PCB layout structure for controlling servo motor
By designing the layout structure of the signal layer, power supply layer and horizon layer on the PCB board that controls the servo motor, the shortcomings of the PCB board in the prior art in withstand high current and anti-interference are solved, and a compact design and good heat dissipation effect are achieved, reducing the overall space and manufacturing cost of the servo motor.
Patent Information
- Application Number
- CN202520838545.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-29
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2035-04-29
AI Technical Summary
The existing PCB boards that control servo motors have shortcomings in bearing high current and anti-interference, and have poor heat dissipation effects, resulting in larger overall space of servo motors and increased manufacturing costs.
A PCB layout structure for controlling a servo motor is designed, including a signal layer, a power supply layer and a horizon layer. The power supply layer and a signal layer are arranged on the same side of the PCB board, the horizon layer is arranged on the other side, and the horizon layer acts as a shielding layer to regulate the current direction according to the direction of the interference source. The signal layer is modularly arranged, and the power supply layer and the signal layer are gap isolated.
The PCB board has achieved improvements in withstanding high currents and anti-interference. At the same time, due to the compact design, the overall space and manufacturing cost of the servo motor are reduced, and the heat dissipation effect is improved by optimizing the heat dissipation structure.
Smart Images

Figure CN222981737U_ABST
Abstract
Description
Technical Field
[0001] A PCB layout structure for controlling a servo motor, which relates to the field of circuit boards, especially the field of servo motor control boards. Background Art
[0002] Since the operation of a servo motor requires a large operating current, the coils, permanent magnets of the motor, and the magnets that cooperate with the magnetic encoder will all generate magnetic fields. Therefore, the PCB board for controlling the servo motor needs to be able to withstand large currents, have strong anti-interference ability, and have good heat dissipation.
[0003] The existing PCB boards for controlling servo motors usually divide the control board into a power supply board and a signal board, and add a magnetic shielding shell, a radiator, and a cooling fan to solve the above problems. However, the use of these technical means will increase the overall space of the servo motor, which is disadvantageous for equipment such as robots that require small-sized servo motors. Moreover, the use of the above technical means will also increase the manufacturing cost of the servo motor. Utility Model Content
[0004] To solve the problem that the PCB board for controlling the servo motor needs to be able to withstand large currents, have anti-interference ability, and have good heat dissipation, the present utility model proposes a new solution.
[0005] A PCB layout structure for controlling a servo motor includes a signal layer, a power supply layer, and a ground plane layer. The main components and circuits of the power supply layer and the signal layer are arranged on the side of the PCB board facing away from the motor coil and the motor permanent magnet, and the main body of the ground plane layer is arranged on the side of the PCB board facing the motor coil; there are two input ports of the power supply layer and two output ports of the ground plane layer, and they are respectively arranged at both ends of the PCB board, and each end is provided with an input port and an output port.
[0006] Further, the ground plane layer is used as a shielding layer layout, and the ground plane layer regulates the current direction according to the direction of the interference source.
[0007] In another solution, the signal layer is modularly arranged, which includes a power module, and other modules of the signal layer are arranged around the power module.
[0008] In another solution, the signal layer includes a power module, a communication module, a main control module, a drive module, a magnetic encoder module, and a detection module. The communication module, the main control module, and the drive module are arranged around the power module, and the magnetic encoder chip of the magnetic encoder module is arranged on the back of the drive chip.
[0009] Further, the communication module, the drive module, the detection module, and the magnetic encoder module are arranged around the main control module.
[0010] Further, the communication module is arranged around the power module along the edge of the board frame, and the communication serial port is arranged on the edge of the board frame close to the communication module.
[0011] In another solution, the power supply layer and the signal layer are separated by a gap and arranged on both sides of the same side of the PCB board.
[0012] Furthermore, the driving module and the main control module in the signal layer are arranged in sequence from the middle of the PCB board to the edge of the board frame in a direction perpendicular to the power supply layer.
[0013] Furthermore, the power module is arranged in parallel with the driving module and the main control module. The power module is arranged as a two-stage circuit, and the power consumption modules of each stage of the power circuit are arranged around the power circuit of this stage.
[0014] In another scheme, a through slot for installing electrolytic capacitors for power supply filtering is opened at each input port side of the power supply layer of the PCB board; the power supply layer includes an inverter circuit and a main power supply circuit, the inverter circuit is arranged between the through slots for installing electrolytic capacitors along the edge of the board frame, and the main power supply circuit is arranged between the inverter circuit and the signal layer.
[0015] Beneficial effect: The power supply layer and the signal layer are arranged on the same side of the PCB board, and the ground layer is arranged on the other side of the PCB board. The power supply layer and the signal layer are arranged on the side away from the motor coil, the permanent magnet and the magnet working with the magnetic encoder, and the signal layer and the power supply layer are isolated by a gap; the ground layer is arranged on the side facing the motor coil. The magnetic field generated by the ground layer (the current of the signal layer and the power supply layer passing through the ground layer and the eddy current formed by the ground layer by each magnet will generate a corresponding magnetic field) will interact with the magnetic field formed by the motor coil, the permanent magnet and the magnet working with the magnetic encoder, thereby offsetting their interference to the signal layer; the gap isolation between the signal layer and the power supply layer will also prevent the signal layer from being interfered with. There are two input ports of the power supply layer and two output ports of the ground layer, which are arranged at both ends of the PCB board, and each end is provided with an input port and an output port. This not only enables the PCB board to withstand large currents, but also can flexibly adjust the current direction of the ground layer according to the directional properties of the interference source, so that the magnetic field generated by the ground layer offsets the interference of the interference source on the signal layer.
[0016] A through slot is provided at each input port of the power supply layer of the PCB board for installing an electrolytic capacitor for power filtering. The through slot arrangement ensures that the larger electrolytic capacitor will not occupy too much space on the PCB board when installed; and the electrolytic capacitor is installed at the input port of the main power supply line, which makes the power filtering effect better.
[0017] The inverter circuit is arranged along the edge of the board frame between the through slots for installing electrolytic capacitors. After the filter capacitors are installed in the through slots, there is still a gap for air flow, which not only saves the space occupied by the PCB board, but also facilitates the heat dissipation of the PCB board and facilitates the PCB board to carry large currents.
[0018] The signal layer is modularly arranged, which includes a power module, a communication module, a main control module, a drive module, a magnetic encoder module, and a detection module. The communication module, the main control module, and the drive module are arranged around the power module. The magnetic encoder chip of the magnetic encoder module is disposed on the back of the drive chip. The communication module, the drive module, and the detection module are arranged around the main control module. The power supply layer and the signal layer are isolated by a gap and are respectively arranged on both sides of the same side of the PCB board. The drive module and the main control module are arranged in the direction perpendicular to the power supply layer, successively from the middle of the PCB board to the edge of the board frame. The power module is arranged in parallel with the drive module and the main control module. The power module is set as a two-stage circuit, and the power-consuming modules of this stage of the power circuit are arranged around each stage of the power circuit, so as to make the power supply line approximately a straight line. Such an arrangement makes the PCB board structure compact and occupies less space; and can minimize the length of the power supply line, reduce current consumption and heat generation; at the same time, avoid the influence of the magnetic field generated by the power supply line on each signal. Description of the Drawings
[0019] Figure 1 It is the top-layer circuit layout diagram of a PCB layout structure for controlling a servo motor.
[0020] Figure 2 It is the bottom-layer circuit layout diagram of a PCB layout structure for controlling a servo motor.
[0021] Figure 3 It is the top-layer component layout diagram of a PCB layout structure for controlling a servo motor.
[0022] Figure 4 It is the schematic diagram of the main control circuit of a PCB layout structure for controlling a servo motor.
[0023] Figure 5 It is the schematic diagram of the drive circuit of a PCB layout structure for controlling a servo motor.
[0024] Figure 6 It is the schematic diagram of the current detection circuit of a PCB layout structure for controlling a servo motor.
[0025] Figure 7 It is the schematic diagram of the magnetic encoder circuit of a PCB layout structure for controlling a servo motor.
[0026] Figure 8 It is the schematic diagram of the RS485 communication circuit of a PCB layout structure for controlling a servo motor.
[0027] Figure 9 It is the schematic diagram of the CAN communication circuit of a PCB layout structure for controlling a servo motor.
[0028] Figure 10 It is the schematic diagram of the temperature detection circuit of a PCB layout structure for controlling a servo motor.
[0029] Figure 11 It is a schematic diagram of a power supply circuit for a PCB layout structure that controls a servo motor.
[0030] In the figure, 1 is the ground plane layer, 2 is the power supply layer, 2-1 is the inverter circuit, 2-2 is the main power supply circuit, 3 is the signal layer, 3-1 is the power module, 3-2 is the communication module, 3-3 is the main control module, 3-4 is the drive module, 3-5 is the magnetic encoder module, and 3-6 is the detection module. Detailed implementation manner
[0031] In order to enable those skilled in the art to better understand the technical solution of the present invention, we will select a preferred implementation manner to describe the technical solution of the present invention in detail below.
[0032] As Figures 1 to 11 shown, a PCB layout structure for controlling a servo motor includes a signal layer 3, a power supply layer 2, and a ground plane layer 1. The main components and circuits of the power supply layer 2 and the signal layer 3 are arranged on the side of the PCB board away from the motor coil and the motor permanent magnet. The main body of the ground plane layer 1 is arranged on the side of the PCB board facing the motor coil. Both the input port of the power supply layer 2 and the output port of the ground plane layer 1 are provided with two, and are respectively arranged at both ends of the PCB board, and each end is provided with an input port and an output port.
[0033] The ground plane layer 1 is both the zero potential layer of the power supply layer 2 and the signal layer 3, and is also used as the shielding layer of the PCB board. Since the ground plane layer 1 occupies most of the area of the bottom layer of the PCB board, eddy currents will be generated in the ground plane layer 1 under the influence of various interference sources, and then a magnetic field that cancels the interference source will be formed. Because the ground plane layer 1 has two parallel output ports, the current direction of the ground plane layer 1 can also be flexibly adjusted according to the nature of the interference source.
[0034] The signal layer 3 is modularly arranged, and it includes a power module 3-1, a communication module 3-2, a main control module 3-3, a drive module 3-4, a magnetic encoder module 3-5, and a detection module 3-6. The communication module 3-2, the main control module 3-3, and the drive module 3-4 are arranged around the power module 3-1. The magnetic encoder chip of the magnetic encoder module 3-5 is arranged on the back of the drive chip. The communication module 3-2, the drive module 3-4, and the detection module 3-6 are arranged around the main control module 3-3.
[0035] The power supply layer 2 and the signal layer 3 are isolated by a gap and are respectively arranged on both sides of the same side of the PCB board. The drive module 3-4 and the main control module 3-3 are arranged in the direction perpendicular to the power supply layer 2, from the middle of the PCB board to the edge of the board frame in sequence.
[0036] The power supply module 3-1 is arranged in parallel with the drive module 3-4 and the main control module 3-3. The power supply module 3-1 is set as a two-stage circuit, and the power-consuming modules of this stage of the power circuit are arranged around each stage of the power circuit to make the power supply line approximately a straight line. As Figure 3 shown, the first-stage power circuit is close to the main power supply line, and its power-consuming module, the drive module 3-4, is arranged beside it. The second-stage power circuit is arranged on the side of the first-stage power circuit, and its power-consuming modules, the main control module 3-3, the communication module 3-2, the magnetic encoder module 3-5, etc., are arranged beside it. The inverter circuit using the main power supply voltage and the communication serial port are arranged on both sides of the main power supply line. Such an arrangement makes the PCB structure compact and occupies less space; and can minimize the length of the power supply line, reduce current consumption and heat generation; at the same time, avoid the influence of the magnetic field generated by the power supply line on each signal.
[0037] As Figures 1 to 4 shown, through slots for installing electrolytic capacitors for power filtering are respectively opened at each input port on the side of the power supply layer 2 of the PCB. The power supply layer 2 includes an inverter circuit and a main power supply circuit. The inverter circuit is arranged along the edge of the board frame between the through slots for installing electrolytic capacitors, and the main power supply circuit is arranged between the inverter circuit and the signal layer 3. There is still a gap for air flow after the filtering capacitors are installed in the through slots, which not only saves the space occupied by the PCB, but also facilitates the heat dissipation of the PCB and is convenient for the PCB to carry large currents.
[0038] The above specific embodiments are only the preferred embodiments of the technical solution of this patent. There are many specific embodiments of the technical solution of this patent, which are not listed one by one here. All other specific embodiment solutions or alternative solutions obtained by those skilled in the art without creative labor after understanding the technical solution of this patent are within the protection scope of this patent obtained according to the Patent Law.
Claims
1. A PCB layout structure for controlling a servo motor, comprising a signal layer, a power supply layer and a ground layer, characterized in that: The main components and lines of the power supply layer and the signal layer are arranged on the side of the PCB board away from the motor coil and the motor permanent magnet, and the main body of the ground layer is arranged on the side of the PCB board facing the motor coil; there are two input ports of the power supply layer and two output ports of the ground layer, which are arranged at both ends of the PCB board, and each end is provided with an input port and an output port.
2. The PCB layout structure for controlling a servo motor according to claim 1, characterized in that: The ground plane is used as a shielding layer layout, and the ground plane regulates the current direction according to the direction of the interference source.
3. The PCB layout structure for controlling a servo motor according to claim 1, characterized in that: The signal layer is modularly arranged, including a power module, and other modules of the signal layer are arranged around the power module.
4. The PCB layout structure for controlling a servo motor according to claim 1, characterized in that: The signal layer includes a power module, a communication module, a main control module, a drive module, a magnetic encoding module and a detection module. The communication module, the main control module and the drive module are arranged around the power module, and the magnetic encoding chip of the magnetic encoding module is arranged on the back of the drive chip.
5. The PCB layout structure for controlling a servo motor according to claim 4, characterized in that: The communication module, the driving module, the detection module and the magnetic encoding module are arranged around the main control module.
6. A PCB layout structure for controlling a servo motor according to claim 4 or 5, characterized in that: The communication module is arranged around the power module along the edge of the board frame, and the communication serial port is arranged at the edge of the board frame close to the communication module.
7. A PCB layout structure for controlling a servo motor according to any one of claims 1 to 5, characterized in that: The power supply layer and the signal layer are isolated by a gap and arranged on both sides of the same side of the PCB board.
8. The PCB layout structure for controlling a servo motor according to claim 7, characterized in that: The driving module and the main control module in the signal layer are arranged in sequence from the middle of the PCB board to the edge of the board frame in a direction perpendicular to the power supply layer.
9. The PCB layout structure for controlling a servo motor according to claim 8, characterized in that: The power module is arranged in parallel with the driving module and the main control module. The power module is arranged as a two-stage circuit. The power consumption modules of each stage of the power circuit are arranged around the power circuit of this stage.
10. A PCB layout structure for controlling a servo motor according to any one of claims 1 to 5, 8 and 9, characterized in that: A through slot for installing electrolytic capacitors for power filtering is provided at each input port on the power supply layer side of the PCB board; the power supply layer includes an inverter circuit and a main power supply circuit, the inverter circuit is arranged between the through slots for installing electrolytic capacitors along the edge of the board frame, and the main power supply circuit is arranged between the inverter circuit and the signal layer.