Tire RFID tag
By using a combined structure of thermal adhesive, positioning frame, protective cover and cushion in tire RFID tags, the problem of lack of protection and easy damage of the tag is solved, and the service life and protective performance of the tag are significantly improved.
Patent Information
- Application Number
- CN202422229911.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-12
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-09-12
AI Technical Summary
The existing tire RFID tags lack protective structure after installation, and are easily damaged after long-term use and are difficult to replace.
The structure includes thermal adhesive, positioning frame, protective cover and cushion pad. The thermal adhesive improves heat dissipation efficiency. The protective cover and positioning frame provide additional protection. The cushion provides cushioning effect and extends the service life of the label.
It improves the protective performance of the label, reduces the risk of internal structure being susceptible to external forces, and extends the service life of the label.
Smart Images

Figure CN222980024U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of tire labels, in particular to a tire RFID label. Background Art
[0002] The tire RFID label is an advanced technical product applied to tires. It consists of a chip and an antenna. By storing key data such as the model, specification, production date, batch number, and manufacturer information of the tire, it plays an important role in the entire life cycle of the tire. In terms of product traceability and management, it can achieve accurate tracking in each stage from production to recycling, facilitating inventory management and optimizing the efficiency of the supply chain. In terms of quality control and safety assurance, it can record production parameters and quality inspection data to prevent the circulation of counterfeit and shoddy products.
[0003] Existing technologies such as the utility model with the publication number of CN218585348U disclose a patch-type RFID electronic label for intelligent tires. This patent uses a patch block. A receiving groove is opened on one side of the patch block. A gasket is pasted on the inner bottom of the receiving groove. A bearing sheet is pasted on one side of the gasket. A top protection sheet is pasted on one side of the bearing sheet. An installation groove is opened on one side of the bearing sheet. An electronic label body is installed inside the installation groove. When in use, the utility model can protect the electronic label body by using the gasket, the top protection sheet, and the patch block, extending the service life of the RFID electronic label to a certain extent. And when the electronic label body is damaged, it can also be replaced, which is very convenient to use, solving the problem that the existing RFID electronic label lacks a protection structure after installation, and it is not convenient to replace the RFID electronic label when it is damaged after long-term use.
[0004] In the process of using RFID labels to manage tires, there is a problem that the structure of existing RFID labels such as the above is relatively simple. During assembly, only the gasket and the bearing sheet are used to protect the chip. Since the environment in which the label is used is relatively harsh, when only the gasket and the bearing sheet are used to protect the chip, the chip is extremely vulnerable to external interference and fails, resulting in accidental damage. Summary of the Utility Model
[0005] The purpose of the utility model is to solve the defect that when only the gasket and the bearing sheet are used to protect the chip in the prior art, the chip is extremely vulnerable to external interference and fails, resulting in accidental damage, and to propose a tire RFID label.
[0006] To achieve the above object, the present utility model adopts the following technical solutions: A tire RFID tag includes a housing and a flexible circuit board. The flexible circuit board is installed inside the housing. An antenna is fixedly connected to the upper surface of the flexible circuit board. A chip is fixedly connected to the upper surface of the antenna. A thermal conductive adhesive is attached to the upper surface of the flexible circuit board. A positioning frame is installed on the inner wall of the housing, and the positioning frame is in contact with the upper surface of the flexible circuit board. Square holes are formed on the surface of the thermal conductive adhesive, and a protective cover is fixedly connected to the inner wall of the square hole. The protective cover is sleeved on the surface of the chip. A cover plate is fixedly connected to the upper surface of the housing, a buffer pad is fixedly connected to the lower surface of the housing, and an adhesive is fixedly connected to the lower surface of the buffer pad.
[0007] Preferably, a protective film is pasted on the lower surface of the adhesive. A handle is provided on the side surface of the protective film. The protective film can protect the pasting part of the tag to reduce the probability of accidental pasting of the pasting part during transportation.
[0008] Preferably, the thermal conductive adhesive is in contact with the upper surface of the antenna. The thermal conductive adhesive can guide the heat of the flexible circuit board to ensure the stability of the flexible circuit board under high temperature conditions.
[0009] Preferably, the protective cover is in contact with the upper surface of the antenna. The protective cover is square, and the inner diameter of the protective cover is larger than the diameter of the chip. The protective cover can support and protect the chip part to reduce the probability of the chip being extruded by external forces.
[0010] Preferably, the cover plate is in contact with the upper surface of the thermal conductive adhesive, the cover plate is in contact with the upper surface of the positioning frame, and the cover plate is in contact with the upper surface of the protective cover. Through the cooperation of the cover plate and the housing, the positioning frame and the thermal conductive adhesive can be stably restricted on the surface of the flexible circuit board to ensure full adhesion of the three.
[0011] Compared with the prior art, the advantages and positive effects of the present utility model are as follows:
[0012] In the present utility model, by providing a thermal conductive adhesive, a positioning frame, a protective cover, and a buffer pad, when encapsulating a chip, the assembled flexible circuit board, antenna, and chip structure are placed into the housing. When the placement is completed, the protective cover is placed directly above the chip, and the positioning frame is snapped into the housing to limit the position of the flexible circuit board. When locking the position of the flexible circuit board, the thermal conductive adhesive is injected into the space formed by the protective cover and the positioning frame. The thermal conductive adhesive seals the flexible circuit board and the antenna and improves the heat dissipation efficiency of the flexible circuit board and the antenna. When the above operations are completed, the cover plate is fixed above the housing to seal the housing. Subsequently, the buffer pad with adhesive can be installed below the housing to complete the overall encapsulation operation of the label. When using the label, the protective film below the adhesive is torn off, the pasting part on the tire is wiped, and after wiping, the adhesive is pasted onto the pasting part of the tire. By providing the thermal conductive adhesive, the positioning frame, the protective cover, and the buffer pad, the protection performance of the label for the internal structure is improved, thereby reducing the problem that the internal structure is vulnerable to external forces due to the lack of protection structure of the label, and further increasing the service life of the label. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 FIG. is a three-dimensional structural schematic diagram of a tire RFID tag proposed by the present utility model;
[0014] Figure 2 FIG. is a cross-sectional structural schematic diagram of a tire RFID tag proposed by the present utility model;
[0015] Figure 3 FIG. is a chip structural schematic diagram of a tire RFID tag proposed by the present utility model;
[0016] Figure 4 FIG. is a partial structural schematic diagram of a tire RFID tag proposed by the present utility model;
[0017] Figure 5 FIG. is a Figure 4 structural schematic diagram of part A in a tire RFID tag proposed by the present utility model.
[0018] LEGEND DESCRIPTION:
[0019] 1. Housing; 2. Flexible circuit board; 3. Antenna; 4. Chip; 5. Thermal conductive adhesive; 6. Positioning frame; 7. Protective cover; 8. Cover plate; 9. Buffer pad; 10. Adhesive; 11. Protective film. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0020] Please refer to Figures 1 - 5, the present utility model provides a technical solution: a tire RFID tag, which includes a housing 1 and a flexible circuit board 2. The flexible circuit board 2 is installed inside the housing 1. An antenna 3 is fixedly connected to the upper surface of the flexible circuit board 2. A chip 4 is fixedly connected to the upper surface of the antenna 3. A thermal conductive adhesive 5 is attached to the upper surface of the flexible circuit board 2. A positioning frame 6 is installed on the inner wall of the housing 1, and the positioning frame 6 is in contact with the upper surface of the flexible circuit board 2. Square holes are formed on the surface of the thermal conductive adhesive 5, and a protective cover 7 is fixedly connected to the inner wall of the square hole of the thermal conductive adhesive 5. The protective cover 7 is sleeved on the surface of the chip 4. A cover plate 8 is fixedly connected to the upper surface of the housing 1. A buffer pad 9 is fixedly connected to the lower surface of the housing 1. An adhesive 10 is fixedly connected to the lower surface of the buffer pad 9.
[0021] Specifically, a protective film 11 is pasted on the lower surface of the adhesive 10. A handle is provided on the side surface of the protective film 11. The pasting part of the tag can be protected through the protective film 11 to reduce the probability of accidental pasting of the pasting part during transportation.
[0022] Specifically, the thermal conductive adhesive 5 is in contact with the upper surface of the antenna 3.
[0023] In this embodiment: the heat of the flexible circuit board 2 can be guided through the thermal conductive adhesive 5 to ensure the stability of the flexible circuit board 2 in a high-temperature state.
[0024] Specifically, the protective cover 7 is in contact with the upper surface of the antenna 3. The protective cover 7 is square, and the inner diameter of the protective cover 7 is larger than the diameter of the chip 4. The chip 4 part can be supported and protected through the protective cover 7 to reduce the probability of the chip 4 being extruded by external forces.
[0025] In this embodiment: the cover plate 8 is in contact with the upper surface of the thermal conductive adhesive 5, the cover plate 8 is in contact with the upper surface of the positioning frame 6, and the cover plate 8 is in contact with the upper surface of the protective cover 7.
[0026] In this embodiment: through the cooperation of the cover plate 8 and the housing 1, the positioning frame 6 and the thermal conductive adhesive 5 can be stably restricted on the surface of the flexible circuit board 2 to ensure that the three are fully adhered.
[0027] Working principle: When encapsulating the chip 4, the assembled flexible circuit board 2, antenna 3 and chip 4 structure are placed into the housing 1. When the placement is completed, the protective cover 7 is placed directly above the chip 4, and the positioning frame 6 is snapped into the housing 1 to limit the position of the flexible circuit board 2. When locking the position of the flexible circuit board 2, the thermal conductive adhesive 5 is injected into the space formed by the protective cover 7 and the positioning frame 6. The thermal conductive adhesive 5 seals the flexible circuit board 2 and the antenna 3 and improves the heat dissipation efficiency of the flexible circuit board 2 and the antenna 3. When the above operations are completed, the cover plate 8 is fixed above the housing 1 to seal the housing 1. Subsequently, the cushion 9 with the adhesive 10 attached can be installed below the housing 1 to complete the overall encapsulation operation of the label; when using the label, tear off the protective film 11 below the adhesive 10, wipe the pasting part on the tire, and after wiping, paste the adhesive 10 onto the tire pasting part. By setting the thermal conductive adhesive 5, positioning frame 6, protective cover 7 and cushion 9, the protection performance of the label for the internal structure is improved, thereby reducing the problem that the label has less protective structure and the internal structure is easily damaged by external forces, and further improving the service life of the label.
Claims
1. A tire RFID tag, comprising a housing (1) and a flexible circuit board (2), characterized in that: The flexible circuit board (2) is installed inside the shell (1); the upper surface of the flexible circuit board (2) is fixedly connected to an antenna (3); the upper surface of the antenna (3) is fixedly connected to a chip (4); the upper surface of the flexible circuit board (2) is bonded with a thermal conductive adhesive (5); a positioning frame (6) is installed on the inner wall of the shell (1); the positioning frame (6) is in contact with the upper surface of the flexible circuit board (2); a square hole is opened on the surface of the thermal conductive adhesive (5); the thermal conductive adhesive (5) is located on the inner wall of the square hole and is fixedly connected to a protective cover (7); the protective cover (7) is sleeved with the surface of the chip (4); the upper surface of the shell (1) is fixedly connected to a cover plate (8); the lower surface of the shell (1) is fixedly connected to a buffer pad (9); the lower surface of the buffer pad (9) is fixedly connected to an adhesive (10).
2. A tire RFID tag according to claim 1, characterized in that: A protective film (11) is adhered to the lower surface of the adhesive (10), and a handle is provided on the side surface of the protective film (11).
3. The tire RFID tag according to claim 1, characterized in that: The thermally conductive adhesive (5) is in contact with the upper surface of the antenna (3).
4. The tire RFID tag according to claim 1, characterized in that: The protective cover (7) is in contact with the upper surface of the antenna (3), the protective cover (7) is square, and the inner diameter of the protective cover (7) is greater than the diameter of the chip (4).
5. The tire RFID tag according to claim 1, characterized in that: The cover plate (8) is in contact with the upper surface of the heat-conducting adhesive (5), the cover plate (8) is in contact with the upper surface of the positioning frame (6), and the cover plate (8) is in contact with the upper surface of the protective cover (7).
Citation Information
Patent Citations
Patch type RFID electronic tag for intelligent tire
CN218585348U
Cited By
RFID sticker label
CN224789216U