Multilayer circuit board surface mounting tool

Abstract

The utility model provides a multilayer circuit board surface mounting tool comprising a tool assembly, and the tool assembly comprises a workbench, a vacuum adsorption clamp, a chute, a motor, a screw rod, a sliding seat, an electric telescopic rod, a supporting plate, a connecting plate, a connecting pipe, a vacuum pipe and a vacuum sucker. The top of the workbench is fixedly connected with a vacuum adsorption clamp, two sliding grooves are symmetrically formed in the upper surface of the workbench, two motors are symmetrically installed on one side of the workbench, and output shafts of the motors are fixedly connected with one ends of lead screws. According to the utility model, a multilayer circuit board is adsorbed through the vacuum chuck, the motor drives the screw rod to rotate, the sliding seat moves, the circuit board is moved to the vacuum adsorption clamp, and the circuit board is adsorbed and fixed through the vacuum adsorption clamp, so that the installation of the multilayer circuit board can be automatically completed, the operation is simple and convenient, and the time is saved; the chip mounting efficiency of the multi-layer circuit board is improved, and automation of the chip mounting tool of the multi-layer circuit board is facilitated.

Description

Technical Field

[0001] The utility model relates to a patch tooling, in particular to a patch tooling for multi-layer circuit boards, belonging to the technical field of multi-layer circuit board production. Background Technique

[0002] A multi-layer circuit board, also known as a multi-layer printed circuit board or multi-layer PCB, is a circuit board with multiple conductive layers fabricated on a single-layer substrate according to certain design requirements. By stacking multiple functional layers together, this circuit board enables high-speed transmission and efficient processing of circuit signals. Multi-layer circuit board patching is a process of precisely positioning and soldering electronic components onto a multi-layer PCB board. Compared with single-layer or double-layer boards, multi-layer PCB boards have higher wiring density and more complex functions, so they are widely used in high-performance and high-density electronic products. Through patching technology, high-density and multi-functional circuit designs can be achieved, meeting the growing requirements of electronic products for miniaturization, thinness, and multi-functionality.

[0003] In order to improve the efficiency and accuracy of circuit board patching, the multi-layer circuit board patching process is mostly completed by automated equipment. However, during the circuit board production process, workers still need to manually install the circuit board on the tooling, which is a rather cumbersome operation process and reduces the patching efficiency of multi-layer circuit boards. Therefore, a patch tooling for multi-layer circuit boards is proposed. Summary of the Utility Model

[0004] In view of this, the utility model provides a patch tooling for multi-layer circuit boards to solve or alleviate the technical problems existing in the prior art, and at least provide a beneficial option.

[0005] The technical solution of the embodiment of the utility model is realized as follows: A patch tooling for multi-layer circuit boards includes a tooling assembly, and the tooling assembly includes a workbench, a vacuum adsorption fixture, a chute, a motor, a lead screw, a sliding seat, an electric telescopic rod, a support plate, a connecting plate, a connecting pipe, a vacuum pipe, and a vacuum chuck;

[0006] A vacuum adsorption fixture is fixedly connected to the top of the workbench. Two chutes are symmetrically opened on the upper surface of the workbench. Two motors are symmetrically installed on one side of the workbench. The output shaft of the motor is fixedly connected to one end of the lead screw. A slide seat is threadedly connected to the outer side wall of the lead screw. An electric telescopic rod is installed on the top of the slide seat. The top end of the electric telescopic rod is fixedly connected to a support plate. A connecting plate is fixedly connected to one side of the support plate. A connecting pipe is fixedly connected inside the support plate and the connecting plate. Vacuum pipes are evenly communicated with the outer side wall of the connecting pipe. One end of the vacuum pipe is installed with a vacuum chuck. The circuit board is adsorbed by the vacuum chuck. At the same time, the motor works to drive the lead screw automatically, so that the slide seat moves. After the circuit board moves above the vacuum adsorption fixture, the electric telescopic rod works again to place the circuit board on the vacuum adsorption fixture. The multi-layer circuit board is fixed by the vacuum adsorption fixture, and the installation of the multi-layer circuit board can be automatically completed.

[0007] Further preferably: The lead screw is rotatably connected to the inner side wall of the chute, and the slide seat is slidably connected to the inner side wall of the chute.

[0008] Further preferably: One end of the connecting pipe penetrates through one side of the support plate and extends to the outside.

[0009] Further preferably: The tooling assembly further includes a control panel. The control panel is installed on the front surface of the workbench. The other end of the workbench away from the motor is connected with a conveying assembly.

[0010] Further preferably: An air inlet pipe and an air outlet pipe are communicated with one end of the vacuum adsorption fixture.

[0011] Further preferably: The conveying assembly includes a base and a conveyor belt;

[0012] The conveyor belt is installed on the inner side wall of the base.

[0013] Further preferably: The base is fixedly connected to one side of the workbench.

[0014] Further preferably: The vacuum chuck is arranged above the conveyor belt.

[0015] Due to the adoption of the above technical solutions in the embodiments of the present invention, it has the following advantages:

[0016] The present invention adsorbs the multi-layer circuit board through the vacuum chuck, drives the lead screw to rotate by the motor, makes the slide seat move, moves the circuit board to the vacuum adsorption fixture, and adsorbs and fixes the circuit board by the vacuum adsorption fixture, so that the installation of the multi-layer circuit board can be automatically completed. The operation is simple and convenient, saving time, improving the pasting efficiency of the multi-layer circuit board, and being beneficial to realizing the automation of the multi-layer circuit board pasting tooling.

[0017] The above summary is only for the purpose of the specification and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present utility model will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 Structural diagram of the present utility model;

[0020] Figure 2 Top view structural diagram of the present utility model;

[0021] Figure 3 Structural diagram of the support plate of the present utility model.

[0022] Reference numerals: 10, tooling assembly; 11, workbench; 12, control panel; 13, vacuum adsorption fixture; 14, intake pipe; 15, exhaust pipe; 16, chute; 17, motor; 18, lead screw; 19, sliding seat; 110, electric telescopic rod; 111, support plate; 112, connecting plate; 113, connecting pipe; 114, vacuum pipe; 115, vacuum chuck; 20, conveying assembly; 21, base; 22, conveyor belt. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] In the following, only some exemplary embodiments are briefly described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present utility model. Therefore, the drawings and the description are considered to be exemplary in nature rather than restrictive.

[0024] The embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.

[0025] As Figures 1-3 shown, the embodiment of the present utility model provides a multi-layer circuit board chip mounting tooling, including a tooling assembly 10. The tooling assembly 10 includes a workbench 11, a vacuum adsorption fixture 13, a chute 16, a motor 17, a lead screw 18, a sliding seat 19, an electric telescopic rod 110, a support plate 111, a connecting plate 112, a connecting pipe 113, a vacuum pipe 114, and a vacuum chuck 115;

[0026] A vacuum adsorption fixture 13 is fixedly connected to the top of the workbench 11. Two chutes 16 are symmetrically arranged on the upper surface of the workbench 11. Two motors 17 are symmetrically installed on one side of the workbench 11. The output shaft of the motor 17 is fixedly connected to one end of the lead screw 18. A slide seat 19 is threadedly connected to the outer side wall of the lead screw 18. An electric telescopic rod 110 is installed on the top of the slide seat 19. The top end of the electric telescopic rod 110 is fixedly connected to a support plate 111. A connecting plate 112 is fixedly connected to one side of the support plate 111. A connecting pipe 113 is fixedly connected inside the support plate 111 and the connecting plate 112. Vacuum pipes 114 are uniformly communicated with the outer side wall of the connecting pipe 113. One end of the vacuum pipe 114 is provided with a vacuum chuck 115. The circuit board is adsorbed by the vacuum chuck 115. At the same time, the motor 17 works to drive the lead screw 18 to rotate automatically, so that the slide seat 19 moves. After the circuit board moves above the vacuum adsorption fixture 13, the electric telescopic rod 110 works again to place the circuit board on the vacuum adsorption fixture 13. The multi-layer circuit board is fixed by the vacuum adsorption fixture 13, and the installation of the multi-layer circuit board can be automatically completed.

[0027] In this embodiment, specifically: The lead screw 18 is rotatably connected to the inner side wall of the chute 16, and the slide seat 19 is slidably connected to the inner side wall of the chute 16.

[0028] In this embodiment, specifically: One end of the connecting pipe 113 penetrates through one side of the support plate 111 and extends to the outside, and one end of the connecting pipe 113 is connected to a vacuum generator.

[0029] In this embodiment, specifically: The tooling assembly 10 further includes a control panel 12. The control panel 12 is installed on the front surface of the workbench 11. The other end of the workbench 11 away from the motor 17 is connected to a conveying assembly 20. The control panel 12 is used to control the automatic fixing of the multi-layer circuit board by the chip mounting tooling.

[0030] In this embodiment, specifically: One end of the vacuum adsorption fixture 13 is communicated with an air inlet pipe 14 and an air outlet pipe 15. The air inlet pipe 14 and the air outlet pipe 15 are used to control the intake and exhaust of the vacuum adsorption fixture 13, so as to realize the fixing and relaxation of the circuit board.

[0031] In this embodiment, specifically: The conveying assembly 20 includes a base 21 and a conveyor belt 22;

[0032] The conveyor belt 22 is installed on the inner side wall of the base 21. The conveyor belt 22 is used to convey the multi-layer circuit board.

[0033] In this embodiment, specifically: The base 21 is fixedly connected to one side of the workbench 11. The base 21 is used to fix and support the conveyor belt 22.

[0034] In this embodiment, specifically, the vacuum suction cup 115 is arranged above the conveyor belt 22, and the stone removal position of the vacuum suction cup 115 is above the conveyor belt 22, so as not to affect the chip mounting work of the multi-layer circuit board.

[0035] When the utility model works: the multi-layer circuit board is conveyed by the conveyor belt 22, the electric telescopic rod 110 works to drive the vacuum suction cup 115 to approach the circuit board, the circuit board is adsorbed by the vacuum suction cup 115, and at the same time, the motor 17 works to drive the lead screw 18 automatically, so that the sliding seat 19 moves. After the circuit board moves above the vacuum adsorption fixture 13, the electric telescopic rod 110 works again to place the circuit board on the vacuum adsorption fixture 13, and the multi-layer circuit board is fixed by the vacuum adsorption fixture 13. The installation of the multi-layer circuit board can be automatically completed, the operation is simple and convenient, time is saved, the chip mounting efficiency of the multi-layer circuit board is improved, and the automation of the multi-layer circuit board chip mounting tooling is facilitated. After the multi-layer circuit board iron tray is finished, the vacuum suction cup 115 sends the multi-layer circuit board back.

[0036] The above is only the specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model can easily think of various changes or substitutions thereof, and these should all be covered within the protection scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the protection scope of the claims.

Claims

1. A multi-layer circuit board patch tool, comprising a tool assembly (10), characterized in that: The tooling assembly (10) comprises a workbench (11), a vacuum adsorption fixture (13), a slide groove (16), a motor (17), a screw rod (18), a slide seat (19), an electric telescopic rod (110), a support plate (111), a connecting plate (112), a connecting pipe (113), a vacuum pipe (114) and a vacuum suction cup (115); The top of the workbench (11) is fixedly connected with a vacuum adsorption fixture (13); the upper surface of the workbench (11) is symmetrically provided with two slide grooves (16); one side of the workbench (11) is symmetrically provided with two motors (17); the output shaft of the motor (17) is fixedly connected with one end of a screw rod (18); the outer wall of the screw rod (18) is threadedly connected with a slide seat (19); the top of the slide seat (19) is provided with an electric telescopic rod (110); the top of the electric telescopic rod (110) is fixedly connected with a support plate (111); one side of the support plate (111) is fixedly connected with a connecting plate (112); the insides of the support plate (111) and the connecting plate (112) are fixedly connected with a connecting pipe (113); the outer wall of the connecting pipe (113) is evenly connected with a vacuum tube (114); one end of the vacuum tube (114) is provided with a vacuum suction cup (115).

2. A multi-layer circuit board mounting tool according to claim 1, characterized in that: The screw rod (18) is rotatably connected to the inner side wall of the slide groove (16), and the slide seat (19) is slidably connected to the inner side wall of the slide groove (16).

3. A multi-layer circuit board mounting tool according to claim 1, characterized in that: One end of the connecting pipe (113) passes through one side of the supporting plate (111) and extends to the outside.

4. A multi-layer circuit board mounting tool according to claim 1, characterized in that: The tooling assembly (10) further comprises a control panel (12), the control panel (12) being mounted on the front surface of the workbench (11), and the other end of the workbench (11) away from the motor (17) being connected to a conveying assembly (20).

5. A multi-layer circuit board mounting tool according to claim 1, characterized in that: One end of the vacuum adsorption fixture (13) is connected to an air inlet pipe (14) and an air outlet pipe (15).

6. A multi-layer circuit board mounting tool according to claim 4, characterized in that: The conveying assembly (20) comprises a base (21) and a conveying belt (22); A conveyor belt (22) is installed on the inner side wall of the base (21).

7. A multi-layer circuit board mounting tool according to claim 6, characterized in that: The base (21) is fixedly connected to one side of the workbench (11).

8. A multi-layer circuit board mounting tool according to claim 6, characterized in that: The vacuum suction cup (115) is arranged above the conveyor belt (22).

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