Vehicle-mounted camera

Abstract

The embodiment of the utility model provides a vehicle-mounted camera, which comprises a shell, an optical circuit board assembled in the shell and a photosensitive chip assembled on the optical circuit board, the optical circuit board comprises a heat dissipation substrate made of heat conduction materials and a circuit board arranged on one side face of the heat dissipation substrate and electrically connected with the photosensitive chip, a hollowed-out hole is formed in the middle of the circuit board, and the photosensitive chip is a COB packaging chip, is contained in the hollowed-out hole and is attached to the heat dissipation substrate through the COB technology. During specific assembly, the photosensitive chip is mounted on the heat dissipation substrate exposed out of the hollow hole through a COB (chip on board) process, the heat dissipation substrate made of heat conduction materials can quickly dissipate heat generated when the photosensitive chip works, and the photosensitive chip is further electrically connected with the circuit board, so that transmission of signals and circuits is realized, and normal work of the photosensitive chip is guaranteed.

Description

Technical Field

[0001] The embodiment of the utility model relates to the technical field of vehicle-mounted accessories, in particular to a vehicle-mounted camera. Background Art

[0002] The existing vehicle-mounted cameras mainly include a housing, a lens assembled on the housing, an optical circuit board assembled in the housing, and a photosensitive chip assembled on one side of the optical circuit board facing the lens and with its optical center falling on the optical axis of the lens; among them, traditional photosensitive chips usually adopt BGA packaging, and the optical circuit board is made of FR4 material to form a PCB board; however, when the photosensitive chip works, it will generate more heat, and traditional PCB boards usually have difficulty in dissipating the heat generated by the photosensitive chip, reducing the service life of the photosensitive chip. Summary of the Utility Model

[0003] The technical problem to be solved by the embodiment of the utility model is to provide a vehicle-mounted camera that can effectively dissipate the heat generated when the photosensitive chip works.

[0004] To solve the above technical problem, the embodiment of the utility model provides the following technical solutions: A vehicle-mounted camera includes a housing, an optical circuit board assembled in the housing, and a photosensitive chip assembled on the optical circuit board. The optical circuit board includes a heat dissipation substrate made of a heat-conducting material and a circuit board disposed on one side surface of the heat dissipation substrate and electrically connected to the photosensitive chip. A hollow hole is provided in the middle of the circuit board. The photosensitive chip is a COB packaged chip and is accommodated in the hollow hole and mounted on the heat dissipation substrate through the COB process.

[0005] Further, the circuit board is a flexible FPC board attached to one side surface of the heat dissipation substrate by means of an adhesive.

[0006] Further, the vehicle-mounted camera further includes a power circuit board assembled in the housing and located on opposite side surfaces of the optical circuit board with the flexible FPC board. The optical circuit board further includes a flexible FPC cable with one end connected to the flexible FPC board and the other end correspondingly inserted into a preset second insertion connector on the power circuit board through a first insertion connector.

[0007] Further, the second insertion connector is disposed on one side surface of the power circuit board facing the optical circuit board. The first insertion connector is between the second insertion connector and the optical circuit board, and a buffer material layer for abutting against the optical circuit board is further provided on the surface of the first insertion connector facing away from the second insertion connector.

[0008] Further, an image processing chip is also assembled on the side of the power supply circuit board facing away from the optical circuit board, and a heat-conducting material layer is also interposed between the image processing chip and the inner wall of the housing.

[0009] Further, a through hole is provided on one side wall of the housing, and the vehicle-mounted camera further includes an internal connector assembled on the side of the power supply circuit board facing away from the optical circuit board and inserted into the through hole to be correspondingly electrically connected to an external connector inserted from the outer end orifice of the through hole.

[0010] Further, a positioning step for abutting and positioning the power supply circuit board is provided on the inner wall of the housing.

[0011] Further, a lens is assembled on one side of the housing and is disposed opposite to the photosensitive chip. A plurality of dispensing bosses are evenly provided on the bottom end surface of the lens. After the lens is aligned with the photosensitive chip on the optical circuit board through an active focusing process, the lens is adhesively fixed to the optical circuit board by the bottom surfaces of the respective dispensing bosses with the aid of UV glue.

[0012] Further, an opening is formed at the front end of the housing, and positioning studs are provided on the periphery of the opening. An annular disk covering the opening is formed on the outer side wall of the bottom end of the lens. A positioning convex ring and a positioning jack are provided on the bottom end surface of the annular disk near the outer periphery. The dispensing bosses are disposed inside the positioning convex ring. The lens is inserted into the opening with the positioning convex ring, and the positioning studs are inserted into the positioning jacks to relatively position the lens and the housing. The annular disk is integrally connected to the periphery of the opening through a laser welding process.

[0013] Further, a dispensing groove is provided on the bottom surface of each dispensing boss.

[0014] After adopting the above technical solution, the embodiment of the present utility model has at least the following beneficial effects: The optical circuit board of the embodiment of the present utility model includes a heat dissipation substrate and a circuit board. A hollow hole is formed in the middle of the circuit board, and the photosensitive chip is a COB packaged chip. During specific assembly, the photosensitive chip is placed in the hollow hole and mounted on the heat dissipation substrate through the COB process. The heat dissipation substrate made of a heat-conducting material can quickly dissipate the heat generated when the photosensitive chip works, and the photosensitive chip is also electrically connected to the circuit board to realize the transmission of signals and circuits, ensuring the normal operation of the photosensitive chip. Description of the Drawings

[0015] Figure 1 It is a schematic exploded view of an optional embodiment of the vehicle-mounted camera of the present utility model.

[0016] Figure 2 It is a schematic assembled view of an optional embodiment of the vehicle-mounted camera of the present utility model.

[0017] Figure 3 The figure is a schematic cross-sectional structure diagram of an optional embodiment of the vehicle-mounted camera of the present utility model.

[0018] Figure 4 The figure is an enlarged schematic cross-sectional view of the assembly part of the photosensitive chip and the optical circuit board of an optional embodiment of the vehicle-mounted camera of the present utility model.

[0019] Figure 5 The figure is a schematic cross-sectional view of the assembly of the lens and the optical circuit board of an optional embodiment of the vehicle-mounted camera of the present utility model.

[0020] Figure 6 The figure is a schematic diagram of the disassembled structure of an optional embodiment of the vehicle-mounted camera of the present utility model after being inverted. Detailed implementation manners

[0021] The following further describes the present application in detail with reference to the accompanying drawings and specific embodiments. It should be understood that the following illustrative embodiments and descriptions are only used to explain the present utility model and are not intended to limit the present utility model. Moreover, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0022] As Figures 1-4 shown, an optional embodiment of the present utility model provides a vehicle-mounted camera, including a housing 1, an optical circuit board 3 assembled in the housing 1, and a photosensitive chip 4 assembled on the optical circuit board 3. The optical circuit board 3 includes a heat dissipation substrate 30 made of a heat-conducting material (such as: ceramic or aluminum) and a circuit board 32 disposed on one side of the heat dissipation substrate 30. A hollow hole 321 is provided in the middle of the circuit board 32. The photosensitive chip 4 is a COB packaged chip and is accommodated in the hollow hole 321 and mounted on the heat dissipation substrate 30 through the COB process.

[0023] The optical circuit board in the embodiment of the present utility model includes a heat dissipation substrate 30 and a flexible circuit board 32. A hollow hole 321 is opened in the middle of the circuit board 32, and the photosensitive chip 4 is a COB packaged chip. During specific assembly, the photosensitive chip 4 is accommodated in the hollow hole 321 and mounted on the heat dissipation substrate 30 through the COB process. The heat dissipation substrate 30 made of a heat-conducting material can quickly dissipate the heat generated when the photosensitive chip 4 works. The photosensitive chip 4 is also electrically connected to the circuit board 32 to realize signal and circuit transmission, ensuring the normal operation of the photosensitive chip 4.

[0024] Specifically, the assembly structure of the photosensitive chip 4 (or crystal source) through the COB process is as Figure 4As shown, the photosensitive chip 4 is bonded to the heat dissipation substrate 30 exposed from the hollow hole 321 by a chip fixing glue 40, and the outer side of the photosensitive chip 4 is fixed to a mounting bracket 44 by a bracket fixing glue 42, and a light-transmitting glass 46 is fixed to the top of the mounting bracket 44 by glass glue 45. The photosensitive chip 4 is electrically connected to the circuit board 32 by bonding with a gold wire 47, and the inner side of the mounting bracket 44 and the edge of the photosensitive chip 4 are filled with a gold wire protection glue 48.

[0025] In an optional embodiment of the present invention, the circuit board 32 is a flexible FPC board attached to one side of the heat dissipation substrate 30 by means of adhesive. In this embodiment, the circuit board 32 is a flexible FPC board, which can be directly attached to the heat dissipation substrate 30 by adhesive during assembly, which is convenient for assembly and circuit design layout.

[0026] In an optional embodiment of the present invention, Figure 1 , Figure 3 and Figure 6 As shown, the vehicle-mounted camera also includes a power circuit board 5 assembled in the housing 1 and located on two opposite sides of the heat dissipation substrate 30 with the flexible FPC board 32, and the optical circuit board 3 also includes a flexible FPC cable 34 connected to the flexible FPC board 32 at one end and correspondingly plugged with a preset second plug connector 50 on the power circuit board 5 at the other end by means of a first plug connector 341. In this embodiment, the optical circuit board 3 also includes a flexible FPC cable 34, so that the optical circuit board 3 is plugged and matched with the second plug connector 50 of the power circuit board 5 through the first plug connector 341 of the flexible FPC cable 34, so that the conduction between the optical circuit board 3 and the power circuit board 5 is realized, and the flexible FPC cable 34 can be flexibly deformed arbitrarily, so as to ensure that the circuit conduction can be realized even when the optical circuit board 3 and the power circuit board 5 are at different distances, thereby improving compatibility.

[0027] In an optional embodiment of the present invention, Figure 3 and Figure 6 As shown, the second plug connector 50 is arranged on a side of the power circuit board 5 facing the heat dissipation substrate 30, the first plug connector 341 is between the second plug connector 50 and the heat dissipation substrate 30, and a buffer material layer 343 for abutting against the heat dissipation substrate 30 is also provided on the surface of the first plug connector 341 facing away from the second plug connector 50. In this embodiment, by providing a buffer material layer 343 (for example, elastic silicone or buffer foam, etc.), when the first plug connector 341 and the second plug connector 50 are plugged and assembled, buffering is achieved; and when the vehicle-mounted camera is used, it can also effectively absorb external impact to prevent the first plug connector 341 and the second plug connector 50 from loosening.

[0028] In an optional embodiment of the present invention, Figure 3 and Figure 6 As shown, the power circuit board 5 is further assembled with an image processing chip 52 on the side away from the optical circuit board 3, and a heat-conducting material layer 54 (for example, heat-conducting silica gel or heat-conducting rubber, etc.) is further provided between the image processing chip 52 and the inner wall of the housing 1. In this embodiment, the image processing function of the vehicle-mounted camera is realized by assembling the image processing chip 52 on the power circuit board 5; and the image processing chip 52 also generates a lot of heat when working. By adding the heat-conducting material layer 54, the heat generated on the image processing chip 52 is quickly transferred to the housing 1, and then the housing 1 is used to dissipate the heat.

[0029] In an optional embodiment of the present invention, Figures 1-3 , Figure 6 As shown, a through hole 10 is provided on one side wall of the housing 1, and the vehicle-mounted camera further comprises an internal connector 7 assembled on the side of the power circuit board 5 away from the optical circuit board 3 and inserted into the through hole 10 so as to be electrically connected to the external connector 6 inserted from the outer end opening of the through hole 10. In this embodiment, the vehicle-mounted camera is further provided with the internal connector 7 to facilitate the docking of the vehicle-mounted camera with the external connector 6.

[0030] In an optional embodiment of the present invention, Figure 1 As shown, the inner wall of the housing 1 is provided with a positioning step 12 for abutting and positioning the power circuit board 5. In this embodiment, the positioning step 12 is also provided to facilitate the assembly and positioning of the power circuit board 5 and the housing 1.

[0031] In an optional embodiment of the present invention, Figure 1 , Figure 3 , Figures 5-6 As shown, a lens 8 facing the photosensitive chip 4 is assembled on one side of the housing 1, and a plurality of glue-dispensing bosses 80 are evenly arranged on the bottom end surface of the lens 8. After the lens 8 is aligned with the photosensitive chip 4 on the optical circuit board 3 through an active focusing process, the bottom surfaces of the glue-dispensing bosses 80 are bonded and fixed to the optical circuit board 3 with the help of UV glue 82. In this embodiment, the lens 8 is aligned with the photosensitive chip 4 by an active focusing process, so as to improve the alignment accuracy of the lens 2 and the photosensitive chip 4, and achieve high assembly efficiency. At the same time, the lens 8 is bonded to the optical circuit board 3 through the glue-dispensing bosses 80 and the UV glue 82, so as to achieve relative fixation of the lens 8 and the photosensitive chip 4 on the optical circuit board 3; at the same time, the heat on the optical circuit board 3 can be further dissipated through the side wall of the lens 8.

[0032] In an optional embodiment of the present invention, Figure 1 , Figure 3 , Figures 5-6As shown, an opening 14 is formed at the front end of the housing 1, and positioning insertion posts 141 are provided on the periphery of the opening 14. An annular disc 84 covering the opening 14 is formed on the outer side wall of the bottom end of the lens 8. A positioning convex ring 841 and a positioning insertion hole 843 are provided on the bottom end surface of the annular disc 84 near the outer periphery. The dispensing boss 80 is arranged inside the positioning convex ring 841. The lens 8 is inserted into the opening 14 with the positioning convex ring 841, and the positioning insertion post 141 is inserted into the positioning insertion hole 843 to relatively position the lens 8 and the housing 1. The annular disc 84 is integrally connected to the periphery of the opening 14 by a laser welding process. In this embodiment, the lens 8 and the housing 1 are initially positioned by inserting the positioning convex ring 841 into the opening 14 and the positioning insertion post 141 into the positioning insertion hole 843. Then, the annular disc 84 covers the opening 14 and is integrally connected to the periphery of the opening 14 by a laser welding process to realize the stable connection and sealing between the lens 8 and the housing 1.

[0033] In an alternative embodiment of the present invention, as Figure 6 shown, a dispensing groove 801 is formed on the bottom surface of each dispensing boss 80. In this embodiment, by further providing the dispensing groove 801 on the bottom surface of the dispensing boss 80, the contact area between the dispensing boss 80 and the UV glue 82 is increased, and the stability of the glue bonding is improved.

[0034] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Under the inspiration of the present invention, those of ordinary skill in the art can also make many forms without departing from the purpose of the present invention and the scope protected by the claims. All of these fall within the protection scope of the present invention.

Claims

1. A vehicle-mounted camera, comprising a housing, an optical circuit board assembled in the housing, and a photosensitive chip assembled on the optical circuit board, characterized in that: The optical circuit board includes a heat dissipation substrate made of a thermally conductive material and a circuit board arranged on one side of the heat dissipation substrate and electrically connected to the photosensitive chip. A hollow hole is provided in the middle of the circuit board. The photosensitive chip is a COB packaged chip and is accommodated in the hollow hole and mounted on the heat dissipation substrate through the COB process.

2. The vehicle-mounted camera according to claim 1, characterized in that: The circuit board is a flexible FPC board attached to one side of the heat dissipation substrate by means of adhesive.

3. The vehicle-mounted camera according to claim 2, characterized in that: The vehicle-mounted camera also includes a power circuit board assembled in the shell and located on two opposite sides of the heat dissipation substrate with the flexible FPC board. The optical circuit board also includes a flexible FPC cable with one end connected to the flexible FPC board and the other end connected to a second plug-in connector preset on the power circuit board by means of a first plug-in connector.

4. The vehicle-mounted camera according to claim 3, characterized in that: The second plug-in connector is arranged on a side of the power circuit board facing the heat dissipation substrate, the first plug-in connector is between the second plug-in connector and the heat dissipation substrate, and a buffer material layer for abutting the heat dissipation substrate is also provided on the surface of the first plug-in connector facing away from the second plug-in connector.

5. The vehicle-mounted camera according to claim 3, characterized in that: An image processing chip is also assembled on the side of the power circuit board facing away from the optical circuit board, and a heat-conducting material layer is also provided between the image processing chip and the inner wall of the shell.

6. The vehicle-mounted camera according to claim 3, characterized in that: A through hole is provided on one side wall of the shell, and the vehicle-mounted camera also includes an internal connector assembled on a side of the power circuit board away from the optical circuit board and inserted into the through hole to be electrically connected to an external connector inserted from an outer end opening of the through hole.

7. The vehicle-mounted camera according to claim 3, characterized in that: The inner wall of the housing is provided with a positioning step for abutting and positioning the power circuit board.

8. The vehicle-mounted camera according to claim 1, wherein: A lens facing the photosensitive chip is assembled on one side of the shell, and a plurality of glue-dispensing bosses are evenly arranged on the bottom end face of the lens. The lens is aligned with the photosensitive chip on the optical circuit board through an active focusing process and then fixed to the optical circuit board by the bottom surfaces of the glue-dispensing bosses with the help of UV glue.

9. The vehicle-mounted camera according to claim 8, characterized in that: An opening is formed at the front end of the shell and a positioning pin is provided at the periphery of the opening. An annular disk covering the opening is formed on the outer side wall of the bottom end of the lens. A positioning convex ring and a positioning socket are provided on the bottom end face of the annular disk near the outer periphery. The glue dispensing boss is arranged on the inner side of the positioning convex ring. The lens is inserted into the opening with the positioning convex ring, and the positioning pin is inserted into the positioning socket to relatively position the lens and the shell. The annular disk is connected to the periphery of the opening as a whole through a laser welding process.

10. The vehicle-mounted camera according to claim 8, characterized in that: The bottom surface of the glue dispensing boss is provided with a glue dispensing groove.

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