Wafer cleaning equipment with improved cleaning efficiency

Abstract

The utility model discloses wafer cleaning equipment with improved cleaning efficiency, and particularly relates to the technical field of semiconductor wafer processing, which comprises a cleaning box, an ultrasonic cleaner is arranged on one side of the bottom in the cleaning box, a cleaning mechanism is arranged in the cleaning box, and the cleaning mechanism comprises a hydraulic telescopic rod. According to the wafer cleaning device, through the cleaning mechanism, a plurality of wafers can be placed at a time for cleaning operation, the cleaning efficiency is improved, the plurality of wafers can be driven to synchronously rotate along with the rotating shaft, the wafer cleaning device is simple in structure and convenient to operate, and the service life of the wafer cleaning device is prolonged. According to the wafer cleaning device, the spraying holes are arranged to make uniform contact with cleaning liquid, thrust generated by the cleaning liquid sprayed out of the spraying holes can be used for driving the transverse pipe to drive the rotating pipe to rotate, the transverse pipe drives the bristles to clean the wafer, the cleaning effect is improved, and practicability is high; and the fixing assembly is matched with the hydraulic telescopic rod, so that the placing plate can be conveniently disassembled and assembled, the wafer can be conveniently taken, and the use is convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer processing, and specifically relates to a wafer cleaning device with improved cleaning efficiency. Background Technique

[0002] A semiconductor wafer is a material with electrical conductivity between that of a conductor and an insulator. Semiconductor wafers are widely used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, lasers, photon detection, high-power power conversion, and other fields. During the processing of wafers, they need to be cleaned, and a cleaning machine is required for cleaning.

[0003] Referring to the patent with the publication number CN216574560U, a cleaning device for wafer processing is disclosed, including a cleaning body. A cleaning frame is arranged inside the cleaning body. An ultrasonic cleaner is fixedly connected to the bottom end inside the cleaning body. Lead screws are movably connected to both sides inside the cleaning body. A driving sleeve block is arranged outside the lead screws. Limiting sliding rails are fixedly connected to both sides inside the cleaning body. A connecting rod is fixedly connected to one side of the driving sleeve block. Driving motors are fixedly connected to both sides of the top end of the cleaning body. The cleaning device for wafer processing drives the lead screws to rotate through the driving motors. The driving sleeve block outside the lead screws moves upward, and the driving sleeve block moves the cleaning frame and the wafers inside to above the cleaning body. The wafers exposed from inside the cleaning body can be directly taken. This structure realizes the convenient taking of the cleaned wafers, improves the cleaning efficiency of the wafers, and solves the problem of inconvenient wafer removal.

[0004] During the use of the above-mentioned cleaning device for wafer processing, although the wafers can be conveniently taken, its cleaning of the wafers only uses an ultrasonic cleaner in cooperation with a cleaning liquid to achieve the cleaning effect on the wafers. However, this cleaning method has relatively low efficiency, reduces the working efficiency, is inconvenient to use, and has relatively poor practicability. Content of the Utility Model

[0005] The purpose of the utility model is to provide a wafer cleaning device with improved cleaning efficiency to solve the problems raised in the above background technique.

[0006] To solve the above technical problems, the present utility model provides the following technical solution: A wafer cleaning device with improved cleaning efficiency, including a cleaning tank. On one side of the bottom inside the cleaning tank, there is an ultrasonic cleaner. Inside the cleaning tank, there is a cleaning mechanism. The cleaning mechanism includes hydraulic telescopic rods, and the hydraulic telescopic rods are symmetrically arranged at the bottom of the cleaning tank. The telescopic ends of the two hydraulic telescopic rods are connected with a cleaning frame inside the cleaning tank. At the top of the cleaning frame, a motor is fixedly installed, and a waterproof housing is arranged outside the motor. The output end of the motor is connected with a rotating shaft inside the cleaning frame, and the rotating shaft is rotatably connected with the inner wall of the cleaning frame. A plurality of placement plates are sleeved outside the cleaning frame, and the placement plates are connected to the rotating shaft through fixing components. At the lower end of the rotating shaft, a rotating connection head is connected to the bottom of the cleaning frame. At the bottom inside the cleaning tank, there is a water pump, and the output end of the water pump is connected to the rotating connection head through a hose.

[0007] Further, the cleaning mechanism further includes a plurality of branch pipes. The branch pipes are symmetrically arranged outside the rotating shaft and are located above the placement plates. A water delivery cavity is opened inside the rotating shaft, and the water delivery cavity is communicated with the branch pipes. At the bottom of one end of each branch pipe, there is a connecting seat. At the bottom of the connecting seat, a rotating pipe is rotatably embedded and installed, and the rotating pipe is communicated with the branch pipe. The lower end of the rotating pipe is communicated with a transverse pipe. A plurality of brush hairs are arranged at the bottom of the transverse pipe. Spray holes are opened at circumferentially symmetric positions on the outer wall of the transverse pipe. Through the cleaning mechanism, the wafer can be driven to rotate, so that it can be evenly contacted with the cleaning liquid and better contacted. At the same time, the cleaning liquid can be sucked and sprayed out through the spray holes. By using the reverse thrust of the cleaning liquid sprayed out from both sides by the transverse pipe, the transverse pipe is pushed to drive the rotating pipe and the brush hairs to rotate, so that the brush hairs brush the wafer, improving the cleaning effect and cleaning efficiency.

[0008] Further, the fixing component includes a support plate. The support plate is sleeved under the placement plate outside the rotating shaft, and a plurality of support plates are provided. At the top of the support plate, clamping blocks are symmetrically arranged. At the top of the placement plate, clamping grooves are symmetrically opened. At one end of the placement plate, a U-shaped groove is opened. Through the fixing component, the placement plate can be supported and limited, and the disassembly of the placement plate is convenient. Cooperating with the use of the hydraulic telescopic rod, the material can be conveniently taken.

[0009] Further, a plurality of placement grooves are opened at circumferentially symmetric positions on the top of the placement plate, and the cross section of the placement groove is an inverted convex shape. An annular arc groove is opened outside the placement groove on the top of the placement plate to limit and support the wafer. The opening of the arc groove is convenient for taking the wafer.

[0010] Further, at one end of the water pump, a connection frame is fixedly installed outside the input end. The filter cover is threadedly connected inside the connection frame, and the filter cover covers the outside of the input end of the water pump to intercept stains and the like during cleaning, avoiding entering the water pump and causing damage to its interior, affecting its service life.

[0011] Further, the pallet is annular and fixedly connected to the rotating shaft. The cleaning frame is in a square shape with an opening at the top of the cleaning box for taking materials. The installation of the pallet is for supporting the placement plate.

[0012] Compared with the prior art, the beneficial effects achieved by the present utility model are as follows:

[0013] 1. Through the cleaning mechanism of the present utility model, multiple wafers can be placed at one time for cleaning operations, improving the cleaning efficiency. Moreover, it can drive several wafers to rotate synchronously with the rotating shaft, enabling them to contact the cleaning liquid evenly. Additionally, the thrust generated by the cleaning liquid ejected from the spray holes can be used to drive the cross tube to drive the rotating tube to rotate, so that the cross tube drives the brush bristles to clean the wafers, improving the cleaning effect;

[0014] 2. Through the fixing component cooperating with the hydraulic telescopic rod, the placement plate can be conveniently disassembled and assembled, facilitating the taking and placing of wafers, and being convenient to use. Description of the Drawings

[0015] The drawings are used to provide further understanding of the present utility model and constitute a part of the specification. Together with the embodiments of the present utility model, they are used to explain the present utility model and do not constitute a limitation to the present utility model. In the drawings:

[0016] Figure 1 is the overall structural schematic diagram of the present utility model;

[0017] Figure 2 is the structural schematic diagram between the placement plate and the rotating shaft of the present utility model;

[0018] Figure 3 is the partial structural schematic diagram between the branch pipe and the cross pipe of the present utility model;

[0019] Figure 4 is the present utility model Figure 1 the enlarged structural schematic diagram of A in;

[0020] In the figure: 1, cleaning box; 2, ultrasonic cleaner; 3, hydraulic telescopic rod; 4, cleaning frame; 5, motor; 6, rotating shaft; 7, placement plate; 8, placement groove; 9, branch pipe; 10, connecting seat; 11, rotating pipe; 12, cross pipe; 13, brush bristles; 14, spray holes; 15, water pump; 16, pallet; 17, clamping block; 18, clamping groove; 19, connecting frame; 20, filter cover. Detailed Embodiments

[0021] The technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0022] As Figure 1 - Figure 4 shown, a wafer cleaning device with improved cleaning efficiency includes a cleaning tank 1. On one side of the inner bottom of the cleaning tank 1, an ultrasonic cleaner 2 is provided. A cleaning mechanism is arranged in the cleaning tank 1. The cleaning mechanism includes a hydraulic telescopic rod 3, and the hydraulic telescopic rods 3 are symmetrically arranged at the bottom of the cleaning tank 1. The telescopic ends of the two hydraulic telescopic rods 3 are connected with a cleaning frame 4 inside the cleaning tank 1. A motor 5 is fixedly installed at the top of the cleaning frame 4, and a waterproof housing is arranged outside the motor 5. The output end of the motor 5 is connected with a rotating shaft 6 inside the cleaning frame 4, and the rotating shaft 6 is rotatably connected with the inner wall of the cleaning frame 4. A plurality of placing plates 7 are sleeved outside the cleaning frame 4, and the placing plates 7 are connected with the rotating shaft 6 through fixing components. The lower end of the rotating shaft 6 is connected with a rotating connector at the bottom of the cleaning frame 4. A water pump 15 is arranged at the inner bottom of the cleaning tank 1, and the output end of the water pump 15 is connected with the rotating connector through a hose.

[0023] In this example, the cleaning mechanism further includes a plurality of branch pipes 9 which are symmetrically arranged outside the rotating shaft 6 and above the placing plate 7. A water delivery cavity is formed inside the rotating shaft 6 and is communicated with the branch pipes 9. A connecting seat 10 is provided at the bottom of one end of each branch pipe 9. A rotating pipe 11 is rotatably embedded and installed at the bottom of the connecting seat 10 and is communicated with the branch pipe 9. A horizontal pipe 12 is connected to the lower end of the rotating pipe 11. A plurality of bristles 13 are provided at the bottom of the horizontal pipe 12. Spray holes 14 are formed at circumferentially symmetric positions on the outer wall of the horizontal pipe 12. Through the cleaning mechanism, the wafer can be driven to rotate so that it can be evenly contacted with the cleaning liquid for better contact. At the same time, the cleaning liquid can be sucked and sprayed out through the spray holes 14. By using the reverse thrust of the cleaning liquid sprayed from the horizontal pipe 12 to both sides, the horizontal pipe 12 is pushed to drive the rotating pipe 11 and the bristles 13 to rotate, so that the bristles 13 brush the wafer, improving the cleaning effect and efficiency. In this example, the fixing assembly includes a supporting plate 16 which is sleeved under the placing plate 7 outside the rotating shaft 6 and a plurality of supporting plates 16 are provided. Clamping blocks 17 are symmetrically provided at the top of the supporting plate 16. Clamping grooves 18 are symmetrically formed at the top of the placing plate 7. A U-shaped groove is formed at one end of the placing plate 7. Through the fixing assembly, the placing plate 7 can be supported and limited, and the disassembly of the placing plate 7 is convenient. Cooperating with the use of the hydraulic telescopic rod 3, the material can be conveniently taken. In this example, a plurality of placing grooves 8 are formed at circumferentially symmetric positions on the top of the placing plate 7, and the cross section of the placing groove 8 is an inverted convex shape. An annular arc groove is formed outside the placing groove 8 on the top of the placing plate 7 for limiting and supporting the wafer. The formation of the arc groove facilitates the taking of the wafer. In this example, a connecting frame 19 is fixedly installed outside the input end of one end of the water pump 15. A filter cover 20 is threadedly connected inside the connecting frame 19 and covers the outside of the input end of the water pump 15 to intercept stains and the like during cleaning, preventing them from entering the water pump 15 and damaging its interior, thus affecting its service life. In this example, the supporting plate 16 is annular and is fixedly connected to the rotating shaft 6. The cleaning frame 4 is in a square shape. A material taking opening is formed at the top of the cleaning box 1. The installation of the supporting plate 16 is for supporting the placing plate 7.

[0024] Working principle of the utility model: When in use, place the wafer into the placement groove 8, then utilize the U-shaped groove to sleave the placement plate 7 outside the rotating shaft 6, and align the clamping groove 18 with the clamping block 17. Then pull down the placement plate 7 to place the placement plate 7 on the top of the support plate 16, and insert the clamping block 17 into the clamping groove 18 to achieve the support and fixation of the placement plate 7. At this time, the lower end of the brush hair 13 will contact the top surface of the wafer. Then start the hydraulic telescopic rod 3 to drive the cleaning frame 4 to move downward, so that the cleaning frame 4 is received into the cleaning box 1. Then start the ultrasonic cleaner 2 to work for cleaning the wafer. At the same time, start the motor 5 to drive the rotating shaft 6 to rotate, and start the water pump 15 to work to suck the cleaning liquid, and cooperate with the hose to transport the cleaning liquid into the water delivery cavity inside the rotating shaft 6, transfer it to the branch pipe 9, and then enter the rotating pipe 11 and the horizontal pipe 12, and spray out through the spray holes 14 provided at both ends of the horizontal pipe 12. Thus, utilize the reverse thrust generated by the sprayed liquid to drive the horizontal pipe 12 to rotate, so that the horizontal pipe 12 drives the brush hair 13 to brush the wafer below, improving the cleaning effect and efficiency, and having strong practicability. After the cleaning is completed, make the hydraulic telescopic rod 3 push the cleaning frame 4 out of the material taking port, and then drag the placement plate 7 upward above the clamping block 17, and then the placement plate 7 can be pulled out, so that the wafer can be conveniently taken, and it is convenient to use and has stronger practicability.

[0025] Finally, it should be noted that the above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A wafer cleaning device with improved cleaning efficiency, comprising a cleaning box (1), characterized in that: An ultrasonic cleaner (2) is provided at one side of the bottom of the cleaning box (1). A cleaning mechanism is provided in the cleaning box (1). The cleaning mechanism comprises a hydraulic telescopic rod (3), and the hydraulic telescopic rod (3) is symmetrically arranged at the bottom of the cleaning box (1). The telescopic ends of the two hydraulic telescopic rods (3) are connected to a cleaning frame (4) in the cleaning box (1). A motor (5) is fixedly installed on the top of the cleaning frame (4), and a waterproof shell is provided on the outside of the motor (5). The output end of the motor (5) is connected to a rotating shaft (6) in the cleaning frame (4), and the rotating shaft (6) is rotatably connected to the inner wall of the cleaning frame (4). A plurality of placement plates (7) are sleeved on the outside of the cleaning frame (4). The placement plates (7) are connected to the rotating shaft (6) through a fixing assembly. The lower end of the rotating shaft (6) is connected to a rotating connector at the bottom of the cleaning frame (4). A water pump (15) is provided at the bottom of the cleaning box (1), and the output end of the water pump (15) is connected to the rotating connector through a hose.

2. The wafer cleaning device with improved cleaning efficiency according to claim 1, characterized in that: The cleaning mechanism further comprises a branch pipe (9), and a plurality of branch pipes (9) are provided. The branch pipes (9) are symmetrically arranged outside the rotating shaft (6), and the branch pipes (9) are located above the placement plate (7). A water delivery cavity is provided inside the rotating shaft (6), and the water delivery cavity is communicated with the branch pipe (9). A connecting seat (10) is provided at the bottom of one end of the branch pipe (9), and a rotating pipe (11) is rotatably embedded and installed at the bottom of the connecting seat (10), and the rotating pipe (11) is communicated with the branch pipe (9). The lower end of the rotating pipe (11) is communicated with a transverse pipe (12), and a plurality of bristles (13) are provided at the bottom of the transverse pipe (12). Spray holes (14) are provided at circumferentially symmetrical positions on the outer wall of the transverse pipe (12).

3. The wafer cleaning device with improved cleaning efficiency according to claim 1, characterized in that: The fixing assembly comprises a support plate (16), the support plate (16) is sleeved below the placement plate (7) outside the rotating shaft (6), and a plurality of support plates (16) are provided, a clamping block (17) is symmetrically provided on the top of the support plate (16), a clamping groove (18) is symmetrically provided on the top of the placement plate (7), and a U-shaped groove is provided at one end of the placement plate (7).

4. The wafer cleaning device with improved cleaning efficiency according to claim 2, characterized in that: A plurality of placement grooves (8) are provided at circumferentially symmetrical positions on the top of the placement plate (7), and the cross-section of the placement grooves (8) is in the shape of an inverted convex letter. An annular arc groove is provided on the outer side of the placement grooves (8) on the top of the placement plate (7).

5. The wafer cleaning device with improved cleaning efficiency according to claim 2, characterized in that: One end of the water pump (15) is fixedly mounted with a connection frame (19) outside the input end, the inner side of the connection frame (19) is threadedly connected with a filter cover (20), and the filter cover (20) is arranged outside the input end of the water pump (15).

6. The wafer cleaning device with improved cleaning efficiency according to claim 3, characterized in that: The support plate (16) is annular and fixedly connected to the rotating shaft (6); the cleaning frame (4) is in the shape of a square; and a material taking port is provided on the top of the Susou cleaning box (1).

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