PCB layout structure of motor control and drive integrated board

Abstract

The utility model relates to a PCB layout structure of a motor control and drive integrated board. The PCB layout structure comprises a top layer board, a power supply layer board, a low-voltage power supply ground layer board and a bottom layer board. The top layer plate comprises a first connector jack, a rotary transformer position decoding chip, a crystal oscillator, an operational amplifier chip, a Hall signal voltage division circuit, a DSP digital operation chip, a JATG interface, an EEPROM chip, a voltage acquisition circuit, a bus current acquisition circuit, a plurality of phase current acquisition circuits, a second connector jack and a bus current wire-wound resistor. And a plurality of first circuit board fixing mounting holes and a plurality of gate driving circuits. According to the PCB layout structure of the motor control and drive integrated board, a control circuit and a drive circuit of a motor driver can be designed on one circuit board, the size of the circuit board can be reduced, and motors in various modes can be driven and controlled.

Description

Technical Field

[0001] The embodiments of the present utility model relate to the technical field of circuits, and more particularly to a PCB board layout structure of a motor control and drive integrated board. Background Art

[0002] At present, the drive circuit and control circuit of the motor of downhole logging instruments are mostly designed separately. Two circuit boards are required to control the motor, and the utilization rate of the components on these two circuit boards is not high, resulting in the motor drive and control circuits occupying a relatively large space of the logging instrument. Summary of the Utility Model

[0003] In view of the above problems, the present utility model is proposed to provide a PCB board layout structure of a motor control and drive integrated board that overcomes the above problems or at least partially solves the above problems.

[0004] According to one aspect of the present utility model, there is provided a PCB board layout structure of a motor control and drive integrated board, including: a top layer board, a power layer board, a low-voltage power ground layer board, and a bottom layer board;

[0005] The top layer board includes: a first connector socket, a resolver position decoding chip, a crystal oscillator, an operational amplifier chip, a Hall signal voltage dividing circuit, a DSP (Digital Signal Processing) digital arithmetic chip, a JATG (Joint Test Action Group) interface, an EEPROM (Electrically Erasable Programmable Read Only Memory) chip, a voltage acquisition circuit, a bus current acquisition circuit, a plurality of phase current acquisition circuits, a second connector socket, a bus current wire-wound resistor, a plurality of first circuit board fixed mounting holes, and a plurality of gate drive circuits;

[0006] The first connector socket and the second connector socket are respectively arranged at positions near the left edge and the right edge on the top layer board; the resolver position decoding chip is arranged on the right side of the first connector socket; the operational amplifier chip is arranged below the resolver position decoding chip; the crystal oscillator and the Hall signal voltage dividing circuit are arranged on the common right side of the operational amplifier chip and the resolver position decoding chip, and the crystal oscillator is arranged above the Hall signal voltage dividing circuit; the DSP digital operation chip and the JATG interface are arranged on the common right side of the crystal oscillator and the Hall signal voltage dividing circuit, and the JATG interface is arranged above the DSP digital operation chip; the EEPROM chip is arranged on the right side of the DSP digital operation chip; the voltage acquisition circuit, the bus current acquisition circuit, the multiple phase current acquisition circuits and the bus current wire-wound resistor are sequentially arranged above the right side of the EEPROM chip; the multiple gate drive circuits are arranged in a row below the common part of the voltage acquisition circuit, the bus current acquisition circuit, the multiple phase current acquisition circuits and the bus current wire-wound resistor; the multiple first circuit board fixing holes are arranged at multiple positions near the edge on the top layer board.

[0007] In an alternative embodiment, the bottom layer board includes:

[0008] A third connector socket, a fourth connector socket, a first voltage conversion circuit, a second voltage conversion circuit, a third voltage conversion circuit, multiple DSP voltage energy storage and voltage stabilizing capacitors, multiple high-voltage power supply energy storage and filtering capacitors, multiple MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors), a phase current acquisition and filtering circuit, and multiple second circuit board fixing holes;

[0009] The third connector socket and the fourth connector socket are respectively arranged at positions near the edge on the right side and the left side near the edge on the bottom board; the first voltage conversion circuit and the second voltage conversion circuit are arranged on the left side of the third connector socket, and the first voltage conversion circuit is arranged above the second voltage conversion circuit; the third voltage conversion circuit is arranged above the common left side of the first voltage conversion circuit and the second voltage conversion circuit; the multiple DSP voltage energy storage and voltage stabilizing capacitors are arranged in the capacitor module area, and the capacitor module area is arranged below the left side of the third voltage conversion circuit; the multiple high-voltage power supply energy storage and filtering capacitors are arranged in columns on the left side of the capacitor module area; in the area on the left side of the multiple high-voltage power supply energy storage and filtering capacitors and on the right side of the fourth connector socket, there are two rows of MOSFETs and a phase current acquisition and filtering circuit up and down, and the phase current acquisition and filtering circuit is arranged between the two leftmost MOSFETs in the upper row; multiple second circuit board fixing holes are respectively arranged at the four corners of the bottom board.

[0010] In an alternative manner, a first circuit board fixing hole is respectively arranged at each of the four corners of the top board.

[0011] In an alternative manner, a first circuit board fixing hole is arranged at a position near the edge of the top board between the bus current acquisition circuit and the voltage acquisition circuit; a first circuit board fixing hole is arranged at a position near the edge of the top board between the bus current acquisition circuit and the nearest phase current acquisition circuit; a first circuit board fixing hole is arranged at a position near the edge of the top board between the bus current wire-wound resistor and the nearest phase current acquisition circuit.

[0012] In an alternative manner, a first circuit board fixing hole is arranged at a position near the edge of the top board on the right side of each gate drive circuit.

[0013] In an alternative manner, the number of the gate drive circuits is three.

[0014] In an alternative manner, the number of MOSFETs in each row is three.

[0015] In an alternative manner, the MOSFETs in each row are arranged in a staggered manner.

[0016] In an alternative manner, the first voltage conversion circuit is used to convert 24 volts of voltage into 5 volts of voltage, the second voltage conversion circuit is used to convert 24 volts of voltage into 12 volts of voltage, and the third voltage conversion circuit is used to convert 5 volts of voltage into 3.3 volts of voltage.

[0017] In an alternative embodiment, heat dissipation holes are further provided on the bottom layer board, above the capacitor module area and opposite to the position of the DSP digital arithmetic chip.

[0018] As can be seen from the above technical solutions, the PCB board layout structure of the integrated motor control and drive board provided by the present utility model has the following beneficial effects: the motor driver control circuit and the drive circuit can be designed on one circuit board, which can reduce the size of the circuit board; it can drive and control motors in multiple modes and can be used to drive and control motors in three modes of resolver, Hall sensor, and sensorless; it can also support two motor control algorithms of trapezoidal wave control and field-oriented control.

[0019] The above description is only an overview of the technical solutions of the embodiments of the present utility model. In order to understand the technical means of the embodiments of the present utility model more clearly, it can be implemented according to the content of the description. And in order to make the above and other purposes, features, and advantages of the embodiments of the present utility model more obvious and understandable, the following specifically describes the specific implementation manners of the embodiments of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] By reading the detailed description of the preferred embodiments below, various other advantages and benefits will become clear to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of the embodiments of the present utility model. Moreover, throughout the drawings, the same reference numerals are used to represent the same components. In the drawings:

[0021] Figure 1 shows a schematic structural diagram of the top layer board in the PCB board layout structure of the integrated motor control and drive board according to an embodiment of the present utility model;

[0022] Figure 2 shows a schematic structural diagram of the bottom layer board in the PCB board layout structure of the integrated motor control and drive board according to an embodiment of the present utility model.

[0023] The reference numerals in the figure are: first connector socket 1, resolver position decoding chip 2, crystal oscillator 3, operational amplifier chip 4, Hall signal voltage dividing circuit 5, voltage dividing resistor 51, DSP digital operation chip 6, JATG interface 7, EEPROM chip 8, voltage acquisition circuit 9, bus current acquisition circuit 10, phase current acquisition circuit 11, second connector socket 12, bus current wire-wound resistor 13, first circuit board fixing and mounting holes 14, gate drive circuit 15, third connector socket 16, fourth connector socket 17, first voltage conversion circuit 18, second voltage conversion circuit 19, third voltage conversion circuit 20, DSP voltage energy storage and voltage stabilizing capacitor 21, capacitor module area 211, high-voltage power supply energy storage and filtering capacitor 22, MOSFET 23, phase current acquisition and filtering circuit 24, second circuit board fixing and mounting holes 25. Detailed implementation manners

[0024] In order to better understand the purpose, structure and function of the present invention, the PCB board layout structure of a motor control and drive integrated board of the present invention will be further described in detail below with reference to the accompanying drawings.

[0025] The PCB board layout structure of a motor control and drive integrated board supporting multiple motor control modes according to an embodiment of the present invention adopts a four-layer board design, specifically including a top layer board, a power supply layer board, a low-voltage power supply ground layer board and a bottom layer board. The top layer board, the power supply layer board, the low-voltage power supply ground layer board and the bottom layer board are stacked and connected through the fixing and mounting holes in each layer board.

[0026] In a specific embodiment, the power supply layer board is specifically a 5V power supply layer board.

[0027] Figure 1 The structural schematic diagram of the top layer board in the PCB board layout structure of a motor control and drive integrated board according to an embodiment of the present invention is shown, as Figure 1 shown, the top layer board includes:

[0028] First connector socket 1, resolver position decoding chip 2, crystal oscillator 3, operational amplifier chip 4, Hall signal voltage dividing circuit 5, DSP digital operation chip 6, JATG interface 7, EEPROM chip 8, voltage acquisition circuit 9, bus current acquisition circuit 10, multiple phase current acquisition circuits 11, second connector socket 12, bus current wire-wound resistor 13, multiple first circuit board fixing and mounting holes 14 and multiple gate drive circuits 15.

[0029] The first connector socket 1 and the second connector socket 12 are respectively arranged at positions near the left edge and the right edge on the top layer board; the resolver position decoding chip 2 is arranged on the right side of the first connector socket 1; the operational amplifier chip 4 is arranged below the resolver position decoding chip 2; the crystal oscillator 3 and the Hall signal voltage dividing circuit 5 are arranged on the common right side of the operational amplifier chip 4 and the resolver position decoding chip 2, and the crystal oscillator 3 is arranged above the Hall signal voltage dividing circuit 5; the DSP digital operation chip 6 and the JATG interface 7 are arranged on the common right side of the crystal oscillator 3 and the Hall signal voltage dividing circuit 5, and the JATG interface 7 is arranged above the DSP digital operation chip 6; the EEPROM chip 8 is arranged on the right side of the DSP digital operation chip 6; the voltage acquisition circuit 9, the bus current acquisition circuit 10, the multiple phase current acquisition circuits 11 and the bus current wire-wound resistor 13 are successively arranged above the right side of the EEPROM chip 8; the multiple gate drive circuits 15 are arranged in rows below the common part of the voltage acquisition circuit 9, the bus current acquisition circuit 10, the multiple phase current acquisition circuits 11 and the bus current wire-wound resistor 13; the multiple first circuit board fixing holes 14 are arranged at multiple positions near the edge on the top layer board.

[0030] The Hall signal voltage dividing circuit 5 is provided with voltage dividing resistors 51 arranged in multiple rows and multiple columns, such as three rows and two columns.

[0031] Among them, the resolver position decoding chip 2 is used to decode the resolver position and speed information and send the parsing result to the DSP digital operation chip 6; the Hall signal voltage dividing circuit 5 is used to decode the Hall sensor position information and send it to the DSP. The DSP digital operation chip 6 outputs position, communication and controls three-phase PWM waveforms through its internal firmware code by collecting the position information and speed information of the motor, so as to control the rotation speed and position of the motor; the gate drive circuit 15 includes a PWM output module and a gate drive function circuit, which is mainly used to control the switching of the MOSFET; the phase current acquisition circuit 11 is used to collect two-phase current for driving the firmware code of the field-oriented control algorithm.

[0032] Specifically, the voltage acquisition circuit 9 is arranged above the right side of the EEPROM chip 8, the bus current acquisition circuit 10 is arranged on the right side of the voltage acquisition circuit 9, the multiple phase current acquisition circuits 11 are arranged in rows on the right side of the bus current acquisition circuit 10, the bus current wire-wound resistor 13 is arranged on the right side of the multiple phase current acquisition circuits 11, and the right boundary of the bus current wire-wound resistor 13 does not exceed the right boundary of the second connector socket 12.

[0033] In a specific embodiment, a first circuit board fixing and mounting hole 14 is respectively arranged at four corners of the top layer board.

[0034] In a specific embodiment, a first circuit board fixing and mounting hole 14 is arranged at a position close to the edge of the top layer board between the bus bar current acquisition circuit 10 and the voltage acquisition circuit 9; a first circuit board fixing and mounting hole 14 is arranged at a position close to the edge of the top layer board between the bus bar current acquisition circuit 10 and the phase current acquisition circuit 11 closest to it; a first circuit board fixing and mounting hole 14 is arranged at a position close to the edge of the top layer board between the bus bar current wire wound resistor 13 and the phase current acquisition circuit 11 closest to it.

[0035] In a specific embodiment, a first circuit board fixing and mounting hole 14 is arranged at a position close to the edge of the top layer board on the right side of each gate drive circuit 15.

[0036] In a specific embodiment, the number of gate drive circuits 15 is three.

[0037] Figure 2 The structural schematic diagram of the bottom layer board in the PCB board layout structure of the motor control and drive integrated board according to an embodiment of the present invention is shown, as Figure 2 shown, the bottom layer board specifically includes:

[0038] The third connector socket 16, the fourth connector socket 17, the first voltage conversion circuit 18, the second voltage conversion circuit 19, the third voltage conversion circuit 20, multiple DSP voltage energy storage and voltage stabilizing capacitors 21, multiple high-voltage power supply energy storage and filtering capacitors 22, multiple MOSFETs 23, the phase current acquisition and filtering circuit 24, and multiple second circuit board fixing and mounting holes 25.

[0039] The third connector socket 16 and the fourth connector socket 17 are respectively arranged at positions near the edge on the right side and the left side near the edge on the bottom board; the first voltage conversion circuit 18 and the second voltage conversion circuit 19 are arranged on the left side of the third connector socket 16, and the first voltage conversion circuit 18 is arranged above the second voltage conversion circuit 19; the third voltage conversion circuit 20 is arranged above the common left side of the first voltage conversion circuit 18 and the second voltage conversion circuit 19; the multiple DSP voltage energy storage and voltage stabilizing capacitors 21 are arranged in the capacitor module area 211, and the capacitor module area 211 is arranged below the left side of the third voltage conversion circuit 20; the multiple high-voltage power energy storage and filtering capacitors 22 are arranged in columns on the left side of the capacitor module area 211; in the area on the left side of the multiple high-voltage power energy storage and filtering capacitors 22 and on the right side of the fourth connector socket 17, there are two rows of MOSFETs 23 and a phase current acquisition and filtering circuit 24 up and down, and the phase current acquisition and filtering circuit 24 is arranged between the two leftmost MOSFETs 23 in the upper row; multiple second circuit board fixing holes 25 are respectively arranged at the four corners of the bottom board.

[0040] Among them, the multiple DSP voltage energy storage and voltage stabilizing capacitors 21 are arranged in rows in the capacitor module area 211.

[0041] In a specific embodiment, the number of MOSFETs 23 in each row is three.

[0042] In a specific embodiment, the MOSFETs 23 in each row are arranged in a staggered manner.

[0043] In a specific embodiment, the first voltage conversion circuit 18 is used to convert 24 volts of voltage into 5 volts of voltage, the second voltage conversion circuit 19 is used to convert 24 volts of voltage into 12 volts of voltage, and the third voltage conversion circuit 20 is used to convert 5 volts of voltage into 3.3 volts of voltage.

[0044] In a specific embodiment, heat dissipation holes are also arranged on the bottom board, which are arranged above the capacitor module area 211 and are opposite to the position of the DSP digital operation chip 6, and can dissipate heat from the DSP digital operation chip 6.

[0045] In a specific embodiment, each component uses high-temperature components, so that the circuit board can be used in a high-temperature environment.

[0046] According to the PCB board layout structure of the integrated motor control and drive board provided by this embodiment, the motor driver control circuit and the drive circuit can be designed on one circuit board, which can reduce the size of the circuit board. The size of the circuit board can be controlled within 230 mm in length and 47 mm in width, and the size of the circuit board is relatively small. It can drive and control motors in multiple modes and can be used to drive and control motors in three modes: resolver, Hall sensor, and sensorless. It can also support two motor control algorithms: trapezoidal wave control and field-oriented control.

[0047] It should be noted that unless otherwise specified, the technical terms or scientific terms used in this application should have the ordinary meanings understood by those skilled in the art to which this utility model belongs.

[0048] In this application, unless otherwise clearly defined and limited, terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0049] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present utility model, rather than to limit them; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present utility model, and they should all be covered by the scope of the claims and the description of the present utility model. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The present utility model is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. A PCB layout structure of a motor control and drive integrated board, characterized in that: include: Top layer board, power layer board, low voltage power ground layer board and bottom layer board; The top board includes: a first connector socket, a rotary transformer position decoding chip, a crystal oscillator, an operational amplifier chip, a Hall signal voltage divider circuit, a DSP digital operation chip, a JATG interface, an EEPROM chip, a voltage acquisition circuit, a bus current acquisition circuit, multiple phase current acquisition circuits, a second connector socket, a bus current wire-wound resistor, multiple first circuit board fixing holes and multiple gate drive circuits; The first connector socket and the second connector socket are respectively arranged at a position near the edge on the left side and the edge on the right side of the top board; the resolver position decoding chip is arranged on the right side of the first connector socket; the operational amplifier chip is arranged below the resolver position decoding chip; the crystal oscillator and the Hall signal voltage divider circuit are arranged on the common right side of the operational amplifier chip and the resolver position decoding chip, and the crystal oscillator is arranged above the Hall signal voltage divider circuit; the DSP digital operation chip and the JATG interface are arranged on the common right side of the crystal oscillator and the Hall signal voltage divider circuit, and the JATG interface is arranged above the DSP digital operation chip; the EEPROM chip is arranged on the right side of the DSP digital operation chip; the voltage acquisition circuit, the bus current acquisition circuit, the multiple phase current acquisition circuits and the bus current wire-wound resistor are arranged in sequence above the right side of the EEPROM chip; the multiple gate drive circuits are arranged in a row below the voltage acquisition circuit, the bus current acquisition circuit, the multiple phase current acquisition circuits and the bus current wire-wound resistor; the multiple first circuit board fixing and mounting holes are arranged at multiple positions near the edge of the top board.

2. The PCB layout structure of the motor control and drive integrated board according to claim 1, characterized in that: The bottom plate comprises: A third connector socket, a fourth connector socket, a first voltage conversion circuit, a second voltage conversion circuit, a third voltage conversion circuit, a plurality of DSP voltage energy storage stabilizing capacitors, a plurality of high-voltage power supply energy storage filter capacitors, a plurality of MOSFETs, a phase current acquisition filter circuit, and a plurality of second circuit board fixing mounting holes; The third connector socket and the fourth connector socket are respectively arranged at a position near the edge on the right side and the edge on the left side of the bottom board; the first voltage conversion circuit and the second voltage conversion circuit are arranged on the left side of the third connector socket, and the first voltage conversion circuit is arranged above the second voltage conversion circuit; the third voltage conversion circuit is arranged above the common left side of the first voltage conversion circuit and the second voltage conversion circuit; the multiple DSP voltage energy storage and stabilizing capacitors are arranged in a capacitor module area, and the capacitor module area is arranged below the left side of the third voltage conversion circuit; the multiple high-voltage power supply energy storage filter capacitors are arranged in a row on the left side of the capacitor module area; two upper and lower rows of MOSFETs and a phase current acquisition filter circuit are arranged in the area located on the left side of the multiple high-voltage power supply energy storage filter capacitors and on the right side of the fourth connector socket, and the phase current acquisition filter circuit is arranged between the two MOSFETs on the left side of the upper row; multiple second circuit board fixing holes are respectively arranged on the four corners of the bottom board.

3. The PCB layout structure of the motor control and drive integrated board according to claim 1 or 2, characterized in that: A first circuit board fixing installation hole is respectively arranged on the four corners of the top plate.

4. The PCB layout structure of the motor control and drive integrated board according to claim 1 or 2, characterized in that: A first circuit board fixing installation hole is arranged between the bus current collection circuit and the voltage collection circuit, near the edge of the top board; a first circuit board fixing installation hole is arranged between the bus current collection circuit and the phase current collection circuit closest to it, near the edge of the top board; a first circuit board fixing installation hole is arranged between the bus current wirewound resistor and the phase current collection circuit closest to it, near the edge of the top board.

5. The PCB layout structure of the motor control and drive integrated board according to claim 1 or 2, characterized in that: A first circuit board fixing and mounting hole is arranged on the right side of each gate drive circuit near the edge of the top board.

6. The PCB layout structure of the motor control and drive integrated board according to claim 1 or 2, characterized in that: The number of the gate driving circuits is three.

7. The PCB layout structure of the motor control and drive integrated board according to claim 2, characterized in that: The number of MOSFETs 23 in each row is three.

8. The PCB layout structure of the motor control and drive integrated board according to claim 2, characterized in that: The MOSFETs 23 in each row are arranged in a staggered manner.

9. The PCB layout structure of the motor control and drive integrated board according to claim 2, characterized in that: The first voltage conversion circuit is used to convert a 24 volt voltage into a 5 volt voltage, the second voltage conversion circuit is used to convert a 24 volt voltage into a 12 volt voltage, and the third voltage conversion circuit is used to convert a 5 volt voltage into a 3.3 volt voltage.

10. The PCB layout structure of the motor control and drive integrated board according to claim 2, characterized in that: The bottom plate is also provided with heat dissipation holes, which are arranged above the capacitor module area and opposite to the position of the DSP digital operation chip.

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