU 2, the data input terminal of the 74H573 data latch is connected to the data output terminal of the MCU, and the output terminal of the 74H573 data latch is connected to the CD4067 analog switch; the CD4067 analog switch is used to allow the wireless MCU 2 to access the outputs of multiple sensors through a single interface; the address control pin of the CD4067 analog switch is connected to the GPIO of the wireless MCU 2; the output terminal of the CD4067 analog switch is connected to the input terminal of the wireless MCU 2; the power management circuit is connected to the power supply terminal 6; the storage unit is connected to the wireless MCU 2 through the SPI communication interface; the sensor lock socket 1 is connected to the wireless MCU 2, the latch, and the analog switch through the traces on the PCB.

[0029] In a specific embodiment, as Figure 2 shown, the functions of the wireless MCU 2 and the control circuit are to control the input current, collect sensor output parameters, judge qualified and unqualified, store results, transfer parameters, etc. The MCU controls the 74H573 data latch to pull down the CHK (self-check) pins of 32 sensors for 800 ms as shown at t2 in Figure 2 and after a delay of 400 ms (as shown at t3 in Figure 2 ), the MCU addresses the CD4067 analog switch to sequentially read the output states of the trip pins of 32 sensors, reads the TRIP pin level (the level at t4 in Figure 2 is greater than 250 ms), polls and reads the levels of the TRIP pins of 32 sensors once every 5 ms, and ends the polling after 50 times (5 ms * 50 = 250 ms, t4). According to the status data of the output levels of the TRIP pins, the data of 32 sensors are saved. According to the saved data, it is judged whether the output level of the trip pin meets the self-check requirements, and the judgment results are placed in the registers of the MCU one by one according to the numbers on the aging measurement device board. The aging measurement device receives the polling instruction from the host and sends the saved sensor data to the host, and displays the qualified status of the sensors on the aging measurement device on the host computer.

[0030] In the above embodiments, the leakage sensor participates in the test process through the self-check pin CHK and the TRIP pin.

[0031] In a specific embodiment, the CHK pin is typically used to trigger the self - test program inside the sensor, while the TRIP pin is used to report leakage events or internal fault states detected by the sensor. The technical principle is based on fault detection and diagnosis techniques in electrical engineering, including analog signal processing, digital logic judgment, and possibly artificial intelligence algorithms for pattern recognition and fault prediction. Through the self - test program, the sensor can detect the integrity and functionality of its internal circuit, ensuring the performance stability and reliability of the sensor during the aging process.

[0032] In a specific embodiment, the aging measurement device first sends a self - test command to the sensor through the wireless MCU2 on the PCB main board, triggering the CHK pin. After receiving the command, the sensor executes the internal self - test program to check the status of its circuit and components. After the self - test is completed, the sensor outputs a status signal through the TRIP pin, indicating whether it is working properly or an anomaly has been detected. The MCU collects the status data of the sensor based on the level change of the TRIP pin and makes a logical judgment. If the level output by the TRIP pin meets the preset qualified standard, the sensor is considered to have passed the self - test; otherwise, it is marked as faulty or requires further inspection. These data are then stored and can be sent wirelessly to the monitoring system for technicians to analyze and evaluate.

[0033] The leakage current sensor aging measurement device using the self - test pins CHK and TRIP has important practical significance and beneficial effects. First of all, this self - test mechanism can monitor the health status of the sensor in real time, detect potential faults in a timely manner, thus avoiding safety accidents caused by sensor failure in actual applications. Secondly, through the automated test process, the efficiency and accuracy of aging measurement are greatly improved, the need for manual detection is reduced, and the cost is lowered. In addition, the wireless data transmission function of this device makes remote monitoring and data analysis possible, providing technical support for the realization of smart grids and intelligent manufacturing. Finally, the design of this device helps to improve the service life and reliability of the sensor. Through regular aging tests and status monitoring, the maintenance cycle can be predicted and planned, the unexpected downtime can be reduced, and the operating efficiency of the entire system can be improved.

[0034] In the above - mentioned embodiment, the sensor locking socket 1 is welded on the PCB main board and realizes the series connection of current through the input current connecting rod 7 and the connecting side plate.

[0035] In the above - mentioned embodiment, a lower pressing lever is arranged inside the sensor locking socket 1; the lower pressing lever includes a lever main body and a locking mechanism; the lever main body is in a straight - rod shape; the locking mechanism is located below the lever main body and is connected to the lever main body through a spring.

[0036] In a specific embodiment, the design of the input current connecting rod 7 and the connecting side plate realizes the series connection of current among multiple sensors. This design allows the current to be evenly distributed in the sensor array, ensuring the consistency and accuracy of the test. The design of the downward pressing lever adopts a straight rod shape, simplifying the mechanical structure. The locking mechanism is set to be connected to the lever body through a spring, providing a self-locking mechanism to ensure the stability of the sensor during the test. This integrated mechanical and electrical design reflects the strict control of details in high-precision testing equipment. In a specific embodiment, first, the sensor is inserted into the sensor locking socket 1 welded to the PCB main board. Then, by operating the downward pressing lever, the straight rod-shaped lever body applies a downward force, compressing the spring below, causing the locking mechanism to mechanically engage with the sensor, thereby achieving the firm locking of the sensor. At this time, the input current connecting rod 7 and the connecting side plate guide the current to the sensor to realize the series connection of the current. During the aging test process, the continuous flow of current will age the sensor, simulating the electrical load it may encounter in actual use. After the test is completed, releasing the downward pressing lever, the spring force resets the locking mechanism, and the sensor can be removed from the locking socket to complete the entire test process.

[0037] The leakage current sensor aging measurement device adopting this design has significant significance and beneficial effects. First, the stability of the sensor locking socket 1 and the self-locking characteristic of the locking mechanism greatly improve the reliability of the sensor connection during the test, reducing the test error caused by poor contact. Second, through the series connection design of the current, the ability to simultaneously age multiple sensors is realized. This not only improves the test efficiency but also allows for batch production testing, meeting the requirements of modern industrial production. In addition, the mechanical design of the downward pressing lever and the locking mechanism simplifies the installation and disassembly process of the sensor, reduces the operation complexity, and improves the convenience of maintenance. Finally, this design also helps to reduce the manual intervention during the test, reduce the operation risk, and improve the safety of the entire test system. Generally speaking, the design of this leakage current sensor aging measurement device not only improves the test accuracy and efficiency but also provides a solid foundation for realizing an automated and intelligent test process.

[0038] In the above embodiment, 32 sensor interfaces are provided on the PCB main board for control and reading; the PCB main board accesses the sensor interfaces in a polling manner.

[0039] In a specific embodiment, the polling control mechanism is a time-slicing access strategy. Through a predefined timing sequence and protocol, the microcontroller activates each sensor interface one by one, sends control commands to query the status or read data, then waits for a response, and after completion, moves on to the next interface. This mechanism utilizes the powerful computing ability and flexible I / O control of the microcontroller to achieve the simultaneous management and efficient communication of multiple sensors, without the need to allocate independent control lines for each sensor, reducing the hardware complexity and cost.

[0040] During the implementation process, each of the 32 carefully arranged sensor interfaces is connected to the GPIO (General-Purpose Input / Output) pins of the microcontroller. The access sequence and control protocol for each interface are defined through software programming. At the start of the aging test, the microcontroller sends initialization instructions to each interface one by one according to a predefined polling algorithm, activating the corresponding sensors to enter the working mode. Subsequently, according to the test process, the microcontroller will cyclically send read commands to each interface to obtain the real-time status or measurement data of the sensors, such as leakage current values, temperature, etc. After each polling cycle, the microcontroller will process and analyze the data to determine whether the sensor is working properly or shows signs of aging. The entire process is automatically carried out under the precise control of the microcontroller without manual intervention, greatly improving the automation level and efficiency of the test. The significance of this design is that it greatly enhances the automation degree and test efficiency of the leakage sensor aging test. By integrating 32 sensor interfaces on the PCB motherboard and adopting a polling access mechanism, the simultaneous monitoring and data acquisition of a large number of sensors are achieved. For sensor manufacturers or quality control departments, this means that the test cycle can be significantly shortened, the product verification process can be accelerated, and the production cost can be reduced. In addition, through centralized control and data processing, this technical solution simplifies the system architecture, enhances the scalability and flexibility of the system, and facilitates the addition of more sensor interfaces or function upgrades in the future. On the premise of ensuring the test accuracy, this design also helps to reduce the floor area and energy consumption of the test equipment, meeting the requirements of modern industry for efficient and green production. In summary, this embodiment not only improves the test efficiency and accuracy but also provides an economical, efficient, and easy-to-maintain solution for large-scale sensor aging tests, which is of great significance for promoting the development of related industries.

[0041] Although the specific implementation manners of the present invention have been described above, those skilled in the art should understand that these specific implementation manners are only illustrative. Without departing from the principles and essence of the present invention, those skilled in the art can make various omissions, substitutions, and changes to the details of the above methods and systems. For example, combining the above method steps so as to perform substantially the same function in a substantially the same manner to achieve substantially the same result belongs to the scope of the present invention. Therefore, the scope of the present invention is only defined by the appended claims.

Claims

1. A leakage sensor aging measurement device, characterized in that: It comprises a PCB mainboard, which integrates a wireless MCU, a 74H573 data latch, a CD4067 analog switch, a power management circuit, a storage unit and a sensor locking socket; the PCB mainboard transmits data to a display terminal by wireless means; the display terminal is used to display the test process, results and equipment status; a first connecting side plate is connected to the left side of the PCB mainboard; a second connecting side plate is connected to the right side of the PCB mainboard; a current input terminal is arranged on the side of the first connecting side plate away from the PCB mainboard; a current input rod spring is arranged on the side of the second connecting side plate close to the PCB mainboard, which is connected to the input current connecting rod to form a transmission path for current between sensors; the current input rod spring is used to clamp the input current connecting rod to ensure continuous transmission of current; a power supply terminal is arranged below the PCB mainboard; the input current connecting rod passes between sensors, and both ends are clamped by the current input rod spring to ensure stable current transmission.

2. The leakage sensor aging measurement device according to claim 1, characterized in that: The wireless MCU is used to receive and send wireless instructions and control the entire test process, including sending self-test signals, controlling data collection, result analysis and storage, and communicating with the display terminal; the wireless MCU communicates with the storage unit through the SPI communication interface, and controls the 74H573 latch and the CD4067 analog switch through the GPIO; the 74H573 data latch is used to temporarily store data under the control of the wireless MCU; the control pin LE of the 74H573 data latch is directly connected to the GPIO of the wireless MCU, and the data input end of the 74H573 data latch is connected to the data output end of the MCU The output end of the 74H573 data latch is connected to the CD4067 analog switch; the CD4067 analog switch is used to allow the wireless MCU to access the output of multiple sensors through a single interface; the address control pin of the CD4067 analog switch is connected to the GPIO of the wireless MCU; the output end of the CD4067 analog switch is connected to the input end of the wireless MCU; the power management circuit is connected to the power supply terminal; the storage unit is connected to the wireless MCU through the SPI communication interface; the sensor locking socket is connected to the wireless MCU, the latch and the analog switch through the wiring on the PCB.

3. The leakage sensor aging measurement device according to claim 1, characterized in that: The leakage sensor participates in the test process through the self-test pin CHK and the TRIP pin.

4. The leakage sensor aging measurement device according to claim 1, characterized in that: The sensor locking socket is welded on the PCB main board, and the current is connected in series through the input current connecting rod and the connecting side plate.

5. The leakage sensor aging measurement device according to claim 1, characterized in that: A downward pressing rod is arranged inside the sensor locking socket; the downward pressing rod comprises a rod body and a locking mechanism; the rod body is in the shape of a straight rod; the locking mechanism is located below the rod body and is connected to the rod body through a spring.

6. The leakage sensor aging measurement device according to claim 1, characterized in that: The PCB mainboard is provided with 32 sensor interfaces for control and reading; the PCB mainboard sequentially accesses the sensor interfaces in a polling manner.

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