Precise semiconductor photoetching equipment

Abstract

The utility model discloses precise semiconductor photoetching equipment, which comprises a photoetching mechanism and a protection mechanism, the protection mechanism is fixedly connected with the photoetching mechanism, the protection mechanism comprises a power box, the bottom of the inner wall of the power box is fixedly connected with a motor, the output end of the motor is fixedly connected with a worm assembly, and the output end of the worm assembly is fixedly connected with a transmission shaft. A top rotating shaft of the worm assembly is movably connected with a baffle, the outer side of the baffle is fixedly connected with the inner wall of a power box, and the back face of the inner wall of the power box is movably connected with a contraction wheel through a rotating rod. According to the utility model, the protection mechanism is arranged, so that the phenomena that the photoetching equipment is polluted by stains such as dust and the like due to no protection measures when the traditional semiconductor photoetching equipment is idle, and serious consequences are caused if cleaning is not carried out in time during subsequent photoetching operation are changed, the photoetching equipment can be effectively protected, and the working efficiency is improved. And the influence of factors such as dust is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of lithography equipment, in particular to a precision semiconductor lithography equipment. Background Art

[0002] According to the patent disclosed on the Chinese Patent Network, the patent name is: A Precision Semiconductor Lithography Equipment, and the patent number is: 202121679986.1. The utility model provides a precision semiconductor lithography equipment. The utility model relates to the technical field of lithography equipment. The precision semiconductor lithography equipment includes a machine table, a rotating mechanism, a lifting mechanism and a laser engraving head. A storage groove is opened at the center of the upper surface of the machine table. The rotating mechanism is located in the storage groove. The lifting mechanism is located above the machine table. The laser engraving head is installed inside the lifting mechanism. A plurality of positioning disks distributed in a ring are fixed on the outer periphery of the upper surface of the machine table. A fixed clamping block is fixed on the inner wall of one side of each positioning disk close to the center of the machine table. And a threaded hole is opened on the outer wall of one side of each positioning disk close to the center of the machine table. The threaded hole communicates with the inside of the positioning disk. The beneficial effects of the utility model are as follows: It is beneficial to make the semiconductor hot plate lithography more accurate, and it is beneficial for the laser engraving head to continuously perform lithography processing on multiple semiconductor hot plates, which can improve the working efficiency of the lithography equipment and facilitate the staff to take out the lithographed semiconductor hot plates from the positioning disks. However, when the above semiconductor lithography equipment is idle, due to the lack of protection for the lithography operation platform, it may be contaminated by dust and other stains, which will affect the subsequent lithography operation.

[0003] Therefore, it is necessary to design and transform the semiconductor lithography equipment to effectively prevent the phenomenon of lack of protection. Summary of the Utility Model

[0004] To solve the problems raised in the above background art, the purpose of the utility model is to provide a precision semiconductor lithography equipment, which has the advantage of preventing the lithography operation platform from being contaminated when idle, and solves the problem that the subsequent lithography operation is affected due to the contamination of the lithography operation platform.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A precision semiconductor lithography equipment, including:

[0006] A lithography mechanism;

[0007] The protection mechanism is fixedly connected to the lithography mechanism. The protection mechanism includes a power box. At the bottom of the inner wall of the power box, a motor is fixedly connected. The output end of the motor is fixedly connected to a worm assembly. The top rotating shaft of the worm assembly is movably connected to a baffle. The outer side of the baffle is fixedly connected to the inner wall of the power box. The back of the inner wall of the power box is movably connected to a contraction wheel through a rotating rod. On the front of the contraction wheel, a worm gear assembly is fixedly connected. The worm gear assembly meshes with the worm assembly. The surface of the contraction wheel is drivingly connected to a transmission belt. The back of the inner wall of the power box is movably connected to a steering wheel through a rotating rod. The surface of the steering wheel is drivingly connected to the transmission belt. On the left side of the inner wall of the power box, a sliding rod is fixedly connected. The other side of the sliding rod is fixedly connected to the inner wall of the power box. The surface of the sliding rod is slidably connected to a transmission rod. The top of the transmission rod extends to the outside of the power box. The back of the transmission rod is slidably connected to a limit slide rail through a slider. The back of the limit slide rail is fixedly connected to the inner wall of the power box. The bottom of the transmission rod is fixedly connected to a pulling block assembly. The bottom of the pulling block assembly is drivingly connected to the side of the transmission belt away from the contraction wheel. The back of the transmission rod is fixedly connected to a shielding cover. The surface of the sliding rod is sleeved with a return spring. The inner side of the return spring is fixedly connected to the outer side of the transmission rod.

[0008] Preferably, the lithography mechanism includes a base. The front of the base is fixedly connected to the back of the power box. On both sides of the base, a housing is fixedly connected. Inside the housing, a lithography component is movably connected. On the top of the base, a lithography platform is fixedly connected.

[0009] Preferably, on both sides of the power box, a reinforcing plate is fixedly connected. The back of the reinforcing plate is fixedly connected to the front of the base.

[0010] Preferably, on both sides of the motor, a limit plate is fixedly connected. The bottom of the limit plate is fixedly connected to the inner wall of the power box.

[0011] Preferably, the surface of the sliding rod is sleeved with a support plate. The back of the support plate is fixedly connected to the inner wall of the power box.

[0012] Preferably, on the top and bottom of the limit slide rail, a connecting plate is fixedly connected. The back of the connecting plate is fixedly connected to the inner wall of the power box.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] 1. By setting up a protection mechanism, the present utility model changes the phenomenon that in traditional semiconductor lithography equipment, when it is idle, due to the lack of protection measures, dust and other stains contaminate the lithography equipment, and if not cleaned in time during subsequent lithography operations, it will cause serious consequences. It can effectively carry out protection operations on the lithography equipment and avoid its influence by factors such as dust.

[0015] 2. Through the setting of the lithography mechanism, the present utility model can accurately transfer the designed circuit pattern from the mask plate onto the silicon wafer or other substrates. Through lithography technology, tiny circuit structures can be formed on the silicon wafer, and then various electronic components and chips are constituted. The accuracy and efficiency of lithography equipment directly affect the performance and cost of integrated circuits. With the development of technology, the size of integrated circuits is getting smaller and the width of circuit lines is getting narrower. This requires lithography equipment to have higher accuracy and resolution, and it plays an extremely important role in fields such as semiconductor manufacturing, optoelectronics, and micro-nano electronics, and is of great significance for promoting the development and technological progress of the semiconductor industry.

[0016] 3. Through the setting of the reinforcement plate, the present utility model can reinforce the power box, strengthen the connection between the power box and the base, and enable the two to be connected more stably.

[0017] 4. Through the setting of the limit plate, the present utility model can limit the position of the motor and avoid the phenomenon of the motor shifting in position during long-term use.

[0018] 5. Through the setting of the support plate, the present utility model can support the slide bar, strengthen its supporting force, and avoid the phenomenon of the slide bar breaking.

[0019] 6. Through the setting of the connecting plate, the present utility model can reinforce the limit slide rail and strengthen the connection between the limit slide rail and the power box. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is the structural schematic diagram of the present utility model;

[0021] Figure 2 is the structural diagram of the lithography mechanism of the present utility model;

[0022] Figure 3 is the structural diagram of the protection mechanism of the present utility model;

[0023] Figure 4 is the exploded view of the power box of the present utility model;

[0024] Figure 5 is the front view sectional view of the power box of the present utility model.

[0025] In the figure: 1. Photolithography mechanism; 11. Base; 12. Housing; 13. Photolithography component; 14. Photolithography platform; 2. Protection mechanism; 21. Power box; 22. Motor; 23. Worm gear assembly; 24. Baffle; 25. Shrinkage wheel; 26. Worm wheel assembly; 27. Transmission belt; 28. Steering wheel; 29. Slide bar; 210. Transmission rod; 211. Limit slide rail; 212. Pull block assembly; 213. Mask cover; 214. Return spring; 3. Reinforcement plate; 4. Limit plate; 5. Support plate; 6. Connecting plate. Detailed implementation manners

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0027] As Figures 1 to 5 shown, a precision semiconductor photolithography equipment provided by the present invention includes:

[0028] A photolithography mechanism 1;

[0029] A protection mechanism 2, the protection mechanism 2 is fixedly connected to the photolithography mechanism 1. The protection mechanism 2 includes a power box 21. A motor 22 is fixedly connected to the bottom of the inner wall of the power box 21. The output end of the motor 22 is fixedly connected to a worm gear assembly 23. The top rotating shaft of the worm gear assembly 23 is movably connected to a baffle 24. The outside of the baffle 24 is fixedly connected to the inner wall of the power box 21. The back of the inner wall of the power box 21 is movably connected to a shrinkage wheel 25 through a rotating rod. A worm wheel assembly 26 is fixedly connected to the front of the shrinkage wheel 25. The worm wheel assembly 26 meshes with the worm gear assembly 23. The surface of the shrinkage wheel 25 is drivingly connected to a transmission belt 27. The back of the inner wall of the power box 21 is movably connected to a steering wheel 28 through a rotating rod. The surface of the steering wheel 28 is drivingly connected to the transmission belt 27. A slide bar 29 is fixedly connected to the left side of the inner wall of the power box 21. The other side of the slide bar 29 is fixedly connected to the inner wall of the power box 21. A transmission rod 210 is slidably connected to the surface of the slide bar 29. The top of the transmission rod 210 extends to the outside of the power box 21. The back of the transmission rod 210 is slidably connected to a limit slide rail 211 through a slider. The back of the limit slide rail 211 is fixedly connected to the inner wall of the power box 21. The bottom of the transmission rod 210 is fixedly connected to a pull block assembly 212. The bottom of the pull block assembly 212 is drivingly connected to the side of the transmission belt 27 away from the shrinkage wheel 25. The back of the transmission rod 210 is fixedly connected to a mask cover 213. A return spring 214 is sleeved on the surface of the slide bar 29. The inner side of the return spring 214 is fixedly connected to the outside of the transmission rod 210.

[0030] Reference Figure 2 As shown in Figure 2 , the lithography mechanism 1 includes a base 11. The front surface of the base 11 is fixedly connected to the back surface of the power box 21. Both sides of the base 11 are fixedly connected with a housing 12. The inside of the housing 12 is movably connected with a lithography assembly 13. The top of the base 11 is fixedly connected with a lithography platform 14.

[0031] As a technical optimization scheme of the present utility model, through the setting of the lithography mechanism 1, the designed circuit pattern can be accurately transferred from the mask plate to the silicon wafer or other substrates. Through lithography technology, tiny circuit structures can be formed on the silicon wafer, and then various electronic components and chips can be constituted. The accuracy and efficiency of the lithography equipment directly affect the performance and cost of the integrated circuit. With the development of technology, the size of the integrated circuit is getting smaller and the width of the circuit lines is getting narrower, which requires the lithography equipment to have higher accuracy and resolution. It plays an extremely important role in the fields of semiconductor manufacturing, optoelectronics, micro-nano electronics, etc., and is of great significance for promoting the development and technological progress of the semiconductor industry.

[0032] Reference Figure 1 As shown in Figure 1 , both sides of the power box 21 are fixedly connected with reinforcement plates 3. The back surface of the reinforcement plates 3 is fixedly connected to the front surface of the base 11.

[0033] As a technical optimization scheme of the present utility model, through the setting of the reinforcement plates 3, the power box 21 can be strengthened, and the connection between the power box 21 and the base 11 is enhanced, so that the two can be connected more stably.

[0034] Reference Figure 5 As shown in Figure 5 , both sides of the motor 22 are fixedly connected with limit plates 4. The bottom of the limit plates 4 is fixedly connected to the inner wall of the power box 21.

[0035] As a technical optimization scheme of the present utility model, through the setting of the limit plates 4, the motor 22 can be limited, and the phenomenon that the position of the motor 22 shifts during long-term use can be avoided.

[0036] Reference Figure 5 As shown in Figure 5 , the surface of the sliding rod 29 is sleeved with a support plate 5. The back surface of the support plate 5 is fixedly connected to the inner wall of the power box 21.

[0037] As a technical optimization scheme of the present utility model, through the setting of the support plate 5, the sliding rod 29 can be supported, its supporting force is enhanced, and the phenomenon that the sliding rod 29 breaks can be avoided.

[0038] Reference Figure 5 As shown in Figure 5 , both the top and bottom of the limit sliding rail 211 are fixedly connected with connecting plates 6. The back surface of the connecting plates 6 is fixedly connected to the inner wall of the power box 21.

[0039] As a technical optimization solution of the present utility model, through the setting of the connecting plate 6, the limiting slide rail 211 can be strengthened, and the connection between the limiting slide rail 211 and the power box 21 is enhanced.

[0040] The working principle and usage process of the present utility model are as follows: First, when the user needs to perform a protection operation on the lithography platform 14, only need to start the motor 22 in the power box 21. The output end of the motor 22 drives the worm assembly 23 to rotate. The worm assembly 23 drives the worm wheel assembly 26 to rotate. The worm wheel assembly 26 drives the retraction wheel 25 to rotate. The retraction wheel 25 drives the pull block assembly 212 to move to the right through the transmission belt 27. The pull block assembly 212 drives the mask cover 213 to move to a suitable position through the transmission rod 210 for masking operation. When the protection operation is not required, the return spring 214 drives the mask cover 213 to move to a suitable position immediately through the transmission rod 210. Through the above process, the effect of protecting the working platform of the lithography equipment is achieved.

[0041] In summary, for this precise semiconductor lithography equipment, by setting the protection mechanism, it changes the phenomenon that the traditional semiconductor lithography equipment is contaminated by dust and other stains due to the lack of protection measures during idle time, and serious consequences will occur if not cleaned in time during subsequent lithography operations. It can effectively perform protection operations on the lithography equipment and avoid its influence by factors such as dust.

[0042] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or also includes elements inherent to this process, method, article or device.

[0043] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A precision semiconductor lithography device, characterized in that: include: Photolithography mechanism (1); A protection mechanism (2), the protection mechanism (2) being fixedly connected to the photolithography mechanism (1), the protection mechanism (2) comprising a power box (21), the bottom of the inner wall of the power box (21) being fixedly connected to a motor (22), the output end of the motor (22) being fixedly connected to a worm assembly (23), the top rotating shaft of the worm assembly (23) being movably connected to a baffle (24), the outer side of the baffle (24) being fixedly connected to the inner wall of the power box (21), the back side of the inner wall of the power box (21) being movably connected to a contraction wheel (25) via a rotating rod, the front side of the contraction wheel (25) being fixedly connected to a worm gear assembly (26), the worm gear assembly (26) being meshed with the worm gear assembly (23), the surface of the contraction wheel (25) being transmission-connected to a transmission belt (27), the back side of the inner wall of the power box (21) being movably connected to a steering wheel (28) via a rotating rod, the surface of the steering wheel (28) being transmission-connected to the transmission belt (27), The left side of the inner wall of the power box (21) is fixedly connected to a slide bar (29), the other side of the slide bar (29) is fixedly connected to the inner wall of the power box (21), the surface of the slide bar (29) is slidably connected to a transmission rod (210), the top of the transmission rod (210) extends to the outside of the power box (21), the back of the transmission rod (210) is slidably connected to a limited slide rail (211) through a slider, and the back of the limited slide rail (211) is in contact with the power box (21). ), the bottom of the transmission rod (210) is fixedly connected to a pull block assembly (212), the bottom of the pull block assembly (212) is transmission-connected to a side of the transmission belt (27) away from the retracting wheel (25), the back of the transmission rod (210) is fixedly connected to a shield cover (213), the surface of the slide bar (29) is sleeved with a return spring (214), and the inner side of the return spring (214) is fixedly connected to the outer side of the transmission rod (210).

2. A precision semiconductor lithography device according to claim 1, characterized in that: The photolithography mechanism (1) comprises a base (11), the front side of the base (11) being fixedly connected to the back side of a power box (21), both sides of the base (11) being fixedly connected to a shell (12), the inner side of the shell (12) being movably connected to a photolithography assembly (13), and the top of the base (11) being fixedly connected to a photolithography platform (14).

3. A precision semiconductor lithography device according to claim 2, characterized in that: Reinforcement plates (3) are fixedly connected to both sides of the power box (21), and the back side of the reinforcement plate (3) is fixedly connected to the front side of the base (11).

4. The precision semiconductor lithography equipment according to claim 1, characterized in that: Both sides of the motor (22) are fixedly connected to limit plates (4), and the bottom of the limit plates (4) is fixedly connected to the inner wall of the power box (21).

5. The precision semiconductor lithography equipment according to claim 1, characterized in that: A support plate (5) is sleeved on the surface of the slide bar (29), and the back surface of the support plate (5) is fixedly connected to the inner wall of the power box (21).

6. The precision semiconductor lithography equipment according to claim 1, characterized in that: The top and bottom of the position-limiting slide rail (211) are both fixedly connected to a connecting plate (6), and the back surface of the connecting plate (6) is fixedly connected to the inner wall of the power box (21).

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