CPU (Central Processing Unit) radiating fin

Abstract

The utility model discloses a CPU radiating fin in the field of radiating fins, which comprises a heat conducting plate and a radiating plate, a clamping plate is arranged on one side of the heat conducting plate, the surface of the clamping plate sinks inwards to form a clamping groove, a limiting block is arranged on one side of the heat conducting plate, the surface of the limiting block sinks inwards to form a limiting groove, and the surface of the limiting block is provided with a limiting groove. A plurality of square openings are formed in the surface of the heat conducting plate, connecting blocks are arranged in the square openings, the side faces of the connecting blocks extend outwards to form barb parts, the barb parts are inserted into the square openings, and the barb parts are connected with the square openings in a buckled mode; according to the CPU cooling fin, the clamping plate and the limiting block are arranged on one side of the heat conduction plate, the corresponding clamping groove and the corresponding limiting groove are designed, the cooling plate can be conveniently and rapidly mounted and dismounted, meanwhile, the barb part is inserted into the square opening, the barb part and the square opening are connected in a buckled mode, and therefore the whole cooling fin is convenient to mount and dismount.

Description

Technical Field

[0001] The utility model relates to the field of heat sinks, in particular to a CPU heat sink. Background Technique

[0002] The CPU, whose full name is Central Processing Unit and is called the central processing unit in Chinese, is the core component of a computer system. It is responsible for executing program instructions, processing data, and controlling the operation of other devices in the computer system. In short, the CPU is the "brain" of the computer and is responsible for performing all computing and control tasks. When the CPU is working, it will generate a large amount of heat, so it needs to be dissipated by a CPU heat sink. The CPU heat sink is a hardware component specifically designed to reduce the temperature of the CPU. Its main function is to effectively dissipate the heat generated by the CPU into the surrounding environment through heat transfer methods such as conduction, convection, and radiation, so as to keep the CPU operating within a relatively low and stable temperature range.

[0003] The existing CPU heat sinks still have the following defects: The CPU heat sink usually consists of a bottom plate for heat conduction and fins arranged on the surface of the bottom plate. Heat is dissipated through the fins. Screw holes are provided on the surfaces of the bottom plate and the fins, and the fins are fixed to the bottom plate by inserting fasteners such as screws. Then, screw holes are additionally opened on the bottom plate, and the circuit board is fixed to the bottom of the bottom plate by means of screws and other fasteners, so that the CPU on the circuit board is in contact with the bottom plate, and the heat is transferred from the bottom plate to the fins and then dissipated. This way of installing the heat sink by screwing has the problem of being inconvenient for installation and disassembly. When the CPU models are different, fins with different heights and different areas need to be matched, and tools such as screwdrivers are required to install and disassemble the fins, which is very troublesome. Secondly, before the bottom plate, fins and circuit board are assembled, the CPU heat sink is divided into two parts, namely the bottom plate and the fins. Similarly, the fins need to be installed on the bottom plate first by using the screw fixing method. The bottom plate and the fins need tools such as screwdrivers for installation and disassembly, which is difficult to operate and inconvenient for installing and disassembling the bottom plate and the fins. Moreover, the areas of the bottom plate and the fins are large. Before assembling the bottom plate and the fins to the circuit board, they occupy a large space, are not convenient to separate the bottom plate and the fins individually, and are not convenient to divide the bottom plate and the fins into multiple parts separately, making the CPU heat sink have certain limitations. Content of the Utility Model

[0004] In order to overcome the deficiencies of the prior art solutions, the utility model provides a CPU heat sink, which can effectively solve the technical problem that the existing heat sink is inconvenient for installation and disassembly.

[0005] The technical solution adopted by the present utility model to solve its technical problems is as follows: A CPU heat sink includes a heat conduction plate and a heat dissipation plate. On one side of the heat conduction plate, there is a clamping plate. The surface of the clamping plate is recessed inward to form a clamping groove. On one side of the heat conduction plate, there is a limiting block. The surface of the limiting block is recessed inward to form a limiting groove. On the surface of the heat conduction plate, there are a number of square openings. Inside the square openings, there are connection blocks. The side surface of the connection block extends outward to form a barb portion. The barb portion is inserted into the square opening, and the barb portion is snap-connected with the square opening.

[0006] Further, the top surface of the heat dissipation plate extends outward to form a number of fins, and the number of fins are evenly arranged at equal intervals.

[0007] Further, the surface of the connection block extends outward to form a connection column, and a screw hole is provided inside the connection column.

[0008] Further, the heat conduction plate, the heat dissipation plate, and the fins are all made of metal copper material.

[0009] Further, a heat conduction silicone sheet is provided at the bottom of the heat conduction plate.

[0010] Compared with the prior art, the beneficial effects of the present utility model are as follows: For a CPU heat sink of the present utility model, by providing a clamping plate and a limiting block on one side of the heat conduction plate and designing corresponding clamping grooves and limiting grooves, the quick installation and disassembly of the heat dissipation plate and the fins can be conveniently achieved. At the same time, by inserting the barb portion into the square opening and snap-connecting the barb portion with the square opening, the whole heat sink is convenient for installation and disassembly, and it is convenient to disassemble the whole heat sink into multiple parts such as the heat conduction plate, the heat dissipation plate, and the connection block. Description of the Drawings

[0011] Figure 1 It is the front view of a CPU heat sink of the present utility model;

[0012] Figure 2 It is the structural schematic diagram of the heat conduction plate and the heat dissipation plate of a CPU heat sink of the present utility model;

[0013] Figure 3 It is the three-dimensional view of the heat conduction plate of a CPU heat sink of the present utility model;

[0014] Figure 4 It is the three-dimensional view of the connection block of a CPU heat sink of the present utility model;

[0015] Figure 5 It is the bottom view of a CPU heat sink of the present utility model.

[0016] Reference numerals in the drawings:

[0017] 1 - Heat conduction plate; 2 - Heat conduction silicone sheet; 3 - Heat dissipation plate; 4 - Fins; 5 - Clamping plate; 6 - Clamping groove; 7 - Limit block; 8 - Limit groove; 9 - Connecting block; 10 - Connecting column; 11 - Square opening; 12 - Barbed portion; 13 - Screw hole. Specific embodiments

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0019] As Figures 1 - 5 shown, a CPU heat sink includes a heat conduction plate 1 and a heat dissipation plate 3. A clamping plate 5 is provided on one side of the heat conduction plate 1. A clamping groove 6 is formed by inward depression on the surface of the clamping plate 5. A limit block 7 is provided on one side of the heat conduction plate 1. A limit groove 8 is formed by inward depression on the surface of the limit block 7. A plurality of square openings 11 are provided on the surface of the heat conduction plate 1. A connecting block 9 is provided inside the square opening 11. A barbed portion 12 extends outward from the side surface of the connecting block 9. The barbed portion 12 is inserted into the square opening 11, and the barbed portion 12 is snap-connected to the square opening 11. A plurality of fins 4 extend outward from the top surface of the heat dissipation plate 3. The plurality of fins 4 are evenly arranged at equal intervals, effectively increasing the heat dissipation area and improving the heat exchange efficiency. It can more quickly dissipate the heat generated by the CPU into the air, ensure the stable operation of the CPU, and extend the service life. A connecting column 10 extends outward from the surface of the connecting block 9. A screw hole 13 is provided inside the connecting column 10. Through fasteners such as screws, the heat sink can be more firmly fixed on the CPU or other heat sources, reducing displacement caused by vibration or external force and ensuring the stability of the heat dissipation effect. The heat conduction plate 1, the heat dissipation plate 3, and the fins 4 are all made of metal copper material, taking advantage of the high heat conduction performance of copper, which can quickly and effectively conduct the heat generated by the CPU to the heat dissipation plate 3 and the fins 4 and dissipate it, significantly improving the overall heat dissipation performance of the heat sink. A heat conduction silicone sheet 2 is provided at the bottom of the heat conduction plate 1. Adding a heat conduction silicone sheet 2 at the bottom of the heat conduction plate 1 can further fill the tiny gap between the heat conduction plate 1 and the CPU and improve the heat conduction efficiency. The softness and high heat conduction performance of the heat conduction silicone sheet 2 ensure seamless heat transfer.

[0020] A CPU heat sink according to this embodiment, when in use, first inserts the barb portion 12 into the square opening 11, and the barb portion 12 is snap-connected to the square opening 11, so that the connection block 9 is installed at the bottom of the heat conduction plate 1. Secondly, the side surface of the heat dissipation plate 3 is snapped into the engaging groove 6 and the limiting groove 8 to install the heat dissipation plate 3. After installing the heat dissipation plate 3, align the positioning holes on the circuit board with the screw holes 13 of the connecting columns 10, and install the circuit board at the bottom of the heat conduction plate 1 through fasteners such as screws. The CPU on the circuit board is aligned with the heat conduction silicone sheet 2 and contacts the heat conduction silicone sheet 2. During heat dissipation, the heat generated by the CPU is transferred to the heat conduction plate 1 through the heat conduction silicone sheet 2, transferred to the heat dissipation plate 3 through the heat conduction plate 1, and then discharged through the fins 4 on the heat dissipation plate 3.

[0021] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention, and any reference signs in the claims should not be regarded as limiting the claims involved.

Claims

1. A CPU heat sink, comprising a heat conducting plate and a heat dissipating plate, characterized in that: A clamping plate is provided on one side of the heat conducting plate, and the surface of the clamping plate is recessed inward to form a clamping groove. A limiting block is provided on one side of the heat conducting plate, and the surface of the limiting block is recessed inward to form a limiting groove. A plurality of square openings are provided on the surface of the heat conducting plate, and a connecting block is provided inside the square opening. The side surface of the connecting block extends outward to form a barb portion, and the barb portion is inserted into the square opening, and the barb portion is snap-fitted and connected with the square opening.

2. A CPU heat sink according to claim 1, characterized in that: The top surface of the heat sink extends outward to form a plurality of fins, and the plurality of fins are evenly spaced and arranged.

3. A CPU heat sink according to claim 1, characterized in that: The surface of the connection block extends outward to form a connection column, and a screw hole is arranged inside the connection column.

4. A CPU heat sink according to claim 2, characterized in that: The heat conducting plate, the heat dissipating plate and the fins are all made of metal copper.

5. A CPU heat sink according to any one of claims 1 to 4, characterized in that: A heat-conducting silicone sheet is arranged at the bottom of the heat-conducting plate.

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