Semiconductor pre-alignment device

Abstract

The utility model discloses a semiconductor pre-alignment device. The semiconductor pre-alignment device provided by the utility model comprises a wafer bearing table, a limiting module and a manipulator. The wafer bearing table comprises a bearing surface, and the bearing surface is a horizontal surface and is used for placing a semiconductor. The limiting module is fixed on the periphery of the wafer bearing table and comprises an abutting face, the intersecting line of the abutting face and the horizontal plane is located on the outer contour line of a reference circle, and the circle center of the reference circle and the center of the bearing face are located on the same vertical straight line of the bearing face. And the manipulator is used for moving relative to the wafer bearing table so as to drive the semiconductor to move and enable the peripheral edge of the semiconductor to be in contact with the abutting surface. By presetting the distance between the limiting module and the center of the wafer bearing table, the mechanical arm transports the semiconductor to move towards the wafer bearing table, when the peripheral edge of the semiconductor abuts against the abutting face of the limiting module, positioning is completed, through the design, reciprocating folding and unfolding of the limiting module are not needed, and the working procedure is simpler and more efficient.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, in particular to a semiconductor pre-alignment device. Background Art

[0002] During the testing and processing of semiconductors, the center of the semiconductor is determined to facilitate subsequent testing. Therefore, the semiconductor needs to be transported to an alignment device for adjustment to find the center of the semiconductor. In the prior art, a limit column is arranged on a wafer stage around the center of the wafer stage. After the semiconductor is placed on the wafer stage, the limit column is retracted toward the center, thereby abutting against the outer edge of the semiconductor to align the center of the semiconductor. After the alignment process is completed, the limit column is unfolded to facilitate the removal of the semiconductor. In this design, the limit column needs to be retracted and unfolded during the center alignment process of each semiconductor, which is very cumbersome. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a semiconductor pre-alignment device, which presets the distance between the limit module and the center of the wafer stage, so that the robot transports the semiconductor to the wafer stage, and the positioning is completed when the peripheral edge of the semiconductor abuts against the abutment surface of the limit module. Such a design does not require the limit module to be reciprocated and expanded, and the process is simpler and more efficient.

[0004] The semiconductor pre-alignment device according to the embodiment of the utility model includes: a wafer stage, a limiting module and a manipulator. The wafer stage includes a bearing surface, which is a horizontal surface, and the bearing surface is used to place the semiconductor. The limiting module is fixed to the periphery of the wafer stage, and the limiting module includes an abutment surface, and the intersection line of the abutment surface and the horizontal surface is located on the outer contour line of a reference circle, and the center of the reference circle and the center of the bearing surface are located on the same vertical straight line of the bearing surface. The manipulator is used to move relative to the wafer stage, thereby driving the semiconductor to move and making the peripheral edge of the semiconductor contact with the abutment surface.

[0005] The semiconductor pre-alignment device according to the embodiment of the utility model has at least the following beneficial effects: by presetting the distance between the limit module and the center of the wafer stage, the robot transports the semiconductor toward the wafer stage, and the positioning is completed when the outer peripheral edge of the semiconductor abuts the abutment surface of the limit module. Such a design does not require the limit module to reciprocate and expand, and the process is simpler and more efficient.

[0006] According to some embodiments of the present invention, the abutting surface is a curved surface.

[0007] According to some embodiments of the present utility model, the limiting module includes two limiting blocks. The outer surface of the limiting block includes a contact surface. The manipulator moves relative to the bearing surface along a reference line. The two limiting blocks are symmetrically arranged along the reference line, and the included angle between the central axis of the limiting block and the reference line is an acute angle.

[0008] According to some embodiments of the present utility model, the distance between the contact surface and the center of the bearing surface is adjustable.

[0009] According to some embodiments of the present utility model, the contact surface includes a first contact surface and a second contact surface. The first contact surface and the second contact surface are distributed in the vertical direction, and the first contact surface and the second contact surface are spaced apart in the radial direction of the bearing surface.

[0010] According to some embodiments of the present utility model, the limiting module has a first state and a second state. When the limiting module is in the first state, the first contact surface is located above the second contact surface, and the first contact surface is used to contact the semiconductor. When the limiting module is in the second state, the second contact surface is located above the first contact surface, and the second contact surface is used to contact the semiconductor.

[0011] According to some embodiments of the present utility model, the semiconductor pre-aligning device further includes a lifting mechanism. The lifting mechanism is used to drive the wafer stage to lift relative to the limiting module, so that the bearing surface is located within the first contact surface or within the second contact surface in terms of height.

[0012] According to some embodiments of the present utility model, the semiconductor pre-aligning device further includes a rotating mechanism and an adsorbing mechanism. The wafer stage includes an air inlet, and the air inlet is located on the bearing surface. The rotating mechanism is used to drive the wafer stage to rotate along the vertical line where the center of the bearing surface is located. The adsorbing mechanism is connected to the air inlet to pump air to make the bearing surface adsorb the semiconductor. The semiconductor pre-aligning device further includes an optical fiber sensor, and the optical fiber sensor is located on the side of the wafer stage. The optical fiber sensor is used to detect the arrangement direction of the crystal grains in the semiconductor.

[0013] According to some embodiments of the present utility model, the bearing surface includes an air inlet, a plurality of first flow channels and a plurality of second flow channels. The air inlet is located at the center of the bearing surface. The plurality of first flow channels are radially connected to the air inlet. The second flow channels are circularly distributed around the air inlet. The plurality of second flow channels are spaced apart. The second flow channels are communicated with the first flow channels. The air inlet is communicated with the adsorbing mechanism. The adsorbing mechanism pumps air to the air inlet to make the bearing surface adsorb the semiconductor.

[0014] According to some embodiments of the present utility model, the manipulator has an adsorption hole capable of adsorbing the semiconductor. The manipulator includes a body part and a protruding part. The adsorption hole is opened on the body part. The protruding part surrounds the adsorption hole and protrudes relative to the upper surface of the body part. The protruding part is used to place the semiconductor.

[0015] Additional aspects and advantages of the present utility model will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present utility model. Description of the Drawings

[0016] The present utility model will be further described below in conjunction with the drawings and embodiments, where:

[0017] Figure 1 is a perspective view of a semiconductor pre-alignment device in an embodiment of the present utility model;

[0018] Figure 2 is a perspective view of a semiconductor pre-alignment device with a semiconductor placed therein in an embodiment of the present utility model;

[0019] Figure 3 is a top view of a semiconductor pre-alignment device in an embodiment of the present utility model;

[0020] Figure 4 is a perspective view of a limit module in a second state in an embodiment of the present utility model;

[0021] Figure 5 is a perspective view of a wafer stage and surrounding components in an embodiment of the present utility model;

[0022] Figure 6 is a partial structural diagram of a manipulator in an embodiment of the present utility model.

[0023] Reference numerals: semiconductor pre-alignment device 100, wafer stage 101, bearing surface 102, limit module 103, manipulator 104, limit block 105, abutting surface 106, first abutting surface 107, second abutting surface 108, fiber optic sensor 109, guiding mechanism 110, semiconductor 201, reference circle 301, reference line 302, lifting mechanism 501, rotating mechanism 502, adsorption mechanism 503, air inlet 504, first flow channel 505, second flow channel 506, adsorption hole 601, body part 602, protruding part 603, convex block 604, protruding part 605. Detailed Embodiments

[0024] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for explaining the present utility model and should not be construed as limiting the present utility model.

[0025] In the description of the present utility model, it should be understood that when it comes to orientation descriptions, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc., it is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.

[0026] In the description of the present utility model, the meaning of several is more than one, and the meaning of multiple is more than two. Understandings such as greater than, less than, exceeding, etc. do not include the present number, and understandings such as above, below, within, etc. include the present number. If there is a description of first and second, it is only for the purpose of distinguishing technical features and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or the sequence relationship of the indicated technical features.

[0027] In the description of the present utility model, unless otherwise clearly defined, words such as setting, installing, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present utility model in combination with the specific content of the technical solution.

[0028] In the description of the present utility model, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0029] Reference Figures 1 to 3, the semiconductor pre-alignment device 100 according to an embodiment of the present invention includes: a wafer stage 101, a limiting module 103, and a manipulator 104. The wafer stage 101 includes a carrying surface 102, and the carrying surface 102 is a horizontal plane for placing the semiconductor 201. The limiting module 103 is fixed on the periphery of the wafer stage 101. The limiting module 103 includes an abutting surface 106, and the intersection line of the abutting surface 106 and the horizontal plane is located on the outer contour line of a reference circle 301. The center of the reference circle 301 and the center of the carrying surface 102 are on the same vertical line of the carrying surface 102. The manipulator 104 is used to move relative to the wafer stage 101, so as to drive the semiconductor 201 to move and make the outer periphery of the semiconductor 201 contact the abutting surface 106. By presetting the distance between the limiting module 103 and the center of the wafer stage 101, the manipulator 104 transports the semiconductor 201 to move towards the wafer stage 101. When the outer periphery of the semiconductor 201 abuts against the abutting surface 106 of the limiting module 103, the positioning is completed. Such a design does not require the limiting module 103 to be retracted and expanded reciprocally, and the process is simpler and more efficient.

[0030] It should be noted that, in some embodiments of the present invention, the semiconductor 201 may be a wafer, or other electronic components or circular devices.

[0031] It should be noted that, in some embodiments of the present invention, the limiting module 103 being fixed on the periphery of the wafer stage 101 means that during the alignment process of the semiconductor 201, the position of the limiting module 103 remains unchanged, while during the adjustment process before alignment, the position of the limiting module 103 can be adjusted according to the size of the semiconductor 201 to adapt to different sizes of the semiconductor 201.

[0032] It should be noted that, referring to Figure 2 and Figure 3 , the size of the reference circle 301 depends on the size of the semiconductor 201 to be aligned. Specifically, in the final state of alignment, the outer contour of the semiconductor 201 abuts against the abutting surface 106, and the reference circle 301 and the outer contour line of the carrying surface 102 are concentric circles. When the outer contour of the semiconductor 201 abuts against the abutting surface 106, the outer contour line of the semiconductor 201 and the carrying surface 102 form concentric circles. At this time, the center of the carrying surface 102 is the center of the semiconductor 201, thereby determining the center of the semiconductor 201.

[0033] It should be noted that, in some embodiments of the present invention, a pressure sensor is further provided on the limiting module 103. When the outer contour of the semiconductor 201 completely abuts against the abutting surface 106, the pressure sensor is triggered to determine that the semiconductor 201 has been aligned.

[0034] Referring to Figure 1 andFigure 2 , in some embodiments of the present utility model, the abutting surface 106 is an arc surface. The arc surface can have a larger contact area with the outer contour of the semiconductor 201, and can better abut against the semiconductor 201. It should be noted that, in some embodiments of the present utility model, a plurality of dot-shaped limiting posts can also be provided on the reference circle 301, and abutting the semiconductor 201 against the limiting posts can also achieve the alignment effect.

[0035] Reference Figure 1 and Figure 3 , in some embodiments of the present utility model, the limiting module 103 includes two limiting blocks 105. The outer surface of the limiting block 105 includes an abutting surface 106. The manipulator 104 moves relative to the bearing surface 102 along a reference line 302. The two limiting blocks 105 are symmetrically arranged along the reference line 302, and the included angle between the central axis of the limiting block 105 and the reference line 302 is an acute angle. The design that the included angle between the central axis of the limiting block 105 and the reference line 302 is an acute angle can enable the manipulator 104 to move along the reference line 302 towards the limiting block 105 and make the semiconductor 201 abut against the limiting block 105. Then, the two limiting blocks 105 simultaneously exert a reaction force in the opposite direction of the movement direction of the manipulator 104 and an inward force towards the reference line 302 on the semiconductor 201. Also, because the manipulator 104 does not forcibly limit the displacement of the semiconductor 201, at this time, the semiconductor 201 can be stably positioned at the aligned position, improving the alignment effect of the semiconductor 201.

[0036] It should be noted that, in the embodiments of the present utility model, the reference line 302 passes through the centers of the reference circle 301 and the bearing surface 102.

[0037] Reference Figure 1 and Figure 3 , in some embodiments of the present utility model, the distance between the abutting surface 106 and the center of the bearing surface 102 is adjustable. In this way, the size of the reference circle 301 can be changed to adapt to the alignment of semiconductors 201 of different sizes. Specifically, in some embodiments of the present utility model, the semiconductor pre-aligning device 100 further includes a guiding mechanism 110. The guiding mechanism 110 is connected to the limiting block 105. The limiting block 105 is slidably connected to the guiding mechanism 110. The track direction of the guiding mechanism 110 points to the center of the bearing surface 102, thereby realizing the change of the position of the abutting surface 106. The guiding mechanism 110 can be manually adjusted. After adjusting the position, the limiting block 105 and the guiding mechanism 110 can be fixed by structures such as bolts. It can also be automatically controlled by setting a piston rod on the limiting block 105 and using pneumatic or hydraulic components.

[0038] Reference Figure 1 and Figure 4, in some embodiments of the present utility model, the abutting surface 106 includes a first abutting surface 107 and a second abutting surface 108. The first abutting surface 107 and the second abutting surface 108 are distributed along the vertical direction, and the first abutting surface 107 and the second abutting surface 108 are spaced apart in the radial direction of the bearing surface 102. Spacing the first abutting surface 107 and the second abutting surface 108 in the radial direction of the bearing surface 102 enables the limiting block 105 to adapt to the alignment of semiconductors 201 of two sizes. In this way, the distance between the first abutting surface 107 and the second abutting surface 108 can be designed according to the sizes of the two most commonly used semiconductors 201 when manufacturing the limiting block 105. For example, when the diameter sizes of the two commonly used semiconductors 201 are 6 inches and 10 inches respectively, the radius difference is 2 inches. Then, when designing the limiting block 105, the distance difference between the first abutting surface 107 and the second abutting surface 108 in the radial direction can be made 2 inches, making the alignment process of the semiconductor pre-alignment device 100 of the embodiments of the present utility model simpler for the two commonly used semiconductors 201.

[0039] Reference Figure 1 And Figure 4 , in some embodiments of the present utility model, the limiting module 103 has a first state and a second state. When the limiting module 103 is in the first state, the first abutting surface 107 is located above the second abutting surface 108, and the first abutting surface 107 is used to abut against the semiconductor 201; when the limiting module 103 is in the second state, the second abutting surface 108 is located above the first abutting surface 107, and the second abutting surface 108 is used to abut against the semiconductor 201. It should be noted that Figure 1 The limiting module 103 in Figure 1 And Figure 4 is in the first state. The first abutting surface 107 and the second abutting surface 108 can adapt to semiconductors 201 of different sizes, and such a design only requires, as shown in

[0040] Reference Figure 4 And Figure 5, in some embodiments of the present invention, the semiconductor pre-aligning device 100 further includes a lifting mechanism 501. The lifting mechanism 501 is used to drive the wafer stage 101 to lift relative to the limiting module 103, so that the bearing surface 102 is located within the first abutting surface 107 or within the second abutting surface 108 in height. The lifting mechanism 501 can make the switching process of using the first abutting surface 107 and the second abutting surface 108 to abut against the semiconductor 201 simpler. There is no need to disassemble and flip the limiting block 105, and only the lifting mechanism 501 needs to be used to drive the wafer stage 101 to lift. In some embodiments of the present invention, the lifting mechanism 501 can use a guide rail slider mechanism, or a lead screw lifting mechanism 501 or a rack and pinion lifting structure, etc., which can be adjusted according to the actual use scenario.

[0041] Reference Figure 5 , in some embodiments of the present invention, the semiconductor 201 is a wafer, and grains are provided inside. The semiconductor pre-aligning device 100 further includes a rotating mechanism 502 and an adsorption mechanism 503. The wafer stage 101 includes an air inlet 504, and the air inlet 504 is located on the bearing surface 102. The rotating mechanism 502 is used to drive the wafer stage 101 to rotate along the vertical straight line where the center of the bearing surface 102 is located. The adsorption mechanism 503 is connected to the air inlet 504 to pump air to make the bearing surface 102 adsorb the semiconductor 201. The semiconductor pre-aligning device 100 further includes an optical fiber sensor 109, and the optical fiber sensor 109 is located on the side of the wafer stage 101. The optical fiber sensor 109 is used to detect the arrangement direction of the grains in the semiconductor 201. The adsorption mechanism 503 pumps air to make the bearing surface 102 adsorb the semiconductor 201, which causes less scraping and damage to the surface of the semiconductor 201 compared with the traditional mechanical clamping, improving the quality of the semiconductor 201. The rotating mechanism 502 is placed on the semiconductor 201 on the bearing surface 102 to rotate the semiconductor 201 so that the semiconductor 201 is cut within the optical path range of the optical fiber sensor 109. The optical fiber sensor 109 detects the arrangement direction of the grains in the semiconductor 201 accordingly. At the same time, the rotating mechanism 502 can also adjust the orientation of the grains, and finally rotate the direction of the grains inside the semiconductor 201 to the target orientation.

[0042] It should be noted that, reference Figure 3 , in some embodiments of the present invention, the center line of the optical fiber sensor 109 coincides with the reference line 302 and passes through the center of the reference circle 301. Thus, during the rotation of the semiconductor 201, the offset of the rotation center relative to the vertical plane where the center line of the optical fiber sensor 109 is located is zero. Therefore, the optical fiber sensor 109 can further detect whether the semiconductor 201 has been aligned during the rotation of the semiconductor 201, improving the alignment accuracy of the semiconductor 201.

[0043] Reference Figure 5, In some embodiments of the present utility model, the bearing surface 102 includes an air inlet 504, a plurality of first flow channels 505, and a plurality of second flow channels 506. The air inlet 504 is located at the center of the bearing surface 102. The plurality of first flow channels 505 are radially connected to the air inlet 504. The second flow channels 506 are circularly distributed around the air inlet 504. The plurality of second flow channels 506 are spaced apart. The second flow channels 506 communicate with the first flow channels 505. The air inlet 504 communicates with the adsorption mechanism 503. The adsorption mechanism 503 evacuates the air inlet 504 to enable the bearing surface 102 to adsorb the semiconductor 201. The radially arranged first flow channels 505 and the second flow channels 506 distributed around the center make the air flow generated in the first flow channels 505 and the second flow channels 506 evenly distributed on the bearing surface 102 when the adsorption mechanism 503 evacuates the air, improving the adsorption effect of the bearing surface 102 and the uniformity of the surface adsorption of different positions of the semiconductor 201.

[0044] Reference Figure 6 , In some embodiments of the present utility model, the manipulator 104 has an adsorption hole 601 capable of adsorbing the semiconductor 201. The manipulator 104 includes a main body portion 602 and a protruding portion 603. The adsorption hole 601 is opened in the main body portion 602. The protruding portion 603 surrounds the adsorption hole 601 and protrudes relative to the upper surface of the main body portion 602. The protruding portion 603 is used to place the semiconductor 201. The adsorption hole 601 is used to adsorb the semiconductor 201, causing less scratching and damage to the surface of the semiconductor 201 compared to traditional mechanical clamping, improving the quality of the semiconductor 201. In order to ensure a higher flatness, a protruding portion 603 is provided around the adsorption hole 601, so that it is not necessary to process the entire main body portion 602 with high flatness. Only the small-area protruding portion 603 needs to be processed to ensure the vacuum degree during the adsorption of the semiconductor 201. It should be noted that, in some embodiments of the present utility model, the manipulator 104 further includes two protruding portions 605. The protruding portions 605 protrude from the main body portion 602 in the direction towards the limit block 105. The two protruding portions 605 are spaced apart. When the manipulator 104 moves relative to the wafer stage 101 to Figure 1 and Figure 3 the position shown, the wafer stage 101 is located between the two protruding portions 605. In this way, the lifting of the wafer stage 101 connected to the lifting mechanism 501 is not affected by the manipulator 104, thereby realizing the transfer of the semiconductor 201 from being placed on the manipulator 104 to being placed on the wafer stage 101.

[0045] It should be noted that, reference Figure 6 , In some embodiments of the present utility model, a convex block 604 is further provided on the protruding portion 605. The convex block 604 and the protruding portion 603 have the same height and are both used to place the semiconductor 201. At the same time, it is more convenient to process the flatness of the surface of the small-area convex block 604.

[0046] Reference Figure 1 、 Figure 2 and Figure 5 , in some embodiments of the present utility model, the specific alignment process of the semiconductor 201 is as follows:

[0047] Preset the position of the limit block 105 so that the reference circle 301 is the same size as the semiconductor 201. The manipulator 104 adsorbs the semiconductor 201 and moves along the reference line 302. When the outer contour of the semiconductor 201 abuts against the abutting surface 106, the wafer stage 101 adsorbs the semiconductor 201, and the manipulator 104 withdraws, and the alignment of the semiconductor 201 is completed. In some embodiments, the rotating mechanism 502 drives the wafer stage 101 to rotate, and the fiber optic sensor 109 detects the crystal grain direction of the semiconductor 201. After adjusting the center position and crystal grain direction of the semiconductor 201, the manipulator 104 adsorbs the semiconductor 201 and leaves again.

[0048] The above has described the embodiments of the present utility model in detail with reference to the drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those of ordinary skill in the art, various changes can be made without departing from the gist of the present utility model. In addition, without conflict, the embodiments of the present utility model and the features in the embodiments can be combined with each other.

Claims

1. A semiconductor pre-alignment device, characterized in that: include: A wafer stage, the wafer stage comprising a carrying surface, the carrying surface is a horizontal surface, and the carrying surface is used to place a semiconductor; A limit module, the limit module is fixed to the periphery of the wafer stage, the limit module comprises an abutment surface, the intersection line of the abutment surface and the horizontal plane is located on the outer contour line of a reference circle, and the center of the reference circle and the center of the bearing surface are located on the same vertical straight line of the bearing surface; A robot arm is used to move relative to the wafer stage, thereby driving the semiconductor to move and making the outer peripheral edge of the semiconductor contact the abutment surface.

2. The semiconductor pre-alignment device according to claim 1, characterized in that: The abutting surface is a curved surface.

3. The semiconductor pre-alignment device according to claim 1, characterized in that: The limit module includes two limit blocks, the outer surface of the limit block includes the abutment surface, the manipulator moves along a reference line relative to the bearing surface, the two limit blocks are symmetrically arranged along the reference line, and the angle between the central axis of the limit block and the reference line is an acute angle.

4. The semiconductor pre-alignment device according to claim 1, characterized in that: The distance between the abutting surface and the center of the bearing surface is adjustable.

5. The semiconductor pre-alignment device according to claim 1, characterized in that: The abutting surface includes a first abutting surface and a second abutting surface, the first abutting surface and the second abutting surface are distributed along the vertical direction, and the first abutting surface and the second abutting surface are spaced apart in the radial direction of the bearing surface.

6. The semiconductor pre-alignment device according to claim 5, characterized in that: The limiting module has a first state and a second state. When the limiting module is in the first state, the first abutting surface is located above the second abutting surface, and the first abutting surface is used to abut the semiconductor; when the limiting module is in the second state, the second abutting surface is located above the first abutting surface, and the second abutting surface is used to abut the semiconductor.

7. The semiconductor pre-alignment device according to claim 5, characterized in that: The semiconductor pre-alignment device further includes a lifting mechanism, which is used to drive the wafer stage to rise and fall relative to the limiting module so that the carrying surface is located within the first abutting surface or within the second abutting surface in terms of height.

8. The semiconductor pre-alignment device according to claim 1, characterized in that: The semiconductor pre-alignment device also includes a rotating mechanism and an adsorption mechanism. The wafer stage includes an air inlet, which is located on the carrying surface. The rotating mechanism is used to drive the wafer stage to rotate along a vertical line with the center of the carrying surface located therein. The adsorption mechanism is connected to the air inlet to draw air so that the carrying surface adsorbs the semiconductor. The semiconductor pre-alignment device also includes an optical fiber sensor, which is located on the side of the wafer stage. The optical fiber sensor is used to detect the arrangement direction of the grains in the semiconductor.

9. The semiconductor pre-alignment device according to claim 8, characterized in that: The carrying surface includes the air inlet, multiple first flow channels and multiple second flow channels, the air inlet is located at the center of the carrying surface, multiple first flow channels are radially connected to the air inlet, the second flow channels are distributed in a circle around the air inlet, the multiple second flow channels are arranged at intervals, the second flow channels are connected to the first flow channels, the air inlet is connected to the adsorption mechanism, and the adsorption mechanism evacuates the air inlet so that the carrying surface adsorbs the semiconductor.

10. The semiconductor pre-alignment device according to claim 1, characterized in that: The manipulator has an adsorption hole capable of adsorbing a semiconductor. The manipulator includes a main body and a protruding part. The adsorption hole is opened in the main body. The protruding part surrounds the adsorption hole and protrudes relative to the upper surface of the main body. The protruding part is used to place the semiconductor.

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