Low-thermal-resistance high-luminous-efficiency high-power LED lamp bead

Abstract

The utility model discloses a low thermal resistance high luminous efficiency high power LED lamp bead, which comprises an outer packaging seat, a lens, a ceramic base, a pin, an LED chip and a heat conducting plate, the lens is arranged on the outer packaging seat, the ceramic base is arranged in the outer packaging seat, the bottom of the ceramic base is provided with a plurality of grooves, and the pins are arranged in the grooves. The bottom of the ceramic base is coated with heat-conducting double-faced adhesive tape, the pins are arranged on the ceramic base, the LED chips are arranged in the ceramic base, the heat-conducting plate is arranged in the ceramic base, and a plurality of heat-conducting fins are arranged at the bottom of the heat-conducting plate. The ceramic base and the heat conducting plate are arranged, under the condition that use of the LED lamp beads is not affected, the rapid heat conducting effect is achieved, the heat dissipation effect is good, the use range is large, and meanwhile the heat dissipation effect is improved and fixation is convenient through the heat conducting double-faced adhesive tape.

Description

Technical Field

[0001] The utility model relates to the technical field of LED lamp beads, and specifically relates to a high-power LED lamp bead with low thermal resistance and high luminous efficiency. Background Technique

[0002] High-power LED lamp beads with low thermal resistance and high luminous efficiency are high-end products in LED lighting technology, with various excellent characteristics and are widely used in various lighting fields. High-power LED lamp beads with low thermal resistance and high luminous efficiency are usually encapsulated with high-quality heat-conducting materials (such as ceramic bases) to effectively reduce thermal resistance and accelerate the heat dissipation speed, thereby ensuring the stability of the lamp beads and extending the service life. However, the heat dissipation ability of high-power LED lamp beads with low thermal resistance and high luminous efficiency is limited, and they are prone to failures in a high-temperature environment, and the scope of use is small. For this reason, we have proposed a high-power LED lamp bead with low thermal resistance and high luminous efficiency. Content of the Utility Model

[0003] The utility model aims to solve the problems existing in the prior art or related technologies.

[0004] For this reason, the technical solution adopted by the utility model is: a high-power LED lamp bead with low thermal resistance and high luminous efficiency, including an outer encapsulation seat, a lens, a ceramic base, pins, an LED chip and a heat-conducting plate. The lens is arranged on the outer encapsulation seat, the ceramic base is arranged inside the outer encapsulation seat, several grooves are opened at the bottom of the ceramic base, a heat-conducting double-sided adhesive is coated at the bottom of the ceramic base, the pins are arranged on the ceramic base, the LED chip is arranged inside the ceramic base, the heat-conducting plate is arranged inside the ceramic base, and several heat-conducting sheets are arranged at the bottom of the heat-conducting plate.

[0005] Preferably, the outer encapsulation seat is bonded and encapsulated with the lens and the ceramic base through epoxy resin glue, and the ceramic base is inserted inside the outer encapsulation seat.

[0006] Preferably, a card slot for installing the heat-conducting plate is opened on the inner side of the ceramic base.

[0007] Preferably, a release paper for protecting the heat-conducting double-sided adhesive is bonded to the bottom of the heat-conducting double-sided adhesive.

[0008] Preferably, there are two pins, and the two pins are symmetrically distributed.

[0009] Preferably, two connecting wires are arranged at the top of the LED chip, and the two connecting wires are fixedly connected to the corresponding pins.

[0010] By adopting the above technical solution, the beneficial effects achieved by the present utility model are as follows: By providing a ceramic base and a heat conduction plate, the effect of rapid heat conduction is achieved without affecting the use of the LED lamp beads, with good heat dissipation effect, large application range. At the same time, by providing a heat-conducting double-sided adhesive, while improving the heat dissipation effect, it is convenient for fixing. During use, the heat generated by the LED chip can be quickly guided into the ceramic base through the heat conduction plate, and the heat conduction speed can be accelerated by increasing the contact area between the heat conduction plate and the ceramic base through the heat conduction sheet. Then, the surface area of the bottom of the ceramic base can be increased through the groove, further improving the heat conduction efficiency, thereby enhancing the heat dissipation effect and having a large application range. Then, the heat can be quickly conducted through the heat-conducting double-sided adhesive, and it can be bonded to the substrate to fix the pins. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a disassembled schematic diagram of the present utility model;

[0012] Figure 2 of the present utility model Figure 1 is a schematic structural diagram of the ceramic base in the present utility model;

[0013] Figure 3 of the present utility model Figure 1 is a schematic structural diagram of the heat conduction plate in the present utility model;

[0014] Figure 4 is an overall schematic diagram of the present utility model.

[0015] Reference Signs:

[0016] 100, outer encapsulation base;

[0017] 200, lens;

[0018] 300, ceramic base; 301, card slot; 302, groove; 303, heat-conducting double-sided adhesive; 304, release paper;

[0019] 400, pin;

[0020] 500, LED chip; 501, connecting wire;

[0021] 600, heat conduction plate; 601, heat conduction sheet. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] To make the objectives, technical solutions, and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below in conjunction with the specific embodiments and with reference to the accompanying drawings. It should be noted that, without conflict, the embodiments of the present utility model and the features in the embodiments can be combined with each other.

[0023] Some embodiments of the present utility model will be described below with reference to the accompanying drawings to provide a low thermal resistance, high luminous efficiency, high-power LED lamp bead.

[0024] Example 1:

[0025] Referring to Figures 1-4 , this is the first embodiment of the present utility model. This embodiment provides a low thermal resistance, high luminous efficiency, high-power LED lamp bead, which includes an outer encapsulation base 100, a lens 200, a ceramic base 300, pins 400, an LED chip 500, and a heat conduction plate 600.

[0026] Specifically, the outer encapsulation base 100 is bonded and encapsulated with the lens 200 and the ceramic base 300 through epoxy resin glue, and the ceramic base 300 is inserted into the inside of the outer encapsulation base 100. During use, the outer encapsulation base 100, the lens 200, and the ceramic base 300 are fixed through epoxy resin glue, having good mechanical strength, heat conductivity, and chemical resistance, and being applicable to different environmental conditions.

[0027] Specifically, the lens 200 is arranged on the outer encapsulation base 100. During use, the lens 200 can focus the scattered light emitted by the LED lamp bead to form a more concentrated light beam, thereby significantly improving the brightness and luminous intensity of the lamp.

[0028] Specifically, the ceramic base 300 is arranged inside the outer encapsulation base 100. A plurality of grooves 302 are formed at the bottom of the ceramic base 300, a heat conduction double-sided tape 303 is coated at the bottom of the ceramic base 300, a release paper 304 for protecting the heat conduction double-sided tape 303 is bonded to the bottom of the heat conduction double-sided tape 303, and a card slot 301 for installing the heat conduction plate 600 is formed inside the ceramic base 300. During use, the surface area of the bottom of the ceramic base 300 can be increased through the grooves 302, the heat conduction efficiency can be further improved, thereby improving the heat dissipation effect, and the application range is wide. Then, the heat conduction double-sided tape 303 can conduct heat quickly and can be bonded to the substrate to fix the pins 400, saving time and effort.

[0029] Specifically, the pins 400 are arranged on the ceramic base 300. There are two pins 400, and the two pins 400 are symmetrically distributed. During use, the two pins 400 can be placed at the correct positions on the substrate and welded after placement to connect the power supply of the LED chip 500.

[0030] Specifically, the LED chip 500 is arranged inside the ceramic base 300. Two connecting wires 501 are arranged at the top of the LED chip 500, and the two connecting wires 501 are fixedly connected to the corresponding pins 400. During use, the pins 400 can be welded to the substrate, and after welding, the power supply of the LED chip 500 can be connected through the connecting wires 501 for lighting.

[0031] Specifically, the heat conduction plate 600 is disposed inside the ceramic base 300. A number of heat conduction fins 601 are provided at the bottom of the heat conduction plate 600. During use, the heat conduction plate 600 is a copper plate. The heat generated by the LED chip 500 can be quickly guided into the ceramic base 300 through the heat conduction plate 600, and the contact area between the heat conduction plate 600 and the ceramic base 300 can be increased through the heat conduction fins 601, so as to accelerate the heat conduction speed.

[0032] The working principle and usage process of the present utility model: During use, the heat generated by the LED chip 500 can be quickly guided into the ceramic base 300 through the heat conduction plate 600, and the contact area between the heat conduction plate 600 and the ceramic base 300 can be increased through the heat conduction fins 601, so as to accelerate the heat conduction speed. Then, the surface area of the bottom of the ceramic base 300 can be increased through the groove 302, which can further improve the heat conduction efficiency, thereby improving the heat dissipation effect and having a wide range of applications. Then, the heat conduction double-sided tape 303 can conduct heat quickly and can be bonded to the substrate at the same time to fix the pins 400, saving time and effort.

[0033] Although the embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the claims and their equivalents.

Claims

1. A low thermal resistance, high light efficiency, high power LED lamp bead, characterized in that: include: External packaging seat (100); A lens (200) is arranged on the outer packaging seat (100); A ceramic base (300) is arranged inside the outer packaging base (100), a plurality of grooves (302) are provided at the bottom of the ceramic base (300), and a heat-conducting double-sided adhesive (303) is coated on the bottom of the ceramic base (300); Pins (400) are arranged on the ceramic base (300); An LED chip (500) is arranged inside the ceramic base (300); The heat conducting plate (600) is arranged inside the ceramic base (300), and a plurality of heat conducting sheets (601) are arranged at the bottom of the heat conducting plate (600).

2. The low thermal resistance, high light efficiency, high power LED lamp bead according to claim 1, characterized in that: The outer packaging seat (100) is bonded and packaged with the lens (200) and the ceramic base (300) by epoxy resin glue, and the ceramic base (300) is inserted into the interior of the outer packaging seat (100).

3. The low thermal resistance, high light efficiency, high power LED lamp bead according to claim 1, characterized in that: A slot (301) for mounting a heat conducting plate (600) is provided on the inner side of the ceramic base (300).

4. The low thermal resistance, high light efficiency, high power LED lamp bead according to claim 1, characterized in that: A release paper (304) for protecting the thermally conductive double-sided adhesive (303) is bonded to the bottom of the thermally conductive double-sided adhesive (303).

5. The low thermal resistance, high light efficiency, high power LED lamp bead according to claim 1, characterized in that: Two pins (400) are provided, and the two pins (400) are symmetrically distributed.

6. The low thermal resistance, high light efficiency, high power LED lamp bead according to claim 1, characterized in that: Two connecting wires (501) are arranged at the top of the LED chip (500), and the two connecting wires (501) are fixedly connected to corresponding pins (400).

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