Novel LED packaging structure
By placing the LED chip and crystal wire in an independent sealing chamber in the LED packaging structure, the crystal wire fracture problem caused by the thermal expansion and contraction stress of the mixed colloid is solved, and the reliability and service life of the LED packaging structure are improved.
Patent Information
- Application Number
- CN202422002141.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-16
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-08-16
AI Technical Summary
In the hot and cold impact and high temperature and high humidity environment, the thermal expansion and contraction of the mixed colloids produces greater stress, resulting in crystalline fracture and affecting the service life of LED lamp beads.
A new LED packaging structure is adopted, in which the LED chip is fixed on the substrate and is electrically connected to the substrate through crystal lines. The periphery of the fluorescent diaphragm is supported on the steps of the bracket and sealedly connected with the bracket. The packaging colloid is arranged on the top surface of the fluorescent diaphragm and contacts the inner wall of the bracket to prevent the packaging colloid from directly contacting the LED chip and crystal lines.
By placing the LED chip and crystal wire in an independent sealed chamber, the thermal expansion and contraction stress of the packaging colloid is avoided, the reliability of the LED packaging structure is improved, the service life is extended, and the binding stability and airtightness of the fluorescent diaphragm and the bracket are enhanced.
Smart Images
Figure CN222981925U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LED packaging, and particularly relates to a novel LED packaging structure. Background Art
[0002] As a new type of solid semiconductor device, the LED has the advantages of small volume, light weight, high luminous efficiency, energy conservation and environmental protection, and has now been widely applied to various industries. The existing LED packaging method is to fix the LED chip on the substrate through die bonding glue, then connect the circuit on the substrate through bonding wires (or called crystal wires), and then cure after dropping a mixture of phosphor and packaging glue with corresponding specifications into the bowl cup, thereby making the lamp bead.
[0003] Although the existing LED packaging has a simple structure and low manufacturing cost, however, as Figure 1 shown, since the mixed colloid 10 formed by mixing the phosphor and the packaging glue directly contacts the LED chip 1 and the crystal wire 11, and there are differences in the thermal expansion coefficients of the mixed colloid 10, the bracket 2, and the substrate 3. When the LED lamp bead is in a thermal shock and high temperature and high humidity environment, the mixed colloid will expand and contract thermally to generate large stress, resulting in the fracture and failure of the crystal wire, seriously affecting the service life of the LED lamp bead. In other words, there is still room for improvement in the reliability of the existing LED packaging structure. Summary of the Utility Model
[0004] The technical problem solved by the utility model is to provide a novel LED packaging structure with high reliability.
[0005] To solve the above technical problem, the technical solution adopted by the utility model is: a novel LED packaging structure, comprising:
[0006] A bowl cup, the bowl cup includes a substrate and a bracket provided on the substrate, the bracket is in a ring frame shape, and the inner wall of the bracket has a step arranged in a circle;
[0007] An LED chip, the LED chip is fixed on the substrate and electrically connected to the substrate through a crystal wire;
[0008] A fluorescent film, the periphery of the fluorescent film is supported on the step and hermetically connected to the bracket;
[0009] A packaging colloid, the packaging colloid is provided on the top surface of the fluorescent film, and the packaging colloid contacts the inner wall of the bracket.
[0010] In one embodiment, the fluorescent film is hermetically connected to the step through an adhesive medium.
[0011] In one embodiment, at least a partial region of the bonding medium is located between the step surface of the step and the bottom surface of the fluorescent film.
[0012] In one embodiment, the substrate has a positive electrode pad and a negative electrode pad. The crystal wires of the LED chip are divided into a positive bonding wire and a negative bonding wire. The positive bonding wire is welded and conducted with the positive electrode pad, and the negative bonding wire is welded and conducted with the negative electrode pad.
[0013] In one embodiment, the LED chip is fixed on the substrate by die bonding glue.
[0014] In one embodiment, the fluorescent film is arranged without contacting the LED chip, and the crystal wires are arranged without contacting the fluorescent film.
[0015] In one embodiment, the fluorescent film is circular, oval or polygonal.
[0016] In one embodiment, the encapsulation colloid is a transparent colloid.
[0017] In one embodiment, the encapsulation colloid is a mixed colloid formed by mixing phosphor powder and encapsulation glue.
[0018] In one embodiment, the top surface of the encapsulation colloid is higher than, flush with or lower than the top surface of the bracket.
[0019] The beneficial effects of the present utility model are as follows:
[0020] In this LED packaging structure, the bracket, the fluorescent film and the substrate enclose a sealed chamber, so that the LED chip and the crystal wires are in an independent sealed chamber without encapsulation colloid, avoiding the direct contact between the encapsulation colloid and the LED chip and the crystal wires, effectively solving the problem of crystal wire fracture caused by stress generated by the thermal expansion and contraction of the encapsulation colloid, being beneficial to improving the reliability of the LED packaging structure and prolonging the service life of the LED packaging structure. In addition, the encapsulation colloid arranged on the top surface of the fluorescent film can also enhance the stability and airtightness of the combination of the fluorescent film and the bracket, and prevent external water vapor from entering the sealed chamber. Description of the Drawings
[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.
[0022] Figure 1 It is a cross-sectional view of an LED packaging structure of the prior art;
[0023] Figure 2 It is a cross-sectional view of the novel LED packaging structure of the first embodiment of the present utility model;
[0024] Figure 3 is Figure 2 the enlarged view of the position A in
[0025] Explanation of the reference numerals in the drawings:
[0026] 10. Mixed colloid;
[0027] 1. LED chip; 11. Crystal wire;
[0028] 2. Bracket; 21. Step; 22. Step surface;
[0029] 3. Substrate;
[0030] 4. Fluorescent film;
[0031] 5. Encapsulation colloid;
[0032] 6. Adhesive medium. Detailed implementation manners
[0033] The realization of the purpose, functional features and advantages of the present utility model will be further described with reference to the embodiments and the accompanying drawings.
[0034] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.
[0035] It should be noted that if there are directional indications such as up, down, left, right, front, back... in the embodiments of the present utility model, the directional indications are only used to explain the relative positional relationship and movement conditions between the components in a specific posture as shown in the drawings. If the specific posture changes, the directional indications will also change accordingly.
[0036] In addition, if there are descriptions such as "first", "second", etc. in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature.
[0037] In addition, the meaning of "and / or" as used throughout the text is that it includes three parallel solutions. Taking "and / or" as an example, it includes the solution of, or the solution of, or the solution that satisfies both simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.
[0038] In this application, unless otherwise clearly specified and defined, terms such as "installed", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0039] Embodiment 1
[0040] Please refer to Figure 2 and Figure 3 , Embodiment 1 of this utility model is: a novel LED packaging structure, including a bowl cup, an LED chip 1, a fluorescent film 4, and a packaging colloid 5. The bowl cup includes a substrate 3 and a bracket 2 provided on the substrate 3. The bracket 2 is in a ring frame shape, and the inner wall of the bracket 2 has a step 21 arranged in a circle; the LED chip 1 is fixed on the substrate 3 and is electrically connected to the substrate 3 through a crystal wire 11; the periphery of the fluorescent film 4 is supported on the step 21 and is hermetically connected to the bracket 2. The fluorescent film 4 is not in contact with the LED chip 1, and the crystal wire 11 is not in contact with the fluorescent film 4. That is to say, the step surface 22 of the step 21 is higher than the LED chip 1 and the crystal wire 11; the packaging colloid 5 is provided on the top surface of the fluorescent film 4, and the packaging colloid 5 is in contact with the inner wall of the bracket 2 to form a connection.
[0041] The LED chip 1 is fixed on the substrate 3 through a die bonding adhesive; the substrate 3 has a positive electrode pad and a negative electrode pad. The crystal wire 11 of the LED chip 1 is divided into a positive bonding wire and a negative bonding wire. The positive bonding wire is welded and conducted with the positive electrode pad, and the negative bonding wire is welded and conducted with the negative electrode pad.
[0042] The fluorescent film 4 is hermetically connected to the step 21 through an adhesive medium 6. At least part of the area of the adhesive medium 6 is located between the step surface 22 of the step 21 and the bottom surface of the fluorescent film 4. The adhesive medium 6 includes but is not limited to a sealant.
[0043] The fluorescent film 4 is circular, oval, polygonal or other shapes, and the polygon can be a triangle, a rectangle, a pentagon, a hexagon, etc.
[0044] In an actual product, the encapsulation colloid 5 can be either a transparent colloid or a mixed colloid 10 formed by mixing phosphor powder and an encapsulation adhesive.
[0045] In this embodiment, the top surface of the encapsulation colloid 5 is arranged flush with the top surface of the bracket 2; in other embodiments, the top surface of the encapsulation colloid 5 is arranged higher than the top surface of the bracket 2, or the top surface of the encapsulation colloid 5 is arranged lower than the top surface of the bracket 2.
[0046] The above are only optional embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. Any equivalent structural transformation made under the inventive concept of the present utility model by using the content of the specification and drawings of the present utility model, or any direct / indirect application in other related technical fields is included in the patent protection scope of the present utility model.
Claims
1. A new type of LED packaging structure, characterized in that: include A bowl cup, the bowl cup comprising a base plate and a bracket arranged on the base plate, the bracket being in the shape of a ring frame, and the inner wall of the bracket having steps arranged in a circle; An LED chip, wherein the LED chip is fixed on the substrate and electrically connected to the substrate through a crystal wire; A fluorescent diaphragm, the periphery of which is supported on the step and is sealed and connected to the bracket; The encapsulating colloid is arranged on the top surface of the fluorescent film, and the encapsulating colloid is in contact with the inner wall of the bracket.
2. The novel LED packaging structure according to claim 1, characterized in that: The fluorescent film is sealed and connected to the step via an adhesive medium.
3. The novel LED packaging structure according to claim 2, characterized in that: At least a partial area of the adhesive medium is located between the step surface of the step and the bottom surface of the fluorescent film.
4. The novel LED packaging structure according to claim 1, characterized in that: The substrate has a positive electrode pad and a negative electrode pad, the crystal wires of the LED chip are divided into positive electrode bonding wires and negative electrode bonding wires, the positive electrode bonding wires are welded and connected to the positive electrode pad, and the negative electrode bonding wires are welded and connected to the negative electrode pad.
5. The novel LED packaging structure according to claim 1, characterized in that: The LED chip is fixed on the substrate by a bonding adhesive.
6. The novel LED packaging structure according to claim 1, characterized in that: The fluorescent film is arranged without contact with the LED chip, and the crystal wire is arranged without contact with the fluorescent film.
7. The novel LED packaging structure according to claim 1, characterized in that: The fluorescent film is circular, elliptical or polygonal.
8. The novel LED packaging structure according to claim 1, characterized in that: The encapsulating colloid is a transparent colloid.
9. The novel LED packaging structure according to claim 1, characterized in that: The encapsulating colloid is a mixed colloid formed by mixing fluorescent powder and encapsulating glue.
10. The novel LED packaging structure according to claim 1, characterized in that: The top surface of the packaging colloid is arranged higher than, flush with or lower than the top surface of the bracket.